10-FY07HVA075S5-L985F08 [VINCOTECH]

High speed and smooth switching;Low gate charge;Very low collector emitter saturation voltage;
10-FY07HVA075S5-L985F08
型号: 10-FY07HVA075S5-L985F08
厂家: VINCOTECH    VINCOTECH
描述:

High speed and smooth switching;Low gate charge;Very low collector emitter saturation voltage

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中文:  中文翻译
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10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
flowPACK 1 H6.5  
650 V / 75 A  
Features  
flow 1 12 mm housing  
● Innovative H6.5 Topology  
● IGBT S5 + IGBT L5  
● NTC  
Press-fit  
Solder  
Schematic  
Target applications  
● Solar Inverters  
● Special Application  
Types  
● 10-FY07HVA075S5-L985F08  
● 10-PY07HVA075S5-L985F08Y  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Condition  
Value  
Unit  
High Buck Switch / Low Buck Switch  
VCES  
IC  
ICRM  
Ptot  
VGES  
Tjmax  
Collector-emitter voltage  
650  
58  
V
A
Collector current  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
Repetitive peak collector current  
Total power dissipation  
Gate-emitter voltage  
tp limited by Tjmax  
Tj = Tjmax  
225  
86  
A
W
V
±20  
175  
Maximum junction temperature  
°C  
Copyright Vincotech  
1
04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Condition  
Value  
Unit  
Buck Diode  
VRRM  
IF  
IFRM  
Ptot  
Peak repetitive reverse voltage  
650  
47  
V
A
Continuous (direct) forward current  
Repetitive peak forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
100  
63  
A
Tj = Tjmax  
W
°C  
Tjmax  
Maximum junction temperature  
175  
Boost Switch  
VCES  
IC  
Collector-emitter voltage  
650  
84  
V
A
Collector current  
Tj = Tjmax  
Ts = 80 °C  
ICRM  
Repetitive peak collector current  
Turn off safe operating area  
Total power dissipation  
tp limited by Tjmax  
Tj ≤ 175 °C, VCE ≤ 650 V  
Tj = Tjmax  
225  
300  
95  
A
A
Ptot  
Ts = 80 °C  
W
V
VGES  
Gate-emitter voltage  
±20  
175  
Maximum junction temperature  
°C  
T
jmax  
Low Boost Diode / High Boost Diode  
VRRM  
IF  
IFRM  
Ptot  
Peak repetitive reverse voltage  
Continuous (direct) forward current  
Repetitive peak forward current  
Total power dissipation  
650  
47  
V
A
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
100  
63  
A
Tj = Tjmax  
W
°C  
Tjmax  
Maximum junction temperature  
175  
Copyright Vincotech  
2
04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Condition  
Value  
Unit  
Module Properties  
Thermal Properties  
Tstg  
Tjop  
Storage temperature  
-40…+125  
°C  
°C  
Operation temperature under switching condition  
Isolation Properties  
-40…(Tjmax - 25)  
DC Test Voltage*  
AC Voltage  
tp = 2 s  
6000  
2500  
V
Visol  
Isolation voltage  
tp = 1 min  
V
Creepage distance  
Clearance  
min. 12,7  
7,99  
mm  
mm  
Comparative Tracking Index  
*100 % tested in production  
CTI  
> 200  
Copyright Vincotech  
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04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
Characteristic Values  
Parameter  
Symbol  
Conditions  
Value  
Typ  
Unit  
VCE [V] IC [A]  
VGE [V]  
VGS [V]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
Min  
Max  
High Buck Switch / Low Buck Switch  
Static  
VGE(th)  
Gate-emitter threshold voltage  
VGE = VCE  
0,00075 25  
25  
3,2  
4
4,8  
V
V
1,56  
1,56  
1,59  
1,75  
VCEsat  
Collector-emitter saturation voltage  
15  
75  
125  
150  
ICES  
IGES  
rg  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
0
650  
0
25  
25  
50  
µA  
nA  
Ω
20  
100  
none  
4500  
130  
17  
Cies  
Coes  
Cres  
Qg  
Output capacitance  
f = 1 Mhz  
0
25  
25  
25  
pF  
Reverse transfer capacitance  
Gate charge  
15  
520  
75  
164  
nC  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
1,10  
K/W  
25  
31  
31  
31  
td(on)  
125  
150  
25  
Turn-on delay time  
10  
tr  
Rise time  
125  
150  
25  
125  
150  
25  
125  
150  
25  
125  
150  
25  
10  
11  
110  
126  
132  
10  
Rgon = 4 Ω  
Rgoff = 4 Ω  
ns  
td(off)  
Turn-off delay time  
Fall time  
-5 / 15  
350  
75  
tf  
25  
32  
0,450  
0,701  
0,758  
0,457  
0,875  
Qr  
FWD  
Qr  
FWD  
Qr  
FWD  
= 2,2 μC  
= 4 μC  
= 4,7 μC  
Eon  
Turn-on energy (per pulse)  
mWs  
125  
Eoff  
Turn-off energy (per pulse)  
150  
1,023  
Copyright Vincotech  
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04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
Characteristic Values  
Parameter  
Symbol  
Conditions  
Value  
Typ  
Unit  
VCE [V] IC [A]  
VGE [V]  
VGS [V]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
Min  
Max  
Buck Diode  
Static  
25  
1,50  
1,44  
1,42  
1,92  
2,65  
VF  
IR  
125  
150  
Forward voltage  
50  
V
Reverse leakage current  
650  
25  
µA  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
1,50  
K/W  
25  
86  
110  
117  
IRRM  
125  
150  
25  
Peak recovery current  
A
55  
trr  
Qr  
Reverse recovery time  
125  
150  
25  
125  
150  
25  
125  
150  
25  
125  
150  
87  
101  
ns  
di/dt = 5329 A/μs  
di/dt = 8023 A/μs  
di/dt = 7260 A/μs  
2,18  
4,04  
4,70  
0,381  
0,838  
1,021  
5984  
4040  
4174  
-5 / 15  
350  
75  
Recovered charge  
μC  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
mWs  
A/µs  
(dirf/dt)max  
Copyright Vincotech  
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04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
Characteristic Values  
Parameter  
Symbol  
Conditions  
Value  
Typ  
Unit  
VCE [V] IC [A]  
VGE [V]  
VGS [V]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
Min  
Max  
Boost Switch  
Static  
VGE(th)  
Gate-emitter threshold voltage  
VGE = VCE  
0,001  
75  
25  
4,2  
5
5,8  
V
V
25  
1,10  
1,08  
1,09  
1,45  
VCEsat  
Collector-emitter saturation voltage  
15  
125  
150  
ICES  
IGES  
rg  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
0
650  
0
25  
25  
40  
µA  
nA  
Ω
20  
100  
none  
11625  
150  
Cies  
Coes  
Cres  
Qg  
Output capacitance  
f = 1 Mhz  
0
25  
25  
25  
pF  
Reverse transfer capacitance  
Gate charge  
30  
15  
520  
75  
436  
nC  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
Rth(j-s)  
Thermal resistance junction to sink  
1,00  
K/W  
Dynamic (T21,D12)  
25  
123  
121  
120  
9
td(on)  
125  
150  
25  
Turn-on delay time  
tr  
Rise time  
125  
150  
25  
125  
150  
25  
125  
150  
25  
125  
150  
25  
8
8
Rgon = 4 Ω  
Rgoff = 4 Ω  
ns  
189  
215  
221  
53  
217  
257  
0,171  
0,164  
0,200  
3,189  
4,647  
td(off)  
Turn-off delay time  
Fall time  
±15  
350  
75  
tf  
Qr  
FWD  
Qr  
FWD  
Qr  
FWD  
= 2,1 μC  
= 3,8 μC  
= 4,4 μC  
Eon  
Turn-on energy (per pulse)  
mWs  
125  
Eoff  
Turn-off energy (per pulse)  
150  
5,023  
Copyright Vincotech  
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04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
Characteristic Values  
Parameter  
Symbol  
Conditions  
Value  
Typ  
Unit  
VCE [V] IC [A]  
VGE [V]  
VGS [V]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
Min  
Max  
Low Boost Diode  
Static  
25  
1,50  
1,44  
1,42  
1,92  
2,65  
VF  
IR  
125  
150  
Forward voltage  
50  
V
Reverse leakage current  
650  
25  
µA  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
Rth(j-s)  
Thermal resistance junction to sink  
1,50  
K/W  
Dynamic (T21,D12)  
25  
76  
IRRM  
125  
150  
25  
101  
105  
58  
Peak recovery current  
A
trr  
Qr  
Reverse recovery time  
125  
150  
25  
125  
150  
25  
125  
150  
25  
125  
150  
89  
101  
ns  
di/dt = 7349 A/μs  
di/dt = 6426 A/μs  
di/dt = 7461 A/μs  
2,102  
3,817  
4,395  
0,623  
0,986  
1,148  
4813  
3089  
2758  
±15  
350  
75  
Recovered charge  
μC  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
mWs  
A/µs  
(dirf/dt)max  
Copyright Vincotech  
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04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
Characteristic Values  
Parameter  
Symbol  
Conditions  
Value  
Typ  
Unit  
VCE [V] IC [A]  
VGE [V]  
VGS [V]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
Min  
Max  
Boost Switch  
Static  
VGE(th)  
Gate-emitter threshold voltage  
VGE = VCE  
0,001  
75  
25  
4,2  
5
5,8  
V
V
25  
1,10  
1,08  
1,09  
1,45  
VCEsat  
Collector-emitter saturation voltage  
15  
125  
150  
ICES  
IGES  
rg  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
0
650  
0
25  
25  
40  
µA  
nA  
Ω
20  
100  
none  
11625  
150  
Cies  
Coes  
Cres  
Qg  
Output capacitance  
f = 1 Mhz  
0
25  
25  
25  
pF  
Reverse transfer capacitance  
Gate charge  
30  
15  
520  
75  
436  
nC  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic (T21, D20)  
Turn-on delay time  
1,00  
K/W  
25  
117  
112  
112  
12  
td(on)  
125  
150  
25  
tr  
Rise time  
125  
150  
25  
125  
150  
25  
125  
150  
25  
125  
150  
25  
7
8
Rgon = 4 Ω  
Rgoff = 4 Ω  
ns  
187  
214  
222  
56  
218  
256  
0,375  
0,479  
0,528  
3,056  
4,452  
td(off)  
Turn-off delay time  
Fall time  
±15  
350  
75  
tf  
Qr  
FWD  
Qr  
FWD  
Qr  
FWD  
= 2 μC  
= 4 μC  
= 4,6 μC  
Eon  
Turn-on energy (per pulse)  
mWs  
125  
Eoff  
Turn-off energy (per pulse)  
150  
4,791  
Copyright Vincotech  
8
04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
Characteristic Values  
Parameter  
Symbol  
Conditions  
Value  
Typ  
Unit  
VCE [V] IC [A]  
VGE [V]  
VGS [V]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
Min  
Max  
High Boost Diode  
Static  
25  
1,50  
1,44  
1,42  
1,92  
2,65  
VF  
IR  
125  
150  
Forward voltage  
50  
V
Reverse leakage current  
650  
25  
µA  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic (T21, D20)  
Peak recovery current  
1,50  
K/W  
25  
64  
109  
114  
63  
IRRM  
125  
150  
25  
A
trr  
Qr  
Reverse recovery time  
125  
150  
25  
125  
150  
25  
125  
150  
25  
125  
150  
91  
102  
ns  
di/dt = 7627 A/μs  
di/dt = 7440 A/μs  
di/dt = 7597 A/μs  
2,033  
4,017  
4,576  
0,556  
0,853  
1,006  
2384  
5443  
4708  
±15  
350  
75  
Recovered charge  
μC  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
mWs  
A/µs  
(dirf/dt)max  
Thermistor  
R
ΔR/R  
P
Rated resistance  
25  
100  
25  
25  
25  
25  
22  
kΩ  
%
Deviation of R100  
Power dissipation  
Power dissipation constant  
B-value  
R100 = 1484 Ω  
-5  
5
5
mW  
mW/K  
K
1,5  
B(25/50)  
Tol. ±1 %  
Tol. ±1 %  
3962  
4000  
B(25/100)  
B-value  
K
Vincotech NTC Reference  
I
Copyright Vincotech  
9
04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
High Buck Switch / Low Buck Switch Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical output characteristics  
Typical output characteristics  
I C = f(VCE  
)
I C = f(VCE)  
VGE  
:
I
I
tp  
=
250  
15  
μs  
25 °C  
125 °C  
150 °C  
tp  
=
250  
150  
μs  
°C  
VGE  
=
V
Tj:  
Tj =  
VGE from  
7 V to 17 V in steps of 1 V  
figure 3.  
IGBT  
figure 4.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as function of pulse duration  
I C = f(VGE  
)
Z th(j-s) = f(tp)  
101  
I
Z
100  
10-1  
10-2  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
tp(s)  
102  
tp  
=
100  
10  
μs  
25 °C  
125 °C  
150 °C  
D =  
R th(j-s)  
tp / T  
VCE  
=
V
Tj:  
=
1,10  
K/W  
IGBT thermal model values  
R (K/W)  
τ (s)  
2,16E-01  
6,30E-01  
1,62E-01  
3,68E-02  
6,02E-02  
4,05E-01  
6,87E-02  
1,13E-02  
2,51E-03  
3,09E-04  
Copyright Vincotech  
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04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
High Buck Switch / Low Buck Switch Characteristics  
figure 5.  
IGBT  
figure 6.  
IGBT  
Gate voltage vs gate charge  
Safe operating area  
VGE = f(Q G  
)
I C = f(VCE)  
I
V
D =  
single pulse  
80 ºC  
I C=  
75  
A
Ts  
=
VGE  
=
±15  
V
Tj =  
Tjmax  
ºC  
Copyright Vincotech  
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04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
Buck Diode Characteristics  
figure 1.  
FWD  
figure 2.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
I F = f(VF)  
Z th(j-s) = f(tp)  
101  
Z
100  
10-1  
10-2  
10-4  
=
10-3  
10-2  
10-1  
100  
101  
102  
tp  
=
250  
μs  
25 °C  
125 °C  
150 °C  
D =  
tp / T  
1,50  
Tj:  
R th(j-s)  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
1,03E-01  
2,05E-01  
6,39E-01  
3,39E-01  
1,71E-01  
4,45E-02  
4,73E+00  
5,53E-01  
8,31E-02  
2,02E-02  
4,42E-03  
1,30E-03  
Copyright Vincotech  
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04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
Boost Switch Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical output characteristics  
Typical output characteristics  
I C = f(VCE  
)
I C = f(VCE)  
VGE  
:
I
I
tp  
=
250  
15  
μs  
25 °C  
125 °C  
150 °C  
tp  
=
250  
150  
7 V to 17 V in steps of 1 V  
μs  
VGE  
=
V
Tj:  
Tj =  
°C  
VGE from  
figure 3.  
IGBT  
figure 4.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as function of pulse duration  
I C = f(VGE  
)
Z th(j-s) = f(tp)  
101  
I
Z
100  
10-1  
10-2  
10-3  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
tp(s)  
102  
tp  
=
100  
10  
μs  
25 °C  
125 °C  
150 °C  
D =  
R th(j-s)  
tp / T  
VCE  
=
V
Tj:  
=
1,00  
K/W  
IGBT thermal model values  
R (K/W)  
τ (s)  
8,80E-02  
1,67E-01  
5,38E-01  
1,47E-01  
3,80E-02  
1,88E-02  
2,68E+00  
3,70E-01  
8,09E-02  
1,56E-02  
3,42E-03  
5,45E-04  
Copyright Vincotech  
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04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
Boost Switch Characteristics  
figure 5.  
IGBT  
figure 6.  
IGBT  
Gate voltage vs gate charge  
Safe operating area  
VGE = f(Q G  
)
I C = f(VCE)  
I
V
D =  
single pulse  
80 ºC  
I C  
=
75  
A
Ts  
=
VGE  
=
±15  
V
Tj =  
Tjmax  
Copyright Vincotech  
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04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
Low Boost Diode Characteristics  
figure 1.  
FWD  
figure 2.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
I F = f(VF)  
Z th(j-s) = f(tp)  
101  
Z
100  
10-1  
10-2  
10-4  
=
10-3  
10-2  
10-1  
100  
101  
102  
tp  
=
250  
μs  
25 °C  
125 °C  
150 °C  
D =  
tp / T  
1,50  
Tj:  
R th(j-s)  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
1,03E-01  
2,05E-01  
6,39E-01  
3,39E-01  
1,71E-01  
4,45E-02  
4,73E+00  
5,53E-01  
8,31E-02  
2,02E-02  
4,42E-03  
1,30E-03  
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datasheet  
Boost Switch Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical output characteristics  
Typical output characteristics  
I C = f(VCE  
)
I C = f(VCE)  
VGE  
:
I
I
tp  
=
250  
15  
μs  
25 °C  
125 °C  
150 °C  
tp  
=
250  
150  
7 V to 17 V in steps of 1 V  
μs  
VGE  
=
V
Tj:  
Tj =  
°C  
VGE from  
figure 3.  
IGBT  
figure 4.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as function of pulse duration  
I C = f(VGE  
)
Z th(j-s) = f(tp)  
101  
I
Z
100  
10-1  
10-2  
10-3  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
tp(s)  
102  
tp  
=
100  
10  
μs  
25 °C  
125 °C  
150 °C  
D =  
R th(j-s)  
tp / T  
VCE  
=
V
Tj:  
=
1,00  
K/W  
IGBT thermal model values  
R (K/W)  
τ (s)  
8,80E-02  
1,67E-01  
5,38E-01  
1,47E-01  
3,80E-02  
1,88E-02  
2,68E+00  
3,70E-01  
8,09E-02  
1,56E-02  
3,42E-03  
5,45E-04  
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datasheet  
Boost Switch Characteristics  
figure 5.  
IGBT  
figure 6.  
IGBT  
Gate voltage vs gate charge  
Safe operating area  
VGE = f(Q G  
)
I C = f(VCE)  
I
V
D =  
single pulse  
80 ºC  
I C  
=
75  
A
Ts  
=
VGE  
=
±15  
V
Tj =  
Tjmax  
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datasheet  
High Boost Diode Characteristics  
figure 1.  
FWD  
figure 2.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
I F = f(VF)  
Z th(j-s) = f(tp)  
101  
Z
100  
10-1  
10-2  
10-4  
=
10-3  
10-2  
10-1  
100  
101  
102  
tp  
=
250  
μs  
25 °C  
125 °C  
150 °C  
D =  
tp / T  
1,50  
Tj:  
R th(j-s)  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
1,03E-01  
2,05E-01  
6,39E-01  
3,39E-01  
1,71E-01  
4,45E-02  
4,73E+00  
5,53E-01  
8,31E-02  
2,02E-02  
4,42E-03  
1,30E-03  
Thermistor Characteristics  
figure 1.  
Thermistor  
Typical Thermistor resistance values  
Typical NTC characteristic as a function of temperature  
as a function of temperature  
R = f(T)  
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datasheet  
Buck Switching Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of gate resistor  
E = f(R g)  
E = f(I C  
)
E
E
25 °C  
With an inductive load at  
With an inductive load at  
25 °C  
VCE  
VGE  
=
=
=
=
350  
V
V
Ω
Ω
Tj:  
VCE  
VGE  
I C  
=
=
=
350  
-5 / 15  
75  
V
V
A
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
-5 / 15  
R gon  
R goff  
4
4
figure 3.  
FWD  
figure 4.  
FWD  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(I c)  
Erec = f(R g)  
E
E
With an inductive load at  
25 °C  
With an inductive load at  
25 °C  
VCE  
VGE  
=
=
=
350  
-5 / 15  
4
V
V
Ω
Tj:  
VCE  
VGE  
I C  
=
=
=
350  
-5 / 15  
75  
V
V
A
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
R gon  
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datasheet  
Buck Switching Characteristics  
figure 5.  
IGBT  
figure 6.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of gate resistor  
t = f(I C  
)
t = f(R g)  
t
t
With an inductive load at  
With an inductive load at  
Tj =  
150  
350  
-5 / 15  
4
°C  
V
Tj =  
150  
350  
°C  
V
VCE  
=
=
=
=
VCE  
=
=
=
VGE  
R gon  
R goff  
V
VGE  
I C  
-5 / 15  
75  
V
Ω
Ω
A
4
figure 7.  
FWD  
figure 8.  
FWD  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn on gate resistor  
trr = f(I C  
)
trr = f(R gon  
)
t
t
25 °C  
At  
VCE  
=
350  
V
V
Ω
At  
VCE  
=
350  
V
V
A
25 °C  
VGE  
=
=
-5 / 15  
4
Tj:  
VGE  
I C  
=
-5 / 15  
75  
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
R gon  
=
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datasheet  
Buck Switching Characteristics  
figure 9.  
FWD  
figure 10.  
FWD  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of IGBT turn on gate resistor  
Q r = f(I C  
)
Q r = f(R gon)  
Q
Q
25 °C  
At  
VCE  
VGE  
R gon  
=
350  
V
V
Ω
At  
VCE  
VGE  
I C  
=
350  
-5 / 15  
75  
V
V
A
25 °C  
=
-5 / 15  
4
Tj:  
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
=
=
figure 11.  
FWD  
figure 12.  
FWD  
Typical peak reverse recovery current current as a function of collector current  
Typical peak reverse recovery current as a function of IGBT turn on gate resistor  
I RM = f(I C  
)
I RM = f(R gon)  
I
I
25 °C  
At  
VCE  
=
350  
V
V
Ω
At  
VCE  
VGE  
I C  
=
350  
-5 / 15  
75  
V
V
A
25 °C  
VGE  
=
=
-5 / 15  
4
Tj:  
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
R gon  
=
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04 Jul. 2019 / Revision 3  
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datasheet  
Buck Switching Characteristics  
figure 13.  
FWD  
figure 14.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of IGBT turn on gate resistor  
di F/dt, di rr/dt = f(I C  
)
di F/dt, di rr/dt = f(R gon)  
diF/dt  
dir r/dt  
diF/dt  
dirr/dt  
t
t
i
i
At  
VCE  
=
350  
V
V
Ω
25 °C  
125 °C  
150 °C  
At  
VCE  
VGE  
I C  
=
350  
-5 / 15  
75  
V
V
A
25 °C  
125 °C  
150 °C  
VGE  
R gon  
=
=
-5 / 15  
4
=
Tj:  
Tj:  
=
figure 15.  
IGBT  
Reverse bias safe operating area  
I C = f(VCE  
)
IC MAX  
I
I
I
V
At  
Tj =  
175  
°C  
Ω
R gon  
R goff  
=
=
4
4
Ω
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datasheet  
Buck Switching Definitions  
General conditions  
T j  
=
=
=
125 °C  
R gon  
R goff  
4 Ω  
4 Ω  
figure 1.  
IGBT  
figure 2.  
IGBT  
Turn-off Switching Waveforms & definition of tdoff, tEoff (tEoff = integrating time for Eoff  
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)  
tdoff  
IC  
IC  
VGE  
VGE  
VCE  
tEoff  
VCE  
tEon  
VGE (0%) =  
-5  
V
VGE (0%) =  
-5  
15  
V
VGE (100%) =  
VC (100%) =  
I C (100%) =  
15  
V
VGE (100%) =  
VC (100%) =  
I C (100%) =  
V
350  
75  
V
350  
75  
V
A
A
tdoff  
=
126  
ns  
tdon  
=
31  
ns  
figure 3.  
IGBT  
figure 4.  
IGBT  
Turn-off Switching Waveforms & definition of tf  
Turn-on Switching Waveforms & definition of tr  
IC  
IC  
VCE  
tr  
VCE  
tf  
VC (100%) =  
I C (100%) =  
tf =  
350  
75  
V
VC (100%) =  
I C (100%) =  
350  
75  
V
A
A
25  
ns  
tr  
=
10  
ns  
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datasheet  
Buck Switching Characteristics  
figure 5.  
FWD  
figure 6.  
FWD  
Turn-off Switching Waveforms & definition of trr  
Turn-on Switching Waveforms & definition of tQr (tQr = integrating time for Qr)  
Qr  
IF  
IF  
fitted  
VF  
VF (100%) =  
I F (100%) =  
I RRM (100%) =  
350  
75  
V
I F (100%) =  
Q r (100%) =  
75  
A
A
4,04  
μC  
110  
87  
A
trr  
=
ns  
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datasheet  
Low Boost Switching Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of gate resistor  
E = f(R g)  
E = f(I C  
)
E
E
25 °C  
25 °C  
With an inductive load at  
With an inductive load at  
VCE  
VGE  
=
=
=
=
350  
±15  
4
V
V
Ω
Ω
Tj:  
VCE  
VGE  
I C  
=
=
=
350  
±15  
75  
V
V
A
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
R gon  
R goff  
4
figure 3.  
FWD  
figure 4.  
FWD  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(I c)  
Erec = f(R g)  
E
E
With an inductive load at  
25 °C  
With an inductive load at  
25 °C  
VCE  
VGE  
=
=
=
350  
±15  
4
V
V
Ω
Tj:  
VCE  
VGE  
I C  
=
=
=
350  
±15  
75  
V
V
A
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
R gon  
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datasheet  
Low Boost Switching Characteristics  
figure 5.  
IGBT  
figure 6.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of gate resistor  
t = f(I C  
)
t = f(R g)  
t
t
With an inductive load at  
With an inductive load at  
Tj =  
150  
350  
±15  
4
°C  
V
Tj =  
150  
350  
±15  
75  
°C  
V
VCE  
=
=
=
=
VCE  
=
=
=
VGE  
R gon  
R goff  
V
VGE  
I C  
V
Ω
Ω
A
4
figure 7.  
FWD  
figure 8.  
FWD  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn on gate resistor  
trr = f(I C  
)
trr = f(R gon  
)
t
t
350  
25 °C  
At  
VCE  
=
V
V
Ω
At  
VCE  
=
350  
±15  
75  
V
V
A
25 °C  
VGE  
=
=
±15  
Tj:  
VGE  
I C  
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
R gon  
4
=
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datasheet  
Low Boost Switching Characteristics  
figure 9.  
FWD  
figure 10.  
FWD  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of IGBT turn on gate resistor  
Q r = f(I C  
)
Q r = f(R gon)  
Q
Q
25 °C  
At  
VCE  
VGE  
R gon  
=
350  
±15  
4
V
V
Ω
At  
VCE  
VGE  
I C  
=
350  
±15  
75  
V
V
A
25 °C  
=
Tj:  
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
=
=
figure 11.  
FWD  
figure 12.  
FWD  
Typical peak reverse recovery current current as a function of collector current  
Typical peak reverse recovery current as a function of IGBT turn on gate resistor  
I RM = f(I C  
)
I RM = f(R gon)  
I
I
At  
VCE  
=
350  
±15  
4
V
V
Ω
At  
VCE  
VGE  
I C  
=
350  
±15  
75  
V
V
A
25 °C  
25 °C  
VGE  
=
=
Tj:  
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
R gon  
=
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datasheet  
Low Boost Switching Characteristics  
figure 13.  
FWD  
figure 14.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of IGBT turn on gate resistor  
di F/dt, di rr/dt = f(I C  
)
di F/dt, di rr/dt = f(R gon)  
diF/dt  
dir r/dt  
diF/dt  
dirr/dt  
t
t
i
i
At  
VCE  
=
350  
±15  
4
V
V
Ω
25 °C  
125 °C  
150 °C  
At  
VCE  
VGE  
I C  
=
350  
±15  
75  
V
V
A
25 °C  
125 °C  
150 °C  
VGE  
=
=
=
Tj:  
Tj:  
R gon  
=
figure 15.  
IGBT  
Reverse bias safe operating area  
I C = f(VCE  
)
IC MAX  
I
I
I
V
At  
Tj =  
175  
°C  
Ω
R gon  
R goff  
=
=
4
4
Ω
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10-FY07HVA075S5-L985F08  
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datasheet  
Low Boost Switching Definitions  
General conditions  
T j  
=
=
=
125 °C  
R gon  
R goff  
4 Ω  
4 Ω  
figure 1.  
IGBT  
figure 2.  
IGBT  
Turn-off Switching Waveforms & definition of tdoff, tEoff (tEoff = integrating time for Eoff  
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)  
tdoff  
IC  
IC  
VGE  
VGE  
VCE  
tEoff  
VCE  
tEon  
VGE (0%) =  
-15  
15  
V
VGE (0%) =  
-15  
V
VGE (100%) =  
VC (100%) =  
I C (100%) =  
V
VGE (100%) =  
VC (100%) =  
I C (100%) =  
15  
V
350  
75  
V
350  
75  
V
A
A
tdoff  
=
215  
ns  
tdon  
=
121  
ns  
figure 3.  
IGBT  
figure 4.  
IGBT  
Turn-off Switching Waveforms & definition of tf  
Turn-on Switching Waveforms & definition of tr  
IC  
IC  
VCE  
tr  
VCE  
tf  
VC (100%) =  
I C (100%) =  
tf =  
350  
75  
V
VC (100%) =  
I C (100%) =  
350  
75  
8
V
A
A
217  
ns  
tr  
=
ns  
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datasheet  
Low Boost Switching Characteristics  
figure 5.  
FWD  
figure 6.  
FWD  
Turn-off Switching Waveforms & definition of trr  
Turn-on Switching Waveforms & definition of tQr (tQr = integrating time for Qr)  
Qr  
IF  
IF  
fitted  
VF  
VF (100%) =  
I F (100%) =  
I RRM (100%) =  
350  
75  
V
I F (100%) =  
Q r (100%) =  
75  
A
A
3,82  
μC  
101  
89  
A
trr  
=
ns  
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datasheet  
High Boost Switching Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of gate resistor  
E = f(R g)  
E = f(I C  
)
E
E
25 °C  
25 °C  
With an inductive load at  
With an inductive load at  
VCE  
VGE  
=
=
=
=
350  
±15  
4
V
V
Ω
Ω
Tj:  
VCE  
VGE  
I C  
=
=
=
350  
±15  
75  
V
V
A
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
R gon  
R goff  
4
figure 3.  
FWD  
figure 4.  
FWD  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(I c)  
Erec = f(R g)  
E
E
With an inductive load at  
25 °C  
With an inductive load at  
25 °C  
VCE  
VGE  
=
=
=
350  
±15  
4
V
V
Ω
Tj:  
VCE  
VGE  
I C  
=
=
=
350  
±15  
75  
V
V
A
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
R gon  
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datasheet  
High Boost Switching Characteristics  
figure 5.  
IGBT  
figure 6.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of gate resistor  
t = f(I C  
)
t = f(R g)  
t
t
With an inductive load at  
With an inductive load at  
Tj =  
150  
350  
±15  
4
°C  
V
Tj =  
150  
350  
±15  
75  
°C  
V
VCE  
=
=
=
=
VCE  
=
=
=
VGE  
R gon  
R goff  
V
VGE  
I C  
V
Ω
Ω
A
4
figure 7.  
FWD  
figure 8.  
FWD  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn on gate resistor  
trr = f(I C  
)
trr = f(R gon  
)
t
t
25 °C  
At  
VCE  
=
350  
±15  
4
V
V
Ω
At  
VCE  
=
350  
V
V
A
25 °C  
VGE  
=
=
Tj:  
VGE  
I C  
=
±15  
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
R gon  
=
75  
Copyright Vincotech  
32  
04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
High Boost Switching Characteristics  
figure 9.  
FWD  
figure 10.  
FWD  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of IGBT turn on gate resistor  
Q r = f(I C  
)
Q r = f(R gon)  
Q
Q
25 °C  
At  
VCE  
VGE  
R gon  
=
350  
±15  
4
V
V
Ω
At  
VCE  
VGE  
I C  
=
350  
±15  
75  
V
V
A
25 °C  
=
Tj:  
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
=
=
figure 11.  
FWD  
figure 12.  
FWD  
Typical peak reverse recovery current current as a function of collector current  
Typical peak reverse recovery current as a function of IGBT turn on gate resistor  
I RM = f(I C  
)
I RM = f(R gon)  
I
I
25 °C  
At  
VCE  
=
350  
±15  
4
V
V
Ω
At  
VCE  
VGE  
I C  
=
350  
±15  
75  
V
V
A
25 °C  
VGE  
=
=
Tj:  
=
Tj:  
125 °C  
150 °C  
125 °C  
150 °C  
R gon  
=
Copyright Vincotech  
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04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
High Boost Switching Characteristics  
figure 13.  
FWD  
figure 14.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of IGBT turn on gate resistor  
di F/dt, di rr/dt = f(I C  
)
di F/dt, di rr/dt = f(R gon)  
diF/dt  
dir r/dt  
diF/dt  
dirr/dt  
t
t
i
i
At  
VCE  
=
350  
±15  
4
V
V
Ω
25 °C  
125 °C  
150 °C  
At  
VCE  
VGE  
I C  
=
350  
±15  
75  
V
V
A
25 °C  
VGE  
R gon  
=
=
=
125 °C  
Tj:  
Tj:  
=
150 °C  
figure 15.  
IGBT  
Reverse bias safe operating area  
I C = f(VCE  
)
IC MAX  
I
I
I
V
At  
Tj =  
175  
°C  
Ω
R gon  
R goff  
=
=
4
4
Ω
Copyright Vincotech  
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04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
High Boost Switching Definitions  
General conditions  
T j  
=
=
=
125 °C  
R gon  
R goff  
4 Ω  
4 Ω  
figure 1.  
IGBT  
figure 2.  
IGBT  
Turn-off Switching Waveforms & definition of tdoff, tEoff (tEoff = integrating time for Eoff  
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)  
tdoff  
IC  
IC  
VGE  
VGE  
VCE  
tEoff  
VCE  
tEon  
VGE (0%) =  
-15  
15  
V
VGE (0%) =  
-15  
V
VGE (100%) =  
VC (100%) =  
I C (100%) =  
V
VGE (100%) =  
VC (100%) =  
I C (100%) =  
15  
V
350  
75  
V
350  
75  
V
A
A
tdoff  
=
214  
ns  
tdon  
=
112  
ns  
figure 3.  
IGBT  
figure 4.  
IGBT  
Turn-off Switching Waveforms & definition of tf  
Turn-on Switching Waveforms & definition of tr  
IC  
IC  
VCE  
tr  
VCE  
tf  
VC (100%) =  
I C (100%) =  
tf =  
350  
75  
V
VC (100%) =  
I C (100%) =  
350  
75  
7
V
A
A
218  
ns  
tr  
=
ns  
Copyright Vincotech  
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04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
High Boost Switching Characteristics  
figure 5.  
FWD  
figure 6.  
FWD  
Turn-off Switching Waveforms & definition of trr  
Turn-on Switching Waveforms & definition of tQr (tQr = integrating time for Qr)  
Qr  
IF  
IF  
fitted  
VF  
VF (100%) =  
I F (100%) =  
I RRM (100%) =  
350  
75  
V
I F (100%) =  
Q r (100%) =  
75  
A
A
4,02  
μC  
109  
91  
A
trr  
=
ns  
Copyright Vincotech  
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04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
Ordering Code & Marking  
Version  
without thermal paste 12 mm housing with solder pins  
without thermal paste 12 mm housing with press-fit pins  
Ordering Code  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
Name  
Date code  
WWYY  
UL & VIN  
UL VIN  
Lot  
Serial  
NN-NNNNNNNNNNNNNN  
TTTTTTVVWWYY UL  
VIN LLLLL SSSS  
Text  
NN-NNNNNNNNNNNNNN-TTTTTTVV  
LLLLL  
SSSS  
Type&Ver  
Lot number  
Serial  
Date code  
WWYY  
Datamatrix  
TTTTTTTVV  
LLLLL  
SSSS  
Outline  
Pin table  
Pin  
X
Y
0
0
Function  
G14  
52,2  
49,2  
1
2
S14  
3
4
Not assembled  
26,1  
0
0
Therm2  
5
23,1  
Therm1  
S12  
6
3
0
0
0
0
0
7
0
G12  
8
8
DC+  
9
10,5  
17,7  
DC+  
10  
DC-1  
11  
12  
13  
0
0
3
20,2  
28,2  
28,2  
DC-1  
G11  
S11  
14  
15  
16  
17  
18  
19  
20  
21  
22  
10  
28,2  
28,2  
28,2  
28,2  
28,2  
28,2  
28,2  
28,2  
28,2  
G21  
S21  
Ph2  
Ph2  
Ph1  
Ph1  
S22  
G22  
S13  
13  
20,35  
22,85  
29,35  
31,85  
39,2  
42,2  
49,2  
23  
24  
25  
26  
27  
28  
52,2  
52,2  
52,2  
52,2  
52,2  
26,1  
28,2  
20,2  
17,7  
10,5  
8
G13  
DC-2  
DC-2  
DC+  
DC+  
A20  
22,1  
Copyright Vincotech  
37  
04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
Pinout  
Identification  
ID  
Component  
Voltage  
Current  
Function  
Comment  
T11 , T12 , T13, T14  
IGBT  
650 V  
75 A  
50 A  
75 A  
50 A  
High Buck Switch / Low Buck Switch  
Buck Diode  
D21, D22  
T21, T22  
D12, D14, D20  
Rt  
FWD  
IGBT  
FWD  
NTC  
650 V  
650 V  
650 V  
Boost Switch  
Low Boost Diode / High Boost diode  
Thermistor  
Copyright Vincotech  
38  
04 Jul. 2019 / Revision 3  
10-FY07HVA075S5-L985F08  
10-PY07HVA075S5-L985F08Y  
datasheet  
Packaging instruction  
Handling instruction  
Standard packaging quantity (SPQ) 100  
>SPQ  
Standard  
<SPQ  
Sample  
Handling instructions for flow 1 packages see vincotech.com website.  
Package data  
Package data for flow 1 packages see vincotech.com website.  
UL recognition and file number  
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.  
Document No.:  
Date:  
Modification:  
Pages  
10-xY07HVA075S5-L985F08x-D3-14  
04 Jul. 2019  
Correction of Ic/If values  
2
DISCLAIMER  
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to  
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations  
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,  
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said  
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons  
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine  
the suitability of the information and the product for reader’s intended use.  
LIFE SUPPORT POLICY  
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval  
of Vincotech.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or  
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be  
reasonably expected to result in significant injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or effectiveness.  
Copyright Vincotech  
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04 Jul. 2019 / Revision 3  

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