10-FZ122PB100SC02-M819F08 [VINCOTECH]

Easy paralleling;Low turn-off losses;Low collector emitter saturation voltage;Positive temperature coefficient;Short tail current;
10-FZ122PB100SC02-M819F08
型号: 10-FZ122PB100SC02-M819F08
厂家: VINCOTECH    VINCOTECH
描述:

Easy paralleling;Low turn-off losses;Low collector emitter saturation voltage;Positive temperature coefficient;Short tail current

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中文:  中文翻译
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10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
flowPHASE 0 + NTC  
1200 V / 100 A  
Features  
flow 0 housing  
17 mm housing  
solder pin /  
Press-fit pin  
● High efficiency IGBT4 half-bridge  
● Full current FWD  
● Thermistor  
12 mm housing  
solder pin /  
Press-fit pin  
Schematic  
Target applications  
● Industrial Drives  
● Power Supply  
● Solar Inverters  
● UPS  
● Welding & Cutting  
Types  
● 10-FZ122PB100SC02-M819F08  
● 10-PZ122PB100SC02-M819F08Y  
● 10-F0122PB100SC02-M819F09  
● 10-P0122PB100SC02-M819F09Y  
Maximum Ratings  
T
j
= 25 °C, unless otherwise specified  
Parameter  
Symbol  
Condition  
Value  
Unit  
Half-Bridge Switch  
VCES  
IC  
Collector-emitter voltage  
1200  
98  
V
A
Collector current  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
Tj = 150 °C  
ICRM  
Ptot  
VGES  
tSC  
Repetitive peak collector current  
Total power dissipation  
Gate-emitter voltage  
tp limited by Tjmax  
Tj = Tjmax  
300  
199  
±20  
10  
A
W
V
Short circuit ratings  
VGE = 15 V  
Vcc = 800 V  
µs  
°C  
Tjmax  
Maximum junction temperature  
175  
Copyright Vincotech  
1
17 Aug. 2018 / Revision 1  
10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Condition  
Value  
Unit  
Half-Bridge Diode  
VRRM  
IF  
IFRM  
Ptot  
Peak repetitive reverse voltage  
1200  
79  
V
A
Continuous (direct) forward current  
Repetitive peak forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
200  
123  
175  
A
Tj = Tjmax  
W
°C  
Tjmax  
Maximum junction temperature  
Module Properties  
Thermal Properties  
Tstg  
Tjop  
Storage temperature  
-40…+125  
°C  
°C  
Operation temperature under switching condition  
Isolation Properties  
-40…(Tjmax - 25)  
DC Test Voltage*  
AC Voltage  
tp = 2 s  
6000  
2500  
V
V
Visol  
Isolation voltage  
Creepage distance  
Clearance  
tp = 1 min  
min. 12,7  
9,12 / 9,54  
min. 12,7  
mm  
12 mm housing solder pin / Press-fit pin  
17 mm housing solder pin / Press-fit pin  
mm  
Copyright Vincotech  
2
17 Aug. 2018 / Revision 1  
10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
Characteristic Values  
Parameter  
Symbol  
Conditions  
Value  
Typ  
Unit  
VCE [V] IC [A]  
VGE [V]  
VGS [V]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
Min  
Max  
Half-Bridge Switch  
Static  
VGE(th)  
Gate-emitter threshold voltage  
VGE = VCE  
0,0038 25  
25  
5,1  
5,8  
6,4  
V
V
1,53  
1,72  
1,97  
2,01  
1,97  
VCEsat  
Collector-emitter saturation voltage  
15  
100  
125  
150  
ICES  
IGES  
rg  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
0
1200  
0
25  
25  
1,3  
µA  
nA  
Ω
20  
120  
7,5  
6300  
270  
Cies  
Cres  
Qg  
f = 1 Mhz  
0
25  
25  
25  
pF  
Reverse transfer capacitance  
Gate charge  
15  
800  
nC  
Thermal  
λpaste=3,4 W/mK  
(PSX)  
Rth(j-s)  
Thermal resistance junction to sink  
0,48  
K/W  
Dynamic  
25  
125  
25  
125  
25  
125  
25  
125  
25  
125  
25  
125  
171  
184  
33  
37  
293  
365  
60  
121  
6,905  
10,138  
6,265  
9,373  
td(on)  
tr  
td(off)  
tf  
Turn-on delay time  
Rise time  
Rgon = 4 Ω  
Rgoff = 4 Ω  
ns  
Turn-off delay time  
Fall time  
±15  
600  
100  
Qr  
Qr  
= 9,1 μC  
= 16,8 μC  
FWD  
Eon  
Eoff  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
FWD  
mWs  
Copyright Vincotech  
3
17 Aug. 2018 / Revision 1  
10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
Characteristic Values  
Parameter  
Symbol  
Conditions  
Value  
Typ  
Unit  
VCE [V] IC [A]  
VGE [V]  
VGS [V]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
Min  
Max  
Half-Bridge Diode  
Static  
25  
1,77  
1,75  
1,73  
2,05  
18  
VF  
IR  
125  
150  
Forward voltage  
100  
V
Reverse leakage current  
1200  
25  
µA  
Thermal  
λpaste=3,4 W/mK  
(PSX)  
Rth(j-s)  
Thermal resistance junction to sink  
0,78  
K/W  
Dynamic  
25  
125  
25  
125  
25  
125  
25  
125  
25  
125  
104  
119  
247  
IRRM  
Peak recovery current  
Reverse recovery time  
Recovered charge  
A
trr  
Qr  
ns  
392  
di/dt = 3987 A/μs  
di/dt = 3060 A/μs  
9,064  
16,837  
3,237  
6,304  
3017  
1630  
±15  
600  
100  
μC  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
mWs  
A/µs  
(dirf/dt)max  
Thermistor  
R
ΔR/R  
P
Rated resistance  
25  
100  
25  
25  
25  
25  
22  
kΩ  
%
Deviation of R100  
Power dissipation  
Power dissipation constant  
B-value  
R100 = 1484 Ω  
-5  
5
5
mW  
mW/K  
K
1,5  
B(25/50)  
Tol. ±1 %  
Tol. ±1 %  
3962  
4000  
B(25/100)  
B-value  
K
Vincotech NTC Reference  
I
Copyright Vincotech  
4
17 Aug. 2018 / Revision 1  
10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
Half-Bridge Switch Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical output characteristics  
Typical output characteristics  
I C = f(VCE  
)
I C = f(VCE  
)
300  
300  
VGE  
:
7 V  
I
I
I
I
I
I
I
I
8 V  
250  
200  
150  
100  
50  
9 V  
250  
200  
150  
100  
50  
10 V  
11 V  
12 V  
13 V  
14 V  
15 V  
16 V  
17 V  
0
0
0
1
2
3
4
5
0
1
2
3
4
5
VC E (V)  
VC E (V)  
tp  
=
250  
15  
μs  
V
25 °C  
125 °C  
150 °C  
tp  
Tj  
=
=
250  
150  
7 V to 17 V in steps of 1 V  
μs  
=
:
Tj  
°C  
VGE  
VGE from  
figure 3.  
IGBT  
figure 4.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as function of pulse duration  
I C = f(VGE  
)
Z th(j-s) = f(tp)  
100  
100  
I
I
I
I
80  
60  
40  
20  
0
Z
Z
Z
Z
10-1  
10-2  
10-3  
0,5  
0,2  
0,1  
0,05  
0,02  
0,01  
0,005  
0
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
tp(s)  
102  
0
2
4
6
8
10  
12  
VG E (V)  
tp  
=
100  
10  
μs  
V
25 °C  
125 °C  
150 °C  
D =  
R th(j-s)  
IGBT thermal model values  
(K/W)  
t
p / T  
VCE  
=
Tj:  
=
0,48  
K/W  
R
τ
(s)  
9,76E-02  
1,99E-01  
1,27E-01  
3,20E-02  
1,66E-02  
4,53E-03  
9,68E-01  
1,64E-01  
6,12E-02  
1,05E-02  
9,83E-04  
3,89E-04  
Copyright Vincotech  
5
17 Aug. 2018 / Revision 1  
10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
Half-Bridge Switch Characteristics  
figure 6.  
IGBT  
Safe operating area  
I C = f(VCE  
)
1000  
1ms  
10µs  
100µs  
10ms  
I
I
I
I
100ms  
DC  
100  
10  
1
0,1  
0,01  
1
10  
100  
1000  
10000  
VC E (V)  
D =  
single pulse  
80 ºC  
Ts  
=
VGE  
=
±15  
V
Tj =  
Tjmax  
Copyright Vincotech  
6
17 Aug. 2018 / Revision 1  
10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
Half-Bridge Diode Characteristics  
figure 1.  
FWD  
figure 2.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
= f(  
300  
)
= f( )  
tp  
I F  
VF  
Z th(j-s)  
100  
250  
200  
150  
100  
50  
Z
Z
Z
Z
10-1  
0,5  
0,2  
0,1  
0,05  
0,02  
0,01  
0,005  
0
10-2  
=
0
10-4  
=
10-3  
10-2  
10-1  
100  
101  
102  
tp (s)  
0
1
2
3
4
VF (V)  
=
250  
μs  
25 °C  
125 °C  
150 °C  
/
tp  
tp  
D
T
:
Tj  
R th(j-s)  
0,78  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
3,30E-02  
9,76E-02  
3,59E-01  
2,01E-01  
5,37E-02  
3,09E-02  
5,07E+00  
9,33E-01  
1,37E-01  
4,10E-02  
6,38E-03  
6,30E-04  
Thermistor Characteristics  
Typical Thermistor resistance values  
figure 1.  
Thermistor  
Typical NTC characteristic as a function of temperature  
as a function of temperature  
R = f(T)  
NTC-typical temperature characteristic  
25000  
20000  
15000  
10000  
5000  
0
25  
50  
75  
100  
125  
T (°C)  
Copyright Vincotech  
7
17 Aug. 2018 / Revision 1  
10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
Inverter Switching Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of gate resistor  
E = f(R g)  
E = f(IC  
)
25  
20  
E
E
E
E
E
E
E
E
Eon  
20  
15  
10  
5
Eon  
15  
10  
5
Eoff  
Eon  
Eoff  
Eoff  
Eon  
Eoff  
0
0
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
200  
0
2
4
6
8
10  
12  
14  
16  
18  
R
g (Ω)  
IC (A)  
With an inductive load at  
25 °C  
With an inductive load at  
25 °C  
125 °C  
Tj:  
Tj:  
VCE  
VGE  
=
=
=
=
600  
±15  
4
V
V
Ω
Ω
VCE  
VGE  
IC  
=
=
=
600  
±15  
100  
V
V
A
125 °C  
R gon  
R goff  
4
figure 3.  
FWD  
figure 4.  
FWD  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(Ic)  
Erec = f(R g)  
8
10  
E
E
E
E
E
E
E
E
Erec  
8
6
4
2
0
6
4
2
0
Erec  
Erec  
Erec  
0
2
4
6
8
10  
12  
14  
16  
18  
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
IC (A)  
200  
R
g (Ω)  
With an inductive load at  
25 °C  
With an inductive load at  
25 °C  
Tj:  
Tj:  
VCE  
VGE  
=
=
=
600  
±15  
4
V
V
Ω
VCE  
VGE  
IC  
=
=
=
600  
±15  
100  
V
V
A
125 °C  
125 °C  
R gon  
Copyright Vincotech  
8
17 Aug. 2018 / Revision 1  
10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
Inverter Switching Characteristics  
figure 5.  
IGBT  
figure 6.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of gate resistor  
t = f(I C  
)
t = f(R g)  
1
1
td(off)  
t
t
t
t
t
t
t
t
td(off)  
td(on)  
td(on)  
tf  
tf  
0,1  
0,1  
tr  
tr  
0,01  
0,01  
0
2
4
6
8
10  
12  
14  
16  
18  
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
200  
Rg (Ω)  
IC (A)  
With an inductive load at  
With an inductive load at  
Tj  
VCE  
=
=
=
=
=
125  
600  
±15  
4
°C  
V
Tj  
VCE  
VGE  
I C  
=
=
=
=
125  
600  
±15  
100  
°C  
V
VGE  
V
V
R gon  
R goff  
Ω
Ω
A
4
figure 7.  
FWD  
figure 8.  
FWD  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn on gate resistor  
trr = f(I C  
)
trr = f(R gon  
)
0,5  
0,6  
trr  
trr  
t
t
t
t
t
t
t
t
0,5  
0,4  
0,3  
0,2  
0,1  
0
0,4  
0,3  
0,2  
0,1  
0
trr  
trr  
0
20  
40  
600  
60  
80  
100  
120  
140  
160  
180  
IC (A)  
200  
0
2
4
6
8
10  
12  
14  
16  
18  
Rgon (Ω)  
At  
VCE  
=
V
At  
VCE  
=
600  
±15  
100  
V
V
A
25 °C  
25 °C  
125 °C  
Tj:  
Tj:  
VGE  
R gon  
=
=
±15  
4
V
VGE  
I C  
=
125 °C  
Ω
=
Copyright Vincotech  
9
17 Aug. 2018 / Revision 1  
10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
Inverter Switching Characteristics  
figure 9.  
FWD  
figure 10.  
FWD  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of IGBT turn on gate resistor  
Q r = f(I C  
)
Q r = f(R gon)  
25  
20  
Qr  
Q
Q
Q
Q
Q
Q
Q
Q
Qr  
20  
15  
10  
5
15  
10  
5
Qr  
Qr  
0
0
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
IC (A)  
200  
0
2
4
6
8
10  
12  
14  
16  
18  
Rg on (Ω)  
At  
VCE  
VGE  
R gon  
=
600  
±15  
4
V
V
Ω
At  
VCE  
VGE  
I C  
=
600  
±15  
100  
V
V
A
25 °C  
25 °C  
Tj:  
Tj:  
=
=
125 °C  
125 °C  
=
=
figure 11.  
FWD  
figure 12.  
FWD  
Typical peak reverse recovery current current as a function of collector current  
Typical peak reverse recovery current as a function of IGBT turn on gate resistor  
I RM = f(I C  
)
I RM = f(R gon  
)
160  
160  
IRM  
I
I
I I  
I I  
I
I
120  
80  
40  
0
120  
80  
40  
0
IRM  
IRM  
IRM  
0
2
4
6
8
10  
12  
14  
16  
18  
Rgo n (Ω)  
0
50  
100  
150  
200  
IC (A)  
At  
VCE  
=
600  
±15  
4
V
V
Ω
At  
VCE  
=
600  
±15  
100  
V
V
A
25 °C  
125 °C  
25 °C  
125 °C  
Tj:  
Tj:  
VGE  
=
=
VGE  
I C  
=
R gon  
=
Copyright Vincotech  
10  
17 Aug. 2018 / Revision 1  
10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
Inverter Switching Characteristics  
figure 13.  
FWD  
figure 14.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of IGBT turn on gate resistor  
di F/dt, di rr/dt = f(I C  
)
di F/dt, di rr/dt = f(R gon  
)
5000  
5000  
d
iF/d  
t
t
d
iF/dt  
t
t
t t  
t t  
t
t
d
i
r r/d  
dirr/dt  
i
i
i i  
i i  
i
i
4000  
3000  
2000  
1000  
0
4000  
3000  
2000  
1000  
0
0
5
10  
15  
20  
Rgon (Ω)  
0
20  
40  
600  
60  
80  
100  
120  
140  
160  
180  
200  
IC (A)  
At  
VCE  
=
V
25 °C  
125 °C  
At  
VCE  
VGE  
I C  
=
600  
±15  
100  
V
V
A
25 °C  
125 °C  
±15  
4
V
:
=
:
Tj  
VGE  
=
=
Tj  
R gon  
Ω
=
figure 15.  
IGBT  
Reverse bias safe operating area  
I C = f(VCE  
)
250  
I
I
I
I
IC MAX  
200  
150  
100  
50  
I
I
I
I
I
I
I
I
V
V
V
V
0
0
200  
400  
600  
800  
1000  
1200  
1400  
C E (V)  
V
At  
Tj  
=
=
=
125  
°C  
Ω
R gon  
R goff  
4
4
Ω
Copyright Vincotech  
11  
17 Aug. 2018 / Revision 1  
10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
Inverter Switching Definitions  
General conditions  
=
=
=
T j  
125 °C  
4 Ω  
4 Ω  
R gon  
R goff  
figure 1.  
IGBT  
figure 2.  
IGBT  
Turn-off Switching Waveforms & definition of tdoff, tEoff (tEoff = integrating time for Eoff  
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)  
tdoff  
%
%
VGE 90%  
VCE 90%  
IC  
IC  
VGE  
VGE  
VCE  
tdon  
tEoff  
IC 1%  
VCE 3%  
VCE  
IC 10%  
VGE 10%  
tEon  
t (µs)  
t (µs)  
VGE (0%) =  
-15  
15  
V
VGE (0%) =  
-15  
V
V
V
GE (100%) =  
C (100%) =  
V
VGE (100%) =  
VC (100%) =  
I C (100%) =  
15  
V
600  
100  
365  
V
600  
100  
184  
V
I
C (100%) =  
A
A
tdoff  
=
ns  
tdon  
=
ns  
figure 3.  
IGBT  
figure 4.  
IGBT  
Turn-off Switching Waveforms & definition of tf  
Turn-on Switching Waveforms & definition of tr  
fitted  
%
%
IC  
IC  
IC 90%  
IC 60%  
IC 40%  
VCE  
IC 90%  
tr  
IC10%  
VCE  
IC 10%  
tf  
t (µs)  
t (µs)  
VC (100%) =  
C (100%) =  
tf  
600  
100  
121  
V
VC (100%) =  
I C (100%) =  
600  
100  
37  
V
I
A
A
=
ns  
tr  
=
ns  
Copyright Vincotech  
12  
17 Aug. 2018 / Revision 1  
10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
Inverter Switching Characteristics  
figure 5.  
FWD  
figure 6.  
FWD  
Turn-off Switching Waveforms & definition of trr  
Turn-on Switching Waveforms & definition of tQr (tQr  
=
integrating time for Qr)  
%
%
Qr  
trr  
tQr  
IF  
IF  
fitted  
IRRM 10%  
VF  
IRRM 90%  
IRRM 100%  
t
(µs)  
t
(µs)  
VF (100%) =  
600  
100  
119  
392  
V
I F (100%) =  
Q r (100%) =  
100  
A
I
I
F (100%) =  
A
16,84  
μC  
RRM (100%) =  
A
trr  
=
ns  
Copyright Vincotech  
13  
17 Aug. 2018 / Revision 1  
10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
Ordering Code & Marking  
Version  
without thermal paste 12 mm housing with solder pins  
with thermal paste 12 mm housing with solder pins  
without thermal paste 12 mm housing with Press-fit pins  
with thermal paste 12 mm housing with Press-fit pins  
without thermal paste 17 mm housing with solder pins  
with thermal paste 17 mm housing with solder pins  
without thermal paste 17 mm housing with Press-fit pins  
with thermal paste 17 mm housing with Press-fit pins  
Ordering Code  
10-FZ122PB100SC02-M819F08  
10-FZ122PB100SC02-M819F08-/3/  
10-PZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y-/3/  
10-F0122PB100SC02-M819F09  
10-F0122PB100SC02-M819F09-/3/  
10-P0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y-/3/  
Name  
Date code  
WWYY  
Serial  
UL & VIN  
UL VIN  
Lot  
Serial  
NN-NNNNNNNNNNNNNN  
TTTTTTVV WWYY UL  
VIN LLLLL SSSS  
Text  
NN-NNNNNNNNNNNNNN-TTTTTTVV  
LLLLL  
SSSS  
Type&Ver  
Lot number  
Date code  
WWYY  
Datamatrix  
TTTTTTTVV  
LLLLL  
SSSS  
Outline  
Pin table  
Pin  
X
0
0
0
0
0
0
0
0
Y
Function  
DC-  
0
1
2
2,3  
4,6  
6,9  
15,6  
17,9  
20,2  
22,5  
DC-  
DC-  
3
4
5
6
7
8
9
DC-  
DC+  
DC+  
DC+  
DC+  
G12  
13,85 16,45  
16,75 16,45  
10  
11  
12  
13  
14  
S12  
Ph  
Ph  
33,5  
33,5  
33,5  
33,5  
11,5  
9,2  
6,9  
4,6  
Ph  
Ph  
15  
16  
17  
18  
19  
20  
21  
33,5  
33,5  
2,3  
0
Ph  
Ph  
13,85 13,55  
Ph  
19,55  
19,55  
33,5  
4,95  
7,85  
22,5  
22,5  
S11  
G11  
Therm1  
Therm2  
26,1  
Copyright Vincotech  
14  
17 Aug. 2018 / Revision 1  
10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
Pinout  
Identification  
ID  
Component  
Voltage  
Current  
Function  
Comment  
T11, T12  
IGBT  
1200 V  
100 A  
100 A  
Half-Bridge Switch  
D11, D12  
Rt  
FWD  
NTC  
1200 V  
Half-Bridge Diode  
Thermistor  
Copyright Vincotech  
15  
17 Aug. 2018 / Revision 1  
10-FZ122PB100SC02-M819F08Y  
10-PZ122PB100SC02-M819F08Y  
10-F0122PB100SC02-M819F09Y  
10-P0122PB100SC02-M819F09Y  
datasheet  
Packaging instruction  
Standard packaging quantity (SPQ) 135  
>SPQ  
Standard  
<SPQ  
Sample  
Handling instruction  
Handling instructions for flow 0 packages see vincotech.com website.  
Package data  
Package data for flow 0 packages see vincotech.com website.  
UL recognition and file number  
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.  
Document No.:  
Date:  
Modification:  
Pages  
10-FZ122PB100SC02-M819F0xx-D1-14  
17 Aug. 2018  
Initial release  
DISCLAIMER  
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to  
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations  
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,  
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said  
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons  
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine  
the suitability of the information and the product for reader’s intended use.  
LIFE SUPPORT POLICY  
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval  
of Vincotech.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or  
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be  
reasonably expected to result in significant injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or effectiveness.  
Copyright Vincotech  
16  
17 Aug. 2018 / Revision 1  

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