IRLD014PBF [VISHAY]
Power MOSFET; 功率MOSFET型号: | IRLD014PBF |
厂家: | VISHAY |
描述: | Power MOSFET |
文件: | 总8页 (文件大小:1729K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
IRLD014, SiHLD014
Vishay Siliconix
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
60
Available
• For Automatic Insertion
R
DS(on) ()
VGS = 5 V
0.20
RoHS*
• End Stackable
Qg (Max.) (nC)
8.4
2.6
COMPLIANT
• Logic-Level Gate Drive
Q
Q
gs (nC)
gd (nC)
6.4
• RDS(on) Specified at VGS = 4 V and 5 V
• 175 °C Operating Temperature
• Fast Switching
Configuration
Single
D
HVMDIP
• Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The 4 pin DIP package is a low cost machine-insertiable
case style which can be stacked in multiple combinations on
standard 0.1" pin centers. The dual drain servers as a
thermal link to the mounting surface for power dissipation
levels up to 1 W.
G
S
G
D
S
N-Channel MOSFET
ORDERING INFORMATION
Package
HVMDIP
IRLD014PbF
SiHLD014-E3
IRLD014
Lead (Pb)-free
SnPb
SiHLD014
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
60
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
10
TA = 25 °C
TA = 100 °C
1.7
Continuous Drain Current
VGS at 5.0 V
ID
1.2
14
A
Pulsed Drain Currenta
IDM
Linear Derating Factor
0.0083
490
W/°C
mJ
Single Pulse Avalanche Energyb
Maximum Power Dissipation
EAS
PD
T
A = 25 °C
1.3
W
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
4.5
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
- 55 to + 175
300d
°C
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, starting TJ = 25 °C, L = 197 mH, Rg = 25 , IAS = 1.7 A (see fig. 12).
c. ISD 10 A, dI/dt 90 A/µs, VDD VDS, TJ 175 °C.
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91307
S10-2465-Rev. D, 08-Nov-10
www.vishay.com
1
IRLD014, SiHLD014
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYP.
MAX.
UNIT
Maximum Junction-to-Ambient
RthJA
-
120
°C/W
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-Source Breakdown Voltage
VDS
VDS/TJ
VGS(th)
IGSS
VGS = 0 V, ID = 250 µA
Reference to 25 °C, ID = 1 mA
VDS = VGS, ID = 250 µA
60
-
-
V
V/°C
V
V
DS Temperature Coefficient
-
0.070
-
Gate-Source Threshold Voltage
Gate-Source Leakage
1.0
-
-
-
-
-
-
-
2.0
100
25
VGS
VDS = 60 V, VGS = 0 V
DS = 48 V, VGS = 0 V, TJ = 150 °C
=
10 V
-
nA
-
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
IDSS
µA
V
-
-
250
0.20
0.28
-
VGS = 5.0 V
VGS = 4.0 V
ID = 1.0 Ab
RDS(on)
gfs
ID = 0.85 Ab
-
Forward Transconductance
Dynamic
VDS = 25 V, ID = 1.0 Ab
1.9
S
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Ciss
Coss
Crss
Qg
-
-
-
-
-
-
-
-
-
-
400
170
42
-
-
VGS = 0 V
DS = 25 V
f = 1.0 MHz, see fig. 5
V
-
pF
nC
-
8.4
2.6
6.4
-
ID = 10 A, VDS = 48 V
see fig. 6 and 13b
Qgs
Qgd
td(on)
tr
V
GS = 5.0 V
-
-
9.3
110
17
26
-
V
DD = 30 V, ID = 10 A
ns
Turn-Off Delay Time
Fall Time
td(off)
tf
Rg = 12 , RD = 2.8 , see fig. 10b
-
-
D
Between lead,
Internal Drain Inductance
LD
LS
-
-
4.0
6.0
-
-
6 mm (0.25") from
package and center of
die contact
nH
G
Internal Source Inductance
S
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
D
MOSFET symbol
showing the
integral reverse
p - n junction diode
IS
-
-
-
-
1.7
14
A
G
Pulsed Diode Forward Currenta
ISM
S
Body Diode Voltage
VSD
trr
TJ = 25 °C, IS = 1.7 A, VGS = 0 Vb
-
-
-
-
1.6
130
0.65
V
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
93
ns
µC
TJ = 25 °C, IF = 10 A, dI/dt = 100 A/µsb
Qrr
ton
0.34
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width 300 µs; duty cycle 2 %.
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Document Number: 91307
S10-2465-Rev. D, 08-Nov-10
IRLD014, SiHLD014
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
20 µs PULSE WIDTH
T
= 25 °C
A
Fig. 1 - Typical Output Characteristics, TA = 25 °C
Fig. 3 - Typical Transfer Characteristics
20 µs PULSE WIDTH
T
A
= 175 °C
Fig. 2 - Typical Output Characteristics, TA = 175 °C
Fig. 4 - Normalized On-Resistance vs. Temperature
Document Number: 91307
S10-2465-Rev. D, 08-Nov-10
www.vishay.com
3
IRLD014, SiHLD014
Vishay Siliconix
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
Fig. 7 - Typical Source-Drain Diode Forward Voltage
T
T
= 25 °C
= 175 °C
A
J
SINGLE PULSE
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
Fig. 8 - Maximum Safe Operating Area
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Document Number: 91307
S10-2465-Rev. D, 08-Nov-10
IRLD014, SiHLD014
Vishay Siliconix
RD
VDS
VGS
D.U.T.
Rg
+
V
-
DD
10 V
Pulse width ≤ 1 µs
Duty factor ≤ 0.1 %
Fig. 10a - Switching Time Test Circuit
VDS
90 %
10 %
VGS
T , Ambient Temperature (°C)
A
td(on) tr
td(off) tf
Fig. 9 - Maximum Drain Current vs. Ambient Temperature
Fig. 10b - Switching Time Waveforms
t , Rectangular Pulse Duration (s)
1
Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Document Number: 91307
S10-2465-Rev. D, 08-Nov-10
www.vishay.com
5
IRLD014, SiHLD014
Vishay Siliconix
L
VDS
VDS
Vary tp to obtain
required IAS
tp
VDD
D.U.T.
IAS
Rg
+
-
VDD
VDS
10 V
0.01 W
tp
IAS
Fig. 12a - Unclamped Inductive Test Circuit
Fig. 12b - Unclamped Inductive Waveforms
Fig. 12c - Maximum Avalanche Energy vs. Drain Current
Current regulator
Same type as D.U.T.
50 kΩ
QG
VGS
12 V
0.2 µF
0.3 µF
QGS
QGD
+
-
VDS
D.U.T.
VG
VGS
3 mA
Charge
IG
ID
Current sampling resistors
Fig. 13b - Gate Charge Test Circuit
Fig. 13a - Basic Gate Charge Waveform
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Document Number: 91307
S10-2465-Rev. D, 08-Nov-10
IRLD014, SiHLD014
Vishay Siliconix
Peak Diode Recovery dV/dt Test Circuit
+
Circuit layout considerations
• Low stray inductance
• Ground plane
D.U.T.
• Low leakage inductance
current transformer
-
+
-
-
+
Rg
• dV/dt controlled by Rg
+
• Driver same type as D.U.T.
• ISD controlled by duty factor “D”
• D.U.T. - device under test
VDD
-
Driver gate drive
P.W.
P.W.
D =
Period
Period
V
GS = 10 Va
D.U.T. lSD waveform
D.U.T. VDS waveform
Reverse
recovery
current
Body diode forward
current
dI/dt
Diode recovery
dV/dt
VDD
Re-applied
voltage
Body diode forward drop
Inductor current
ISD
Ripple ≤ 5 %
Note
a. VGS = 5 V for logic level devices
Fig. 14 - For N-Channel
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?91307.
Document Number: 91307
S10-2465-Rev. D, 08-Nov-10
www.vishay.com
7
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
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liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
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requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
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provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Document Number: 91000
Revision: 11-Mar-11
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