SI2309CDS-T1-GE3 [VISHAY]

P-Channel 60-V (D-S) MOSFET; P通道60 -V (D -S )的MOSFET
SI2309CDS-T1-GE3
型号: SI2309CDS-T1-GE3
厂家: VISHAY    VISHAY
描述:

P-Channel 60-V (D-S) MOSFET
P通道60 -V (D -S )的MOSFET

晶体 晶体管 功率场效应晶体管 开关 光电二极管 CD PC
文件: 总6页 (文件大小:108K)
中文:  中文翻译
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New Product  
Si2309CDS  
Vishay Siliconix  
P-Channel 60-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free Option Available  
TrenchFET® Power MOSFET  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)d  
0.345 at VGS = - 10 V  
0.450 at VGS = - 4.5 V  
- 1.6  
- 1.4  
- 60  
2.7 nC  
APPLICATIONS  
Load Switch  
TO-236  
(SOT-23)  
G
S
1
3
2
D
S
G
Top View  
Si2309CDS (N9)*  
* Marking Code  
D
Ordering Information: Si2309CDS-T1-E3 (Lead (Pb)-free)  
Si2309CDS-T1-GE3 (Lead (Pb)-free and Halogen-free)  
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
- 60  
20  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
- 1.6  
- 1.3  
Continuous Drain Current (TJ = 150 °C)a, b  
ID  
- 1.2a, b  
- 1.0a, b  
- 8  
A
IDM  
IAS  
Pulsed Drain Current (10 µs Pulse Width)  
Single Pulse Avalanche Current  
- 5  
L = 0.1 mH  
TC = 25 °C  
TA = 25 °C  
TC = 25 °C  
- 1.4  
IS  
Continuous Source-Drain Diode Current  
- 0.9a, b  
1.7  
T
C = 70 °C  
A = 25 °C  
1.1  
PD  
W
Maximum Power Dissipation  
1.0a, b  
T
0.67a, b  
- 55 to 150  
260  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)c  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambienta, c  
Symbol  
Typical  
92  
Maximum  
120  
Unit  
RthJA  
t 5 s  
°C/W  
RthJF  
Maximum Junction-to-Foot (Drain)  
Steady State  
58  
73  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. t = 5 s.  
c. Maximum under Steady State conditions is 166 °C/W.  
d. When TC = 25 °C.  
Document Number: 68980  
S-82584-Rev. A, 27-Oct-08  
www.vishay.com  
1
New Product  
Si2309CDS  
Vishay Siliconix  
SPECIFICATIONS T = 25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
VDS  
ΔVDS/TJ  
ΔVGS(th)/TJ  
VGS(th)  
VGS = 0 V, ID = - 250 µA  
ID = - 250 µA  
Drain-Source Breakdown Voltage  
- 60  
V
V
DS Temperature Coefficient  
- 65  
4.5  
mV/°C  
VGS(th) Temperature Coefficient  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
VDS = VGS, ID = - 250 µA  
- 1  
- 6  
- 3  
- 100  
- 1  
V
IGSS  
VDS = 0 V, VGS  
=
20 V  
nA  
VDS = - 60 V, VGS = 0 V  
DS = - 60 V, VGS = 0 V, TJ = 55 °C  
VDS 5 V, VGS = - 10 V  
IDSS  
ID(on)  
RDS(on)  
gfs  
Zero Gate Voltage Drain Current  
On-State Drain Currenta  
µA  
A
V
- 10  
VGS = - 10 V, ID = - 1.25 A  
0.285  
0.360  
2.8  
0.345  
0.450  
Drain-Source On-State Resistancea  
Ω
S
VGS = - 4.5 V, ID = - 1.0 A  
Forward Transconductancea  
VDS = - 10 V, ID = - 1.0 A  
Dynamicb  
Ciss  
Coss  
Crss  
Qg  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
Turn-On Delay Time  
Rise Time  
210  
28  
20  
2.7  
0.8  
1.2  
7
VDS = - 30 V, VGS = 0 V, f = 1 MHz  
pF  
4.1  
Qgs  
Qgd  
Rg  
VDS = - 30 V, VGS = - 4.5 V, ID = - 1.25 A  
f = 1 MHz  
nC  
Ω
td(on)  
tr  
td(off)  
tf  
td(on)  
tr  
td(off)  
tf  
40  
35  
15  
10  
5
60  
55  
25  
20  
10  
20  
25  
20  
V
DD = - 30 V, RL = 30 Ω  
ID - 1 A, VGEN = - 4.5 V, Rg = 1 Ω  
Turn-Off Delay Time  
Fall Time  
ns  
Turn-On Delay Time  
Rise Time  
10  
15  
10  
V
DD = - 30 V, RL = 30 Ω  
ID - 1 A, VGEN = - 10 V, Rg = 1 Ω  
Turn-Off Delay Time  
Fall Time  
Drain-Source Body Diode Characteristics  
Continuous Source-Drain Diode Current  
Pulse Diode Forward Current  
IS  
ISM  
VSD  
trr  
TC = 25 °C  
- 1.4  
- 8  
A
IS = - 0.75 A, VGS = 0 V  
Body Diode Voltage  
- 0.8  
30  
- 1.2  
60  
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
ns  
nC  
Qrr  
ta  
33  
60  
IF = - 1.25 A, dI/dt = 100 A/µs, TJ = 25 °C  
18  
ns  
tb  
Reverse Recovery Rise Time  
12  
Notes:  
a. Pulse test; pulse width 300 µs, duty cycle 2 %.  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
www.vishay.com  
2
Document Number: 68980  
S-82584-Rev. A, 27-Oct-08  
New Product  
Si2309CDS  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
2.0  
1.5  
1.0  
0.5  
0.0  
8
V
= 10 thru 5 V  
GS  
6
4
2
0
V
= 4 V  
GS  
T
= 25 °C  
C
V
GS  
= 3 V  
T
= 125 °C  
2
C
T
C
= - 55 °C  
4
0
1
3
5
0
1
2
3
4
5
V
DS  
- Drain-to-Source Voltage (V)  
V
GS  
- Gate-to-Source Voltage (V)  
Output Characteristics  
Transfer Characteristics  
0.8  
0.6  
0.4  
0.2  
0.0  
350  
280  
210  
140  
70  
C
iss  
V
GS  
= 4.5 V  
V
GS  
= 10 V  
C
oss  
C
rss  
0
0
2
4
6
8
0
15  
30  
45  
60  
I
- Drain Current (A)  
D
V
DS  
- Drain-to-Source Voltage (V)  
On-Resistance vs. Drain Current and Gate Voltage  
Capacitance  
10  
2.0  
1.7  
1.4  
1.1  
0.8  
0.5  
I
= 1.25 A  
I
= 1.25 A  
D
D
V
DS  
= 30 V  
8
6
4
2
0
V
GS  
= 10 V  
V
DS  
= 15 V  
V
GS  
= 4.5 V  
V
DS  
= 45 V  
0
1
2
3
4
5
- 50 - 25  
0
25  
50  
75  
100 125 150  
T
J
- Junction Temperature (°C)  
Q
g
- Total Gate Charge (nC)  
Gate Charge  
On-Resistance vs. Junction Temperature  
Document Number: 68980  
S-82584-Rev. A, 27-Oct-08  
www.vishay.com  
3
New Product  
Si2309CDS  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
100  
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
I
= 1.25 A  
D
10  
T
J
= 150 °C  
T
= 25 °C  
J
1
0.1  
T
T
= 125 °C  
T
J
= - 50 °C  
J
0.01  
0.001  
= 25 °C  
J
0.0  
0.3  
0.6  
0.9  
1.2  
1.5  
0
2
4
6
8
10  
V
GS  
- Gate-to-Source Voltage (V)  
V
SD  
- Source-to-Drain Voltage (V)  
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
0.6  
0.4  
8
6
4
2
0
I
= 250 µA  
D
T
A
= 25 °C  
I
= 1 mA  
D
0.2  
0.0  
- 0.2  
- 0.4  
- 50 - 25  
0
25  
50  
75  
100 125 150  
0.01  
0.1  
1
10  
100  
1000  
T
J
- Temperature (°C)  
Time (s)  
Single Pulse Power, Junction-to-Ambient  
Threshold Voltage  
10  
10 µs  
Limited by R  
DS(on)*  
1
100 µs  
1 ms  
10 ms  
0.1  
100 ms  
T
= 25 °C  
A
1 s, 10 s  
100 s, DC  
Single Pulse  
0.01  
100  
0.1  
1
10  
V
DS  
- Drain-to-Source Voltage (V)  
* V > minimum V at which R is specified  
DS(on)  
GS  
GS  
Safe Operating Area, Junction-to-Ambient  
www.vishay.com  
4
Document Number: 68980  
S-82584-Rev. A, 27-Oct-08  
New Product  
Si2309CDS  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
1
Duty Cycle = 0.5  
0.2  
0.1  
Notes:  
0.1  
0.05  
P
DM  
0.02  
t
1
t
2
t
t
1
2
1. Duty Cycle, D =  
2. Per Unit Base = R  
= 166 °C/W  
thJA  
(t)  
3. T - T = P  
Z
JM  
A
DM thJA  
Single Pulse  
4. Surface Mounted  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
100  
1000  
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
1
Duty Cycle = 0.5  
0.2  
0.1  
Notes:  
0.1  
P
DM  
0.05  
0.02  
t
1
t
2
t
t
1
2
1. Duty Cycle, D =  
2. Per Unit Base = R  
= 73 °C/W  
thJA  
(t)  
3. T - T = P  
Z
JM  
A
DM thJA  
4. Surface Mounted  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
10  
1
10  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see http://www.vishay.com/ppg?68980.  
Document Number: 68980  
S-82584-Rev. A, 27-Oct-08  
www.vishay.com  
5
Legal Disclaimer Notice  
Vishay  
Disclaimer  
All product specifications and data are subject to change without notice.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf  
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein  
or in any other disclosure relating to any product.  
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any  
information provided herein to the maximum extent permitted by law. The product specifications do not expand or  
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed  
therein, which apply to these products.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this  
document or by any conduct of Vishay.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless  
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such  
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting  
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding  
products designed for such applications.  
Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 18-Jul-08  
www.vishay.com  
1

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