SI4160DY [VISHAY]

N-Channel 30-V (D-S) MOSFET; N通道30 -V (D -S )的MOSFET
SI4160DY
型号: SI4160DY
厂家: VISHAY    VISHAY
描述:

N-Channel 30-V (D-S) MOSFET
N通道30 -V (D -S )的MOSFET

文件: 总7页 (文件大小:141K)
中文:  中文翻译
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New Product  
Si4160DY  
Vishay Siliconix  
N-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a  
25.4  
TrenchFET® Power MOSFET  
100 % Rg Tested  
0.0049 at VGS = 10 V  
0.0063 at VGS = 4.5 V  
30  
16.9 nC  
100 % UIS Tested  
22.4  
APPLICATIONS  
Notebook  
- Vcore low side  
- DC/DC  
SO-8  
D
S
D
D
D
D
1
2
3
4
8
7
6
5
S
S
G
G
Top View  
S
Ordering Information: Si4160DY-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
VDS  
Limit  
30  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
T
C = 25 °C  
TC = 70 °C  
A = 25 °C  
25.4  
20.2  
16.8b, c  
13.4b, c  
70  
Continuous Drain Current (TJ = 150 °C)  
ID  
T
TA = 70 °C  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
5.1  
2.2b, c  
30  
Continuous Source-Drain Diode Current  
T
A = 25 °C  
L = 0.1 mH  
C = 25 °C  
TC = 70 °C  
A = 25 °C  
TA = 70 °C  
IAS  
Single Pulse Avalanche Current  
Avalanche Energy  
EAS  
mJ  
W
45  
T
5.7  
3.6  
PD  
Maximum Power Dissipation  
2.5b, c  
1.6b, c  
T
TJ, Tstg  
Operating Junction and Storage Temperature Range  
- 55 to 150  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, d  
Maximum Junction-to-Foot (Drain)  
Symbol  
RthJA  
RthJF  
Typical  
39  
Maximum  
Unit  
t 10 s  
Steady State  
50  
22  
°C/W  
18  
Notes:  
a. Based on TC = 25 °C.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. Maximum under Steady State conditions is 85 °C/W.  
Document Number: 69069  
S-83092-Rev. A, 29-Dec-08  
www.vishay.com  
1
New Product  
Si4160DY  
Vishay Siliconix  
SPECIFICATIONS T = 25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
VDS  
ΔVDS/TJ  
ΔVGS(th)/TJ  
VGS(th)  
VGS = 0 V, ID = 250 µA  
ID = 250 µA  
Drain-Source Breakdown Voltage  
30  
V
V
DS Temperature Coefficient  
29  
mV/°C  
VGS(th) Temperature Coefficient  
- 5.5  
VDS = VGS , ID = 250 µA  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
1.0  
30  
2.4  
100  
1
V
IGSS  
VDS = 0 V, VGS  
=
20 V  
nA  
VDS = 30 V, VGS = 0 V  
VDS = 30 V, VGS = 0 V, TJ = 55 °C  
VDS 5 V, VGS = 10 V  
IDSS  
ID(on)  
RDS(on)  
gfs  
Zero Gate Voltage Drain Current  
On-State Drain Currenta  
µA  
A
10  
VGS = 10 V, ID = 15 A  
0.004  
0.0049  
Drain-Source On-State Resistancea  
Forward Transconductancea  
Ω
S
VGS = 4.5 V, ID = 10 A  
0.0051 0.0063  
60  
VDS = 15 V, ID = 15 A  
Dynamicb  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
2071  
406  
V
DS = 15 V, VGS = 0 V, f = 1 MHz  
pF  
168  
V
DS = 15 V, VGS = 10 V, ID = 10 A  
36  
16.8  
5.1  
5.2  
0.85  
25  
54  
Qg  
Total Gate Charge  
25.5  
nC  
Qgs  
Qgd  
Rg  
Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
VDS = 15 V, VGS = 4.5 V, ID = 10 A  
f = 1 MHz  
0.2  
1.7  
45  
30  
50  
24  
20  
18  
45  
18  
Ω
td(on)  
tr  
td(off)  
tf  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Rise Time  
16  
V
DD = 15 V, RL = 1.5 Ω  
ID 10 A, VGEN = 4.5 V, Rg = 1 Ω  
Turn-Off Delay Time  
Fall Time  
28  
12  
ns  
Turn-On Delay Time  
Rise Time  
10  
9
V
DD = 15 V, RL = 1.5 Ω  
ID 10 A, VGEN = 10 V, Rg = 1 Ω  
Turn-Off Delay Time  
Fall Time  
25  
9
Drain-Source Body Diode Characteristics  
Continuous Source-Drain Diode Current  
IS  
ISM  
VSD  
trr  
TC = 25 °C  
IS = 3 A  
5.1  
70  
A
Pulse Diode Forward Currenta  
Body Diode Voltage  
0.73  
19  
10  
10  
9
1.1  
38  
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
Reverse Recovery Rise Time  
ns  
nC  
Qrr  
ta  
20  
IF = 10 A, dI/dt = 100 A/µs, TJ = 25 °C  
ns  
tb  
Notes:  
a. Pulse test; pulse width 300 µs, duty cycle 2 %  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
www.vishay.com  
2
Document Number: 69069  
S-83092-Rev. A, 29-Dec-08  
New Product  
Si4160DY  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
70  
10  
8
V
GS  
= 10 thru 4 V  
56  
42  
28  
14  
0
6
V
GS  
= 3 V  
4
T
C
= 25 °C  
2
T
C
= 125 °C  
1
T
C
= - 55 °C  
3
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
0
2
4
5
V
GS  
- Gate-to-Source Voltage (V)  
V
DS  
- Drain-to-Source Voltage (V)  
Output Characteristics  
Transfer Characteristics  
2800  
2240  
1680  
1120  
560  
0.0060  
0.0055  
0.0050  
0.0045  
0.0040  
0.0035  
V
= 4.5 V  
GS  
C
iss  
V
GS  
= 10 V  
C
oss  
C
rss  
0
0
6
12  
18  
24  
30  
0
14  
28  
42  
56  
70  
I
- Drain Current (A)  
V
DS  
- Drain-to-Source Voltage (V)  
D
On-Resistance vs. Drain Current and Gate Voltage  
Capacitance  
10  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
I
= 10 A  
I
= 15 A  
D
D
8
V
= 10 V  
DS  
V
GS  
= 10 V  
6
V
DS  
= 15 V  
V
DS  
= 20 V  
4
V
GS  
= 4.5 V  
2
0
0
8
16  
24  
32  
40  
- 50 - 25  
0
25  
50  
75  
100 125 150  
T
J
- Junction Temperature (°C)  
Q
g
- Total Gate Charge (nC)  
On-Resistance vs. Junction Temperature  
Gate Charge  
Document Number: 69069  
S-83092-Rev. A, 29-Dec-08  
www.vishay.com  
3
New Product  
Si4160DY  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
0.020  
100  
10  
1
I
= 15 A  
D
T
J
= 150 °C  
0.015  
0.010  
0.005  
0.000  
T
J
= 25 °C  
0.1  
0.01  
T
= 125 °C  
= 25 °C  
J
T
J
0.001  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
1
2
3
4
5
6
7
8
9
10  
V
SD  
- Source-to-Drain Voltage (V)  
V
GS  
- Gate-to-Source Voltage (V)  
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
0.4  
0.2  
170  
136  
102  
68  
0.0  
- 0.2  
- 0.4  
- 0.6  
- 0.8  
I
= 5 mA  
D
I
= 250 µA  
D
34  
0
- 50 - 25  
0
25  
50  
75  
100 125 150  
0.001  
0.01  
0.1  
1
10  
T
J
- Temperature (°C)  
Time (s)  
Threshold Voltage  
Single Pulse Power, Junction-to-Ambient  
100  
Limited by R  
*
DS(on)  
10  
1 ms  
10 ms  
1
100 ms  
1 s  
0.1  
10 s  
DC  
T
= 25 °C  
A
BVDSS Limited  
Single Pulse  
0.01  
0.01  
0.1  
1
10  
100  
V
DS  
- Drain-to-Source Voltage (V)  
* V > minimum V at which R is specified  
DS(on)  
GS  
GS  
Safe Operating Area, Junction-to-Ambient  
www.vishay.com  
4
Document Number: 69069  
S-83092-Rev. A, 29-Dec-08  
New Product  
Si4160DY  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
30  
24  
18  
12  
6
0
0
25  
50  
75  
100  
125  
150  
T
C
- Case Temperature (°C)  
Current Derating*  
7.0  
5.6  
4.2  
2.8  
1.4  
0.0  
1.80  
1.44  
1.08  
0.72  
0.36  
0.00  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
T
C
- Case Temperature (°C)  
T
A
- Ambient Temperature (°C)  
Power, Junction-to-Foot  
Power, Junction-to-Ambient  
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper  
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
Document Number: 69069  
S-83092-Rev. A, 29-Dec-08  
www.vishay.com  
5
New Product  
Si4160DY  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
Notes:  
P
DM  
0.05  
t
1
t
2
t
t
1
2
1. Duty Cycle, D =  
0.02  
2. Per Unit Base = R  
= 85 °C/W  
thJA  
(t)  
3. T - T = P  
Z
JM  
A
DM thJA  
Single Pulse  
4. Surface Mounted  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
100  
1000  
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see www.vishay.com/ppg?69069.  
www.vishay.com  
6
Document Number: 69069  
S-83092-Rev. A, 29-Dec-08  
Legal Disclaimer Notice  
Vishay  
Disclaimer  
All product specifications and data are subject to change without notice.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf  
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein  
or in any other disclosure relating to any product.  
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any  
information provided herein to the maximum extent permitted by law. The product specifications do not expand or  
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed  
therein, which apply to these products.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this  
document or by any conduct of Vishay.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless  
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such  
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting  
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding  
products designed for such applications.  
Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 18-Jul-08  
www.vishay.com  
1

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