TSMP6000 [VISHAY]

Linear Output Photo IC;
TSMP6000
型号: TSMP6000
厂家: VISHAY    VISHAY
描述:

Linear Output Photo IC

输出元件 光电
文件: 总10页 (文件大小:287K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
New Product  
TSMP6000  
Vishay Semiconductors  
www.vishay.com  
IR Sensor Module for Remote Control Systems  
FEATURES  
• Photo detector and preamplifier in one package  
• AC coupled response from 20 kHz to 60 kHz, all  
data formats  
• Improved shielding against electrical field  
disturbance  
• TTL and CMOS compatibility  
• Output active low  
4
3
• Supply voltage 2.5 V to 5.5 V, typically the  
device works in the range between 2.0 V and 5.5 V  
2
1
16797  
• Carrier out signal for code learning functions and IR  
synchronizing signals for 3D TVs  
MECHANICAL DATA  
• Material categorization: For definitions of compliance  
please see www.vishay.com/doc?99912  
Pinning:  
1 = GND, 2 = n.c., 3 = VS, 4 = carrier out  
DESCRIPTION  
The TSMP6000 is a miniaturized sensor for receiving various  
kinds of modulated IR signals. A PIN diode and preamplifier  
are assembled on a lead frame, the epoxy package is  
designed as an IR filter. The modulated output signal, carrier  
out, can be used for code learning applications or as  
receiver for the synchronizing signals in active 3D goggles.  
This component has not been qualified according to  
automotive specifications.  
PARTS TABLE  
CARRIER FREQUENCY  
20 kHz to 60 kHz  
CODE LEARNING APPLICATIONS  
TSMP6000  
BLOCK DIAGRAM  
APPLICATION CIRCUIT  
19750-2  
R1 = 100 Ω  
VS  
Transmitter  
with  
TSALxxxx  
TSMPxxxx  
3 VS  
+ VS  
C1 =  
4.7 µF  
R2 =  
4.7 kΩ  
4 Carrier out  
1 GND  
µC  
OUT  
GND  
TIA  
Amp  
Signal shaping  
VO  
GND  
R1 + C1 recommended to suppress power supply disturbances.  
R2 recommended to get faster slopes and a correct high level of the  
output pulses.  
19746-1  
Rev. 1.1, 12-Mar-12  
Document Number: 82451  
1
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
New Product  
TSMP6000  
Vishay Semiconductors  
www.vishay.com  
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)  
PARAMETER  
TEST CONDITION  
SYMBOL  
VALUE  
- 0.3 to + 6  
- 0.3 to (VS + 0.3)  
5
UNIT  
V
Supply voltage (pin 3)  
Output voltage (pin 4)  
Output current (pin 4)  
Junction temperature  
Storage temperature range  
Operating temperature range  
Soldering temperature  
VS  
VO  
V
IO  
mA  
°C  
°C  
°C  
°C  
Tj  
100  
Tstg  
Tamb  
Tsd  
- 25 to + 85  
- 25 to + 85  
260  
t 10 s, 1 mm from case  
Note  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only  
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification  
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.  
ELECTRICAL AND OPTICAL CHARACTERISTICS CARRIER OUT  
(Tamb = 25 °C, unless otherwise specified, VS = 3 V)  
PARAMETER  
TEST CONDITION  
SYMBOL  
MIN.  
0.55  
2.5  
TYP.  
MAX.  
0.9  
UNIT  
mA  
V
Supply current (pin 3)  
Supply voltage  
Ev = 0  
ISD  
VS  
0.7  
5.5  
Ev = 0, test signal see fig. 1,  
IR diode TSAL6200,  
IF = 400 mA  
Transmission distance  
d
5
m
Output voltage low (pin 4)  
Minimum irradiance  
Maximum irradiance  
Directivity  
IOSL = 0.5 mA, test signal see fig. 1  
VS = 3 V, (20 kHz to 60 kHz)  
VOSL  
Ee min.  
Ee max.  
ϕ1/2  
250  
25  
mV  
mW/m2  
W/m2  
deg  
12  
80  
50  
test signal see fig. 1, (20 kHz to 60 kHz)  
Angle of half transmission distance  
50  
fC = 20 kHz to 60 kHz,  
Ee = 25 mW/m2 to 50 W/m2,  
testsignal see fig. 1, BER 2%  
N
inputburst  
length  
- 1 cycle  
inputburst  
length  
+ 1 cycle  
inputburst  
length  
Output accuracy  
carrier  
pulses  
counts  
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)  
Carrier cycle  
(26.3 μs in case of 38 kHz)  
Optical burst  
(input signal)  
Delay time td  
Output voltage  
Fig. 1 - Testsignal  
Rev. 1.1, 12-Mar-12  
Document Number: 82451  
2
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
New Product  
TSMP6000  
Vishay Semiconductors  
www.vishay.com  
0°  
10°  
20°  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
30°  
40°  
1.0  
0.9  
0.8  
50°  
60°  
70°  
80°  
0.7  
700 750 800 850 900 950 1000 10501100  
0.6  
- Relative Transmission Distance  
0.6  
0.4  
0.2  
0
0.2  
0.4  
20431  
λ - Wavelength (nm)  
d
16801  
rel  
Fig. 2 - Relative Spectral Sensitivity vs. Wavelength  
Fig. 3 - Horizontal Directivity  
PACKAGE DIMENSIONS in millimeters  
7.5  
Pick and place area. TT taping  
7.2  
A
1
4
0.1  
(1.4)  
0.5 0.15  
0.3  
4x  
0.1  
1.27  
2.9  
3 x 1.27  
=
3.81  
4
A
0.4  
5.51  
Not indicated tolerances 0.3  
Pick and place area. TR taping  
2.6  
technical drawings  
according to DIN  
specifications  
Footprint  
3 x 1.27 = 3.81  
1.27  
0.9  
R 1.7  
Drawing-No.: 6.544-5341.01-4  
Issue: 8; 02.09.09  
16776  
Rev. 1.1, 12-Mar-12  
Document Number: 82451  
3
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
New Product  
TSMP6000  
Vishay Semiconductors  
www.vishay.com  
ASSEMBLY INSTRUCTIONS  
Reflow Soldering  
Manual Soldering  
• Reflow soldering must be done within 72 h while stored  
under a max. temperature of 30 °C, 60 % RH after  
opening the dry pack envelope  
• Use a soldering iron of 25 W or less. Adjust the  
temperature of the soldering iron below 300 °C  
• Finish soldering within 3 s  
• Set the furnace temperatures for pre-heating and heating  
in accordance with the reflow temperature profile as  
shown in the diagram. Excercise extreme care to keep the  
maximum temperature below 260 °C. The temperature  
shown in the profile means the temperature at the device  
surface. Since there is a temperature difference between  
the component and the circuit board, it should be verified  
that the temperature of the device is accurately being  
measured  
• Handle products only after the temperature has cooled off  
• Handling after reflow should be done only after the work  
surface has been cooled off  
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE  
300  
max. 260 °C  
245 °C  
255 °C  
250  
240 °C  
217 °C  
200  
max. 20 s  
150  
max. 100 s  
max. 120 s  
100  
max. Ramp Up 3 °C/s  
50  
max. Ramp Down 6 °C/s  
0
0
50  
100  
150  
t (s)  
200  
250  
300  
19800  
max. 2 cycles allowed  
Rev. 1.1, 12-Mar-12  
Document Number: 82451  
4
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
New Product  
TSMP6000  
Vishay Semiconductors  
www.vishay.com  
TAPING VERSION TSMP..TT DIMENSIONS in millimeters  
16584  
Rev. 1.1, 12-Mar-12  
Document Number: 82451  
5
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
New Product  
TSMP6000  
Vishay Semiconductors  
www.vishay.com  
TAPING VERSION TSMP..TR DIMENSIONS in millimeters  
16585  
Rev. 1.1, 12-Mar-12  
Document Number: 82451  
6
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
New Product  
TSMP6000  
Vishay Semiconductors  
www.vishay.com  
REEL DIMENSIONS in millimeters  
16734  
LEADER AND TRAILER DIMENSIONS in millimeters  
Trailer  
Leader  
no devices  
devices  
no devices  
End  
Start  
min. 200  
min. 400  
96 11818  
COVER TAPE PEEL STRENGTH  
According to DIN EN 60286-3  
0.1 N to 1.3 N  
LABEL  
Standard bar code labels for finished goods  
The standard bar code labels are product labels and used  
for identification of goods. The finished goods are packed in  
final packing area. The standard packing units are labeled  
with standard bar code labels before transported as finished  
goods to warehouses. The labels are on each packing unit  
and contain Vishay Semiconductor GmbH specific data.  
300 mm/min. 10 mm/min.  
165° to 180° peel angle  
Rev. 1.1, 12-Mar-12  
Document Number: 82451  
7
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
New Product  
TSMP6000  
Vishay Semiconductors  
www.vishay.com  
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)  
PLAIN WRITTING  
Item-description  
Item-number  
Selection-code  
LOT-/serial-number  
Data-code  
ABBREVIATION  
LENGTH  
-
18  
INO  
8
SEL  
3
BATCH  
10  
COD  
3 (YWW)  
Plant-code  
PTC  
2
Quantity  
QTY  
8
Accepted by  
ACC  
-
Packed by  
PCK  
-
Mixed code indicator  
Origin  
MIXED CODE  
-
xxxxxxx+  
Company logo  
LONG BAR CODE TOP  
Item-number  
Plant-code  
TYPE  
LENGTH  
N
8
N
2
Sequence-number  
Quantity  
X
3
N
8
Total length  
-
21  
SHORT BAR CODE BOTTOM  
Selection-code  
Data-code  
TYPE  
LENGTH  
X
N
X
-
3
3
Batch-number  
Filter  
10  
1
Total length  
-
17  
DRY PACKING  
The reel is packed in an anti-humidity bag to protect the  
devices from absorbing moisture during transportation and  
In case of moisture absorption, the devices will recover to  
the former condition by drying under the following condition:  
storage.  
192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen)  
or  
Aluminum bag  
96 h at 60 °C + 5 °C and < 5 % RH for all device containers  
or  
Label  
24 h at 125 °C + 5 °C not suitable for reel or tubes.  
An EIA JEDEC standard JESD22-A112 level 4 label is  
included on all dry bags.  
Reel  
LEVEL  
15973  
CAUTION  
This bag contains  
MOISTURE-SENSITIVE DEVICES  
4
FINAL PACKING  
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative  
humidity (RH)  
The sealed reel is packed into a cardboard box. A secondary  
cardboard box is used for shipping purposes.  
2. After this bag is opened, devices that will be subjected to soldering  
reflow or equivalent processing (peak package body temp. 260 °C)  
must be  
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or  
2b. Stored at < 5 % RH  
RECOMMENDED METHOD OF STORAGE  
3. Devices require baking befor mounting if:  
Humidity Indicator Card is > 10 % when read at 23 °C 5 °C or  
2a. or 2b. are not met.  
Dry box storage is recommended as soon as the aluminum  
bag has been opened to prevent moisture absorption. The  
following conditions should be observed, if dry boxes are  
not available:  
4. If baking is required, devices may be baked for:  
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or  
96 hours at 60 °C 5 °C and < 5 % RH for all device containers or  
24 hours at 125 °C 5 °C not suitable for reels or tubes  
Bag Seal Date:  
• Storage temperature 10 °C to 30 °C  
(If blank, see barcode label)  
Note: Level and body temperature defined by EIA JEDEC Standard JSTD-020  
• Storage humidity 60 % RH max.  
After more than 72 h under these conditions moisture  
content will be too high for reflow soldering.  
22522  
Example of JESD22-A112 level 4 label  
Rev. 1.1, 12-Mar-12  
Document Number: 82451  
8
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
New Product  
TSMP6000  
Vishay Semiconductors  
www.vishay.com  
ESD PRECAUTION  
VISHAY SEMICONDUCTORS STANDARD  
BAR CODE LABELS  
Proper storage and handling procedures should be followed  
to prevent ESD damage to the devices especially when they  
are removed from the antistatic shielding bag. Electro-static  
sensitive devices warning labels are on the packaging.  
The Vishay Semiconductors standard bar code labels are  
printed at final packing areas. The labels are on each  
packing unit and contain Vishay Semiconductors specific  
data.  
22645  
Rev. 1.1, 12-Mar-12  
Document Number: 82451  
9
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
Legal Disclaimer Notice  
www.vishay.com  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical  
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements  
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular  
product with the properties described in the product specification is suitable for use in a particular application. Parameters  
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All  
operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree  
to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and  
damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay  
or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to  
obtain written terms and conditions regarding products designed for such applications.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by  
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.  
Material Category Policy  
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the  
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council  
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment  
(EEE) - recast, unless otherwise specified as non-compliant.  
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that  
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.  
Revision: 12-Mar-12  
Document Number: 91000  
1

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