VSMY3940X01-GS08 [VISHAY]
High Speed Infrared Emitting Diode, 940 nm,Surface Emitter Technology;
| 型号： | VSMY3940X01-GS08 |
| 厂家： | 
VISHAY |
| 描述： | High Speed Infrared Emitting Diode, 940 nm,Surface Emitter Technology |
| 文件： | 总7页 (文件大小：149K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VSMY3940X01
Vishay Semiconductors
www.vishay.com
High Speed Infrared Emitting Diode, 940 nm,
Surface Emitter Technology
FEATURES
• Package type: surface mount
• Package form: PLCC-2
• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75
• AEC-Q101 qualified
• Peak wavelength: λp = 940 nm
• High reliability
• High radiant power
• High radiant intensity
948553
• Angle of half intensity: ϕ = 60°
• Suitable for high pulse current operation
• Floor life: 168 h, MSL 3, acc. J-STD-020
• Lead (Pb)-free reflow soldering
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
As part of the SurfLightTM portfolio, the VSMY3940X01 is an
infrared, 940 nm emitting diode based on surface emitter
technology with high radiant intensity, high optical power
and high speed, molded in a PLCC-2 package for surface
mounting (SMD).
RELEASED FOR APPLICATIONS
Infrared radiation source for operation with CMOS cameras
(illumination)
• High speed IR data transmission
• IR touch panels
• 3D TV
• Light curtain
PRODUCT SUMMARY
COMPONENT
Ie (mW/sr)
ϕ (deg)
λP (nm)
tr (ns)
VSMY3940X01
15
60
940
10
Note
•
Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
VSMY3940X01-GS08
VSMY3940X01-GS18
PACKAGING
REMARKS
PACKAGE FORM
PLCC-2
Tape and reel
Tape and reel
MOQ: 7500 pcs, 1500 pcs/reel
MOQ: 8000 pcs, 8000 pcs/reel
PLCC-2
Note
•
MOQ: minimum order quantity
Rev. 1.2, 25-Jun-14
Document Number: 84220
1
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY3940X01
Vishay Semiconductors
www.vishay.com
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
V
Reverse voltage
VR
5
100
Forward current
IF
mA
mA
A
Pulse peak forward current
Surge forward current
Power dissipation
tp/T = 0.5, tp = 100 μs
IFM
200
tp = 100 μs
IFSM
PV
1
190
mW
°C
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
Thermal resistance junction/ambient
Tj
100
Tamb
Tstg
Tsd
-40 to +85
-40 to +100
260
°C
°C
acc. figure 10, J-STD-020
°C
J-STD-051, soldered on PCB
RthJA
250
K/W
200
180
160
140
120
100
80
120
100
80
60
40
20
0
RthJA = 250 K/W
RthJA = 250 K/W
60
40
20
0
0
20
40
60
80
100
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
Tamb - Ambient Temperature (°C)
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 μs
IF = 100 mA
SYMBOL
MIN.
TYP.
1.44
2.2
MAX.
UNIT
V
VF
VF
TKVF
IR
1.9
Forward voltage
V
Temperature coefficient of VF
Reverse current
-1.6
mV/K
μA
not designed for reverse operation
125
Junction capacitance
V
R = 0 V, f = 1 MHz, E = 0
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 μs
IF = 100 mA, tp = 20 ms
IF = 100 mA
Cj
pF
Ie
8
15
120
55
24
mW/sr
mW/sr
mW
%/K
deg
nm
Radiant intensity
Ie
Radiant power
φe
Temperature coefficient of φe
Angle of half intensity
Peak wavelength
Spectral bandwidth
Temperature coefficient of λp
Rise time
TKφe
ϕ
-0.25
60
IF = 20 mA
IF = 30 mA
IF = 100 mA
IF = 100 mA
IF = 100 mA
λp
920
940
40
960
Δλ
TKλp
tr
nm
0.25
10
nm/K
ns
Fall time
tf
10
ns
Rev. 1.2, 25-Jun-14
Document Number: 84220
2
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY3940X01
Vishay Semiconductors
www.vishay.com
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
1000
100
10
1000
100
10
tp = 100 μs
tp = 100 μs
1
1
0.1
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
VF - Forward Voltage (V)
1
10
100
1000
IF - Forward Current (mA)
Fig. 3 - Forward Current vs. Forward Voltage
Fig. 6 - Radiant Intensity vs. Forward Current
1.65
120
IF = 100 mA
IF = 100 mA
tp = 20 ms
1.60
1.55
1.50
1.45
1.40
1.35
1.30
tp = 20 ms
110
100
90
80
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
Tamb - Ambient Temperature (°C)
Tamb - Ambient Temperature (°C)
Fig. 7 - Relative Radiant Intensity vs. Ambient Temperature
Fig. 4 - Forward Voltage vs. Ambient Temperature
115
100
IF = 100 mA
IF = 20 mA
90
80
70
60
50
40
30
20
10
0
tp = 20 ms
110
105
100
95
90
-60 -40 -20
0
20 40 60 80 100
800
850
900
950
1000
1050
Tamb - Ambient Temperature (°C)
Fig. 5 - Relative Forward Voltage vs. Ambient Temperature
λ - Wavelength (nm)
Fig. 8 - Relative Radiant Intensity vs. Wavelength
Rev. 1.2, 25-Jun-14
Document Number: 84220
3
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY3940X01
Vishay Semiconductors
www.vishay.com
0°
10°
20°
30°
40°
1.0
0.9
50°
60°
0.8
0.7
70°
80°
0.6
0.4
0.2
0
Fig. 9 - Relative Radiant Intensity vs. Angular Displacement
PACKAGE DIMENSIONS in millimeters
3.5 0.2
technical drawings
according to DIN
specifications
Mounting Pad Layout
Pin identification
1.2
area covered with
solder resist
A
C
4
1.6 (1.9)
Ø 2.4
3 + 0.15
Drawing-No.: 6.541-5067.02-4
Issue: 4; 19.07.10
20767
Rev. 1.2, 25-Jun-14
Document Number: 84220
4
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY3940X01
Vishay Semiconductors
www.vishay.com
SOLDER PROFILE
3.5
3.1
2.2
2.0
300
5.75
5.25
max. 260 °C
245 °C
4.0
3.6
255 °C
240 °C
217 °C
250
200
150
100
50
8.3
7.7
3.6
3.4
max. 30 s
1.85
1.65
0.25
1.6
1.4
4.1
3.9
4.1
3.9
max. 100 s
max. 120 s
2.05
1.95
94 8668
max. ramp down 6 °C/s
max. ramp up 3 °C/s
Fig. 12 - Tape Dimensions in mm for PLCC-2
0
0
50
100
150
200
250
300
MISSING DEVICES
19841
Time (s)
A maximum of 0.5 % of the total number of components per
reel may be missing, exclusively missing components at the
beginning and at the end of the reel. A maximum of three
consecutive components may be missing, provided this gap
is followed by six consecutive components.
Fig. 10 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
De-reeling direction
94 8158
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
> 160 mm
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 3, acc. to J-STD-020.
40 empty
compartments
min. 75 empty
compartments
DRYING
Tape leader
Carrier leader
Carrier trailer
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Fig. 13 - Beginning and End of Reel
The tape leader is at least 160 mm and is followed by a
carrier tape leader with at least 40 empty compartments.
The tape leader may include the carrier tape as long as the
cover tape is not connected to the carrier tape. The least
component is followed by a carrier tape trailer with a least
75 empty compartments and sealed with cover tape.
TAPE AND REEL
PLCC-2 components are packed in antistatic blister tape
(DIN IEC (CO) 564) for automatic component insertion.
Cavities of blister tape are covered with adhesive tape.
10.0
9.0
120°
Adhesive tape
4.5
3.5
13.00
12.75
2.5
1.5
Blister tape
63.5
60.5
Identification
Label:
Vishay
type
group
tape code
Component cavity
94 8670
production
code
quantity
Fig. 11 - Blister Tape
14.4 max.
180
178
94 8665
Fig. 14 - Dimensions of Reel-GS08
Rev. 1.2, 25-Jun-14
Document Number: 84220
5
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY3940X01
Vishay Semiconductors
www.vishay.com
COVER TAPE REMOVAL FORCE
10.4
8.4
The removal force lies between 0.1 N and 1.0 N at a removal
speed of 5 mm/s. In order to prevent components from
popping out of the blisters, the cover tape must be pulled off
at an angle of 180° with regard to the feed direction.
120°
4.5
3.5
13.00
12.75
2.5
1.5
62.5
60.0
Identification
Label:
Vishay
type
group
tape code
production
code
14.4 max.
321
329
quantity
18857
Fig. 15 - Dimensions of Reel-GS18
Rev. 1.2, 25-Jun-14
Document Number: 84220
6
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
Document Number: 91000
1
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