RFBPF2009A25T [WALSIN]

2.4 GHz ISM Band RF Application;
RFBPF2009A25T
型号: RFBPF2009A25T
厂家: Walsin Technology    Walsin Technology
描述:

2.4 GHz ISM Band RF Application

ISM频段
文件: 总7页 (文件大小:595K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Application sheet  
RFBPF 2012(0805) Series RoHS Compliance  
MULTILAYER CERAMIC BAND PASS FILTER  
Halogens Free Product  
2.4 GHz ISM Band RF Application  
P/N: RFBPF2009A25T  
*Contents in this sheet are subject to change without prior notice.  
Page 1 of 7  
ASC_RFBPF2009A25T_V01  
Apr. 2018  
Application sheet  
FEATURES  
1.  
2.  
3.  
4.  
5.  
6.  
Miniature footprint: 2.0 X 1.2 X 0.9 mm3  
Low Profile Thickness  
Low Insertion loss (Typical -1.5dB)  
High Rejection Rate  
High attenuation on 2nd harmonic suppressed  
LTCC process  
APPLICATIONS  
1.  
2.  
2.4GHz ISM band RF applications  
Bluetooth, Wireless LAN 802.11b/g, HomeRF  
CONSTRUCTION  
Top view  
P2  
PIN  
1
Connection  
Input / Output port  
GND  
P1  
P3  
2
3
Input / Output port  
GND  
4
P4  
DIMENSIONS  
Figure  
Symbol  
Dimension (mm)  
L
2.00 ± 0.15  
Bottom view  
W
1.25 ± 0.15  
0.90 ± 0.10  
1.00 ± 0.15  
0.30 ± 0.15  
0.50 ± 0.15  
T
A
B
C
Side view  
D
E
0.25 ± 0.15  
0.25 ± 0.15  
Side view  
Page 2 of 7  
ASC_RFBPF2009A25T_V01  
Apr. 2018  
Application sheet  
ELECTRICAL CHARACTERISTICS  
RFBPF2009A25T  
Specification  
Frequency range  
2400 ~ 2500 MHz  
1.7 dB max. at 25 C  
Insertion Loss  
1.9 dB max. at -40C ~ +85C  
30dB min. @ 900MHz  
Attenuation  
20dB min. @ 1850 MHz  
30dB min. @ 4800 MHz  
VSWR  
2.0 max.  
Impedance (Unbalanced)  
50 Ω  
Moisture sensitivity levels  
MSL is LEVEL 1 (Refer to : IPC/JEDEC J-STD-020)  
Operating & Storage Condition (Component)  
Operation Temperature Range: -40C ~ +85C  
Storage Temperature Range: -40C ~ +85C  
Storage Condition before Soldering (Included packaging material)  
Storage Temperature Range: +5 ~ +40  
Humidity: 30 to 70% relative humidity  
Typical Electrical Chart  
SOLDER LAND PATTERN  
Figure  
Unit : mm  
Line width to be designed to match 50 Ω characteristic impedance, depending on PCB material and thickness.  
Page 3 of 7  
ASC_RFBPF2009A25T_V01  
Apr. 2018  
Application sheet  
RELIABILITY TEST  
Test condition / Test method  
Test item  
Specification  
Solderability  
At least 95% of a surface of each terminal  
*Solder bath temperature235 5C  
JIS C 0050-4.6  
JESD22-B102D  
electrode must be covered by fresh solder.  
*Immersion time2 0.5 sec  
SolderSn3Ag0.5Cu for lead-free  
*Solder bath temperature260 5C  
*Leaching immersion time30 0.5 sec  
Solder : SN63A  
Leaching  
Loss of metallization on the edges of each  
electrode shall not exceed 25%.  
(Resistance to  
dissolution of  
metallization)  
IEC 60068-2-58  
Resistance to soldering  
heat  
*Preheating temperature120~150,  
1 minute.  
No mechanical damage.  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
JIS C 0050-5.4  
*Solder temperature2705C  
*Immersion time101 sec  
SolderSn3Ag0.5Cu for lead-free  
Loss of metallization on the edges of each  
electrode shall not exceed 25%.  
Measurement to be made after keeping at  
room temperature for 242 hrs  
Drop Test  
*Height75 cm  
No mechanical damage.  
JIS C 0044  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
*Test SurfaceRigid surface of concrete or  
Customer’s specification.  
steel.  
*Times6 surfaces for each units2 times  
for each side.  
Vibration  
*Frequency10Hz~55Hz~10Hz(1min)  
*Total amplitude1.5mm  
No mechanical damage.  
JIS C 0040  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
*Test times6hrs.(Two hrs each in three  
mutually perpendicular directions)  
Adhesive Strength  
of Termination  
*Pressurizing force  
No remarkable damage or removal of the  
termination.  
5N(0603)10N(>0603)  
JIS C 0051- 7.4.3  
*Test time10±1 sec  
Bending test  
The middle part of substrate shall be  
pressurized by means of the pressurizing rod  
at a rate of about 1 mm/s per second until the  
deflection becomes 1mm/s and then pressure  
shall be maintained for 51 sec.  
No mechanical damage.  
JIS C 0051- 7.4.1  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
Measurement to be made after keeping at  
room temperature for 242 hours  
Page 4 of 7  
ASC_RFBPF2009A25T_V01  
Apr. 2018  
Application sheet  
Temperature cycle  
1. 303 minutes at -40C3C,  
2. 10~15 minutes at room temperature,  
3. 303 minutes at +85C3C,  
No mechanical damage.  
JIS C 0025  
Electrical specification shall satisfy the  
descriptions in electrical characteristics  
under the operational temperature range  
within -40 ~ 85°C.  
4. 10~15 minutes at room temperature,  
Total 100 continuous cycles  
Measurement to be made after keeping at  
room temperature for 242 hrs  
High temperature  
JIS C 0021  
*Temperature85C2C  
No mechanical damage.  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
*Test duration1000+24/-0 hours  
Measurement to be made after keeping at  
room temperature for 242 hrs  
Humidity  
*Humidity90% to 95% R.H.  
*Temperature402C  
*Time1000+24/-0 hrs.  
No mechanical damage.  
(steady conditions)  
JIS C 0022  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
Measurement to be made after keeping at  
room temperature for 242 hrs  
500hrs measuring the first data then  
1000hrs data  
Low temperature  
JIS C 0020  
*Temperature-40C2C  
No mechanical damage.  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
*Test duration1000+24/-0 hours  
Measurement to be made after keeping at  
room temperature for 242 hrs  
Page 5 of 7  
ASC_RFBPF2009A25T_V01  
Apr. 2018  
Application sheet  
SOLDERING CONDITION  
Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2,  
Fig 2. Infrared soldering profile  
ORDERING CODE  
RF  
Walsin  
RF device  
BPF  
2009  
A
25  
T
Product Code  
Dimension code  
Application  
Specification  
Design Code  
Packing  
T : Reeled  
BPF : Band Pass  
Filter  
Per 2 digits of Length,  
Width, Thickness :  
A : 2.4GHz ISM  
Band  
e.g. :  
2009 =  
Length 20,  
Width 12,  
Thickness 09  
Minimum Ordering Quantity: 2000 pcs per reel.  
PACKAGING  
Plastic Tape specifications (unit :mm)  
ΦD  
Index  
Ao  
Bo  
T
W
1.30 ± 0.10  
2.25 ± 0.10  
1.55 ± 0.10  
1.10 ± 0.10  
8.00 ± 0.30  
Dimension (mm)  
Index  
E
F
Po  
P1  
P2  
1.75± 0.10  
3.50 ± 0.05  
4.00 ± 0.10  
4.00 ± 0.10  
2.00± 0.10  
Dimension (mm)  
Page 6 of 7  
ASC_RFBPF2009A25T_V01  
Apr. 2018  
Application sheet  
Reel dimensions  
B
A
C
Index  
A
B
C
Φ178.0  
Φ60.0  
Φ13.0  
Dimension (mm)  
Taping Quantity:2000 pieces per 7” reel  
CAUTION OF HANDLING  
Limitation of Applications  
Please contact us before using our products for the applications listed below which require especially high reliability for  
the prevention of defects, which might directly cause damage to the third party’s life, body or property.  
(1) Aircraft equipment  
(2) Aerospace equipment  
(3) Undersea equipment  
(4) Medical equipment  
(5) Disaster prevention / crime prevention equipment  
(6) Traffic signal equipment  
(7) Transportation equipment (vehicles, trains, ships, etc.)  
(8) Applications of similar complexity and /or reliability requirements to the applications listed in the above.  
Storage condition  
(1) Products should be used in 6 months from the day of WALSIN outgoing inspection.  
(2) Storage environment condition.  
Products should be storage in the warehouse on the following conditions.  
Temperature  
Humidity  
: +5 to +40℃  
: 30 to 70% relative humidity  
Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of  
electrode, resulting in poor solderability.  
Products should be storage on the palette for the prevention of the influence from humidity, dust and son on.  
Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.  
Products should be storage under the airtight packaged condition.  
Page 7 of 7  
ASC_RFBPF2009A25T_V01  
Apr. 2018  

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