W24010-70LL [WINBOND]
Standard SRAM, 128KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32;
| 型号： | W24010-70LL |
| 厂家： | 
WINBOND |
| 描述： | Standard SRAM, 128KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 静态存储器 光电二极管 内存集成电路 |
| 文件： | 总12页 (文件大小：243K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
W24010/LL
128K ´ 8 CMOS STATIC RAM
GENERAL DESCRIPTION
The W24010 is a normal-speed, very low-power CMOS static RAM organized as 131072 ´ 8 bits that
operates on a single 5-volt power supply. This device is manufactured using Winbond's high
performance CMOS technology.
FEATURES
· Battery back-up operation capability
· Data retention voltage: 2V (min.)
· Packaged in 32-pin 600 mil DIP, 450 mil SOP,
standard type one TSOP (8 mm ´ 20 mm),
reverse type one TSOP (8 mm ´ 20 mm),
small type one TSOP (8 mm ´ 13.4 mm) and
reverse small type one TSOP (8 mm ´ 13.4
mm)
· Low power consumption:
- Active: 350 mW (max.)
- Standby: 250 mW (max.)
· Access time: 70 nS (max.)
· Single 5V power supply
· Fully static operation
· All inputs and outputs directly TTL compatible
· Three-state outputs
PIN CONFIGURATIONS
BLOCK DIAGRAM
CLK GEN.
PRECHARGE CKT.
32
31
30
V
DD
NC
A16
A14
1
A16
A14
A15
2
A12
A4
CS2
3
R
O
CORE CELL ARRAY
1024 ROWS
W
4
A12
A7
29
28
27
26
25
24
23
22
21
20
19
18
17
WE
A13
A8
A3
D
E
C
O
D
E
R
5
A2
A7
A6
A5
A9
128 X 8 COLUMNS
A6
6
A5
A9
7
A11
A4
A3
A2
A1
A0
8
OE
9
I/O1
:
I/O8
I/O CKT.
COLUMN DECODER
DATA
10
11
12
13
14
15
16
A10
CNTRL.
CS1
I/O8
I/O7
I/O6
I/O5
I/O4
CLK
GEN.
A15 A13 A8 A1 A0 A11 A10
WE
I/O1
I/O2
I/O3
CS1
CS2
OE
V
SS
1
2
3
4
5
6
7
A11
A9
A8
OE
A10
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
PIN DESCRIPTION
CS1
I/O8
I/O7
I/O6
I/O5
I/O4
A13
WE
CS2
A15
SYMBOL
DESCRIPTION
V
32-pin
TSOP
DD
8
9
NC
A16
A14
A12
A7
A6
A5
A4
V
SS
Address Inputs
10
11
12
13
14
15
16
I/O3
I/O2
I/O1
A0
A1
A2
A0- A16
Data Inputs/Outputs
Chip Select Input
I/O1- I/O8
A3
CS1, CS2
WE
A3
A2
A1
A0
I/O1
I/O2
A4
A5
A6
A7
A12
A14
16
15
14
13
12
11
10
9
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Write Enable Input
Output Enable Input
Power Supply
Ground
A16
NC
I/O3
32-pin
Reverse
TSOP
OE
VDD
VSS
NC
V
SS
V
DD
8
I/O4
I/O5
I/O6
I/O7
I/O8
A15
CS2
7
6
5
WE
A13
A8
A9
A11
4
3
CS1
A10
OE
2
1
No Connection
Publication Release Date: April 1997
Revision A3
- 1 -
W24010/LL
TRUTH TABLE
CS1
H
CS2
X
OE
X
WE
X
MODE
Not Selected
Not Selected
Output Disable
Read
VDD CURRENT
ISB, ISB1
ISB, ISB1
IDD
I/O1- I/O8
High Z
X
L
X
X
High Z
L
H
H
L
H
High Z
L
H
H
Data Out
Data In
IDD
L
H
X
L
Write
IDD
DC CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER
Supply Voltage to VSS Potential
Input/Output to VSS Potential
Allowable Power Dissipation
Storage Temperature
RATING
UNIT
V
-0.5 to +7.0
-0.5 to VDD +0.5
1.0
V
W
-65 to +150
0 to 70
°C
°C
Operating Temperature
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the
device.
Operating Characteristics
(VDD = 5V ±10%; VSS = 0V; TA = 0° C to 70° C)
PARAMETER
Input Low Voltage
Input High Voltage
Input Leakage Current
SYM.
VIL
TEST CONDITIONS
MIN.
-0.5
+2.2
-1
TYP.
MAX.
+0.8
UNIT
V
-
-
-
-
-
VIH
ILI
-
VDD +0.5
+1
V
VIN = VSS to VDD
mA
mA
Output Leakage
Current
ILO
-1
+1
CS
VI/O = VSS to VDD,
= VIH
= VIH (min.) or
= VIL (max.)
OE
(min.) or
WE
Output Low Voltage
Output High Voltage
VOL
VOH
IDD
IOL = +2.1 mA
IOH = -1.0 mA
-
2.4
-
-
-
-
0.4
-
V
V
Operating Power
Supply Current
70
mA
CS = VIL (max.), I/O = 0 mA,
Cycle = min. Duty = 100%
Standby Power
Supply Current
ISB
-
-
-
-
3
mA
CS = VIH (min.), Cycle =
min. Duty = 100%
ISB1
50
mA
CS ³ VDD -0.2V
- 2 -
W24010/LL
CAPACITANCE
(VDD = 5V, TA = 25° C, f = 1 MHz)
PARAMETER
Input Capacitance
SYM.
CIN
CONDITIONS
VIN = 0V
MAX.
UNIT
pF
6
8
Input/Output Capacitance
CI/O
VOUT = 0V
pF
Note: These parameters are sampled but not 100% tested.
AC CHARACTERISTICS
AC Test Conditions
PARAMETER
Input Pulse Levels
CONDITIONS
0V to 3.0V
5 nS
Input Rise and Fall Times
Input and Output Timing Reference Level
Output Load
1.5V
See the drawing below
AC Test Loads and Waveform
1 TTL
1 TTL
OUTPUT
OUTPUT
100 pF
Including
Jig and
Scope
5 pF
Including
Jig and
Scope
(For TCLZ, TOLZ, TCHZ, TOHZ, TWHZ, TOW
)
90%
90%
3.0V
10%
10%
0V
5 nS
5 nS
Publication Release Date: April 1997
Revision A3
- 3 -
W24010/LL
AC Characteristics, continued
(VDD = 5V ±10%; VSS = 0V; TA = 0° C to 70° C)
Read Cycle
PARAMETER
Read Cycle Time
SYMBOL
TRC
MIN.
MAX.
UNIT
nS
nS
nS
nS
nS
nS
nS
nS
nS
70
-
-
Address Access Time
TAA
70
70
35
-
Chip Select Access Time
TACS
TAOE
TCLZ*
TOLZ*
TCHZ*
TOHZ*
TOH
-
Output Enable to Output Valid
Chip Selection to Output in Low Z
Output Enable to Output in Low Z
Chip Deselection to Output in High Z
Output Disable to Output in High Z
Output Hold from Address Change
*These parameters are sampled but not 100% tested
-
10
5
-
-
30
30
-
-
10
Write Cycle
PARAMETER
Write Cycle Time
SYMBOL
TWC
MIN.
70
50
50
0
MAX.
UNIT
nS
-
-
-
-
-
-
Chip Selection to End of Write
Address Valid to End of Write
Address Setup Time
TCW
nS
TAW
nS
TAS
nS
Write Pulse Width
TWP
50
0
nS
Write Recovery Time
TWR
nS
CS1, CS2, WE
Data Valid to End of Write
TDW
30
0
-
-
-
nS
nS
nS
nS
nS
Data Hold from End of Write
Write to Output in High Z
TDH
TWHZ*
TOHZ*
TOW
25
25
-
Output Disable to Output in High Z
Output Active from End of Write
-
5
*These parameters are sampled but not 100% tested
- 4 -
W24010/LL
TIMING WAVEFORMS
Read Cycle 1
(Address Controlled)
T
RC
Address
T
AA
T
OH
TOH
D
OUT
Read Cycle 2
(Chip Select Controlled)
CS1
CS2
T
ACS
T
CHZ
T
CLZ
D
OUT
Read Cycle 3
(Output Enable Controlled)
TRC
Address
OE
T
AA
T
TAOE
OLZ
OH
T
CS1
CS2
T
OHZ
TACS
TCLZ
CHZ
T
D
OUT
Publication Release Date: April 1997
Revision A3
- 5 -
W24010/LL
Timing Waveforms, continued
Write Cycle 1
T
WC
Address
OE
T
WR
T
CW
CS1
CS2
T
AW
T
WE
WP
T
AS
T
OHZ
(1, 4)
D
OUT
T
T
DH
DW
D
IN
Write Cycle 2
(OE = VIL Fixed)
T
WC
Address
CS1
T
WR
T
CW
CS2
WE
T
AW
T
T
OH
WP
T
AS
(2)
(3)
T
WHZ
T
OW
(1, 4)
D
OUT
T
DH
T
DW
D
IN
Notes:
1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied.
2. The data output from DOUT are the same as the data written to DIN during the write cycle.
3. DOUT provides the read data for the next address.
4. Transition is measured ±500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.
- 6 -
W24010/LL
DATA RETENTION CHARACTERISTICS
(TA = 0° C to 70° C)
PARAMETER
SYM.
TEST CONDITIONS
CS ³ VDD -0.2V
MIN. TYP. MAX. UNIT
VDD for Data Retention
VDR
2.0
-
-
-
-
-
20
-
V
Data Retention Current
IDDDR
TCDR
mA
nS
CS ³ VDD -0.2V, VDD = 3V
Chip Deselect to Data
Retention Time
See data retention waveform
0
Operation Recovery Time
TR
TRC*
-
-
nS
* Read Cycle Time
DATA RETENTION WAVEFORM
V
DD
0.9VDD
0.9 VDD
>
VDR 2V
=
T
CDR
R
T
>
CS VDD
=
-0.2V
CS1
CS2
Publication Release Date: April 1997
Revision A3
- 7 -
W24010/LL
ORDERING INFORMATION
PART NO.
ACCESS
TIME (nS)
OPERATING
CURRENT
MAX. (mA)
STANDBY
CURRENT
MAX. (mA)
PACKAGE
W24010-70LL
W24010S-70LL
W24010T-70LL
W24010U-70LL
W24010Q-70LL
W24010V-70LL
70
70
70
70
70
70
70
70
70
70
70
70
50
50
50
50
50
50
600 mil DIP
450 mil SOP
Standard type one TSOP
Reverse type one TSOP
Small type one TSOP
Reverse small type one
TSOP
Notes:
1. Winbond reserves the right to make changes to its products without prior notice.
2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications
where personal injury might occur as a consequence of product failure.
- 8 -
W24010/LL
PACKAGE DIMENSIONS
32-pin P-DIP
Dimension in inches
Dimension in mm
Symbol
A
Min. Nom. Max. Min. Nom. Max.
5.33
0.210
0.010
0.150 0.155 0.160 3.81
0.016 0.018 0.41
0.048 0.050 0.054 1.22
0.25
1
A
3.94
0.46
1.27
0.25
4.06
0.56
1.37
0.36
2
A
0.022
B
1
B
0.20
0.010 0.014
1.650 1.660
0.008
D
c
D
E
E1
e1
L
17
32
41.91 42.16
15.49
14.10
2.79
0.610
15.24
13.97
2.54
0.590 0.600
14.99
13.84
0.545
0.090 0.100
0.555
0.110
0.550
2.29
3.05
0
E1
0.120
0
0.140
15
3.30
0.130
3.56
15
a
17.02
0.630 0.650 0.670 16.00 16.51
0.085
A
e
S
2.16
16
1
Notes:
E
S
1. Dimensions D Max. & S include mold flash or
tie bar burrs.
c
2. Dimension E1 does not include interlead flash.
2
A
A
L
A1
Base Plane
3. Dimensions D & E1 include mold mismatch and
.
are determined at the mold parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
Seating Plane
5. Controlling dimension: Inches
6. General appearance spec. should be based on
B
e1
eA
a
B1
final visual inspection spec.
32-pin SOP Wide Body
Dimension in Inches
Dimension in mm
Symbol
A
Nom.
Nom.
Min.
Max. Min.
0.118
Max.
3.00
17
32
0.004
0.101
0.014
0.006
0.10
A
A
b
c
1
e1
0.106
0.111
0.020
0.012
0.817
2.57
0.36
0.15
2.69
0.41
2.82
0.51
2
0.016
0.008
0.805
0.445
0.050
0.20
0.31
20.75
11.43
1.42
20.45
11.30
1.27
D
E HE
11.18
1.12
0.440
0.044
0.450
0.056
E
e
0.546
0.023
0.556
0.031
0.556
0.039
13.87
0.58
14.12
0.79
14.38
0.99
HE
L
L
1.19
0.047
0.063
0.036
1.40
0.055
1.60
0.91
Detail F
L
E
1
16
b
S
y
q
0.10
10
0.004
10
0
0
Notes:
1. Dimensions D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
e1
D
c
3. Dimensions D & E include mold mismatch
.
A
A 2
and determined at the mold parting line.
4. Controlling dimension: Inches
5. General appearance spec should be based
on final visual inspection spec.
S
e
y
LE
A 1
See Detail F
Seating Plane
Publication Release Date: April 1997
Revision A3
- 9 -
W24010/LL
Package Dimensions, continued
32-pin Standard Type One TSOP
HD
D
Dimension in Inches
Dimension in mm
Symbol
Min.
Max.
Min. Nom. Max.
Nom.
__
__
__
__
A
1.20
0.15
1.05
0.23
0.047
c
__
__
0.002
0.037
0.006 0.05
A1
A2
b
1
0.95
0.041
1.00
0.039
M
e
0.007 0.008
0.17 0.20
0.12 0.15
0.009
E
c
D
E
0.005 0.006
0.720 0.724
0.17
0.007
0.728
0.10(0.004)
18.30 18.40 18.50
b
0.311 0.315
0.780 0.787
7.90 8.00
8.10
0.319
19.80
__
20.00 20.20
0.795
__
HD
e
__
__
0.020
0.50
0.016 0.020
0.40 0.50
0.60
__
0.024
__
L
__
__
L 1
0.031
0.80
A
__
__
0.000
0.004
5
0.10
5
0.00
Y
2
A
1
3
1
3
q
q
L
1
A
Y
L1
Controlling dimension: Millimeters
32-pin Reverse Type One TSOP
H D
D
Dimension in Inches
Min. Nom. Max.
Dimension in mm
Symbol
A
Min.
Max.
Nom.
__
__
__
__
1.20
0.15
1.05
0.23
0.047
c
__
__
0.002
0.037
0.006 0.05
A1
A2
b
0.95
0.041
1.00
0.039
M
e
0.007 0.008
0.17 0.20
0.12 0.15
0.009
E
c
0.005 0.006
0.720 0.724
0.17
0.007
0.728
0.10(0.004)
D
18.30 18.40 18.50
b
0.311 0.315
0.780 0.787
7.90 8.00
8.10
E
0.319
1
19.80
__
20.00
0.50
0.795
__
20.20
__
HD
e
__
0.020
0.016 0.020
0.40 0.50
0.60
__
L
0.024
__
__
__
L 1
0.031
0.80
A
__
__
0.000
0.004
5
0.10
5
A2
0.00
Y
q
1
A
L
q
1
3
1
3
Y
L1
Controlling dimension: Millimeters
- 10 -
W24010/LL
Package Dimensions, continued
32-pin Small Type One TSOP
D
H
Dimension in Inches
Dimension in mm
Symbol
Min.
Max.
Nom.
Min. Nom.
Max.
D
c
A
0.049
1.25
0.15
1
1
0.006 0.05
A
0.002
0.039
0.95
A
b
c
2
0.037
0.007
1.00 1.05
0.041
e
0.008 0.009 0.17 0.20 0.27
E
0.0056 0.0059 0.0062 0.14 0.15 0.16
0.461
0.311
0.520
0.469 11.70 11.80 11.90
0.319 7.90 8.00 8.10
0.536 13.20 13.40 13.60
0.465
0.315
D
E
H
e
b
0.528
D
0.020
0.020
0.50
0.012
0.027
0.000
0.028
0.50 0.70
0.30
L
1
0.675
L
2
A
A
0.004 0.00
0.10
Y
q
A
q
1
L
0
3
5
0
3
5
Y
L1
Controlling dimension: Millimeters
32-pin Reverse Small Type One TSOP
H D
D
Dimension in Inches
Dimension in mm
Min. Nom. Max.
Symbol
Min.
Max.
Nom.
0.049
1.25
A
c
0.006 0.05
0.15
A
A
b
c
1
2
0.002
0.95
0.039
0.037
0.007
1.00 1.05
0.041
0.008 0.009 0.17 0.20 0.27
e
0.0056 0.0059 0.0062 0.14 0.15 0.16
0.461
E
D
E
0.469 11.70 11.80 11.90
0.319 7.90 8.00 8.10
0.536 13.20 13.40 13.60
0.465
0.315
0.311
0.520
b
1
0.528
H
e
D
0.020
0.020
0.50
0.012
0.027
0.000
0.028
0.50 0.70
L
0.30
0.675
L
1
0.004 0.00
0.10
Y
2
A
q
q
A
0
3
5
0
3
5
1
A
L
Y
1
L
Controlling dimension: Millimeters
Publication Release Date: April 1997
Revision A3
- 11 -
W24010/LL
Winbond Electronics (H.K.) Ltd.
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
FAX: 886-3-5792647
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-7197006
TEL: 1-408-9436666
FAX: 1-408-5441798
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
Note: All data and specifications are subject to change without notice.
- 12 -
相关型号：
©2020 ICPDF网 联系我们和版权申明