W83L197R-16 [WINBOND]

2-CHIP 100MHZ CLOCK FOR BX NOTEBOOK; 双芯片100MHZ时钟BX笔记本
W83L197R-16
型号: W83L197R-16
厂家: WINBOND    WINBOND
描述:

2-CHIP 100MHZ CLOCK FOR BX NOTEBOOK
双芯片100MHZ时钟BX笔记本

时钟
文件: 总11页 (文件大小:137K)
中文:  中文翻译
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W83L197R-16  
2-CHIP 100MHZ CLOCK FOR BX NOTEBOOK  
1.0 GENERAL DESCRIPTION  
The W83L197R-16 is a Clock Synthesizer which provides all clocks required for high-speed RISC or  
CISC microprocessor. Four different frequency of CPU, and PCI clocks are externally selectable with  
smooth transitions. The 0.5% or 0.75% center type spread spectrum can be selected to reduce EMI.  
The W83L197R-16 accepts a 14.318 MHz reference crystal as its input and runs on a 3.3V supply.  
High drive PCI CLOCK outputs typically provide greater than 1 V /ns slew rate into 30 pF loads. CPU  
¡ Ó  
CLOCK outputs typically provide better than 1 V /ns slew rate into 20 pF loads as maintaining 50  
5% duty cycle. The fixed frequency outputs as REF, 48 MHz provide better than 0.5V /ns slew rate.  
2.0 PRODUCT FEATURES  
·
·
·
·
·
Supports PentiumÔ II CPUs  
4 sets of CPU frequencies selection  
2 CPU clocks (one free running CPU clock)  
6 PCI synchronous clocks(one free running PCI clock)  
Optional single or mixed supply:  
(Vdd3 = VddC= 3.3V±5%) or (VddC = 2.5V±5%)  
Skew form CPU to PCI clock 1.5 to 4.0 ns, CPU leads.  
CPU clock jitter less than 200ps  
·
·
·
·
·
PCI_F,PCI1:6 clock skew less than 500ps  
¡ Ó  
¡ Ó  
0.5% or 0.75% center type spread spectrum function to reduce EMI  
Programmable registers to enable/stop each output and select modes  
(mode as Tri-state or Normal )  
·
·
48 MHz for USB  
28-pin SOP package (209mil)  
Publication Release Date: Mar. 1999  
Revision 0.10  
- 1 -  
W83L197R-16  
PRELIMINARY  
3.0 BLOCK DIAGRAM  
Vdd3  
X1  
X2  
XTAL  
OSC  
REF2X  
CPU_STOP#  
SEL100/66#  
VddC  
PLL1  
Spread  
Spectrum  
STOP  
CPUCLK0  
CPUCLK1  
¡ Ò  
2/3/4  
Vdd3  
PCI  
clock  
Divder  
PCICLK_F  
PCI_STOP#  
PWR_DWN#  
PCICLK(1:5)  
STOP  
Vdd3  
5
Power  
down  
control  
Vdd3  
48MHz  
PLL2  
4.0 PIN CONFIGURATION  
Vss  
Vdd3  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
1
Xin  
Xout  
Vss  
PCICLK_F  
PCICLK1  
2
3
4
5
6
7
8
9
REF2X/FS0*  
VddC  
CPUCLK0  
CPUCLK1  
Vss  
Vdd3  
Vss  
PCI_STOP#  
CPU_STOP#  
PWR_DWN#  
Vdd3  
PCICLK2  
PCICLK3  
Vdd3  
PCICLK4  
PCICLK5  
10  
11  
12  
17  
16  
15  
Vss  
Vdd3  
Vss  
48MHz/SPREAD*  
13  
14  
SEL100/66#  
Publication Release Date: Mar. 1999  
Revision 0.10  
- 2 -  
W83L197R-16  
PRELIMINARY  
5.0 PIN DESCRIPTION  
IN - Input  
OUT - Output  
I/O - Bi-directional Pin  
# - Low active  
* - Internal 250kW pull-up  
5.1 Crystal I/O  
SYMBOL  
PIN  
I/O  
FUNCTION  
Xin  
1
IN  
Crystal input with internal loading capacitors and  
feedback resistors.  
Xout  
2
OUT Crystal output at 14.318MHz nominally.  
5.2 CPU, PCI Clock Outputs  
SYMBOL  
CPUCLK0  
PIN  
I/O  
FUNCTION  
24,23  
OUT Low skew (< 250ps) clock outputs for host  
frequencies such as CPU, Chipset and Cache.  
VddC is the supply voltage for these outputs.  
CPUCLK1  
PCICLK [ 1:5 ]  
PCICLK_F  
5,7,8,10,11  
OUT Low skew (< 250ps) PCI clock outputs.  
4
PCI_STOP#  
19  
I/O  
I/O  
PCI_STOP# input used in power management mode  
for synchronously stopping the all CPU clocks.  
CPU_STOP#  
18  
this pin is CPU_STOP # and used in power  
management mode for synchronously stopping the  
all PCI clocks.  
5.3 Fixed Frequency Outputs  
SYMBOL  
SEL100/66#  
PIN  
I/O  
FUNCTION  
15  
26  
IN  
CPU clock frequency select pin.  
REF2X / FS0*  
I/O  
Internal 250kW pull-up.  
Latched input for FS0* to chose frequencies at initial  
power up.  
Reference clock during normal operation.  
48MHz/SPREAD*  
16  
I/O  
Internal 250kW pull-up.  
48MHz output for USB during normal operation.  
Latched input for SPREAD* to select the spread  
spectrum spend at initial power up.  
Publication Release Date: Mar. 1999  
Revision 0.10  
- 3 -  
W83L197R-16  
PRELIMINARY  
5.4 Power Pins  
SYMBOL  
PIN  
FUNCTION  
VddC  
25  
Power supply for core logic and PLL circuitry. Connect  
to 3.3V supply.  
Vdd3  
Vss  
6,9,13,21,27  
Power supply for others Connect to 3.3V supply.  
3, 12,14,20,22,28 Circuit Ground.  
6.0 FREQUENCY SELECTION  
FS0*  
SEL100/66#  
CPUCLK0, CPUCLK1  
100MHz  
PCI  
1
1
0
0
1
0
1
0
33.3MHz  
33.4MHz  
37.3MHz  
34.33MHz  
66.8MHz  
112MHz  
103MHz  
7.0 FUNTION DESCRIPTION  
7.1 SPREAD SPECTRUM FUNCTION SELECTION TABLE  
SPREAD*  
Spread Spectrum  
¡ Ó  
Type  
Center  
Center  
1
0
0.5%  
¡ Ó  
0.75%  
7.2 POWER MANAGEMENT FUNCTIONS  
The W83L197R-16 may be disabled in the low state according to the following table in order to  
reduce power consumption. All clocks are stopped in the low state, but maintain a valid high period  
on transitions from running to stop. The CPU and PCI clocks transform between running and stop by  
waiting for one positive edge on PCICLK_F followed by negative edge on the clock of interest, after  
which high levels of the output are either enabled or disabled.  
CPU_STOP#  
PCI_STOP#  
CPUCLK1  
LOW  
PCICLK1:5  
LOW  
PCICLK_F  
RUNNING  
RUNNING  
RUNNING  
RUNNING  
XTAL & VCOs  
RUNNING  
RUNNING  
RUNNING  
RUNNING  
0
0
1
1
0
1
0
1
LOW  
RUNNING  
LOW  
RUNNING  
RUNNING  
RUNNING  
Publication Release Date: Mar. 1999  
Revision 0.10  
- 4 -  
W83L197R-16  
PRELIMINARY  
8.0 SPECIFICATIONS  
8.1 ABSOLUTE MAXIMUM RATINGS  
Stresses greater than those listed in this table may cause permanent damage to the device.  
Precautions should be taken to avoid application of any voltage higher than the maximum rated  
voltages to this circuit. Maximum conditions for extended periods may affect reliability. Unused  
inputs must always be tied to an appropriate logic voltage level (Ground or Vdd).  
Symbol  
Vdd , VIN  
TSTG  
Parameter  
Rating  
Voltage on any pin with respect to GND  
- 0.5 V to + 7.0 V  
Storage Temperature  
Ambient Temperature  
Operating Temperature  
- 65°C to + 150°C  
- 55°C to + 125°C  
0°C to + 70°C  
TB  
TA  
8.2 AC CHARACTERISTICS  
Vdd3 = VddCore = 3.3V  
Parameter  
±
5%, VddC = 2.5V  
Symbol Min  
45  
±5% , TA = 0°C to +70°C  
Typ  
Max  
55  
4
Units  
%
Test Conditions  
Output Duty Cycle  
CPU to PCI Offset  
50  
Measured at 1.5V  
1
ns  
15 pF Load Measured at 1.5V  
15 pF Load Measured at 1.5V  
tOFF  
Skew (CPU-CPU), (PCI-  
PCI)  
250  
ps  
tSKEW  
Cycle to Cycle Jitter  
200  
500  
ps  
ps  
tCCJ  
tJA  
CPU  
Absolute Jitter  
Jitter Spectrum 20 dB  
Bandwidth from Center  
Output Rise (0.4V ~ 2.0V)  
& Fall (2.0V ~0.4V) Time  
BWJ  
500  
1.6  
KHz  
ns  
0.4  
15 pF Load on CPU and PCI  
outputs  
tTLH  
tTHL  
Overshoot/Undershoot  
Beyond Power Rails  
Ring Back Exclusion  
Vover  
0.7  
0.7  
1.5  
2.1  
V
V
22 W at source of 8 inch PCB  
run to 15 pF load  
VRBE  
Ring Back must not enter this  
range.  
Publication Release Date: Mar. 1999  
Revision 0.10  
- 5 -  
W83L197R-16  
PRELIMINARY  
8.3 DC CHARACTERISTICS  
Vdd3 = VddCore = 3.3V  
Parameter  
±
5%, VddC = 2.5V±5% , TA = 0°C to +70°C  
Symbol Min  
Typ  
Max  
Units  
Test Conditions  
Input Low Voltage  
0.8  
VIL  
Vdc  
Vdc  
mA  
mA  
Input High Voltage  
Input Low Current  
Input High Current  
2.0  
VIH  
IIL  
-25  
10  
50  
IIH  
Output Low Voltage  
IOL = 1 mA  
CPU_F, CPU1  
VOL  
mVdc  
Output High Voltage  
IOH = -1mA  
3.1  
CPU_F, CPU1  
VOH  
Vdc  
Output Low Current  
27  
20.5  
40  
57  
53  
85  
74  
37  
55  
55  
87  
88  
44  
97  
139  
140  
152  
76  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
CPU_F,CPI1  
PCI_F,PCI1:6  
IOAPIC  
IOL  
50  
REF2X  
25  
48,24MHz  
CPU_F,CPI1  
PCI_F,PCI1:6  
IOAPIC  
Output High Current  
IOH  
25  
97  
31  
189  
155  
188  
94  
40  
54  
REF2X  
27  
48,24MHz  
Publication Release Date: Mar. 1999  
Revision 0.10  
- 6 -  
W83L197R-16  
PRELIMINARY  
8.4 BUFFER CHARACTERISTICS  
8.4.1 TYPE 1 BUFFER FOR CPUCLK  
Parameter  
Symbol  
IOH(min)  
IOH(max)  
Min  
Typ  
Max  
Units  
Test Conditions  
Pull-Up Current Min  
-27  
mA  
Vout = 1.0 V  
Pull-Up Current Max  
Pull-Down Current Min  
Pull-Down Current Max  
-27  
mA  
mA  
Vout = 2.0V  
Vout = 1.2 V  
IOL(min)  
IOL(max)  
TRF(min)  
27  
mA  
ns  
Vout = 0.3 V  
10 pF Load  
Rise/Fall Time Min  
Between 0.4 V and 2.0 V  
0.4  
Rise/Fall Time Max  
Between 0.4 V and 2.0 V  
1.6  
ns  
20 pF Load  
TRF(max)  
8.4.2 TYPE 3 BUFFER FOR REF2X, 48MHZ  
Parameter  
Symbol Min  
Typ  
Max  
Units  
Test Conditions  
Pull-Up Current Min  
-29  
mA  
Vout = 1.0 V  
IOH(min)  
IOH(max)  
IOL(min)  
IOL(max)  
TRF(min)  
Pull-Up Current Max  
Pull-Down Current Min  
Pull-Down Current Max  
-23  
mA  
mA  
Vout = 3.135V  
Vout = 1.95 V  
29  
mA  
ns  
Vout = 0.4 V  
10 pF Load  
Rise/Fall Time Min  
Between 0.8 V and 2.0 V  
1.0  
Rise/Fall Time Max  
4.0  
ns  
20 pF Load  
TRF(max)  
Between 0.8 V and 2.0 V  
8.4.3 TYPE 5 BUFFER FOR PCICLK(1:5,F)  
Parameter  
Symbol Min  
Typ  
Max  
Units  
Test Conditions  
Pull-Up Current Min  
-33  
mA  
Vout = 1.0 V  
IOH(min)  
IOH(max)  
IOL(min)  
IOL(max)  
TRF(min)  
Pull-Up Current Max  
Pull-Down Current Min  
Pull-Down Current Max  
-33  
mA  
mA  
Vout = 3.135 V  
Vout = 1.95 V  
30  
38  
mA  
ns  
Vout = 0.4 V  
15 pF Load  
Rise/Fall Time Min  
Between 0.8 V and 2.0 V  
0.5  
Rise/Fall Time Max  
2.0  
ns  
30 pF Load  
TRF(max)  
Between 0.8 V and 2.0 V  
Publication Release Date: Mar. 1999  
Revision 0.10  
- 7 -  
W83L197R-16  
PRELIMINARY  
9.0 OPERATION OF DUAL FUCTION PINS  
Pin16 and pin26 are dual function pins and are used for selecting different functions in this device  
(see Pin description). During power up, these pins are in input mode (see Fig1), therefore, and are  
considered input select pins. When Vdd reaches 2.5V, the logic level that is present on these pins  
are latched into their appropriate internal registers. Once the correct information are properly latched,  
these pins will change into output pins and will be pulled low by default. At the end of the power up  
timer (within 3 ms) outputs starts to toggle at the specified frequency.  
2.5V  
Vdd  
Output  
pull-low  
#16 48/SPREAD*  
#26 REF2X/FS0*  
Output  
tri-state  
Within 3ms  
Input  
Output  
Output  
pull-low  
Output  
tri-state  
All other clocks  
Each of these pins are a large pull-up resistor ( 250 kW @3.3V ) inside. The default state will be logic  
1, but the internal pull-up resistor may be too large when long traces or heavy load appear on these  
dual function pins. Under these conditions, an external 10 kW resistor is recommended to be  
connected to Vdd if logic 1 is expected. The same 10 kW connection to ground if a logic 0 is desired.  
The 10 kW resistor should be place before the serious terminating resistor. Note that these logic will  
only be latched at initial power on.  
If optional EMI reducing capacitor are needed, they should be placed as close to the series  
terminating resistor as possible and after the series terminating resistor. These capacitor has typical  
values ranging from 4.7pF to 22pF.  
Publication Release Date: Mar. 1999  
- 8 -  
Revision 0.10  
W83L197R-16  
PRELIMINARY  
Vdd  
Series  
Terminating  
Resistor  
W
10k  
Clock  
Trace  
Device  
Pin  
EMI  
Reducing  
Cap  
10kW  
Optional  
Ground  
Ground  
Programming Header  
Vdd Pad  
Ground Pad  
Series  
Terminating  
Resistor  
10k  
W
Clock  
Trace  
Device  
Pin  
EMI  
Reducing  
Cap  
Optional  
Ground  
Publication Release Date: Mar. 1999  
Revision 0.10  
- 9 -  
W83L197R-16  
PRELIMINARY  
10.0 ORDERING INFORMATION  
Part Number  
Package Type  
Production Flow  
W83L197R-16  
28 PIN SOP (209mil)  
Commercial, 0°C to +70°C  
11.0 HOW TO READ THE TOP MARKING  
W83L197R-16  
28051234  
814OBB  
1st line: Winbond logo and the type number: W83L197R-16  
2nd line: Tracking code 2 8051234  
2: wafers manufactured in Winbond FAB 2  
8051234: wafer production series lot number  
3rd line: Tracking code 814 G B B  
814: packages made in '98, week 14  
G: assembly house ID; A means ASE, S means SPIL, G means GR  
BB: IC revision  
All the trade marks of products and companies mentioned in this data sheet belong to  
their respective owners.  
Publication Release Date: Mar. 1999  
- 10 -  
Revision 0.10  
W83L197R-16  
PRELIMINARY  
12.0 PACKAGE DRAWING AND DIMENSIONS  
28-SOP  
D
15  
2
DIMENSION IN MM DIMENSION IN INCH  
MIN. NOM MAX. MIN. NOM MAX.  
SYMBOL  
2.00  
0.079  
A
A1  
A2  
b
0.05  
1.65 1.75 1.85  
0.002  
0.065  
DTEAIL A  
0.069  
0.073  
0.015  
0.010  
0.22  
0.09  
0.38 0.009  
0.25 0.004  
H
E
E
c
10.20  
5.30 5.60  
7.80 8.20  
0.65  
9.90  
5.00  
0.389 0.401 0.413  
0.197 0.209 0.220  
0.291 0.307 0.323  
0.0256  
10.50  
D
E
HE  
7.40  
e
L
L1  
0.95  
0.037  
0.55 0.75  
1.25  
0.021 0.030  
0.050  
0.004  
8
Y
0.10  
8
1
14  
0
0
q
A2  
A
SEATING PLANE  
SEATING PLANE  
Y
q
L
L1  
DETAIL A  
e
b
A1  
Headquarters  
No. 4, Creation Rd. III  
Science-Based Industrial Park  
Hsinchu, Taiwan  
TEL: 886-35-770066  
Winbond Electronics  
(North America) Corp.  
2730 Orchard Parkway  
San Jose, CA 95134 U.S.A.  
TEL: 1-408-9436666  
Winbond Electronics (H.K.) Ltd.  
Rm. 803, World Trade Square, Tower II  
123 Hoi Bun Rd., Kwun Tong  
Kowloon, Hong Kong  
TEL: 852-27516023-7  
FAX: 852-27552064  
FAX: 886-35-789467  
www: http://www.winbond.com.tw/  
FAX: 1-408-9436668  
Taipei Office  
11F, No. 115, Sec. 3, Min-Sheng East Rd.  
Taipei, Taiwan  
TEL: 886-2-7190505  
FAX: 886-2-7197502  
TLX: 16485 WINTPE  
Please note that all data and specifications are subject to change without notice. All the  
trade marks of products and companies mentioned in this data sheet belong to their  
respective owners.  
These products are not designed for use in life support appliances, devices, or systems  
where malfunction of these products can reasonably be expected to result in personal  
injury. Winbond customers using or selling these products for use in such applications  
do so at their own risk and agree to fully indemnify Winbond for any damages resulting  
from such improper use or sale.  
Publication Release Date: Mar. 1999  
- 11 -  
Revision 0.10  

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