W83L197R-16 [WINBOND]
2-CHIP 100MHZ CLOCK FOR BX NOTEBOOK; 双芯片100MHZ时钟BX笔记本![W83L197R-16](http://pdffile.icpdf.com/pdf2/p00204/img/icpdf/W83L19_1153440_icpdf.jpg)
型号: | W83L197R-16 |
厂家: | ![]() |
描述: | 2-CHIP 100MHZ CLOCK FOR BX NOTEBOOK |
文件: | 总11页 (文件大小:137K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
W83L197R-16
2-CHIP 100MHZ CLOCK FOR BX NOTEBOOK
1.0 GENERAL DESCRIPTION
The W83L197R-16 is a Clock Synthesizer which provides all clocks required for high-speed RISC or
CISC microprocessor. Four different frequency of CPU, and PCI clocks are externally selectable with
smooth transitions. The 0.5% or 0.75% center type spread spectrum can be selected to reduce EMI.
The W83L197R-16 accepts a 14.318 MHz reference crystal as its input and runs on a 3.3V supply.
High drive PCI CLOCK outputs typically provide greater than 1 V /ns slew rate into 30 pF loads. CPU
¡ Ó
CLOCK outputs typically provide better than 1 V /ns slew rate into 20 pF loads as maintaining 50
5% duty cycle. The fixed frequency outputs as REF, 48 MHz provide better than 0.5V /ns slew rate.
2.0 PRODUCT FEATURES
·
·
·
·
·
Supports PentiumÔ II CPUs
4 sets of CPU frequencies selection
2 CPU clocks (one free running CPU clock)
6 PCI synchronous clocks(one free running PCI clock)
Optional single or mixed supply:
(Vdd3 = VddC= 3.3V±5%) or (VddC = 2.5V±5%)
Skew form CPU to PCI clock 1.5 to 4.0 ns, CPU leads.
CPU clock jitter less than 200ps
·
·
·
·
·
PCI_F,PCI1:6 clock skew less than 500ps
¡ Ó
¡ Ó
0.5% or 0.75% center type spread spectrum function to reduce EMI
Programmable registers to enable/stop each output and select modes
(mode as Tri-state or Normal )
·
·
48 MHz for USB
28-pin SOP package (209mil)
Publication Release Date: Mar. 1999
Revision 0.10
- 1 -
W83L197R-16
PRELIMINARY
3.0 BLOCK DIAGRAM
Vdd3
X1
X2
XTAL
OSC
REF2X
CPU_STOP#
SEL100/66#
VddC
PLL1
Spread
Spectrum
STOP
CPUCLK0
CPUCLK1
¡ Ò
2/3/4
Vdd3
PCI
clock
Divder
PCICLK_F
PCI_STOP#
PWR_DWN#
PCICLK(1:5)
STOP
Vdd3
5
Power
down
control
Vdd3
48MHz
PLL2
4.0 PIN CONFIGURATION
Vss
Vdd3
28
27
26
25
24
23
22
21
20
19
18
1
Xin
Xout
Vss
PCICLK_F
PCICLK1
2
3
4
5
6
7
8
9
REF2X/FS0*
VddC
CPUCLK0
CPUCLK1
Vss
Vdd3
Vss
PCI_STOP#
CPU_STOP#
PWR_DWN#
Vdd3
PCICLK2
PCICLK3
Vdd3
PCICLK4
PCICLK5
10
11
12
17
16
15
Vss
Vdd3
Vss
48MHz/SPREAD*
13
14
SEL100/66#
Publication Release Date: Mar. 1999
Revision 0.10
- 2 -
W83L197R-16
PRELIMINARY
5.0 PIN DESCRIPTION
IN - Input
OUT - Output
I/O - Bi-directional Pin
# - Low active
* - Internal 250kW pull-up
5.1 Crystal I/O
SYMBOL
PIN
I/O
FUNCTION
Xin
1
IN
Crystal input with internal loading capacitors and
feedback resistors.
Xout
2
OUT Crystal output at 14.318MHz nominally.
5.2 CPU, PCI Clock Outputs
SYMBOL
CPUCLK0
PIN
I/O
FUNCTION
24,23
OUT Low skew (< 250ps) clock outputs for host
frequencies such as CPU, Chipset and Cache.
VddC is the supply voltage for these outputs.
CPUCLK1
PCICLK [ 1:5 ]
PCICLK_F
5,7,8,10,11
OUT Low skew (< 250ps) PCI clock outputs.
4
PCI_STOP#
19
I/O
I/O
PCI_STOP# input used in power management mode
for synchronously stopping the all CPU clocks.
CPU_STOP#
18
this pin is CPU_STOP # and used in power
management mode for synchronously stopping the
all PCI clocks.
5.3 Fixed Frequency Outputs
SYMBOL
SEL100/66#
PIN
I/O
FUNCTION
15
26
IN
CPU clock frequency select pin.
REF2X / FS0*
I/O
Internal 250kW pull-up.
Latched input for FS0* to chose frequencies at initial
power up.
Reference clock during normal operation.
48MHz/SPREAD*
16
I/O
Internal 250kW pull-up.
48MHz output for USB during normal operation.
Latched input for SPREAD* to select the spread
spectrum spend at initial power up.
Publication Release Date: Mar. 1999
Revision 0.10
- 3 -
W83L197R-16
PRELIMINARY
5.4 Power Pins
SYMBOL
PIN
FUNCTION
VddC
25
Power supply for core logic and PLL circuitry. Connect
to 3.3V supply.
Vdd3
Vss
6,9,13,21,27
Power supply for others Connect to 3.3V supply.
3, 12,14,20,22,28 Circuit Ground.
6.0 FREQUENCY SELECTION
FS0*
SEL100/66#
CPUCLK0, CPUCLK1
100MHz
PCI
1
1
0
0
1
0
1
0
33.3MHz
33.4MHz
37.3MHz
34.33MHz
66.8MHz
112MHz
103MHz
7.0 FUNTION DESCRIPTION
7.1 SPREAD SPECTRUM FUNCTION SELECTION TABLE
SPREAD*
Spread Spectrum
¡ Ó
Type
Center
Center
1
0
0.5%
¡ Ó
0.75%
7.2 POWER MANAGEMENT FUNCTIONS
The W83L197R-16 may be disabled in the low state according to the following table in order to
reduce power consumption. All clocks are stopped in the low state, but maintain a valid high period
on transitions from running to stop. The CPU and PCI clocks transform between running and stop by
waiting for one positive edge on PCICLK_F followed by negative edge on the clock of interest, after
which high levels of the output are either enabled or disabled.
CPU_STOP#
PCI_STOP#
CPUCLK1
LOW
PCICLK1:5
LOW
PCICLK_F
RUNNING
RUNNING
RUNNING
RUNNING
XTAL & VCOs
RUNNING
RUNNING
RUNNING
RUNNING
0
0
1
1
0
1
0
1
LOW
RUNNING
LOW
RUNNING
RUNNING
RUNNING
Publication Release Date: Mar. 1999
Revision 0.10
- 4 -
W83L197R-16
PRELIMINARY
8.0 SPECIFICATIONS
8.1 ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in this table may cause permanent damage to the device.
Precautions should be taken to avoid application of any voltage higher than the maximum rated
voltages to this circuit. Maximum conditions for extended periods may affect reliability. Unused
inputs must always be tied to an appropriate logic voltage level (Ground or Vdd).
Symbol
Vdd , VIN
TSTG
Parameter
Rating
Voltage on any pin with respect to GND
- 0.5 V to + 7.0 V
Storage Temperature
Ambient Temperature
Operating Temperature
- 65°C to + 150°C
- 55°C to + 125°C
0°C to + 70°C
TB
TA
8.2 AC CHARACTERISTICS
Vdd3 = VddCore = 3.3V
Parameter
±
5%, VddC = 2.5V
Symbol Min
45
±5% , TA = 0°C to +70°C
Typ
Max
55
4
Units
%
Test Conditions
Output Duty Cycle
CPU to PCI Offset
50
Measured at 1.5V
1
ns
15 pF Load Measured at 1.5V
15 pF Load Measured at 1.5V
tOFF
Skew (CPU-CPU), (PCI-
PCI)
250
ps
tSKEW
Cycle to Cycle Jitter
200
500
ps
ps
tCCJ
tJA
CPU
Absolute Jitter
Jitter Spectrum 20 dB
Bandwidth from Center
Output Rise (0.4V ~ 2.0V)
& Fall (2.0V ~0.4V) Time
BWJ
500
1.6
KHz
ns
0.4
15 pF Load on CPU and PCI
outputs
tTLH
tTHL
Overshoot/Undershoot
Beyond Power Rails
Ring Back Exclusion
Vover
0.7
0.7
1.5
2.1
V
V
22 W at source of 8 inch PCB
run to 15 pF load
VRBE
Ring Back must not enter this
range.
Publication Release Date: Mar. 1999
Revision 0.10
- 5 -
W83L197R-16
PRELIMINARY
8.3 DC CHARACTERISTICS
Vdd3 = VddCore = 3.3V
Parameter
±
5%, VddC = 2.5V±5% , TA = 0°C to +70°C
Symbol Min
Typ
Max
Units
Test Conditions
Input Low Voltage
0.8
VIL
Vdc
Vdc
mA
mA
Input High Voltage
Input Low Current
Input High Current
2.0
VIH
IIL
-25
10
50
IIH
Output Low Voltage
IOL = 1 mA
CPU_F, CPU1
VOL
mVdc
Output High Voltage
IOH = -1mA
3.1
CPU_F, CPU1
VOH
Vdc
Output Low Current
27
20.5
40
57
53
85
74
37
55
55
87
88
44
97
139
140
152
76
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
CPU_F,CPI1
PCI_F,PCI1:6
IOAPIC
IOL
50
REF2X
25
48,24MHz
CPU_F,CPI1
PCI_F,PCI1:6
IOAPIC
Output High Current
IOH
25
97
31
189
155
188
94
40
54
REF2X
27
48,24MHz
Publication Release Date: Mar. 1999
Revision 0.10
- 6 -
W83L197R-16
PRELIMINARY
8.4 BUFFER CHARACTERISTICS
8.4.1 TYPE 1 BUFFER FOR CPUCLK
Parameter
Symbol
IOH(min)
IOH(max)
Min
Typ
Max
Units
Test Conditions
Pull-Up Current Min
-27
mA
Vout = 1.0 V
Pull-Up Current Max
Pull-Down Current Min
Pull-Down Current Max
-27
mA
mA
Vout = 2.0V
Vout = 1.2 V
IOL(min)
IOL(max)
TRF(min)
27
mA
ns
Vout = 0.3 V
10 pF Load
Rise/Fall Time Min
Between 0.4 V and 2.0 V
0.4
Rise/Fall Time Max
Between 0.4 V and 2.0 V
1.6
ns
20 pF Load
TRF(max)
8.4.2 TYPE 3 BUFFER FOR REF2X, 48MHZ
Parameter
Symbol Min
Typ
Max
Units
Test Conditions
Pull-Up Current Min
-29
mA
Vout = 1.0 V
IOH(min)
IOH(max)
IOL(min)
IOL(max)
TRF(min)
Pull-Up Current Max
Pull-Down Current Min
Pull-Down Current Max
-23
mA
mA
Vout = 3.135V
Vout = 1.95 V
29
mA
ns
Vout = 0.4 V
10 pF Load
Rise/Fall Time Min
Between 0.8 V and 2.0 V
1.0
Rise/Fall Time Max
4.0
ns
20 pF Load
TRF(max)
Between 0.8 V and 2.0 V
8.4.3 TYPE 5 BUFFER FOR PCICLK(1:5,F)
Parameter
Symbol Min
Typ
Max
Units
Test Conditions
Pull-Up Current Min
-33
mA
Vout = 1.0 V
IOH(min)
IOH(max)
IOL(min)
IOL(max)
TRF(min)
Pull-Up Current Max
Pull-Down Current Min
Pull-Down Current Max
-33
mA
mA
Vout = 3.135 V
Vout = 1.95 V
30
38
mA
ns
Vout = 0.4 V
15 pF Load
Rise/Fall Time Min
Between 0.8 V and 2.0 V
0.5
Rise/Fall Time Max
2.0
ns
30 pF Load
TRF(max)
Between 0.8 V and 2.0 V
Publication Release Date: Mar. 1999
Revision 0.10
- 7 -
W83L197R-16
PRELIMINARY
9.0 OPERATION OF DUAL FUCTION PINS
Pin16 and pin26 are dual function pins and are used for selecting different functions in this device
(see Pin description). During power up, these pins are in input mode (see Fig1), therefore, and are
considered input select pins. When Vdd reaches 2.5V, the logic level that is present on these pins
are latched into their appropriate internal registers. Once the correct information are properly latched,
these pins will change into output pins and will be pulled low by default. At the end of the power up
timer (within 3 ms) outputs starts to toggle at the specified frequency.
2.5V
Vdd
Output
pull-low
#16 48/SPREAD*
#26 REF2X/FS0*
Output
tri-state
Within 3ms
Input
Output
Output
pull-low
Output
tri-state
All other clocks
Each of these pins are a large pull-up resistor ( 250 kW @3.3V ) inside. The default state will be logic
1, but the internal pull-up resistor may be too large when long traces or heavy load appear on these
dual function pins. Under these conditions, an external 10 kW resistor is recommended to be
connected to Vdd if logic 1 is expected. The same 10 kW connection to ground if a logic 0 is desired.
The 10 kW resistor should be place before the serious terminating resistor. Note that these logic will
only be latched at initial power on.
If optional EMI reducing capacitor are needed, they should be placed as close to the series
terminating resistor as possible and after the series terminating resistor. These capacitor has typical
values ranging from 4.7pF to 22pF.
Publication Release Date: Mar. 1999
- 8 -
Revision 0.10
W83L197R-16
PRELIMINARY
Vdd
Series
Terminating
Resistor
W
10k
Clock
Trace
Device
Pin
EMI
Reducing
Cap
10kW
Optional
Ground
Ground
Programming Header
Vdd Pad
Ground Pad
Series
Terminating
Resistor
10k
W
Clock
Trace
Device
Pin
EMI
Reducing
Cap
Optional
Ground
Publication Release Date: Mar. 1999
Revision 0.10
- 9 -
W83L197R-16
PRELIMINARY
10.0 ORDERING INFORMATION
Part Number
Package Type
Production Flow
W83L197R-16
28 PIN SOP (209mil)
Commercial, 0°C to +70°C
11.0 HOW TO READ THE TOP MARKING
W83L197R-16
28051234
814OBB
1st line: Winbond logo and the type number: W83L197R-16
2nd line: Tracking code 2 8051234
2: wafers manufactured in Winbond FAB 2
8051234: wafer production series lot number
3rd line: Tracking code 814 G B B
814: packages made in '98, week 14
G: assembly house ID; A means ASE, S means SPIL, G means GR
BB: IC revision
All the trade marks of products and companies mentioned in this data sheet belong to
their respective owners.
Publication Release Date: Mar. 1999
- 10 -
Revision 0.10
W83L197R-16
PRELIMINARY
12.0 PACKAGE DRAWING AND DIMENSIONS
28-SOP
D
15
2
DIMENSION IN MM DIMENSION IN INCH
MIN. NOM MAX. MIN. NOM MAX.
SYMBOL
2.00
0.079
A
A1
A2
b
0.05
1.65 1.75 1.85
0.002
0.065
DTEAIL A
0.069
0.073
0.015
0.010
0.22
0.09
0.38 0.009
0.25 0.004
H
E
E
c
10.20
5.30 5.60
7.80 8.20
0.65
9.90
5.00
0.389 0.401 0.413
0.197 0.209 0.220
0.291 0.307 0.323
0.0256
10.50
D
E
HE
7.40
e
L
L1
0.95
0.037
0.55 0.75
1.25
0.021 0.030
0.050
0.004
8
Y
0.10
8
1
14
0
0
q
A2
A
SEATING PLANE
SEATING PLANE
Y
q
L
L1
DETAIL A
e
b
A1
Headquarters
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: 886-35-770066
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: 1-408-9436666
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: 852-27516023-7
FAX: 852-27552064
FAX: 886-35-789467
www: http://www.winbond.com.tw/
FAX: 1-408-9436668
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
TLX: 16485 WINTPE
Please note that all data and specifications are subject to change without notice. All the
trade marks of products and companies mentioned in this data sheet belong to their
respective owners.
These products are not designed for use in life support appliances, devices, or systems
where malfunction of these products can reasonably be expected to result in personal
injury. Winbond customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Winbond for any damages resulting
from such improper use or sale.
Publication Release Date: Mar. 1999
- 11 -
Revision 0.10
相关型号:
©2020 ICPDF网 联系我们和版权申明