ZL60301MJD [ZARLINK]
Parallel Fiber Optic Transceiver (4 + 4) x 2.7 Gbps; 并行光纤收发器（4 + 4 ）× 2.7 Gbps的
| 型号： | ZL60301MJD |
| 厂家： | 
ZARLINK SEMICONDUCTOR INC |
| 描述： | Parallel Fiber Optic Transceiver (4 + 4) x 2.7 Gbps |
| 文件： | 总22页 (文件大小：480K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ZL60301
Parallel Fiber Optic Transceiver
(4 + 4) x 2.7 Gbps
Data Sheet
June 2004
Ordering Information
ZL60301/MJD
Parallel Fiber Transceiver
Heat sink and EMI shield options
are available upon request
0°C to +80°C
Features
•
Industry standard MPO/MTP ribbon fiber
connector interface
Pluggable MegArray® ball grid array connector
•
•
•
•
•
Complies with POP4 MSA specification
•
•
4 Transmit channels and 4 Receive channels
Data rate up to 2.7 Gbps per channel
850 nm VCSEL array
Optionally available with EMI shield and external
heat sink
•
•
•
Laser class 1M IEC 60825-1:2001 compliant
Low power consumption, max 1 W
Power supply 3.3 V
Data I/O is CML compatible with DC blocking
capacitors
Link reach 300 m with 50/125 µm 500 MHz.km
fiber at 2.5 Gbps
Channel BER better than 10-12
•
•
VCCA Rx VCCB Rx VEE Rx
Rx_EN Rx_SD SQ_EN
RX0
Trans-
Impedance
and
Limiting
Amplifier
DOUT0+
DOUT0-
RX1
PIN Array
RX2
DOUT3+
DOUT3-
RX3
DIN3+
DIN3-
TX3
TX2
VCSEL
Driver
VCSEL
Array
TX1
DIN0+
DIN0-
TX0
VCSEL Driver Controller
VCC Tx
Tx_EN
Tx_DIS
RESET
FAULT
VEE TX
Figure 1 - Transceiver Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2004, Zarlink Semiconductor Inc. All Rights Reserved.
ZL60301
Data Sheet
Applications
•
•
•
High-speed interconnects within and between switches, routers and transport equipment
Proprietary backplanes
Interconnects rack-to-rack, shelf-to-shelf, board-to-board, board-to-optical backplane
Description
The ZL60301 is a very high-speed transceiver for parallel fiber applications. This transceiver performs E/O and O/E
conversions for data transmission over multimode fiber ribbon.
The transmit section converts parallel electrical input signals via a laser driver and a VCSEL array into parallel
optical output signals at a wavelength of 850 nm.
The receive section converts parallel optical input signals via a PIN photodiode array and a transimpedance and
limiting amplifier, into electrical output signals.
The module is fitted with a pluggable industry-standard MegArray® BGA connector. This provides ease of assembly
on the host board and enables provisioning of bandwidth on demand.
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Zarlink Semiconductor Inc.
ZL60301
Data Sheet
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Transmitter Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Transmitter Control and Status Signal Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Transmitter Control and Status Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Receiver Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Receiver Control and Status Signal Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Receiver Control and Status Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Transceiver Module Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Transceiver Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Regulatory Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Eye safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Electrostatic discharge immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Electromagnetic Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Emission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Handling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Cleaning the Optical Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
ESD handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Link Reach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Link Model Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Electrical Interface - Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
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Zarlink Semiconductor Inc.
ZL60301
Data Sheet
Absolute Maximum Ratings
Not necessarily applied together. Exceeding these values may cause permanent damage. Functional operation
under these conditions is not implied.
Parameter
Symbol
Min.
Max.
Unit
Supply voltage
VCC
∆V
-0.3
4.0
1.2
V
V
Differential input voltage amplitude1
Voltage on any pin
VPIN
MOS
TSTG
VESD
-0.3
5
VCC + 0.3
95
V
Relative humidity (non-condensing)
Storage temperature
%
°C
kV
-40
100
ESD resistance
±1
1. Differential input voltage amplitude is defined as ∆V = DIN+ − DIN-.
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Unit
Power supply voltage
VCC
TCASE
fD
3.135
0
3.465
80
V
°C
Operating case temperature
Signalling rate (per channel)1
Link distance2
1.0
2
2.7
Gbps
m
LD
Data I/O DC blocking capacitors3
Power supply noise4
CBLK
VNPS
100
nF
200
mVp-p
1. Data patterns are to have maximum run lengths and DC balance shifts no worse than that of a Pseudo Random Bit Sequence of
length 223-1 (PRBS-23). Information on lower bit rates and longer run lengths are available on request.
2. For maximum distance, see Table 4.
3. For AC-coupling, DC blocking capacitors external to the module with a minimum value of 100 nF is recommended.
4. Power supply noise is defined at the supply side of the recommended filter for all VCC supplies over the frequency range of 500 Hz
to 2700 MHz with the recommended power supply filter in place.
L1 1
µ
H
L2 6.8 nH
R1 100
Ω
R2 1.0 kΩ
Host
Vcc
Module
Vcc
C1
10
C2
10
C3
0.1
C4
0.1
µ
F
µ
F
µ
F
µ
F
Figure 2 - Recommended Power Supply Filter
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Zarlink Semiconductor Inc.
ZL60301
Data Sheet
Transmitter Specifications
All parameters below require operating conditions according to “Recommended Operating Conditions” on page 4.
Parameter
Symbol
Min.
Max.
Unit
Optical Parameters
Launch power (50/125 µm MMF)1
Extinguished output power
Extinction ratio2
POUT
POFF
ER
-8
-2
dBm
dBm
dB
-30
6
Optical modulation amplitude3
OMA
λC
0.30
830
mW
nm
Center wavelength
860
0.85
-116
150
150
120
50
Spectral width4
∆λ
nmrms
dB/Hz
ps
Relative intensity noise OMA5
Optical output rise time (20 - 80%)
Optical output fall time (20 - 80%)
Total jitter contributed (peak to peak)6
Deterministic jitter contributed (peak to peak)
Channel to channel skew7
RIN12OMA
tRO
tFO
ps
TJ
ps
DJ
ps
tSK
100
ps
Electrical Parameters
Power dissipation
PD
ICC
∆VIN
ZIN
500
150
800
120
160
160
mW
mA
mVp-p
Ω
Supply current
Differential input voltage amplitude (peak to peak)8
Differential input impedance9
Electrical input rise time (20 - 80%)
Electrical input fall time (20 - 80%)
200
80
tRE
ps
tFE
ps
1. The output optical power is compliant with IEC 60825-1 Amendment 2, Class 1M Accessible Emission Limits.
2. The extinction ratio is measured at 622 Mbps.
3. Informative. Corresponds to POUT = -8 dBm and ER = 6 dBm.
4. Spectral width is measured as defined in EIA/TIA-455-127 Spectral Characterization of Multimode Laser Diodes.
5. Corresponds to a Relative Intensity Noise (RIN) of -120 dB/Hz.
6. Total jitter equals TP1 to TP2 as defined in IEEE 802.3 clauses 38.2 and 38.6 (Gigabit Ethernet).
7. Channel skew is defined for the condition of equal amplitude, zero ps skew signals applied to the transmitter inputs.
8. Differential input voltage is defined as the peak to peak value of the differential voltage between DIN+ and DIN-. Data inputs are CML
compatible.
9. Differential input impedance is measured between DIN+ and DIN-.
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Zarlink Semiconductor Inc.
ZL60301
Data Sheet
Classified in accordance with IEC 60825-1/A2:2001, IEC 60825-2 : 2000
Class 1M Laser Product
Emited wavelength: 840 nm
DIN+
VCC
50Ω
50Ω
13k
Ω
Ω
11k
VEE
DIN-
Figure 3 - Differential CML Input Equivalent Circuit
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Zarlink Semiconductor Inc.
ZL60301
Data Sheet
Transmitter Control and Status Signal Requirements
The following table shows the timing relationships of the status and control signals of the transmit section.
Parameter
Symbol
Min.
Typ.
Max.
Unit
Control input voltage high1
Control input voltage low
Control pull-up resistor2
Control pull-down resistor3
Status output voltage low4, 5
Status pull-down resistor4
FAULT assert time
VIH
VIL
2.1
V
0.62
V
RPU
RPD1
VOL
10
10
kΩ
kΩ
V
0.4
RPD2
TFA
10
kΩ
µs
µs
µs
µs
ms
ms
µs
µs
ms
100
100
FAULT lasers off
TFD
RESET duration
TTDD
TOFF
TON
TTEN
TTD
10
RESET assert time
5
10
100
1
RESET de-assert time
Tx_EN assert time
Tx_EN de-assert time
Tx_DIS assert time
5
5
10
10
1
TTD
Tx_DIS de-assert time
TTEN
1. Applies to control signals RESET, Tx_DIS and Tx_EN.
2. Applies to control signals RESET and Tx_EN. Internal pull-up resistor.
3. Applies to control signal Tx_DIS. Internal pull-down resistor.
4. Applies to status signal FAULT. Internal pull-down to VEE
5. With status output sink current max. 2 mA.
.
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Zarlink Semiconductor Inc.
ZL60301
Data Sheet
Transmitter Control and Status Timing Diagrams
The following figures show the timing relationships of the status and control signals of the transmit section.
VCC
TTEN
Tx Output [0:3]
Data [0:3]
Transmitter Not Ready
Normal operation
RESET: floating or high
Figure 4 - Transmitter Power-up Sequence
FAULT
TFA
TFD
Data [0:3]
Tx Output [0:3]
No Fault
Fault
Figure 5 - Transmitter Fault Signal Timing Diagram
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Zarlink Semiconductor Inc.
ZL60301
Data Sheet
RESET
FAULT
TTDD
TON
Data [0:3]
Tx Output [0:3]
Transmitter Not Ready
Normal operation
Figure 6 - Transmitter Reset Signal Timing Diagram
Tx_DIS
Tx_EN
TTD
TTD
Lasers
off
Lasers
off
Data [0:3]
Data [0:3]
Normal operation
Tx_EN
Tx Off
Normal operation
Tx Off
TTEN
Data [0:3]
Transmitter Not Ready
Normal operation
Figure 7 - Transmitter Enable and Disable Timing Diagram
Tx_DIS High
Tx_DIS Low
Normal operation
Transmitter disabled
Tx_EN High
Tx_EN Low
Transmitter disabled
Transmitter disabled
Table 1 - TruthTable for Transmitter Operation (Pre-condition: RESET floating or HIGH)
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Zarlink Semiconductor Inc.
ZL60301
Data Sheet
Receiver Specifications
All parameters below require operating conditions according to “Recommended Operating Conditions” on page 4
and a termination load of 100 Ω differential at the electrical output.
Parameter
Symbol
Min.
Max.
Unit
Optical Parameters
Input optical power1
Center wavelength
Return loss2
PIN
λC
-16
830
12
-2
dBm
nm
860
RL
dB
Stressed receiver sensitivity3
Channel to channel skew4
Signal detect assert
PSS
tSK
-11.7
100
-17
dBm
ps
PSA
PSD
dBm
dBm
Signal detect de-assert
-31
Electrical Parameters
Power dissipation
PD
ICC
500
150
800
120
mW
mA
mVp-p
Ω
Supply current
Differential output voltage amplitude (peak to peak)5
Output differential load impedance6
Stressed receiver eye opening7
Electrical output rise time (20 - 80%)
Electrical output fall time (20 - 80%)
∆VOUT
ZL
500
80
PSE
tRE
0.3
UI
160
160
ps
tFE
ps
1. Receive power for a channel is measured for a BER of 10-12 and worst case extinction ratio. PIN (Min) is measured using a fast
rise/fall time source with low RIN and adjacent channel(s) operating with incident power of 6 dB above PIN (Min).
2. Return loss is measured as defined in TIA/EIA-455-107A Determination of Component Reflectance or Link/System Return Loss Us-
ing a Loss Test Set.
3. The stressed receiver sensitivity is measured using PRBS 223-1 pattern, 2.6 dB inter-symbol interference, ISI (Min), 30 ps duty cycle
dependent deterministic jitter, DCD DJ (Min), and 6 dB extinction ratio, ER (Min) (ER penalty = 2.2 dB). All channels not under test
are receiving signals with an average input power of 6 dB above PIN (Min).
4. Channel skew is defined for the condition of equal amplitude, zero ps skew signals applied to the receiver inputs.
5. Differential output voltage is defined as the peak to peak value of the differential voltage between DOUT+ and DOUT- and measured
with a 100 Ω differential load connected between DOUT+ and DOUT-. Data outputs are CML compatible.
6. See Figure 13.
7. The stressed receiver eye opening represents the eye at TP4 as defined in IEEE 802.3 clauses 38.2 and 38.6 (Gigabit Ethernet).
The stressed receiver eye opening is measured using PRBS 223-1 pattern, 2.6 dB ISI min, 30 ps DCD DJ min, 6 dB ER min and an
average input power of -11.2 dBm (0.5 dB above minimum stressed receiver sensitivity as defined in IEEE 802.3 clause 38.6). All
channels not under test are receiving signals with an average input power of 6 dB above PIN (Min).
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Zarlink Semiconductor Inc.
ZL60301
Data Sheet
Receiver Control and Status Signal Requirements
The following table shows the timing relationships of the status and control signals of the receive section.
Parameter
Symbol
Min.
Typ.
Max.
Unit
Control input voltage high1
VIH
VIL
2.0
V
V
Control input voltage low1
0.9
100
0.4
Control input pull-up current1
Status output voltage low2, 3
Status output pull-up resistor2
Receiver signal detect assert time
Receiver signal detect de-assert time
Receiver enable assert time
Receiver enable de-assert time
IIN
VOL
10
µA
V
RPU
3.25
50
50
33
5
kΩ
µs
µs
ms
µs
TSD
200
200
TLOS
TRXEN
TRXD
1. Applies to control signals Rx_EN, SQ_EN.
2. Applies to status signal Rx_SD. Internal pull-up to VCC
3. With status output sink current max 2 mA.
.
Receiver Control and Status Timing Diagrams
The following figures show the timing relationships of the status and control signals of the receive section.
Rx_EN
TRXD
ICC
Normal Operation
Rx Off
Figure 8 - Receiver Enable Signal Timing Diagram
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Zarlink Semiconductor Inc.
ZL60301
Data Sheet
Rx_SD
TLOS
Signal
No Signal
Figure 9 - Receiver Signal Detect Timing Diagram
Transceiver Module Signals
The pluggable parallel optical transceiver uses a 100 position FCI MegArray electrical connector
(FCI PN: 84513-101), and an industry standard MTP(MPO) optical receptacle compliant with
IEC 61754-7.
K
J
H
G
F
E
D
C
B
A
DOUT00-
VEE Rx
DOUT03+
VEE Rx
VEE Rx
VEE Tx
VEE Tx
DIN03-
VEE Tx
DIN00+
1
2
DOUT00+
VEE Rx
DOUT01+
DOUT01-
VEE Rx
VCCB Rx
NIC
VEE Rx
VEE Rx
VEE Rx
VEE Rx
VEE Rx
VCCB Rx
DNC
DOUT03-
VEE Rx
DOUT02-
DOUT02+
VEE Rx
VCCB Rx
DNC
VEE Rx
VEE Rx
NIC
VEE Rx
VEE Rx
NIC
VEE Tx
VEE Tx
NIC
VEE Tx
VEE Tx
NIC
DIN03+
VEE Tx
DIN02+
DIN02-
VEE Tx
VCC Tx
DNC
VEE Tx
VEE Tx
VEE Tx
VEE Tx
VEE Tx
VCC Tx
DNC
DIN00-
VEE Tx
DIN01-
DIN01+
VEE Tx
VCC Tx
DNC
3
4
NIC
NIC
NIC
NIC
5
NIC
NIC
NIC
NIC
6
NIC
NIC
NIC
NIC
7
DNC
SD
RX_EN
SQ_EN
NIC
TX_DIS
RESET
NIC
TX_EN
FAULT
NIC
8
NIC
DNC
DNC
DNC
DNC
DNC
9
VCCA Rx
VCCA Rx
VEE Rx
NIC
VEE Tx
VCC Tx
VCC Tx
10
Table 2 - Transceiver Pinout Assignments (Top view, toward MPO/MTP connector end)
(10x10 array, 1.27 mm pitch)
Module front view - MTP key up
Tx0
Tx1
Tx2
Tx3
−
−
−
−
Rx3
Rx2
Rx1
Rx0
Host printed circuit board
Table 3 - Transceiver Optical Channel Assignment
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Zarlink Semiconductor Inc.
ZL60301
Data Sheet
Transceiver Pin Description
The transceiver module case is electrically isolated from Transmitter signal common and Receiver signal common.
Connection through mounting screw holes or frontplate whichever is applicable. Make the appropriate electrical
connection for EMI shield integrity.
Signal Name
Type
Description
Comments
DIN[0:3] +/-
Data input Transmitter data in, channel 0 to 3
Internal differential
termination at 100 Ω.
VCC Tx
VEE Tx
Transmitter power supply rail
Transmitter signal common. All transmitter
voltages are referenced to this potential unless
otherwise stated.
Directly connect these pads
to the PC board transmitter
signal ground plane.
TX_EN
TX_DIS
Control
input
Transmitter enable.
HIGH: normal operation
LOW: disable transmitter
Active high, internal pull-up.
See Table 1.
Control
input
Transmitter disable.
HIGH: disable transmitter
LOW: normal operation
Active high, internal pull-
down. See Table 1.
FAULT
Status
output
Transmitter fault.
HIGH: normal operation
When active, all channels
are disabled. Clear by reset
LOW: laser fault detected on at least one channel signal. Internal pull-up.
RESET
Control
input
Transmitter reset.
HIGH: normal operation
LOW:reset to clear fault signal
Internal pull-up.
DOUT[0:3] +/-
Data
Receiver data out, channel 0 to 3.
output
V
CCA Rx
PIN preamplifier power supply rail.
Receiver quantizer power supply rail.
VCCB Rx
VEE Rx
Receiver signal common. All receiver voltages
are referenced to this potential unless otherwise
stated.
Directly connect these pads
to the PC board receiver
signal ground plane.
RX_EN
RX_SD
SQ_EN
Control
input
Receiver enable.
HIGH: normal operation
LOW: disable receiver
Internal pull-up.
Internal pull-up.
Internal pull-up.
Status
output
Receiver signal detect.
HIGH: valid optical input on all channels
LOW: loss of signal on at least one channel
Control
input
Squelch enable.
HIGH: squelch function enabled. Data OUT is
squelched on any channels that have loss of
signal
LOW: squelch function disabled
DNC
NIC
Do not connect to any potential, including ground.
No internal connection.
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Zarlink Semiconductor Inc.
ZL60301
Data Sheet
VCCA and VCCB Rx can be connected to the same power supply. However, to insure maximum receiver sensitivity
and minimize the impact of noise from the power supply, it is recommended to keep the power supplies separate
and to use the recommended power supply filtering network on VCCA Rx, see Figure 2.
Thermal Characteristics
There are three options for heat sinks depending on the cooling needs. They are:
1. Direct application without any attached external heat sink
2. Use a generic external heat sink specified by Zarlink
3. Use a customer designed external heat sink
In Figure 10 and Figure 11, the temperature rise and thermal resistance as a function of air velocity (free air velocity
at the top of the module) is shown for option 1 and 2. The thermal resistance is defined as the temperature
difference between the case temperature and ambient flowing air divided by the total heat dissipation of the
module.
Improved thermal properties can be achieved by using a larger heat sink especially if more height is available
(option 3). For this option, a more detailed discussion with Zarlink is recommended regarding heat sink design
attachment materials.
Temperature rise at 1.0W
(Free stream air velocity)
Option ZL60301/MLD
Option ZL60301/MJD
16
12
8
4
0
0
1
2
3
4
5
Air velocity (m/s)
Figure 10 - Temperature Difference Between Ambient Flowing Air and Case at a Heat Dissipation
of 1.0 W
14
Zarlink Semiconductor Inc.
ZL60301
Data Sheet
Thermal resistance to air
(Free stream air velocity)
15
10
5
Option ZL60301/MLD
Option ZL60301/MJD
0
0
1
2
3
4
5
Air velocity (m/s)
Figure 11 - Thermal Resistance, as a Function of Air Velocity (the airflow is along the shortest
side of the module)
For any other orientation, the thermal resistance is 75-100% of the values shown above.
15
Zarlink Semiconductor Inc.
ZL60301
Data Sheet
Regulatory Compliance
Eye safety
The maximum optical output power is specified to comply with Class 1M in accordance with IEC 60825−1:2001. In
addition the transmitter complies with FDA performance standards for laser products except for deviations pursuant
to Laser Notice No.50, dated July 26, 2001. No maintenance or service of the product may be performed.
Electrostatic discharge
The module is classified as Class 1 (> 1000 Volts) according to MIL−STD−883, test method 3015.7, with regards to
the electrical pads.
Electrostatic discharge immunity
The part withstand a 15 kV (air discharge) and 8 kV (contact discharge) either indirect or directly to receptacle;
tested according to IEC 61000−4−2, while in operation without addition of bit errors.
Electromagnetic Interference
Emission
The electromagnetic emission is tested in front of the module (module fitted with EMI shield), with the module
mounted in a frontplate cutout. The part is tested with FCC Part 15, 30 − 1000 MHz and 1 GHz to 5th harmonic of
the highest fundamental frequency (6.75 GHz), and is specified to be Class B with > 6 dB margin.
Immunity
The electromagnetic immunity is tested without a front panel or enclosure. The module specification is maintained
with an applied field of 10 V/m for frequencies between 10 kHz and 10 GHz, according to IEC 61000−4−3 and GR−
1089−CORE.
Handling instructions
Cleaning the Optical Interface
A protective connector plug is supplied with each module. This plug should remain in place whenever a fiber cable
is not inserted. This will keep the optical port free from dust or other contaminants, which may potentially degrade
the optical signal. Before reattaching the connector plug to the module, visually inspect the plug and remove any
contamination. If the module’s optical port becomes contaminated, it can be cleaned with high-pressure nitrogen
(the use of fluids, or physical contact, is not advised due to potential for damage).
Before a fiber cable connector is attached to the module, it is recommended to clean the fiber cable connector
using an optical connector cleaner, or according to the cable manufacturer's instructions. It is also recommended to
clean the optical port of the module with high-pressure nitrogen.
Connectors
For optimum performance, it is recommended that the number of insertions is limited to 50 for the electrical
MegArray connector and 200 for the optical MPO/MTP connector.
ESD handling
When handling the modules, precautions for ESD sensitive devices should be taken. These include use of ESD
protected work areas with wrist straps, controlled work-benches, floors etc.
16
Zarlink Semiconductor Inc.
ZL60301
Data Sheet
Link Reach
The following table lists the minimum reach distance of the pluggable parallel fiber optic transceiver for different
multi-mode fiber (MMF) types and bandwidths assuming worst case parameters. Each case allows for a maximum
of 2 dB per channel connection loss for patch cables and other connectors.
Fiber Type
Modal Bandwidth ReachDistance ReachDistance ReachDistance
@ 850 nm
@ 1 Gbps
@ 2.5 Gbps
@ 2.7 Gbps
[core / cladding µm]
[MHz*km]
[m]
[m]
[m]
62.5/125 MMF
200
400
500
350
650
750
135
260
300
115
220
270
62.5/125 or 50/125 MMF
50/125 MMF
Table 4 - Link Reach for Different Fiber Types and Data Rates
Link Model Parameters
The link reaches above have been calculated using the following link model parameters and Gigabit Ethernet link
model version 2.3.5 (filename: 5pmd047.xls).
Parameter
Mode partition noise k-factor
Symbol
Value
Unit
k
0.3
0.3
Modal noise
MN
SO
UO
αdB
C1
Q
dB
ps/nm2*km
nm
Dispersion slope parameter
Wavelength of zero dispersion
Attenuation coefficient at 850 nm
Conversion factor
0.11
1320
3.5
dB/km
ns.MHz
480
7.04
0.3
Q-factor [BER 10-12
]
TP4 eye opening
UI
UI
DCD allocation at TP3
RMS baseline wander S.D.
RIN coefficient
DCD DJ
σBLW
kRIN
0.08
0.025
0.70
329
Conversion factor
c_rx
ns.MHz
17
Zarlink Semiconductor Inc.
ZL60301
Data Sheet
Electrical Interface - Application Examples
Recommended CML output
Transmitter CML input
Host PCB
100nF
100nF
ZOUT=100
Differential
Ω
ZIN=100
Differential
Ω
Z0=100Ω Differential
Figure 12 - Recommended Differential CML Input Interface
Receiver CML output
Recommended CML input
Host PCB
100nF
100nF
ZTERM=100
Differential
Ω
Z0=100Ω Differential
ZL
Figure 13 - Recommended Differential CML Output Interface
18
Zarlink Semiconductor Inc.
17
1,5 (5x)
FRONT VIEW ( 2 : 1 )
27
12,6
8,5
NOTES:-
1, All dimensions in mm.
2, Tolerancing per ASME Y14.5M-1994
Washplug Assembly
External Heatink
Module *
* For details of the module, see separate data sheet and/or package drawing.
© Zarlink Semiconductor 2002. All rights reserved.
Projection Method
Package code
Drawing type
Package Drawing,
ML
ISSUE
ACN
2
Previous package codes
104518 rev2
Module Layout External Heatsink
11-AUG-04
DATE
Title
APPRD. MD/MA
104518
NOTES:-
1. All dimensions in mm.
2. Tolerancing per ASME Y14.5M-1994.
© Zarlink Semiconductor 2002. All rights reserved.
Package code
Drawing type
Package drawing - module layout
MJ
ISSUE
ACN
1
Previous package codes
JS004296R1A
12-JUN-03
DATE
Title
APPRD. TD/BE
JS004296
NOTES:-
1. All dimensions in mm.
2. Tolerancing per ASME Y14.5M-1994.
© Zarlink Semiconductor 2002. All rights reserved.
Package code
Drawing type
MJ
ISSUE
ACN
1
Previous package codes
Package Drawing,
JS004296R1A
Host circuit board footprint layout
12-JUN-03
DATE
Title
APPRD. TD/BE
JS004296
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TECHNICAL DOCUMENTATION - NOT FOR RESALE
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