ABBTM-NVC-MDCS71
更新时间：2025-01-16 19:07:41
品牌：ABRACON
描述：Telecom Circuit, 1-Func, ROHS COMPLIANT, SMT-25
概述
规格参数
数据手册ABBTM-NVC-MDCS71 概述
Telecom Circuit, 1-Func, ROHS COMPLIANT, SMT-25 其他电信集成电路
ABBTM-NVC-MDCS71 规格参数
| 是否Rohs认证： | 符合 | 生命周期： | Active |
| 包装说明： | , | Reach Compliance Code： | compliant |
| HTS代码： | 8542.39.00.01 | Factory Lead Time： | 12 weeks 6 days |
| 风险等级： | 5.67 | JESD-30 代码： | R-XXMA-N25 |
| 长度： | 19.5 mm | 功能数量： | 1 |
| 端子数量： | 25 | 最高工作温度： | 70 °C |
| 最低工作温度： | -30 °C | 封装主体材料： | UNSPECIFIED |
| 封装形状： | RECTANGULAR | 封装形式： | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度）： | NOT SPECIFIED | 座面最大高度： | 2.4 mm |
| 标称供电电压： | 3.3 V | 表面贴装： | YES |
| 电信集成电路类型： | TELECOM CIRCUIT | 温度等级： | OTHER |
| 端子形式： | NO LEAD | 端子节距： | 1.5 mm |
| 端子位置： | UNSPECIFIED | 处于峰值回流温度下的最长时间： | NOT SPECIFIED |
| 宽度： | 12.5 mm | Base Number Matches： | 1 |
ABBTM-NVC-MDCS71 数据手册
通过下载ABBTM-NVC-MDCS71数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
Low Power Bluetooth Module
RoHS
RoHS/RoHS II compliant
ABBTM-NVC-MDCS71
Pb
19.5 x 12.5 x 2.4 mm SMT
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Moisture Sensitivity Level (MSL) – Level 3
FEATURES:
• Single mode Bluetooth v4.1 low energy
APPLICATIONS:
• Sports and fitness
• 4 dBm TX power/ -92.5dBm RX sensitivity, RSSI monitoring for proximity applications • Healthcare
• Supports master and slave
• Home entertainment
• Support GATT-based Profile: Proximity, Find Me, Heart Rate, HID and etc.
• UART/I2C master/SPI master interfaces
• 9 digital PIOs/3 analog IOs
• Office and mobile accessories
• Automotive
• Commercial
• 10bit ADC IOs
• Watches
• Wakeup interrupt and watchdog timer
• SMT pads for easy and reliable PCB mounting, Internal chip antenna
• 19.50x12.50x2.4mm
• Human interface devices
• FCC ID: OC3BM1871*
• QDID: B020997*
*Note: ABBTM-NVC-MDCS71 crosses to NovaComm P/N: NVC-MDCS71. BQB/FCC certification documentation is under
P/N: NVC-MDCS71.
GENERAL DESCRIPTION
ABBTM-NVC-MDCS71 is a single-mode Bluetooth 4.1 low power module, based on NovaComm’s proprietary technology. Using the CSR’s
uEnergy platform, it enables ultralow power connectivity and basic data transfer for applications previously limited by the power consump-
tion, size constraints and complexity of other wireless standards. It contains everything required to create a Bluetooth low energy product with
RF, baseband, MCU, qualified Bluetooth V4.1 stack and customized firmware on a single module.
The module can be power directly with a standard 3V coin cell batteries or pair of AAA batteries. In lowest power sleep mode it consumes
only 600nA and will wake up in few hundred microseconds.
PIN CONFIGURATION:
Figure 1. Pinout (Topview)
2 Faraday, Suite# B
Ph. 949.546.8000 Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
| Irvine | CA 92618 Revised: 06.29.15
ABRACON IS
ISO 9001:2008
CERTIFIED
|
LLC
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
Low Power Bluetooth Module
RoHS
RoHS/RoHS II compliant
ABBTM-NVC-MDCS71
Pb
19.5 x 12.5 x 2.4 mm SMT
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PIN DESCRIPTION
Pin
1
Symbol
GND
I/O Type
Description
Ground
Ground
2
AIO2
AIO1
AIO0
Bidirectional analogue
Bidirectional analogue
Bidirectional analogue
10bit Analogue programmable I/O line
10bit Analogue programmable I/O line
10bit Analogue programmable I/O line
3
4
CMOS output, tri-state, with weak
internal pull-up
5
6
7
UART_TX
UART_RX
PIO3
UART data output
UART data input
CMOS input with weak internal pull-
down
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
PWM or LED Controls
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
PWM or LED Controls
8
9
PIO4
GND
Ground
Ground
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
Or debug SPI_CLK select by SPI_PIO_SEL
10
11
12
PIO5/SPI_CLK
PIO6/SPI_CSB
PIO7/SPI_MOSI
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
Or debug chip select, selected by SPI_PIO_SEL
Programmable input/output line
Bi-directional with programmable
strength internal pull-up/down
Or debug SPI_MOSI, selected by SPI_PIO_SEL
13
14
VDD_PIO
Powered
PIO power supply
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
Or debug SPI_MISO, selected by SPI_PIO_SEL
PIO8/SPI_MISO
Bi-directional tri-state with weak internal I2C data input/output or SPI serial flash data
15
I2C_SDA
pull-up
output(SF_OUT)
I2C clock or SPI serial flash clock output
(SF_CLK)
16
17
18
I2C_SCL
GND
Input with weak internal pull-up
Ground
Ground
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
PWM or LED Controls
PIO9
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
PWM or LED Controls
19
20
PIO10
PIO11
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
21
22
23
SPI_PIO_SEL
VDD_BAT
GND
Input with strong internal pull-down
Power supply
Selects SPI debug on (8:5)
Button cell battery or DC 1.8V to 3.6V
Ground
Ground
Input has no internal pull-up or pull-down Set high to wake the module from hibernate. Use
24
25
WAKE
GND
use external pull-down
an external pull-down for this pin.
Ground
Ground
2 Faraday, Suite# B
Ph. 949.546.8000 Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
| Irvine | CA 92618 Revised: 06.29.15
ABRACON IS
ISO 9001:2008
CERTIFIED
|
LLC
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
Low Power Bluetooth Module
RoHS
RoHS/RoHS II compliant
ABBTM-NVC-MDCS71
Pb
19.5 x 12.5 x 2.4 mm SMT
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ELECTRICAL CHARACTERISTICS
Absolute Maximum Rating
Rating
Min
-40
Max
Unit
°C
V
Storage Temperature
+85
3.6
Battery (VDD_BAT) operation*
I/O supply voltage
1.8
-0.4
+3.6
V
Other Terminal Voltages except RF
Vss-0.4
VDD+0.4
V
* Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output regulation and
other specifications are not guaranteed in excess of 4.2V.
Recommended Operating Conditions
Operating Condition
Min
Typ
Max
Unit
Operating Temperature Range
-30
+85
°C
Battery (VDD_BAT) operation
I/O Supply Voltage (VDD_PIO)
1.8
1.2
+3.6
+3.6
V
V
Power Consumptions
The current consumption are measured at the VDD_BAT.
Total typical current at
3V (average)
Mode
Description
All functions are shutdown. To wake up toggle
the WAKE pin
Dormant
<600nA
All functions are shutdown except for the sleep
clock. The module can wake up on a timer on the
sleep clock.
Hibernate
<1.5uA
Fast Advertising
In 30 second after Power on VDD=3.3V
In 3 minutes after fast advertising VDD=3.3V
VDD=3.3V ,VDD_PIO=3.3v
0.8mA
6uA
Slow Advertising
Standby (no connect)
Standby (connect)
Transmit data
5uA
VDD=3.3V ,VDD_PIO=3.3v
8uA
VDD=3.3V VDD_PIO=3.3V
1mA
RF RX /TX active (0dBm) *
VDD=3.3V VDD_PIO=3.3V
~16mA peak
* Note: The TX power of the module can be increased by firmware to a maximum of 4dBm and the peak current is around
28mA.
2 Faraday, Suite# B
Ph. 949.546.8000 Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
| Irvine | CA 92618 Revised: 06.29.15
ABRACON IS
ISO 9001:2008
CERTIFIED
|
LLC
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
Low Power Bluetooth Module
RoHS
RoHS/RoHS II compliant
ABBTM-NVC-MDCS71
Pb
19.5 x 12.5 x 2.4 mm SMT
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I/O CHARACTERISTICS
Digital I/O Characteristics
Supply Voltage Levels
Input Voltage Levels
VIL input logic level low
Min
Typ
Max
Unit
-0.4
0.4
VDD + 0.4
25
V
V
VIH input logic level high
Tr/Tf
0.7*VDD
ns
Output Voltage Levels
VOL output logic level low, IOL = 4.0mA
VOH output logic level high, IOH = -4.0mA
Tr/Tf
0.4
5
V
V
0.75*VDD
ns
Input and Tri-state Current
With strong pull-up
μA
μA
μA
μA
pF
-150
10
-40
40
-10
150
-0.33
5.0
With strong pull-down
With weak pull-up
-5.0
0.33
1.0
-1.0
+1.0
With weak pull-down
CI Input Capacitance
5.0
AIO Characteristics
Input Voltage Levels
Min
Typ
Max
Unit
AIO
0
1.3
V
ESD Protection
Condition
Class
Max Rating
Human Body Model Contact Discharge per JEDEC EIA/JESD22-A114
Machine Model Contact Discharge per JEDEC EIA/JESD22-A115
Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101
2
2000V (all pins)
200V (all pins)
500V (all pins)
200V
III
2 Faraday, Suite# B
Ph. 949.546.8000 Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
| Irvine | CA 92618 Revised: 06.29.15
ABRACON IS
ISO 9001:2008
CERTIFIED
|
LLC
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
Low Power Bluetooth Module
RoHS
RoHS/RoHS II compliant
ABBTM-NVC-MDCS71
Pb
19.5 x 12.5 x 2.4 mm SMT
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PHYSICAL INTERFACES
Power Supply
The module integrates internal regulators. It can be easily powered up by connecting a 3V coin battery with a >100uF
capacitor at pin VDD_BAT.
Figure 2. Capacitor at pin VDD_BAT
Internal Antenna
The module integrates an on-board chip antenna. There’s no need to use external antenna on customer’s PCB. Please
take precaution to leave ample clearance for the antenna (See Figure 6).
PIO
9 PIOs are provided (4 are multiplexed with SPI debug interface). They are powered from VDD_PIO.
PIO lines are software-configurable as weak pull-up, weak pull-down, strong pull-up or strong pull-down.
Note: At reset all PIO lines are inputs with weak pull-downs. Any of the PIO lines can be configured as interrupt
request lines or as wake-up lines from sleep modes.
AIO
3 AIOs are provided. They can be connected to internal 10 bits ADC. Depending on the software, they can be used
to read or output a voltage between 0V to 1.3V. Each of them can be also used as a digital output with special firm-
ware.
PWM
PIO3, PIO4, PIO9, PIO10 can be driven by internal PWM module. The PWM module also works while the module
is sleep. Therefore it can be used as a LED flasher. These functions are controlled by special firmwares.
UART
.
This module has a standard UART interface which provides a simple mechanism for communicating with other serial
devices using the RS232 protocol.
The UART CTS and RTS signals can be assigned to any PIO pin by the on-chip firmware.
Possible UART Settings
Parameter
Possible Values
1200 baud (≤2%Error)
9600 baud (≤1%Error)
2M baud (≤1%Error)
RTS/CTS or None
None, Odd or Even
1 or 2
Minimum
Maximum
Baud Rate
Flow Control
Parity
Number of Stop Bits
Bits per Byte
8
2 Faraday, Suite# B
Ph. 949.546.8000 Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
| Irvine | CA 92618 Revised: 06.29.15
ABRACON IS
ISO 9001:2008
CERTIFIED
|
LLC
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
Low Power Bluetooth Module
RoHS
RoHS/RoHS II compliant
ABBTM-NVC-MDCS71
Pb
19.5 x 12.5 x 2.4 mm SMT
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PHYSICAL INTERFACES
I2C Master
The module can act as an I2C master when configured by software. Any two PIOs can be configured as I2C_SCL and
I2C_SDA.
SPI Master
The module can act as an SPI master (mode 0) when configured by software. Any four PIOs can be configured as
SPI_CLK, SPI_CS#, SPI_DIN and SPI_DOUT. The clock rate of the software SPI is around 470kHz.
SPI Debug
The SPI Debug interface is chosen when SPI_PIO_SEL is high. The interface is used to program and debug the module.
So always place test points or header on PCB for this interface and SPI_PIO_SEL.
SOFTWARE STACK
ABBTM-NVC-MDCS71 is a single mode Bluetooth 4.1 module. It can support all GATT-based profiles. Several profiles
have been developed such as Healthy Thermometer Profile. Please contact Abracon for the support of more profiles and
applications with iNovaLE stack.
iNovaLE Stack
Figure 3. iNovaLE Stack
2 Faraday, Suite# B
Ph. 949.546.8000 Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
| Irvine | CA 92618 Revised: 06.29.15
ABRACON IS
ISO 9001:2008
CERTIFIED
|
LLC
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
Low Power Bluetooth Module
RoHS
RoHS/RoHS II compliant
ABBTM-NVC-MDCS71
Pb
19.5 x 12.5 x 2.4 mm SMT
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REFERENCE DESIGN
Figure 4. Reference Design
2 Faraday, Suite# B
Ph. 949.546.8000 Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
| Irvine | CA 92618 Revised: 06.29.15
ABRACON IS
ISO 9001:2008
CERTIFIED
|
LLC
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
Low Power Bluetooth Module
RoHS
RoHS/RoHS II compliant
ABBTM-NVC-MDCS71
Pb
19.5 x 12.5 x 2.4 mm SMT
|
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LAYOUT AND SOLDERING
Soldering Recommendations
.
ABBTM-NVC-MDCS71 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile
used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular
type of solder paste used. Please refer to the datasheet of the particular solder paste for profile configurations.
The following are recommended for soldering the module to ensure reliable solder joint and operation of the module
after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by
case. Thus following recommendation should be taken as reference only.
•
•
•
Refer to technical documentations of particular solder paste for profile configurations
Avoid using more than one flow.
Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of
150µm stencil thickness is recommended.
•
•
Aperture size of the stencil should be 1:1 with the pad size.
A low residue, “no clean” solder paste should be used due to low mounted height of the component.
REFLOW PROFILE
Figure 5. Typical Lead-Free Reflow Solder Profile for ABBTM-NVC-MDCS71
Key features of the profile:
•
•
•
•
•
Initial Ramp = 1-2.5°C/sec to 175°C ±25°C equilibrium
Equilibrium time = 60 to 180 seconds
Ramp to Maximum temperature (250°C) = 3°C/sec max.
Time above liquidus temperature (217°C): 45-90 seconds
Device absolute maximum reflow temperature: 255°C
2 Faraday, Suite# B
|
Irvine
Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
| CA 92618 Revised: 06.29.15
ABRACON IS
ISO 9001:2008
CERTIFIED
Ph. 949.546.8000
|
LLC
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
Low Power Bluetooth Module
RoHS
RoHS/RoHS II compliant
ABBTM-NVC-MDCS71
Pb
19.5 x 12.5 x 2.4 mm SMT
|
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PHYSICAL INTERFACES
Layout Guideline
.
It is strongly recommended to use good layout practices to ensure proper operation of the module. Placing copper or any
metal near antenna deteriorates its operation by having effect on the matching properties. Metal shield around the
antenna will prevent the radiation and thus metal case should not be used with the module. Use grounding vias separated
maximum 3 mm apart at the edge of grounding areas to prevent RF penetrating inside the PCB and causing an
unintentional resonator. Use GND vias all around the PCB edges. Figure 4 illustrates recommended PCB design around
the antenna of ABBTM-NVC-MDCS71 when the module is placed at the edge of a PCB.
Do not place copper on the top layer under the module, as shown in Figure 6. The module has vias on the area shown,
which can cause short circuit if there is copper underneath. Any metal placed closer than 20 mm in any direction from
the antenna changes the matching properties and thus will considerably deteriorate the RF performance of the module.
Figure 6. Placement of the Module on a Main Board
2 Faraday, Suite# B
Ph. 949.546.8000 Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
| Irvine | CA 92618 Revised: 06.29.15
ABRACON IS
ISO 9001:2008
CERTIFIED
|
LLC
ABBTM- NVC-MDCS71
FCC ID: OC3BM1871
DC: 1326
Low Power Bluetooth Module
RoHS
RoHS/RoHS II compliant
ABBTM-NVC-MDCS71
Pb
19.5 x 12.5 x 2.4 mm SMT
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OUTLINE DIMENSIONS
Recommended Land Pattern
Pin 1
Pin 1
Pin 25
Pin 25
Dimensions: mm
TAPE & REEL:
80pcs/tray
Dimensions: mm
ATTENTION: Abracon Corporation’s products are COTS – Commercial-Off-The-Shelf products; suitable for Commercial, Industrial and, where designated, Automotive Applica-
tions. Abracon’s products are not specifically designed for Military, Aviation, Aerospace, Life-dependant Medical applications or any application requiring high reliability where
component failure could result in loss of life and/or property. For applications requiring high reliability and/or presenting an extreme operating environment, written consent and
authorization from Abracon Corporation is required. Please contact Abracon Corporation for more information.
2 Faraday, Suite# B
Ph. 949.546.8000 Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
| Irvine | CA 92618 Revised: 06.29.15
ABRACON IS
ISO 9001:2008
CERTIFIED
|
LLC
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