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0CANH-002-XTD

更新时间：2025-01-23 18:49:35

品牌：AMI

描述：Interface Circuit, 1-Trnsvr, PDSO8, 0.150 INCH, GREEN, PLASTIC, SOIC-8

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0CANH-002-XTD 概述

Interface Circuit, 1-Trnsvr, PDSO8, 0.150 INCH, GREEN, PLASTIC, SOIC-8 网络接口

0CANH-002-XTD 规格参数

是否Rohs认证：	符合	生命周期：	Transferred
包装说明：	0.150 INCH, GREEN, PLASTIC, SOIC-8	Reach Compliance Code：	unknown
风险等级：	5.79	JESD-30 代码：	R-PDSO-G8
JESD-609代码：	e3/e4	长度：	4.9276 mm
功能数量：	1	端子数量：	8
收发器数量：	1	最高工作温度：	125 °C
最低工作温度：	-40 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP	封装等效代码：	SOP8,.25
封装形状：	RECTANGULAR	封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260	电源：	5 V
认证状态：	Not Qualified	座面最大高度：	1.7272 mm
子类别：	Network Interfaces	最大压摆率：	0.065 mA
标称供电电压：	5 V	表面贴装：	YES
电信集成电路类型：	INTERFACE CIRCUIT	温度等级：	AUTOMOTIVE
端子面层：	MATTE TIN/NICKEL PALLADIUM GOLD	端子形式：	GULL WING
端子节距：	1.27 mm	端子位置：	DUAL
处于峰值回流温度下的最长时间：	40	宽度：	3.937 mm
Base Number Matches：	1

0CANH-002-XTD 数据手册

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AMIS-30660 High-Speed CAN Transceiver

Data Sheet

1.0 General Description

The AMIS-30660 CAN transceiver is the interface between a controller area network (CAN) protocol controller and the physical bus and

may be used in both 12V and 24V systems. The transceiver provides differential transmit capability to the bus and differential receive

capability to the CAN controller.

Due to the wide common-mode voltage range of the receiver inputs, the AMIS-30660 is able to reach outstanding levels of

electromagnetic susceptibility (EMS). Similarly, extremely low electromagnetic emission (EME) is achieved by the excellent matching of

the output signals.

2.0 Key Features

• Fully compatible with the ISO 11898-2 standard

• Certified “Authentication on CAN Transceiver Conformance (d1.1)”

• High speed (up to 1Mbit/s)

• Ideally suited for 12V and 24V industrial and automotive applications

• Low EME common-mode choke is no longer required

• Differential receiver with wide common-mode range (+/- 35V) for high EMS

• No disturbance of the bus lines with an un-powered node

• Transmit data (TxD) dominant time-out function

• Thermal protection

• Bus pins protected against transients in an automotive environment

• Silent mode in which the transmitter is disabled

• Short circuit proof to supply voltage and ground

• Logic level inputs compatible with 3.3V devices

3.0 Technical Characteristics

Table 1: Technical Characteristics

Symbol

V_CANH

V_CANL

V_{i(dif)(bus_dom)}

t_pd(rec-dom)

t_pd(dom-rec)

C_M-range

Parameter

DC voltage at pin CANH

DC voltage at pin CANL

Differential bus output voltage in dominant state

Propagation delay TxD to RxD

Input common-mode range for comparator

Conditions

0 < V_CC< 5.25V; no time limit

42.5Ω < R_LT< 60Ω

See Figure 7

Guaranteed differential receiver threshold and

leakage current

Min.

-45

1.5

Max.

+45

245

+35

Unit

100

-35

V_CM-peak

V_CM-step

Common-mode peak

Common-mode step

See Figures 8 and 9 (Notes)

-500

-150

500

150

Note: The parameters V_CM-peakand V_CM-stepguarantee low electromagnetic emission.

AMI Semiconductor – M-20682-003, Jun 07

www.amis.com

AMIS-30660 High-Speed CAN Transceiver

Data Sheet

4.0 Ordering Information

Ordering Code (Tubes)

Ordering Code (Tape)

Marketing Name

Package

Temp. Range

0CANH-002-XTD

0CANH-002-XTP

AMIS 30660NGA

SOIC-8 GREEN

-40°C…125°C

5.0 Block Diagram

V_CC

Thermal

shutdown

V_CC

CANH

CANL

Driver

control

Timer

TxD

AMIS-30660

COMP

RxD

R_i(cm)

V_cc/₂

V_REF

R_i(cm)

PD20070607.1

GND

Figure 1: Block Diagram

AMI Semiconductor – M-20682-003, Jun 07

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AMIS-30660 High-Speed CAN Transceiver

Data Sheet

6.0 Typical Application

6.1 Application Schematic

VBAT

60 Ω

OUT

5V-reg

47 nF

V_CC

CANH

VREF

CANL

CAN

BUS

RxD

TxD

CAN

controller

AMIS-

30660

60 Ω

47 nF

PC20040918.2

GND

Figure 2: Application Diagram

6.2 Pin Description

6.2.1. Pin Out (Top View)

TxD

GND

V_CC

CANH

CANL

V_REF

RxD

PC20040918.3

Figure 3: Pin Configuration

AMI Semiconductor – M-20682-003, Jun 07

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AMIS-30660 High-Speed CAN Transceiver

Data Sheet

6.3 Pin Description

Table 2: Pin Out

Pin Name Description

TxD Transmit data input; low input → dominant driver; internal pull-up current

GND Ground

V_CCSupply voltage

RxD Receive data output; dominant transmitter→ low output

V_REFReference voltage output

CANL Low-level CAN bus line (low in dominant mode)

CANH High-level CAN bus line (high in dominant mode)

Silent mode control input; internal pull-down current

7.0 Functional Description

7.1 Operating Modes

The behavior of AMIS-30660 under various conditions is illustrated in Table 3 below. In case the device is powered, one of two

operating modes can be selected through pin S.

Table 3: Functional table of AMIS30660; X = don’t care

VCC

pin TxD

pin S

pin CANH

pin CANL

Bus state

pin RxD

4.75 to 5.25.V

VCC<PORL (unpowered)

PORL<VCC<4.75V

0 (or floating)

High

VCC/2

0V<CANH<VCC

Low

VCC/2

0V<CANL<VCC

Dominant

Recessive

1 (or floating)

>2V

7.1.1. High-Speed Mode

If pin S is pulled low (or left floating), the transceiver is in its high-speed mode and is able to communicate via the bus lines. The signals

are transmitted and received to the CAN controller via the pins TxD and RxD. The slopes on the bus line outputs are optimized to give

extremely low electromagnetic emissions.

7.1.2. Silent Mode

In silent mode, the transmitter is disabled. All other IC functions continue to operate. The silent mode is selected by connecting pin S to

VCC and can be used to prevent network communication from being blocked, due to a CAN controller which is out of control.

7.2 Over-temperature Detection

A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of

approximately 160°C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is

reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TxD goes high. The thermal protection

circuit is particularly necessary when a bus line short-circuits.

7.3 TxD Dominant Time-out Function

A TxD dominant time-out timer circuit prevents the bus lines from being driven to a permanent dominant state (blocking all network

communication) if pin TxD is forced permanently low by a hardware and/or software application failure. The timer is triggered by a

negative edge on pin TxD. If the duration of the low-level on pin TxD exceeds the internal timer value t_dom, the transmitter is disabled,

driving the bus into a recessive state. The timer is reset by a positive edge on pin TxD.

AMI Semiconductor – M-20682-003, Jun 07

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AMIS-30660 High-Speed CAN Transceiver

Data Sheet

7.4 Fail-safe Features

A current-limiting circuit protects the transmitter output stage from damage caused by an accidental short-circuit to either positive or

negative supply voltage, although power dissipation increases during this fault condition.

The pins CANH and CANL are protected from automotive electrical transients (according to “ISO 7637”; see Figure 4). Pin TxD is

pulled high internally should the input become disconnected.

8.0 Electrical Characteristics

8.1 Definitions

All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means the current is flowing into the pin;

sourcing current means the current is flowing out of the pin.

8.2 Absolute Maximum Ratings

Stresses above those listed in the following table may cause permanent device failure. Exposure to absolute maximum ratings for

extended periods may affect device reliability.

Table 4: Absolute Maximum Ratings

Symbol

V_CC

V_CANH

V_CANL

V_TxD

V_RxD

V_S

V_REF

V_tran(CANH)

V_tran(CANL)

Parameter

Supply voltage

Conditions

Min.

-0.3

-45

Max.

+45

V_CC+ 0.3

+150

Unit

DC voltage at pin CANH

DC voltage at pin CANL

DC voltage at pin TxD

DC voltage at pin RxD

DC voltage at pin S

DC voltage at pin V_REF

Transient voltage at pin CANH

Transient voltage at pin CANL

0 < V_CC< 5.25V; no time limit

-45

-0.3

-150

-4

Note 1

Note 2

Note 4

+150

+500

V_esd

Electrostatic discharge voltage at all pins

-500

Latch-up

Static latch-up at all pins

Note 3

100

T_stg

T_amb

T_junc

Storage temperature

Ambient temperature

Maximum junction temperature

-55

-40

+155

+125

+150

°C

Notes:

Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b (see Figure 4).

Standardized human body model ESD pulses in accordance to MIL883 method 3015.7.

Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78.

Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993.

8.3 Thermal Characteristics

Table 5: Thermal Characteristics

Symbol

R_th(vj-a)

Parameter

Conditions

In free air

Value

150

Unit

K/W

Thermal resistance from junction to ambient in SO8 package

Thermal resistance from junction to substrate of bare die

R_th(vj-s

)

AMI Semiconductor – M-20682-003, Jun 07

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AMIS-30660 High-Speed CAN Transceiver

Data Sheet

8.4 DC and Timing Characteristics

V_CC= 4.75 to 5.25V; T_junc= -40 to +150°C; R_LT=60Ω unless specified otherwise.

Table 6: DC and Timing Characteristics

Symbol

Parameter

Conditions

Min.

Typ.

Max.

Unit

Supply (Pin V_CC

I_CC

)

Supply current

Dominant; V_TXD= 0V

Recessive; V_TXD= V_CC

Transmitter Data Input (Pin TxD)

V_IH

V_IL

I_IH

I_IL

High-level input voltage

Output recessive

Output dominant

V_TxD= V_CC

V_TxD= 0V

Not tested

2.0

-0.3

-1

-75

-200

V_CC+0.3

+0.8

-350

µA

Low-level input voltage

High-level input current

Low-level input current

Input capacitance

C_i

Mode Select (Pin S)

V_IH

V_IL

I_IH

High-level input voltage

Low-level input voltage

High-level input current

Low-level input current

Silent mode

High-speed mode

V_S=2V

2.0

-0.3

V_CC+0.3

+0.8

µA

I_IL

V_S=0.8V

Receiver Data Output (Pin RxD)

V_OH

High-level output voltage

I_RXD= - 10mA

0.6 x V_CC

0.75 x

V_CC

0.25

V_OL

Low-level output voltage

I_RXD= 6mA

0.45

Reference Voltage Output (Pin V_REF

)

V_REF

Reference output voltage

-50µA < I_VREF< +50µA

0.45 x V_CC

0.40 x V_CC

0.50 x

V_CC

0.50 x

V_CC

0.55 x V_CC

0.60 x V_CC

V_{REF_CM}

Reference output voltage for full common -35V <V_CANH< +35V;

mode range

-35V <V_CANL< +35V

Bus Lines (Pins CANH and CANL)

V_{o(reces)(CANH)}

V_{o(reces)(CANL)}

I_{o(reces) (CANH)}

Recessive bus voltage at pin CANH

Recessive bus voltage at pin CANL

Recessive output current at pin CANH

V_TxD= V_CC; no load

-35V <V_CANH< +35V;

0V <V_CC< 5.25V

-35V <V_CANL< +35V;

0V <V_CC< 5.25V

V_TxD= 0V

2.0

-2.5

2.5

3.0

+2.5

I_{o(reces) (CANL)}

Recessive output current at pin CANL

-2.5

+2.5

V_{o(dom) (CANH)}

V_{o(dom) (CANL)}

V_{i(dif) (bus)}

Dominant output voltage at pin CANH

Dominant output voltage at pin CANL

Differential bus input voltage

3.0

0. 5

1.5

3.6

1.4

2.25

4.25

1.75

3.0

V_TxD= 0V

V_TxD= 0V; dominant;

(V_CANH- V_CANL

)

42.5 Ω < R_LT< 60 Ω

V_TxD=V_CC; recessive;

-120

+50

No load

I_{o(sc) (CANH)}

I_{o(sc) (CANL)}

V_i(dif)(th)

Short circuit output current at pin CANH

Short circuit output current at pin CANL

Differential receiver threshold voltage

V_CANH= 0V; V_TxD= 0V

V_CANL= 36V; V_TxD= 0V

-5V <V_CANL< +10V;

-5V <V_CANH< +10V;

See Figure 5

-45

0.5

-70

0.7

-95

120

0.9

V_{ihcm(dif) (th)}

Differential receiver threshold voltage for -35V <V_CANL< +35V;

0.25

0.7

1.05

100

high common-mode

-35V <V_CANH< +35V;

See Figure 5

V_{i(dif) (hys)}

Differential receiver input voltage hysteresis

-5V <V_CANL< +10V;

-5V <V_CANH< +10V;

See Figure 5

AMI Semiconductor – M-20682-003, Jun 07

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AMIS-30660 High-Speed CAN Transceiver

Data Sheet

Table 6 : DC and Timing Characteristics (continued)

Symbol

Parameter

Conditions

Min.

Typ.

Max.

Unit

R_i(cm)(CANH)

Common-mode input resistance at pin

CANH

KΩ

R_{i(cm) (CANL)}

R_i(cm)(m)

Common-mode input resistance at pin CANL

Matching between pin CANH and pin CANL V_CANH=V_CANL

common-mode input resistance

-3

KΩ

R_i(dif)

Differential input resistance

7.5

3.75

170

KΩ

µA

C_i(CANH)

C_i(CANL)

C_i(dif)

I_LI(CANH)

I_LI(CANL)

V_CM-peak

Input capacitance at pin CANH

Input capacitance at pin CANL

Differential input capacitance

Input leakage current at pin CANH

Input leakage current at pin CANL

V_TxD= V_CC; not tested

V_CC= 0V; V_CANH= 5V

V_CC= 0V; V_CANL= 5V

-500

250

500

Common-mode peak during transition from See Figure 8 and Figure 9

dom → rec or rec → dom

Difference in common-mode between See Figure 8 and Figure 9

dominant and recessive state

V_CM-step

-150

150

Power-on-Reset (POR)

PORL

POR level

CANH, CANL, V_refin tri- 2.2

3.5

4.7

state below POR level

Thermal Shutdown

T_j(sd)

Shutdown junction temperature

150

160

180

130

°C

Timing Characteristics (see Figure 6 and Figure 7)

t_d(TxD-BUSon)

t_{d(TxD-BUSoff)}

t_d(BUSon-RxD)

t_{d(BUSoff-RxD)}

t_pd(rec-dom)

Delay TxD to bus active

Delay TxD to bus inactive

Delay bus active to RxD

Delay bus inactive to RxD

Propagation delay TxD to RxD from

recessive to dominant

V_s= 0V

105

135

245

100

t_d(dom-rec)

t_dom(TxD)

Propagation delay TxD to RxD from

dominant to recessive

TxD dominant time for time out

V_s= 0V

100

250

245

750

µs

V_TxD= 0V

450

8.5 Measurement Set-ups and Definitions

+5 V

100 nF

TxD

V_CC

CANH

1 nF

V_REF

Transient

Generator

AMIS-

30660

RxD

1 nF

CANL

PC20040918.4

20 pF

GND

Figure 4: Test Circuit for Automotive Transients

AMI Semiconductor – M-20682-003, Jun 07

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AMIS-30660 High-Speed CAN Transceiver

Data Sheet

V_RxD

High

Low

Hysteresis

PC20040829.7

0,9

0,5

V_i(dif)(hys)

Figure 5: Hysteresis of the Receiver

+5 V

100 nF

V_CC

CANH

TxD

RxD

R_LT

V_REF

C_LT

AMIS-

30660

100 pF

60 Ω

CANL

20 pF

GND

PC20040018.5

Figure 6: Test Circuit for Timing Characteristics

AMI Semiconductor – M-20682-003, Jun 07

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AMIS-30660 High-Speed CAN Transceiver

Data Sheet

HIGH

LOW

TxD

CANH

CANL

dominant

recessive

V_i(dif)

V_CANH- V_CANL

0,9V

0,5V

RxD

0,7 x V_CC

0,3 x V_CC

t_d(TxD-BUSon)

t_{d(TxD-BUSoff)}

t_d(BUSon-RxD)

t_{d(BUSoff-RxD)}

t_pd(rec-dom)

t_pd(dom-rec)

PC20040829.6

Figure 7: Timing Diagram for AC Characteristics

+5 V

100 nF

TxD

V_CC

6.2 kΩ

CANH

CANL

10 nF

Active Probe

Spectrum Anayzer

AMIS-

30660

Generator

RxD

6.2 kΩ

30 Ω

V_REF

47 nF

20 pF

GND

PC20040918.6

Figure 8: Basic Test Set-up for Electromagnetic Measurement

AMI Semiconductor – M-20682-003, Jun 07

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AMIS-30660 High-Speed CAN Transceiver

Data Sheet

CANH

CANL

recessive

V_CM-peak

V_CM-step

V_i(com)

_CANH+ V_CANL

PC20040829.7

V_CM-peak

Figure 9: Common-mode Voltage Peaks (see measurement set-up Figure 8)

AMI Semiconductor – M-20682-003, Jun 07

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AMIS-30660 High-Speed CAN Transceiver

Data Sheet

9.0 Package Outline

SOIC-8: Plastic small outline; eight leads; body width 150mil

AMI Semiconductor – M-20682-003, Jun 07

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AMIS-30660 High-Speed CAN Transceiver

Data Sheet

10.0 Soldering

10.1 Introduction

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data

Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount

ICs, or for printed circuit boards with high population densities. In these situations reflow soldering is often used.

10.2 Re-flow Soldering

Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit

board by screen printing, stencilling or pressure-syringe dispensing before package placement.

Several methods exist for re-flowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating,

soldering and cooling) vary between 100 and 200 seconds, depending on heating method.

Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept

below 230°C.

10.3 Wave Soldering

Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed circuit boards with a high

component density, as solder bridging and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically developed.

If wave soldering is used, the following conditions must be observed for optimal results:

• Use a double-wave soldering method, comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e):

Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of

the printed-circuit board.

Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit

board. The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45 degree angle to the transport direction of the printed-

circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen

printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most

applications.

10.4 Manual Soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat

part of the lead. Contact time must be limited to ten seconds at up to 300°C.

When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds, between 270 and 320°C.

AMI Semiconductor – M-20682-003, Jun 07

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AMIS-30660 High-Speed CAN Transceiver

Data Sheet

Table 7: Soldering

Soldering Method

Package

Wave

Reflow (1)

BGA, SQFP

Not suitable

Suitable

HLQFP, HSQFP, HSOP,

HTSSOP, SMS

Not suitable (2)

Suitable

PLCC (3) , SO, SOJ

LQFP, QFP, TQFP

SSOP, TSSOP, VSO

Suitable

Not recommended (3)(4)

Not recommended (5)

Notes:

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size

of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For

details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”

These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heat sink (at bottom version) can not be achieved, and

as solder may stick to the heatsink (on top version).

If wave soldering is considered, then the package must be placed at a 45 degree angle to the solder wave direction. The package footprint must incorporate solder

thieves downstream and at the side corners.

Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a

pitch (e) equal to or smaller than 0.65mm.

Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a

pitch (e) equal to or smaller than 0.5mm.

11.0 Company or Product Inquiries

For more information about AMI Semiconductor’s high-speed CAN transceivers, send an email to: auto_assp@amis.com.

For more information about AMI Semiconductor, our technology and our product, visit our Web site at: http://www.amis.com

Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express,

statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS

makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any

time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range,

unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not

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0CBF010.XP	LITTELFUSE	Direct replacement for many OEM applications. Designed for glass fuses without physical alteration in the system. Fits 1 1/4" fuse clips. SAE Type II non-cycling used primarily as a wiring harness protector in 12 volt DC automotive systems. Conforms to SAE J553C standard.	获取价格
0CBF010.Z	LITTELFUSE	Direct replacement for many OEM applications. Designed for glass fuses without physical alteration in the system. Fits 1inch fuse clips. SAE Type II non-cycling used primarily as a wiring harness protector in 12 volt DC automotive systems. Conforms to SAE J355C standard.	获取价格
0CBF015.XP	LITTELFUSE	Direct replacement for many OEM applications. Designed for glass fuses without physical alteration in the system. Fits 1 1/4" fuse clips. SAE Type II non-cycling used primarily as a wiring harness protector in 12 volt DC automotive systems. Conforms to SAE J553C standard.	获取价格
0CBF015.Z	LITTELFUSE	Direct replacement for many OEM applications. Designed for glass fuses without physical alteration in the system. Fits 1inch fuse clips. SAE Type II non-cycling used primarily as a wiring harness protector in 12 volt DC automotive systems. Conforms to SAE J355C standard.	获取价格
0CBF020.XP	LITTELFUSE	Direct replacement for many OEM applications. Designed for glass fuses without physical alteration in the system. Fits 1 1/4" fuse clips. SAE Type II non-cycling used primarily as a wiring harness protector in 12 volt DC automotive systems. Conforms to SAE J553C standard.	获取价格
0CBF020.Z	LITTELFUSE	Direct replacement for many OEM applications. Designed for glass fuses without physical alteration in the system. Fits 1inch fuse clips. SAE Type II non-cycling used primarily as a wiring harness protector in 12 volt DC automotive systems. Conforms to SAE J355C standard.	获取价格
0CBF025.XP	LITTELFUSE	Direct replacement for many OEM applications. Designed for glass fuses without physical alteration in the system. Fits 1 1/4" fuse clips. SAE Type II non-cycling used primarily as a wiring harness protector in 12 volt DC automotive systems. Conforms to SAE J553C standard.	获取价格
0CBF025.Z	LITTELFUSE	Direct replacement for many OEM applications. Designed for glass fuses without physical alteration in the system. Fits 1inch fuse clips. SAE Type II non-cycling used primarily as a wiring harness protector in 12 volt DC automotive systems. Conforms to SAE J355C standard.	获取价格
0CBF030.XP	LITTELFUSE	Direct replacement for many OEM applications. Designed for glass fuses without physical alteration in the system. Fits 1 1/4" fuse clips. SAE Type II non-cycling used primarily as a wiring harness protector in 12 volt DC automotive systems. Conforms to SAE J553C standard.	获取价格