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AAN3216F2P2G45

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AAN3216F2P2G45 概述

蓝牙陶瓷芯片天线

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2.4GHz 3216 Chip Antenna: AAN3216F2P2G45

______________________________________________________________________________________________________

Application:

WLAN, 802.11b/g, Bluetooth, etc…

Features

SMD, high reliability, ultra Impact, Omni-directional…

Part number

AAN

3216 - F2

2G45

(5)

(1)

(2) (3)

(4)

(1)Product Type

(2)Size Code

(3)Type Code

(4)Packing

Chip Antenna

3.2x1.6mm

Paper Tape

2.45GHz

(5)Frequency

Electrical Specification

Working Frequency Range

Peak Gain

2400 ~2484 MHz

0.8 dBi (Typ.)

50 Ohm

Impedance

Return loss

10 dB ( Min)

Linear

Polarization

Azimuth Beamwidth

Operation Temperature(℃)

The specification is defined on EVB.

Omni-directional

-40 ~85℃

Dimension and Terminal Configuration

Dimension (mm)

No.

Terminal Name

Feeding point

GND

3.15+-0.15

1.55+-0.15

0.50+-0.10

0.35+-0.10

2.4GHz 3216 Chip Antenna: AAN3216F2P2G45

______________________________________________________________________________________________________

Evaluation Board Reference

PCB Dimension

Antenna Layout Reference

unit :mm

Electrical Characteristics

Return Loss & Radiation

Return Loss

Frequency

(MHz)

2400

S11 (dB)

-11.0

-20.2

-10.6

2442

2484

Radiation

2.4GHz 3216 Chip Antenna: AAN3216F2P2G45

______________________________________________________________________________________________________

Taping Specifications

Reel and Taping Specification

Reel Specification

TYPE

SIZE

ψB

ψC

ψD

ψM

3216

7” 5K/Reel 2.0±0.5 13.5±1.0 21±1.0

60±1.0 11.5±2.0 178±2.0

Tapping Specification

Packaging

Type

ψD

+0.10

1.50

Paper Type

3216

1.90±0.20 3.50±0.20 8.0±0.20 1.75±0.10 3.5±0.05 4.0±0.10 2.0±0.05 0.75±0.10

4.0±0.1

-0

2.4GHz 3216 Chip Antenna: AAN3216F2P2G45

______________________________________________________________________________________________________

Reliability Table

Requirements

Ceramic Type

Remark

(Reference)

Test Item

Electrical

Procedure

Fulfill the electrical

specification

User Spec.

Characterization

Thermal

Shock

1. Preconditioning:

No Visible Damage.

Fulfill the electrical

specification.

MIL-STD-202

107

50 ± 10℃ / 1 hr , then keep for 24 ± 1 hrs at room temp.

2. Initial measure: Spec: refer Initial spec.

3. Rapid change of temperature test:

-30℃ to +85℃; 100 cycles;

15 minutes at Lower category temperature;

15 minutes at Upper category temperature.

Temperature

Cycling

1. Initial measure: Spec: refer Initial spec.

2. 100 Cycles (-30℃ to +85℃), Soak Mode=1 (2 Cycle/hours).

3. Measurement at 24 ± 2Hours after test condition.

No Visible Damage.

Fulfill the electrical

specification.

JESD22

JA104

High Temperature

Exposure

1. Initial measure: Spec: refer Initial spec.

2. Unpowered; 500hours @ T=+85℃.

3. Measurement at 24 ± 2 hours after test.

No Visible Damage.

Fulfill the electrical

specification.

MIL-STD-202

108

Low Temperature

Storage

1. Initial measure: Spec: refer Initial spec.

2. Unpowered: 500hours @ T= -30℃.

3. Measurement at 24 ± 2 hours after test.

No Visible Damage.

Fulfill the electrical

specification.

MIL-STD-202

108

Solderability

(SMD Bottom Side)

Dipping method:

a. Temperature: 235 ± 5°C

b. Dipping time: 3 ± 0.5s

The solder should cover

over 95% of the critical

area of bottom side.

IEC 60384-21/22

4.10

Soldering Heat

Resistance

(RSH)

Preheating temperature: 150 ± 10°C.

Preheating time: 1~2 min.

Solder temperature: 260 ± 5°C.

Dipping time: 5 ± 0.5s

No Visible Damage.

IEC 60384-21/22

4.10

Vibration

5g's for 20 min., 12 cycles each of 3 orientations

Note: Use 8"X5" PCB .031" thick 7 secure points on, one long

side and 2 secure points at corners of opposite sides. Parts

mounted within 2" from any secure point. Test from 10-2000

Hz.

No Visible Damage.

MIL-STD-202

Method 204

Mechanical

Shock

Three shocks in each direction shall be applied along the three

mutually perpendicular axes of the test specimen (18 shocks)

Peak value: 1,500g’s

No Visible Damage.

MIL-STD-202

Method 213

Duration: 0.5ms

Velocity change: 15.4 ft/s

Waveform: Half-sine

Humidity

Bias

1. Humidity: 85% R.H., Temperature: 85 ± 2 °C.

2. Time: 500 ± 24 hours.

3. Measurement at 24 ± 2hrs after test condition.

No Visible Damage.

Fulfill the electrical

specification.

MIL-STD-202

Method 106

2.4GHz 3216 Chip Antenna: AAN3216F2P2G45

______________________________________________________________________________________________________

Board

1. Mounting method:

No Visible Damage.

AEC-Q200

Flex

(SMD)

IR-Reflow. PCB Size (L:100 × W:40 × T:1.6mm)

2. Applythe load in direction of the arrow until bending reaches

2 mm.

005

Adhesion

Force of 1.8Kg for 60 seconds.

No Visible Damage

AEC-Q200

006

Magnification of 20Xor

greater maybe employed

for inspection of the

mechanical integrityof the

device bodyterminals and

body/terminal junction.

Physical

Dimension

Anyapplicable method using x10 magnification, micrometers,

calipers, gauges, contour projectors, or other measuring

equipment, capable of determining the actual specimen

dimensions.

In accordance with

specification.

JESD22

JB100

Revision History

Revision

Date

2015/7/20

Content

New issue

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