DRV10866DSCR

更新时间:2024-12-04 05:34:56
品牌:TI
描述:5V 标称电压、0.85A 峰值无传感器梯形控制三相 BLDC 电机驱动器 | DSC | 10 | -40 to 85

DRV10866DSCR 概述

5V 标称电压、0.85A 峰值无传感器梯形控制三相 BLDC 电机驱动器 | DSC | 10 | -40 to 85 运动控制电子器件

DRV10866DSCR 规格参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:HVSON, SOLCC10,.11,20
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:1.13模拟集成电路 - 其他类型:BRUSHLESS DC MOTOR CONTROLLER
JESD-30 代码:S-PDSO-N10JESD-609代码:e4
长度:3 mm湿度敏感等级:2
功能数量:1端子数量:10
最高工作温度:85 °C最低工作温度:-40 °C
最大输出电流:0.85 A封装主体材料:PLASTIC/EPOXY
封装代码:HVSON封装等效代码:SOLCC10,.11,20
封装形状:SQUARE封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260电源:1.8/5 V
认证状态:Not Qualified座面最大高度:0.75 mm
子类别:Motion Control Electronics最大供电电流 (Isup):3.5 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):1.65 V
标称供电电压 (Vsup):3 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3 mmBase Number Matches:1

DRV10866DSCR 数据手册

通过下载DRV10866DSCR数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。

PDF下载
DRV10866  
www.ti.com  
SBVS206 NOVEMBER 2012  
5-V, THREE-PHASE, SENSORLESS BLDC MOTOR DRIVER  
1
FEATURES  
2
Input Voltage Range: 1.65 V to 5.5 V  
PWMIN Input from 15 kHz to 50 kHz  
Six Integrated MOSFETS With 680-mA Peak  
Output Current  
Lock Detection  
Voltage Surge Protection  
UVLO  
Ultralow Quiescent Current: 5 µA (typ) in  
Standby Mode  
Thermal Shutdown  
Total Driver H+L RDSOn 900 mΩ  
Sensorless Proprietary BMEF Control Scheme  
150° Commutation  
APPLICATIONS  
Notebook CPU Fans  
Game Station CPU Fans  
ASIC Cooling Fans  
Synchronous Rectification PWM Operation  
Selectable FG and ½ FG Open-Drain Output  
DESCRIPTION  
DRV10866 is a three phase, sensorless motor driver with integrated power MOSFETs with drive current  
capability up to 680 mA peak. DRV10866 is specifically designed for low noise and low external component  
count fan motor drive applications. DRV10866 has built in over-current protection with no external current sense  
resistor needed. The synchronous rectification mode of operation achieves increased efficiency for motor driver  
applications. DRV10866 outputs either FG or ½ FG to indicate motor speed with open drain output. A 150°  
sensorless BEMF control scheme is implemented for a three phase motor. DRV10866 is available in the  
thermally efficient 10-pin, 3-mm x 3-mm x 0.75-mm SON (DSC) package. The operating temperature is specified  
from -40°C to 125°C.  
TYPICAL APPLICATION  
100 kW  
PWMIN  
1
2
3
4
5
FG  
PWM 10  
3.8 kW  
COM  
VCC  
U
CS  
FGS  
V
9
8
7
6
VCC  
2.2 mF/  
6.3 V  
GND  
W
M
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2012, Texas Instruments Incorporated  
DRV10866  
SBVS206 NOVEMBER 2012  
www.ti.com  
ORDERING INFORMATION(1)(2)  
SPECIFIED  
TRANSPORT  
PACKAGE  
DESIGNATOR  
TEMPERATURE  
RANGE  
PACKAGE  
MARKING  
ORDERING  
NUMBER  
MEDIA,  
QUANTITY  
PRODUCT  
PACKAGE-LEAD  
SON-10  
Tape and Reel,  
3000  
DRV10866  
DSC  
–40°C to +125°C  
DRV10866  
DRV10866DSC  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/package.  
FUNCTIONAL BLOCK DIAGRAM  
Lock  
Detection  
FG  
PWM  
PWM and  
Standby  
1/2  
GND  
COM  
FGS  
FIL  
PCOM  
U
V
Current  
Comparator  
Phase  
Select  
CS_S  
VCC  
W
Phase  
Select  
CS  
VREF  
UVLO and  
Clamping  
VCC  
Core  
Logic  
Bandgap  
Predriver  
V
VREF  
U
GND  
OSC (5 MHz)  
Predriver  
VCC  
GND  
Predriver  
W
Thermal  
Detection  
GND  
2
Submit Documentation Feedback  
Copyright © 2012, Texas Instruments Incorporated  
DRV10866  
www.ti.com  
SBVS206 NOVEMBER 2012  
PIN DESIGNATION  
DSC PACKAGE  
3-mm × 3-mm SON  
(TOP VIEW)  
FG  
COM  
VCC  
U
1
2
3
4
5
10  
9
PWM  
CS  
FGS  
V
Thermal Pad(1)  
GND  
8
7
GND  
6
W
(1). Thermal pad connected to ground.  
Table 1. PIN DESCRIPTIONS  
TERMINAL  
NAME  
NO.  
I/O  
DESCRIPTION  
Frequency generator output. If the FGS pin is connected to ground, the output has a period  
equal to six electrical states (FG). If the FGS pin is connected to VCC, the output has a  
period equal to 12 electrical states (1/2FG).  
FG  
1
O
COM  
VCC  
2
3
I
I
Motor common terminal input  
Input voltage for motor and chip-supply voltage; the internal clamping circuit clamps the VCC  
voltage.  
U
GND  
W
4
5
6
7
O
O
Phase U output  
Ground pin  
Phase W output  
Phase V output  
V
O
FG and 1/2FG control pin. Latched upon wake-up signal from the PWM pin. For details, refer  
to the FG pin description section.  
FGS  
8
I
Overcurrent threshold setup pin. The constant current of the internal constant current source  
flows through the resistor connected to this pin. The other side of the resistor is connected to  
ground. The voltage across the resistor compares with the voltage converted from the  
bottom MOSFET current. If the MOSFET current is high, the part enters the overcurrent  
protection mode by turning off the top PWM MOSFET and holding the bottom MOSFET on. I  
(mA) = 3120/RCS(kΩ).  
CS  
9
I
Equation valid range: 300 mA < ILIMIT< 850 mA  
PWM input pin. The PWM input signal is converted to a fixed 156-kHz switching frequency  
on the MOSFET driver. The PWM input signal resolution is less than 1%. This pin can also  
control the device and put it in or out of standby mode. After the signal at the PWM stays low  
(up to 500 µs), the device goes into low-power standby mode. Standby current is  
approximately 5 µA. The rising edge of the PWM signal wakes up the device and puts it into  
active mode, where it is ready to start to turn the motor.  
PWM  
10  
I
Copyright © 2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
DRV10866  
SBVS206 NOVEMBER 2012  
www.ti.com  
ABSOLUTE MAXIMUM RATINGS  
Over operating free-air temperature range (unless otherwise noted).  
VALUE  
MIN  
MAX  
+6.0  
+6.0  
+0.3  
+6.0  
+7.0  
+6.0  
+125  
+150  
4
UNIT  
V
VCC  
–0.3  
–0.3  
–0.3  
–1.0  
–1.0  
–0.3  
–40  
CS, FGS, PWM  
V
Input voltage range(1)  
GND  
V
COM  
V
U, V, W  
V
Output voltage range(1)  
FG  
V
Operating junction temperature, TJ  
°C  
°C  
kV  
V
Temperature  
Storage, Tstg  
–55  
Human body model, HBM  
Electrostatic discharge (ESD)  
Charge device model, CDM  
500  
(1) All voltage values are with respect to network ground terminal unless otherwise noted.  
THERMAL INFORMATION  
DRV10866  
DSC  
THERMAL METRIC(1)  
UNITS  
10 PINS  
42.3  
θJA  
Junction-to-ambient thermal resistance(2)  
Junction-to-case (top) thermal resistance(3)  
Junction-to-board thermal resistance(4)  
θJCtop  
θJB  
44.5  
17.1  
°C/W  
ψJT  
Junction-to-top characterization parameter(5)  
Junction-to-board characterization parameter(6)  
Junction-to-case (bottom) thermal resistance(7)  
0.3  
ψJB  
17.3  
θJCbot  
4.3  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as  
specified in JESD51-7, in an environment described in JESD51-2a.  
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-  
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB  
temperature, as described in JESD51-8.  
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).  
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).  
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific  
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
Spacer  
4
Submit Documentation Feedback  
Copyright © 2012, Texas Instruments Incorporated  
DRV10866  
www.ti.com  
SBVS206 NOVEMBER 2012  
RECOMMENDED OPERATING CONDITIONS  
Over operating free-air temperature range (unless otherwise noted).  
MIN  
1.65  
–0.7  
–0.1  
–0.1  
–0.1  
–40  
NOM  
MAX  
5.5  
UNIT  
V
Supply voltage  
Voltage range  
VCC  
U, V, W  
6.5  
V
FG, CS, FGS, COM  
GND  
5.5  
V
0.1  
V
PWM  
5.5  
V
Operating junction temperature, TJ  
+125  
°C  
ELECTRICAL CHARACTERISTICS  
Over operating free-air temperature range (unless otherwise noted).  
DRV10866  
TYP  
PARAMETER  
SUPPLY CURRENT  
TEST CONDITIONS  
MIN  
MAX  
UNIT  
IVcc  
Supply current  
Standby current  
TA = +25°C; PWM = VCC; VCC = 5 V  
TA = +25°C; PWM = 0 V; VCC = 5 V  
2.5  
3.5  
mA  
µA  
IVcc-Standby  
UVLO  
5
10  
UVLO threshold voltage,  
rising  
VUVLO-Th_r  
VUVLO-Th_f  
VUVLO-Th_hys  
Rise threshold, TA = +25°C  
Fall threshold, TA = +25°C  
TA = +25°C  
1.80  
1.65  
150  
1.9  
V
V
UVLO threshold voltage,  
falling  
1.6  
UVLO threshold voltage,  
hysteresis  
75  
225  
mV  
INTEGRATED MOSFET  
TA = +25°C; VCC = 5 V; IO = 0.5 A  
TA = +25°C; VCC = 4 V; IO = 0.5 A  
TA = +25°C; VCC = 3 V; IO = 0.5 A  
0.8  
0.9  
1.1  
1.2  
1.4  
1.7  
Ω
Ω
Ω
RDSON  
Series resistance (H+L)  
PWM  
VPWM-IH  
VPWM-IL  
FPWM  
High-level input voltage  
Low-level input voltage  
PWM input frequency  
V
CC 4.5 V  
CC 4.5 V  
2.3  
15  
V
V
V
0.8  
50  
kHz  
µA  
µA  
µs  
Standby mode, VCC = 5 V  
Active mode, VCC = 5 V  
PWM = 0  
5
100  
500  
IPWM-Source  
TSTBY  
FG AND FGS  
IFG-Sink  
FG pin sink current  
VFG = 0.3 V  
5
mA  
V
FG pin output, full FG signal, VCC 4.5 V  
FG pin output, one-half FG signal, VCC 4.5 V  
0.8  
VFGS-Th  
FG set threshold voltage  
2.3  
V
LOCK PROTECTION  
TLOCK-On Lock detect time  
TLOCK-Off Lock release time  
CURRENT LIMIT  
Current limit  
THERMAL SHUTDOWN  
Shutdown temperature  
threshold  
FG = 0  
2
3
5
4
s
s
2.5  
7.5  
CS pin to GND resistor = 3.9 kΩ  
680  
800  
920  
mA  
+160  
10  
°C  
°C  
TSHDN  
Hysteresis  
Copyright © 2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
DRV10866  
SBVS206 NOVEMBER 2012  
www.ti.com  
DETAILED DEVICE DESCRIPTION  
DRV10866 is a three phase, sensorless motor driver with integrated power MOSFETs with drive current  
capability up to 680-mA peak. DRV10866 is specifically designed for low noise, low external component count  
fan motor drive applications. DRV10866 has built in over current protection with no external current sense  
resistor needed. The synchronous rectification mode of operation achieves increased efficiency for motor driver  
applications. DRV10866 can output either FG or ½ FG to indicate motor speed with open drain output through  
FGS pin selection. A 150° sensorless BEMF control scheme is implemented for a three phase motor. Voltage  
surge protection scheme prevents input VCC capacitor from over charge during motor acceleration and  
deceleration modes. DRV10866 has multiple built-in protection blocks including UVLO, over current protection,  
lock protection and thermal shut down protection.  
Speed Control  
DRV10866 can control motor speed through either the PWMIN or VCC pin. Motor speed will increase with higher  
PWMIN duty cycle or VCC input voltage. The curve of motor speed (RPM) vs PWMIN duty cycle or VCC input  
voltage is close to linear in most cases. However, motor characteristics will affect the linearity of this speed  
curve. DRV10866 can operate at very low VCC input voltage down to 1.65 V. The PWMIN pin is pulled up to VCC  
internally and frequency range can vary from 15 kHz to 50 kHz. The motor driver MOSFETs will operate at  
constant switching frequency 156 kHz. With this high switching frequency, DRV10866 can eliminate audible  
noise and reduce the ripple of VCC input voltage and current, and thus minimize EMI noise.  
Frequency Generator  
The FG pin outputs a 50% duty cycle of PWM waveform in the normal operation condition. The frequency of the  
FG signal represents the motor speed and phase information. The FG pin is an open drain output, so an external  
pull up resistor is needed when connected to an external system. During the startup, FG output will stay at high  
impedance until the motor speed reaches a certain level and BEMF is detected. During lock protection condition,  
FG output will remain high until the motor restarts and startup process is completed. DRV10866 can output either  
FG or ½ FG to indicate motor status with open drain output through FGS pin selection. When FGS is pulled to  
VCC, the frequency of FG output is half of that when FGS is pulled to GND. Motor speed can be calculated based  
on the FG frequency when FGS is pulled to GND, which equals to:  
(FG ? 60)  
pole pairs  
RPM =  
(1)  
Where FG is in hertz (Hz).  
Lock Protection  
If the motor is blocked or stopped by an external force, the lock protection is triggered after lock detection time.  
During lock detection time, the circuit monitors the PWM and FG signals. If PWM has an input signal while the  
FG output is in high impedance during this period, the lock protection will be enabled and DRV10866 will stop  
driving the motor. After lock release time, DRV10866 will resume driving the motor again. If the lock condition still  
exists, DRV10866 will proceed with the next lock protection cycle until the lock condition is removed. With this  
lock protection, the motor and device will not get over heated or be damaged.  
6
Submit Documentation Feedback  
Copyright © 2012, Texas Instruments Incorporated  
DRV10866  
www.ti.com  
SBVS206 NOVEMBER 2012  
Voltage Surge Protection  
The DRV10866 has a unique feature to clamp the VCC voltage during lock protection and standby mode. If the  
lock mode condition is caused by an external force that suddenly stops the motor at a high speed, or the device  
goes into standby mode from a high duty cycle, either situation releases the energy in the motor winding into the  
input capacitor. When a small input capacitor and anti-reverse diode are used in the system design, the input  
voltage of the IC could rise above the absolute voltage rate of the chip. This condition either destroys the device  
or reduces the reliability of the device. For this reason, the DRV10866 has a voltage clamp circuit that clamps the  
input voltage at 5.95 V, and has a hysteresis of 150 mV. This clamp circuit is only active during the lock  
protection cycle or when the device enters standby mode. It is disabled during normal operation.  
Overcurrent Protection  
The DRV10866 can adjust the overcurrent point through an external resistor connected to the CS pin (pin 9) and  
ground. Without this external current sense resistor, the DRV10866 senses the current through the power  
MOSFET. Therefore, there is no power loss during the current sensing. The current sense architecture improves  
the overall system efficiency. Shorting the CS pin to ground disables the overcurrent protection feature. During  
overcurrent protection, the DRV10866 only limits the current to the motor; it does not shut down the device. The  
overcurrent limit can be set by the value of current sensing resistor through Equation 2.  
3120  
I (A) =  
RCS (W)  
(2)  
UVLO (Undervoltage Lockout)  
The DRV10866 has a built in UVLO function block. The hysteresis of UVLO threshold is 150 mV. The device will  
be locked out when VCC reaches 1.65 V and woke up at 1.8 V.  
Thermal Shutdown  
The DRV10866 has a built in thermal shunt down function, which will shut down the device when the junction  
temperature is over 160°C and will resume operating when the junction temperature drops back to 150°C.  
Copyright © 2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
 
DRV10866  
SBVS206 NOVEMBER 2012  
www.ti.com  
APPLICATION INFORMATION  
The DRV10866 only requires three external components. A 2.2-µF or higher ceramic capacitor connected to VCC  
and ground is needed for decoupling purposes. This capacitor must be placed close to the VCC pin (pin 3) and  
GND pin (pin 5). During normal operation, a sudden drop in motor speed (caused by changing the PWM duty  
from high to low immediately) causes the VCC voltage to rise to a very high level, especially when an anti-reverse  
diode is added on the VCC side. In order to avoid this condition, a larger input capacitor between VCC and GND is  
needed, along with removing the anti-reverse diode. The DRV10866 is simple to design with a single-layer  
printed circuit board (PCB) layout. During layout, the strategy of ground copper pour is very important to enhance  
the thermal performance. Refer to Figure 1 for an example of PCB layout.  
Figure 1. Single-Layer PCB Layout  
8
Submit Documentation Feedback  
Copyright © 2012, Texas Instruments Incorporated  
 
PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Feb-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
DRV10866DSCR  
ACTIVE  
SON  
DSC  
10  
3000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-2-260C-1 YEAR  
-40 to 85  
10866  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) Only one of markings shown within the brackets will appear on the physical device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-Nov-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
DRV10866DSCR  
SON  
DSC  
10  
3000  
330.0  
12.4  
3.3  
3.3  
1.1  
8.0  
12.0  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-Nov-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SON DSC 10  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 35.0  
DRV10866DSCR  
3000  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense  
Video and Imaging  
www.ti.com/space-avionics-defense  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/omap  
OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2013, Texas Instruments Incorporated  

DRV10866DSCR CAD模型

  • 引脚图

  • 封装焊盘图

  • DRV10866DSCR 相关器件

    型号 制造商 描述 价格 文档
    DRV10963 TI 5-V, THREE PHASE, SENSORLESS BLDC MOTOR DRIVER 获取价格
    DRV10963DSNR TI 5-V nominal, 1.8-A peak sensorless sinusoidal control 3-phase BLDC motor driver 10-SON -40 to 125 获取价格
    DRV10963JADSNR TI DRV10963 5-V, Three-Phase, Sensorless BLDC Motor Driver 获取价格
    DRV10963JADSNT TI DRV10963 5-V, Three-Phase, Sensorless BLDC Motor Driver 获取价格
    DRV10963JJDSNR TI DRV10963 5-V, Three-Phase, Sensorless BLDC Motor Driver 获取价格
    DRV10963JJDSNT TI DRV10963 5-V, Three-Phase, Sensorless BLDC Motor Driver 获取价格
    DRV10963JMDSNR TI 暂无描述 获取价格
    DRV10963JMDSNT TI DRV10963 5-V, Three-Phase, Sensorless BLDC Motor Driver 获取价格
    DRV10963JUDSNR TI 5-V nominal, 1.8-A peak sensorless sinusoidal control 3-phase BLDC motor driver 10-SON -40 to 125 获取价格
    DRV10963JUDSNT TI DRV10963 5-V, Three-Phase, Sensorless BLDC Motor Driver 获取价格

    DRV10866DSCR 相关文章

  • 苹果Apple Intelligence适配百度AI模型遇技术挑战
    2024-12-05
    10
  • 苹果携手亚马逊,定制AI芯片助力Apple Intelligence模型训练
    2024-12-05
    9
  • 革命性突破:光衍射极限下微型步行机器人成功面世
    2024-12-05
    11
  • Soitec将为格罗方德9SW平台供应300mm RF-SOI晶圆
    2024-12-05
    9