DRV10866DSCR
更新时间:2024-12-04 05:34:56
品牌:TI
描述:5V 标称电压、0.85A 峰值无传感器梯形控制三相 BLDC 电机驱动器 | DSC | 10 | -40 to 85
DRV10866DSCR 概述
5V 标称电压、0.85A 峰值无传感器梯形控制三相 BLDC 电机驱动器 | DSC | 10 | -40 to 85 运动控制电子器件
DRV10866DSCR 规格参数
是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | HVSON, SOLCC10,.11,20 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 1.13 | 模拟集成电路 - 其他类型: | BRUSHLESS DC MOTOR CONTROLLER |
JESD-30 代码: | S-PDSO-N10 | JESD-609代码: | e4 |
长度: | 3 mm | 湿度敏感等级: | 2 |
功能数量: | 1 | 端子数量: | 10 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
最大输出电流: | 0.85 A | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVSON | 封装等效代码: | SOLCC10,.11,20 |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 电源: | 1.8/5 V |
认证状态: | Not Qualified | 座面最大高度: | 0.75 mm |
子类别: | Motion Control Electronics | 最大供电电流 (Isup): | 3.5 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.65 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 3 mm | Base Number Matches: | 1 |
DRV10866DSCR 数据手册
通过下载DRV10866DSCR数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载DRV10866
www.ti.com
SBVS206 –NOVEMBER 2012
5-V, THREE-PHASE, SENSORLESS BLDC MOTOR DRIVER
1
FEATURES
2
•
Input Voltage Range: 1.65 V to 5.5 V
•
•
•
•
•
PWMIN Input from 15 kHz to 50 kHz
•
Six Integrated MOSFETS With 680-mA Peak
Output Current
Lock Detection
Voltage Surge Protection
UVLO
•
Ultralow Quiescent Current: 5 µA (typ) in
Standby Mode
Thermal Shutdown
•
•
•
•
•
Total Driver H+L RDSOn 900 mΩ
Sensorless Proprietary BMEF Control Scheme
150° Commutation
APPLICATIONS
•
•
•
Notebook CPU Fans
Game Station CPU Fans
ASIC Cooling Fans
Synchronous Rectification PWM Operation
Selectable FG and ½ FG Open-Drain Output
DESCRIPTION
DRV10866 is a three phase, sensorless motor driver with integrated power MOSFETs with drive current
capability up to 680 mA peak. DRV10866 is specifically designed for low noise and low external component
count fan motor drive applications. DRV10866 has built in over-current protection with no external current sense
resistor needed. The synchronous rectification mode of operation achieves increased efficiency for motor driver
applications. DRV10866 outputs either FG or ½ FG to indicate motor speed with open drain output. A 150°
sensorless BEMF control scheme is implemented for a three phase motor. DRV10866 is available in the
thermally efficient 10-pin, 3-mm x 3-mm x 0.75-mm SON (DSC) package. The operating temperature is specified
from -40°C to 125°C.
TYPICAL APPLICATION
100 kW
PWMIN
1
2
3
4
5
FG
PWM 10
3.8 kW
COM
VCC
U
CS
FGS
V
9
8
7
6
VCC
2.2 mF/
6.3 V
GND
W
M
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
DRV10866
SBVS206 –NOVEMBER 2012
www.ti.com
ORDERING INFORMATION(1)(2)
SPECIFIED
TRANSPORT
PACKAGE
DESIGNATOR
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
MEDIA,
QUANTITY
PRODUCT
PACKAGE-LEAD
SON-10
Tape and Reel,
3000
DRV10866
DSC
–40°C to +125°C
DRV10866
DRV10866DSC
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/package.
FUNCTIONAL BLOCK DIAGRAM
Lock
Detection
FG
PWM
PWM and
Standby
1/2
GND
COM
FGS
FIL
PCOM
U
V
Current
Comparator
Phase
Select
CS_S
VCC
W
Phase
Select
CS
VREF
UVLO and
Clamping
VCC
Core
Logic
Bandgap
Predriver
V
VREF
U
GND
OSC (5 MHz)
Predriver
VCC
GND
Predriver
W
Thermal
Detection
GND
2
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
DRV10866
www.ti.com
SBVS206 –NOVEMBER 2012
PIN DESIGNATION
DSC PACKAGE
3-mm × 3-mm SON
(TOP VIEW)
FG
COM
VCC
U
1
2
3
4
5
10
9
PWM
CS
FGS
V
Thermal Pad(1)
GND
8
7
GND
6
W
(1). Thermal pad connected to ground.
Table 1. PIN DESCRIPTIONS
TERMINAL
NAME
NO.
I/O
DESCRIPTION
Frequency generator output. If the FGS pin is connected to ground, the output has a period
equal to six electrical states (FG). If the FGS pin is connected to VCC, the output has a
period equal to 12 electrical states (1/2FG).
FG
1
O
COM
VCC
2
3
I
I
Motor common terminal input
Input voltage for motor and chip-supply voltage; the internal clamping circuit clamps the VCC
voltage.
U
GND
W
4
5
6
7
O
—
O
Phase U output
Ground pin
Phase W output
Phase V output
V
O
FG and 1/2FG control pin. Latched upon wake-up signal from the PWM pin. For details, refer
to the FG pin description section.
FGS
8
I
Overcurrent threshold setup pin. The constant current of the internal constant current source
flows through the resistor connected to this pin. The other side of the resistor is connected to
ground. The voltage across the resistor compares with the voltage converted from the
bottom MOSFET current. If the MOSFET current is high, the part enters the overcurrent
protection mode by turning off the top PWM MOSFET and holding the bottom MOSFET on. I
(mA) = 3120/RCS(kΩ).
CS
9
I
Equation valid range: 300 mA < ILIMIT< 850 mA
PWM input pin. The PWM input signal is converted to a fixed 156-kHz switching frequency
on the MOSFET driver. The PWM input signal resolution is less than 1%. This pin can also
control the device and put it in or out of standby mode. After the signal at the PWM stays low
(up to 500 µs), the device goes into low-power standby mode. Standby current is
approximately 5 µA. The rising edge of the PWM signal wakes up the device and puts it into
active mode, where it is ready to start to turn the motor.
PWM
10
I
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
3
DRV10866
SBVS206 –NOVEMBER 2012
www.ti.com
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted).
VALUE
MIN
MAX
+6.0
+6.0
+0.3
+6.0
+7.0
+6.0
+125
+150
4
UNIT
V
VCC
–0.3
–0.3
–0.3
–1.0
–1.0
–0.3
–40
CS, FGS, PWM
V
Input voltage range(1)
GND
V
COM
V
U, V, W
V
Output voltage range(1)
FG
V
Operating junction temperature, TJ
°C
°C
kV
V
Temperature
Storage, Tstg
–55
Human body model, HBM
Electrostatic discharge (ESD)
Charge device model, CDM
500
(1) All voltage values are with respect to network ground terminal unless otherwise noted.
THERMAL INFORMATION
DRV10866
DSC
THERMAL METRIC(1)
UNITS
10 PINS
42.3
θJA
Junction-to-ambient thermal resistance(2)
Junction-to-case (top) thermal resistance(3)
Junction-to-board thermal resistance(4)
θJCtop
θJB
44.5
17.1
°C/W
ψJT
Junction-to-top characterization parameter(5)
Junction-to-board characterization parameter(6)
Junction-to-case (bottom) thermal resistance(7)
0.3
ψJB
17.3
θJCbot
4.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
4
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
DRV10866
www.ti.com
SBVS206 –NOVEMBER 2012
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range (unless otherwise noted).
MIN
1.65
–0.7
–0.1
–0.1
–0.1
–40
NOM
MAX
5.5
UNIT
V
Supply voltage
Voltage range
VCC
U, V, W
6.5
V
FG, CS, FGS, COM
GND
5.5
V
0.1
V
PWM
5.5
V
Operating junction temperature, TJ
+125
°C
ELECTRICAL CHARACTERISTICS
Over operating free-air temperature range (unless otherwise noted).
DRV10866
TYP
PARAMETER
SUPPLY CURRENT
TEST CONDITIONS
MIN
MAX
UNIT
IVcc
Supply current
Standby current
TA = +25°C; PWM = VCC; VCC = 5 V
TA = +25°C; PWM = 0 V; VCC = 5 V
2.5
3.5
mA
µA
IVcc-Standby
UVLO
5
10
UVLO threshold voltage,
rising
VUVLO-Th_r
VUVLO-Th_f
VUVLO-Th_hys
Rise threshold, TA = +25°C
Fall threshold, TA = +25°C
TA = +25°C
1.80
1.65
150
1.9
V
V
UVLO threshold voltage,
falling
1.6
UVLO threshold voltage,
hysteresis
75
225
mV
INTEGRATED MOSFET
TA = +25°C; VCC = 5 V; IO = 0.5 A
TA = +25°C; VCC = 4 V; IO = 0.5 A
TA = +25°C; VCC = 3 V; IO = 0.5 A
0.8
0.9
1.1
1.2
1.4
1.7
Ω
Ω
Ω
RDSON
Series resistance (H+L)
PWM
VPWM-IH
VPWM-IL
FPWM
High-level input voltage
Low-level input voltage
PWM input frequency
V
CC ≥ 4.5 V
CC ≥ 4.5 V
2.3
15
V
V
V
0.8
50
kHz
µA
µA
µs
Standby mode, VCC = 5 V
Active mode, VCC = 5 V
PWM = 0
5
100
500
IPWM-Source
TSTBY
FG AND FGS
IFG-Sink
FG pin sink current
VFG = 0.3 V
5
mA
V
FG pin output, full FG signal, VCC ≥ 4.5 V
FG pin output, one-half FG signal, VCC ≥ 4.5 V
0.8
VFGS-Th
FG set threshold voltage
2.3
V
LOCK PROTECTION
TLOCK-On Lock detect time
TLOCK-Off Lock release time
CURRENT LIMIT
Current limit
THERMAL SHUTDOWN
Shutdown temperature
threshold
FG = 0
2
3
5
4
s
s
2.5
7.5
CS pin to GND resistor = 3.9 kΩ
680
800
920
mA
+160
10
°C
°C
TSHDN
Hysteresis
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
5
DRV10866
SBVS206 –NOVEMBER 2012
www.ti.com
DETAILED DEVICE DESCRIPTION
DRV10866 is a three phase, sensorless motor driver with integrated power MOSFETs with drive current
capability up to 680-mA peak. DRV10866 is specifically designed for low noise, low external component count
fan motor drive applications. DRV10866 has built in over current protection with no external current sense
resistor needed. The synchronous rectification mode of operation achieves increased efficiency for motor driver
applications. DRV10866 can output either FG or ½ FG to indicate motor speed with open drain output through
FGS pin selection. A 150° sensorless BEMF control scheme is implemented for a three phase motor. Voltage
surge protection scheme prevents input VCC capacitor from over charge during motor acceleration and
deceleration modes. DRV10866 has multiple built-in protection blocks including UVLO, over current protection,
lock protection and thermal shut down protection.
Speed Control
DRV10866 can control motor speed through either the PWMIN or VCC pin. Motor speed will increase with higher
PWMIN duty cycle or VCC input voltage. The curve of motor speed (RPM) vs PWMIN duty cycle or VCC input
voltage is close to linear in most cases. However, motor characteristics will affect the linearity of this speed
curve. DRV10866 can operate at very low VCC input voltage down to 1.65 V. The PWMIN pin is pulled up to VCC
internally and frequency range can vary from 15 kHz to 50 kHz. The motor driver MOSFETs will operate at
constant switching frequency 156 kHz. With this high switching frequency, DRV10866 can eliminate audible
noise and reduce the ripple of VCC input voltage and current, and thus minimize EMI noise.
Frequency Generator
The FG pin outputs a 50% duty cycle of PWM waveform in the normal operation condition. The frequency of the
FG signal represents the motor speed and phase information. The FG pin is an open drain output, so an external
pull up resistor is needed when connected to an external system. During the startup, FG output will stay at high
impedance until the motor speed reaches a certain level and BEMF is detected. During lock protection condition,
FG output will remain high until the motor restarts and startup process is completed. DRV10866 can output either
FG or ½ FG to indicate motor status with open drain output through FGS pin selection. When FGS is pulled to
VCC, the frequency of FG output is half of that when FGS is pulled to GND. Motor speed can be calculated based
on the FG frequency when FGS is pulled to GND, which equals to:
(FG ? 60)
pole pairs
RPM =
(1)
Where FG is in hertz (Hz).
Lock Protection
If the motor is blocked or stopped by an external force, the lock protection is triggered after lock detection time.
During lock detection time, the circuit monitors the PWM and FG signals. If PWM has an input signal while the
FG output is in high impedance during this period, the lock protection will be enabled and DRV10866 will stop
driving the motor. After lock release time, DRV10866 will resume driving the motor again. If the lock condition still
exists, DRV10866 will proceed with the next lock protection cycle until the lock condition is removed. With this
lock protection, the motor and device will not get over heated or be damaged.
6
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
DRV10866
www.ti.com
SBVS206 –NOVEMBER 2012
Voltage Surge Protection
The DRV10866 has a unique feature to clamp the VCC voltage during lock protection and standby mode. If the
lock mode condition is caused by an external force that suddenly stops the motor at a high speed, or the device
goes into standby mode from a high duty cycle, either situation releases the energy in the motor winding into the
input capacitor. When a small input capacitor and anti-reverse diode are used in the system design, the input
voltage of the IC could rise above the absolute voltage rate of the chip. This condition either destroys the device
or reduces the reliability of the device. For this reason, the DRV10866 has a voltage clamp circuit that clamps the
input voltage at 5.95 V, and has a hysteresis of 150 mV. This clamp circuit is only active during the lock
protection cycle or when the device enters standby mode. It is disabled during normal operation.
Overcurrent Protection
The DRV10866 can adjust the overcurrent point through an external resistor connected to the CS pin (pin 9) and
ground. Without this external current sense resistor, the DRV10866 senses the current through the power
MOSFET. Therefore, there is no power loss during the current sensing. The current sense architecture improves
the overall system efficiency. Shorting the CS pin to ground disables the overcurrent protection feature. During
overcurrent protection, the DRV10866 only limits the current to the motor; it does not shut down the device. The
overcurrent limit can be set by the value of current sensing resistor through Equation 2.
3120
I (A) =
RCS (W)
(2)
UVLO (Undervoltage Lockout)
The DRV10866 has a built in UVLO function block. The hysteresis of UVLO threshold is 150 mV. The device will
be locked out when VCC reaches 1.65 V and woke up at 1.8 V.
Thermal Shutdown
The DRV10866 has a built in thermal shunt down function, which will shut down the device when the junction
temperature is over 160°C and will resume operating when the junction temperature drops back to 150°C.
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
7
DRV10866
SBVS206 –NOVEMBER 2012
www.ti.com
APPLICATION INFORMATION
The DRV10866 only requires three external components. A 2.2-µF or higher ceramic capacitor connected to VCC
and ground is needed for decoupling purposes. This capacitor must be placed close to the VCC pin (pin 3) and
GND pin (pin 5). During normal operation, a sudden drop in motor speed (caused by changing the PWM duty
from high to low immediately) causes the VCC voltage to rise to a very high level, especially when an anti-reverse
diode is added on the VCC side. In order to avoid this condition, a larger input capacitor between VCC and GND is
needed, along with removing the anti-reverse diode. The DRV10866 is simple to design with a single-layer
printed circuit board (PCB) layout. During layout, the strategy of ground copper pour is very important to enhance
the thermal performance. Refer to Figure 1 for an example of PCB layout.
Figure 1. Single-Layer PCB Layout
8
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
6-Feb-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
(1)
(2)
(3)
(4)
DRV10866DSCR
ACTIVE
SON
DSC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
10866
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Nov-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DRV10866DSCR
SON
DSC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Nov-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SON DSC 10
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 35.0
DRV10866DSCR
3000
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
DRV10866DSCR 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
DRV10963 | TI | 5-V, THREE PHASE, SENSORLESS BLDC MOTOR DRIVER | 获取价格 | |
DRV10963DSNR | TI | 5-V nominal, 1.8-A peak sensorless sinusoidal control 3-phase BLDC motor driver 10-SON -40 to 125 | 获取价格 | |
DRV10963JADSNR | TI | DRV10963 5-V, Three-Phase, Sensorless BLDC Motor Driver | 获取价格 | |
DRV10963JADSNT | TI | DRV10963 5-V, Three-Phase, Sensorless BLDC Motor Driver | 获取价格 | |
DRV10963JJDSNR | TI | DRV10963 5-V, Three-Phase, Sensorless BLDC Motor Driver | 获取价格 | |
DRV10963JJDSNT | TI | DRV10963 5-V, Three-Phase, Sensorless BLDC Motor Driver | 获取价格 | |
DRV10963JMDSNR | TI | 暂无描述 | 获取价格 | |
DRV10963JMDSNT | TI | DRV10963 5-V, Three-Phase, Sensorless BLDC Motor Driver | 获取价格 | |
DRV10963JUDSNR | TI | 5-V nominal, 1.8-A peak sensorless sinusoidal control 3-phase BLDC motor driver 10-SON -40 to 125 | 获取价格 | |
DRV10963JUDSNT | TI | DRV10963 5-V, Three-Phase, Sensorless BLDC Motor Driver | 获取价格 |
DRV10866DSCR 相关文章
- 2024-12-05
- 10
- 2024-12-05
- 9
- 2024-12-05
- 11
- 2024-12-05
- 9