概述
规格参数
数据手册
替代型号DRV8837CDSGT 概述
12V、1A H 桥电机驱动器 | DSG | 8 | -40 to 85 电机驱动器 运动控制电子器件
DRV8837CDSGT 规格参数
| 是否无铅： | 不含铅 | 是否Rohs认证： | 符合 |
| 生命周期： | Active | 包装说明： | HVSON, |
| Reach Compliance Code： | compliant | Factory Lead Time： | 6 weeks |
| 风险等级： | 1.63 | 模拟集成电路 - 其他类型： | BRUSH DC MOTOR CONTROLLER |
| JESD-30 代码： | S-PDSO-N8 | JESD-609代码： | e4 |
| 长度： | 2 mm | 湿度敏感等级： | 2 |
| 功能数量： | 1 | 端子数量： | 8 |
| 最高工作温度： | 85 °C | 最低工作温度： | -40 °C |
| 最大输出电流： | 1 A | 封装主体材料： | PLASTIC/EPOXY |
| 封装代码： | HVSON | 封装形状： | SQUARE |
| 封装形式： | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度（摄氏度）： | NOT SPECIFIED |
| 座面最大高度： | 0.75 mm | 最大供电电流 (Isup)： | 1.5 mA |
| 最大供电电压 (Vsup)： | 7 V | 最小供电电压 (Vsup)： | 1.8 V |
| 标称供电电压 (Vsup)： | 3 V | 表面贴装： | YES |
| 温度等级： | INDUSTRIAL | 端子面层： | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式： | NO LEAD | 端子节距： | 0.5 mm |
| 端子位置： | DUAL | 处于峰值回流温度下的最长时间： | NOT SPECIFIED |
| 宽度： | 2 mm | Base Number Matches： | 1 |
DRV8837CDSGT 数据手册
通过下载DRV8837CDSGT数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载DRV8837
www.ti.com
SLVSBA4A –JUNE 2012–REVISED AUGUST 2012
LOW-VOLTAGE H-BRIDGE IC
Check for Samples: DRV8837
1
FEATURES
DESCRIPTION
The DRV8837 provides an integrated motor-driver
solution for cameras, consumer products, toys, and
other low-voltage or battery-powered motion-control
applications. The device has one H-bridge driver, and
can drive one dc motor or one winding of a stepper
motor, as well as other devices like solenoids. The
output driver block consists of N-channel power
MOSFETs configured as an H-bridge to drive the
motor winding. An internal charge pump generates
needed gate-drive voltages.
2
•
H-Bridge Motor Driver
–
Drives a DC Motor or One Winding of a
Stepper Motor or Other Loads
–
Low MOSFET On-Resistance: HS + LS
280 mΩ
•
•
1.8-A Maximum Drive Current
1.8-V to 11-V Motor-Operating Supply-Voltage
Range
•
•
•
Separate Motor and Logic Supply Pins
PWM (IN/IN) Interface
The DRV8837 can supply up to 1.8 A of output
current. It operates on a motor power-supply voltage
from 1.8 V to 11 V, and a device power-supply
voltage of 1.8 V to 7 V.
Low-Power Sleep Mode With 120-nA Maximum
Combined Supply Current
•
•
Dedicated SLEEP Pin
The DRV8837 has a PWM (IN/IN) input interface,
which is compatible with industry-standard devices.
2-mm × 2-mm 8-Pin WSON Package
There are internal shutdown functions for overcurrent
protection, short-circuit protection, undervoltage
lockout and overtemperature.
APPLICATIONS
•
•
•
•
•
•
Cameras
The DRV8837 package is an 8-pin 2-mm × 2-mm
WSON PowerPAD™ package.
DSLR Lenses
Consumer Products
Toys
Robotics
Medical Devices
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
DRV8837
SLVSBA4A –JUNE 2012–REVISED AUGUST 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
ORDERABLE PART NUMBER
DRV8837DSGR
PACKAGE
WSON – DSG
WSON – DSG
TOPSIDE MARKING
SHIPPING
Reel of 3000
Reel of 250
837
837
DRV8837DSGT
(1) For the most-current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
FUNCTIONAL BLOCK DIAGRAM
1.8 to 11 V
VM
VM
VM
Drives DC Motor or
½ Stepper
OUT1
Gate
Drive
OCP
Charge
Pump
1.8 to 7 V
VCC
Step
Motor
DCM
VM
VCC
Logic
OUT2
Gate
Drive
OCP
IN1
IN2
Over-
Temp
SLEEP
Osc
GND
B0479-01
Figure 1. Functional Block Diagram
2
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: DRV8837
DRV8837
www.ti.com
SLVSBA4A –JUNE 2012–REVISED AUGUST 2012
DRV8837
DSG Package
(Top View)
1
2
3
4
8
7
6
5
VM
OUT1
OUT2
GND
VCC
Thermal
Pad
(GND)
SLEEP
IN1
IN2
P0145-01
PIN DESCRIPTIONS
PIN
I/O
DESCRIPTION
EXTERNAL COMPONENTS OR CONNECTIONS
NAME
NO.
Power and Ground
GND
VCC
4
8
1
–
–
–
Device ground
Device supply
Motor supply
Bypass to GND with a 0.1-μF 6.3-V ceramic capacitor.
Bypass to GND with a 0.1-μF 16-V ceramic capacitor.
VM
Control
Logic-high sets OUT1 high
Internal pulldown resistor
IN1
IN2
6
5
I
I
Input 1
Input 2
Logic-high sets OUT2 high
Internal pulldown resistor
Logic-low puts device in low-power sleep mode
Logic-high for normal operation
SLEEP
7
I
Sleep mode input
Internal pulldown resistor
Output
OUT1
OUT2
2
3
O
O
Output 1
Output 2
Connect to motor winding
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)(2)
VALUE
UNIT
VM
Power supply voltage range
Power supply voltage range
Digital pin voltage range
–0.3 to 12
–0.3 V to 7
–0.5 V to 7
V
V
VCC
V
Peak motor drive output current
Operating virtual junction temperature range
Storage temperature range
Internally limited
–40 to 150
A
TJ
ºC
ºC
Tstg
–60 to 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: DRV8837
DRV8837
SLVSBA4A –JUNE 2012–REVISED AUGUST 2012
www.ti.com
UNIT
THERMAL INFORMATION
DRV8837
DSG
8 PINS
60.9
THERMAL METRIC(1)
θJA
Junction-to-ambient thermal resistance(2)
Junction-to-case (top) thermal resistance(3)
Junction-to-board thermal resistance(4)
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
θJCtop
θJB
71.4
32.2
ψJT
Junction-to-top characterization parameter(5)
Junction-to-board characterization parameter(6)
Junction-to-case (bottom) thermal resistance(7)
1.6
ψJB
32.8
θJCbot
9.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
4
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: DRV8837
DRV8837
www.ti.com
SLVSBA4A –JUNE 2012–REVISED AUGUST 2012
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
1.8
1.8
0
NOM
MAX
7
UNIT
V
VCC
VM
Device power supply voltage range
Motor power-supply voltage range
H-bridge output current(1)
11
V
IOUT
fPWM
VIN
1.8
250
5.5
A
Externally applied PWM frequency
Logic-level input voltage
0
kHz
V
0
(1) Power dissipation and thermal limits must be observed.
ELECTRICAL CHARACTERISTICS
TA = 25°C, VM = 5 V, VCC = 3 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Power Supplies
VM = 5 V, VCC = 3 V, no PWM
VM = 5 V, VCC = 3 V, 50-kHz PWM
VM = 5 V, VCC = 3 V, SLEEP = 0 V
VM = 5 V, VCC = 3 V, no PWM
VM = 5 V, VCC = 3 V, 50-kHz PWM
VM = 5 V, VCC = 3 V, SLEEP = 0 V
VCC rising
40
0.8
30
100
1.5
95
µA
mA
nA
µA
mA
nA
IVM
VM operating supply current
VM sleep-mode supply current
VCC operating supply current
VCC sleep-mode supply current
VCC undervoltage lockout voltage
IVMQ
IVCC
IVCQ
VUVLO
300
0.7
5
500
1.5
25
1.8
1.7
V
VCC falling
Logic-Level Inputs
VIL
Input low voltage
0.25 VCC
0.38 VCC
0.46 VCC
0.08 VCC
V
V
VIH
VHYS
IIL
Input high voltage
Input hysteresis
0.5 VCC
V
Input low current
Input high current
Pulldown resistance
VIN = 0 V
–5
5
µA
µA
kΩ
IIH
VIN = 3.3 V
50
RPD
100
280
H-Bridge FETs
rds(on) HS + LS FET on-resistance
VCC = 3 V, VM = 5 V, IO = 800 mA,
TJ = 25°C
330
mΩ
IOFF
Off-state leakage current
VOUT = 0 V
±200
nA
Protection Circuits
IOCP
tOCR
tTSD
Overcurrent protection trip level
1.9
3.5
A
OCP retry time
1
ms
ºC
Thermal shutdown temperature
Die temperature
150
160
180
TIMING REQUIREMENTS
TA = 25°C, VM = 5 V, VCC = 3 V, RL = 20 Ω
MIN
MAX UNIT
1
2
3
4
5
6
t1
t2
t3
t4
t5
t6
Output enable time
Output disable time
120
120
120
120
150
150
ns
ns
ns
ns
ns
ns
Delay time, INx high to OUTx high
Delay time, INx low to OUTx low
Output rise time
50
50
Output fall time
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: DRV8837
DRV8837
SLVSBA4A –JUNE 2012–REVISED AUGUST 2012
www.ti.com
IN1
IN2
t1
t4
t2
OUT1
Z
Z
t3
OUT2
Z
Z
DRV8837
80%
80%
OUTx
20%
20%
t5
t6
T0542-01
Figure 2. Input/Output Timing
FUNCTIONAL DESCRIPTION
Bridge Control
The DRV8837 is controlled using a PWM input interface, also called an IN/IN interface. Each output is controlled
by a corresponding input pin.
The following table shows the logic for the DRV8837:
IN1
0
IN2
0
OUT1
OUT2
Function (DC Motor)
Coast
Z
L
Z
H
L
0
1
Reverse
1
0
H
L
Forward
1
1
L
Brake
Sleep Mode
If the nSLEEP pin is brought to a logic-low state, the DRV8837 enters a low-power sleep mode. In this state, all
unnecessary internal circuitry is powered down.
Power Supplies and Input Pins
The input pins may be driven within their recommended operating conditions with or without the VCC and/or VM
power supplies present. No leakage current path exists to the supply. There is a weak pulldown resistor
(approximately 100 kΩ) to ground on each input pin.
6
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: DRV8837
DRV8837
www.ti.com
SLVSBA4A –JUNE 2012–REVISED AUGUST 2012
VCC and VM may be applied and removed in any order. When VCC is removed, the device enters a low-power
state and draws very little current from VM. If the supply voltage is between 1.8 V and 7 V, VCC and VM may be
connected together.
Protection Circuits
The DRV8837 is fully protected against undervoltage, overcurrent, and overtemperature events.
OVERCURRENT PROTECTION (OCP)
An analog current limit circuit on each FET limits the current through the FET by removing the gate drive. If
this analog current limit persists for longer than the OCP time, all FETs in the H-bridge are disabled. After
approximately 1 ms, the bridge is re-enabled automatically.
Overcurrent conditions on both high- and low-side devices, that is, a short to ground, supply, or across the
motor winding all result in an overcurrent shutdown.
THERMAL SHUTDOWN (TSD)
If the die temperature exceeds safe limits, all FETs in the H-bridge are disabled. Once the die temperature
has fallen to a safe level, operation automatically resumes.
UNDERVOLTAGE LOCKOUT (UVLO)
If at any time the voltage on the VCC pin falls below the undervoltage lockout threshold voltage, all circuitry
in the device is disabled and internal logic is reset. Operation resumes when VCC rises above the UVLO
threshold.
THERMAL INFORMATION
Thermal Protection
The DRV8837 has thermal shutdown (TSD) as described in the Protection Circuits section. If the die temperature
exceeds approximately 150°C, the device is disabled until the temperature drops to a safe level.
Any tendency of the device to enter thermal shutdown is an indication of either excessive power dissipation,
insufficient heatsinking, or too high an ambient temperature.
Power Dissipation
Power dissipation in the DRV8837 is dominated by the power dissipated in the output FET resistance, or rDS(on)
.
Average power dissipation can be roughly estimated by:
2
PTOT = rDS(on) ´(IOUT(RMS)
)
(1)
where PTOT is the total power dissipation, rDS(on) is the resistance of the HS plus LS FETs, and IOUT(RMS) is the
rms or dc output current being supplied to the load.
The maximum amount of power that can be dissipated in the device is dependent on ambient temperature and
heatsinking.
Note that rDS(on) increases with temperature, so as the device heats, the power dissipation increases.
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: DRV8837
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
DRV8837DSGR
DRV8837DSGT
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
WSON
WSON
DSG
8
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
837
837
ACTIVE
DSG
250
Green (RoHS
& no Sb/Br)
Level-2-260C-1 YEAR
-40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jun-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DRV8837DSGR
DRV8837DSGT
WSON
WSON
DSG
DSG
8
8
3000
250
330.0
180.0
8.4
8.4
2.3
2.3
2.3
2.3
1.15
1.15
4.0
4.0
8.0
8.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jun-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DRV8837DSGR
DRV8837DSGT
WSON
WSON
DSG
DSG
8
8
3000
250
367.0
210.0
367.0
185.0
35.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
DRV8837CDSGT CAD模型
引脚图
封装焊盘图
DRV8837CDSGT 替代型号
| 型号 | 制造商 | 描述 | 替代类型 | 文档 |
| DRV8837CDSGR | TI | 11-V, 1-A H-bridge motor driver 8-WSON -40 to 85 | 完全替代 |
|
DRV8837CDSGT 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| DRV8837DSGR | TI | LOW-VOLTAGE H-BRIDGE IC | 获取价格 |
|
| DRV8837DSGT | TI | LOW-VOLTAGE H-BRIDGE IC | 获取价格 |
|
| DRV8837EVM | TI | LOW-VOLTAGE H-BRIDGE IC | 获取价格 |
|
| DRV8838 | TI | 具有相位/使能控制的 11V、1.8A H 桥电机驱动器 | 获取价格 |
|
| DRV8838DSGR | TI | 具有相位/使能控制的 11V、1.8A H 桥电机驱动器 | DSG | 8 | -40 to 85 | 获取价格 |
|
| DRV8838DSGT | TI | 具有相位/使能控制的 11V、1.8A H 桥电机驱动器 | DSG | 8 | -40 to 85 | 获取价格 |
|
| DRV8839 | TI | LOW VOLTAGE DUAL 1/2-H-BRIDGE DRIVER IC | 获取价格 |
|
| DRV8839DSSR | TI | LOW VOLTAGE DUAL 1/2-H-BRIDGE DRIVER IC | 获取价格 |
|
| DRV8839_16 | TI | Low-Voltage Dual H-Bridge Driver IC | 获取价格 |
|
| DRV8840 | TI | DC MOTOR DRIVER IC | 获取价格 |
|
DRV8837CDSGT 相关文章
苹果Apple Intelligence适配百度AI模型遇技术挑战
- 2024-12-05
- 10
苹果携手亚马逊，定制AI芯片助力Apple Intelligence模型训练
- 2024-12-05
- 9
革命性突破：光衍射极限下微型步行机器人成功面世
- 2024-12-05
- 11
Soitec将为格罗方德9SW平台供应300mm RF-SOI晶圆
- 2024-12-05
- 9
