概述
数据手册UC1705-SP 概述
具有 40V VDD 和输出锁存器的航天级 QMLV 1.5A/1.5A 单通道栅极驱动器
UC1705-SP 数据手册
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INFO
UC1705
UC2705
UC3705
available
High Speed Power Driver
FEATURES
DESCRIPTION
•
•
•
1.5A Source/Sink Drive
The UC1705 family of power drivers is made with a high speed Schottky pro-
cess to interface between low-level control functions and high-power switching
devices - particularly power MOSFETs. These devices are also an optimum
choice for capacitive line drivers where up to 1.5 amps may be switched in ei-
ther direction. With both Inverting and Non-Inverting inputs available, logic sig-
nals of either polarity may be accepted, or one input can be used to gate or
strobe the other.
100 nsec Delay
40 nsec Rise and Fall into
1000pF
•
•
Inverting and Non-Inverting
Inputs
Supply voltages for both VS and VC can independently range from 5V to 40V.
For additional application details, see the UC1707/3707 data sheet.
Low Cross-Conduction Current
Spike
The UC1705 is packaged in an 8-pin hermetically sealed CERDIP for -55°C to
+125°C operation. The UC3705 is specified for a temperature range of 0°C to
+70°C and is available in either a plastic minidip or a 5-pin, power TO-220
package.
•
•
•
•
Low Quiescent Current
5V to 40V Operation
Thermal Shutdown Protection
MINIDIP and Power Packages
CONNECTION DIAGRAMS
TRUTH TABLE
5-PIN TO-220
(TOP VIEW)
T Package
DIL-8 MINIDIP, SOIC-8
(TOP VIEW)
N or J Package, D Package
INV
N.I
OUT
H
L
H
L
H
H
L
L
H
L
L
L
OUT = INV and N.I.
OUT = INV or N.I.
BLOCK DIAGRAM
JANUARY 1994 - REVISED AUGUST 2000 - SLUS370A
UC1705
UC2705
UC3705
ABSOLUTE MAXIMUM RATINGS
N-Pkg
J-Pkg
T-Pkg
Supply Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . . 40V
Collector Supply Voltage, VC . . . . . . . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . . 40V
Output Current (Source or Sink)
Steady-State. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±500mA. . . . . . . . . . . . . . . . ±500mA. . . . . . . . . . . . . . . . . ±1.0A
Peak Transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1.5A. . . . . . . . . . . . . . . . . . ±1.0A. . . . . . . . . . . . . . . . . . ±2.0A
Capacitive Discharge Energy . . . . . . . . . . . . . . . . . . . . . . 20µ.J. . . . . . . . . . . . . . . . . . . 15µ.J. . . . . . . . . . . . . . . . . . . 50µJ
Digital Inputs (See Note) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V. . . . . . . . . . . . . . . . . . . 5.5V. . . . . . . . . . . . . . . . . . . 5.5V
Power Dissipation at TA = 25°C (See Note) . . . . . . . . . . . . . . 1W. . . . . . . . . . . . . . . . . . . . 1W. . . . . . . . . . . . . . . . . . . . 3W
Power Dissipation at TA (Leads/Case) = 25°C (See Note) . . . 3W. . . . . . . . . . . . . . . . . . . . 2W . . . . . . . . . . . . . . . . . . . 25W
Operating Temperature Range . . . . . . . . . . . . . . . . . . . . 0°C to +70°C . . . . . . . . . . -55°C to +125°C . . . . . . . . . . 0°C to +70°C
Storage Temperature Range . . . . . . . . . . . . . . . . . . . . -65°C to +150°C . . . . . . . . . -65°C to +150°C . . . . . . . . . -65°C to +150°C
Lead Temperature (Soldering, 10 seconds) . . . . . . . . . . . . . 300°C . . . . . . . . . . . . . . . . . 300°C . . . . . . . . . . . . . . . . . 300°C
Note: All currents are positive into, negative out of the specified terminal.
Digital Drive can exceed 5.5V if input current is limited to 10mA
Consult Packaging Section of Databook for thermal limitations and considerations of package.
Unless otherwise stated, these specifications apply for TA = -55°C to +125°C for
the UC1705, -25°C to +85°C for the UC2705, and 0°C to +70°C for the UC3705;
VS = VC = 20V, TA = TJ.
ELECTRICAL CHARACTERISTICS:
PARAMETERS
VS Supply Current
TEST CONDITIONS
VS = 40V, (Outputs High, T Pkg)
VS = 40V, (Outputs Low, T Pkg)
VC = 40V, Outputs Low
MIN
TYP
6
MAX UNITS
8
mA
mA
mA
mA
V
8
12
4
VC Supply Current (N, J Only)
VC Leakage Current (N, J Only)
Digital Input Low Level
Digital Input High Level
Input Current
2
VS = 0, VC = 30V
0.05
0.1
0.8
2.2
V
VI = 0
-0.6
-1.0
0.1
2.0
2.5
0.4
2.5
mA
mA
V
Input Leakage
VI = 5V
0.05
Output High Sat., VC-VO
IO = -50mA
IO = -500mA
IO = 50mA
IO = 500mA
V
Output Low Sat., VO
Thermal Shutdown
V
V
155
°C
VS = VC = 20V, TA = 25°C. Delays measured to 10% output change.
TYPICAL SWITCHING CHARACTERISTICS:
PARAMETERS
From Inv. Input to Output:
Rise Time Delay
TEST CONDITIONS
OUTPUT CL =
UNIT
nF
open
1.0
60
40
60
40
2.2
60
20
60
25
60
60
60
50
ns
10% to 90% Rise
ns
Fall Time Delay
ns
90% to 10% Fall
ns
From N. I. Input to Output:
Rise Time Delay
90
20
60
25
25
0
90
40
60
40
90
60
60
50
ns
ns
ns
ns
ns
ns
10% to 90% Rise
Fall Time Delay
90% to 10% Fall
VC Cross-Conduction
Current Spike Duration
Ouput Rise
Output Fall
2
UC1705
UC2705
UC3705
APPLICATIONS
Power MOSFET Drive Circuit
Power MOSFET Drive Circuit using Negative Bias Voltage and Level
Shifting to Ground Referenced PWMs.
D1, D2: UC3611 Schottky Diodes
D1, D2: UC3611 Schottky Diodes
Transformer Coupled MOSFET Drive Circuit
Charge Pump Circuits
D1, D2: UC3611 Schottky Diodes
UNITRODE CORPORATION
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054
TEL. 603-424-2410 • FAX 603-424-3460
3
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CDIP
CDIP
CDIP
LCCC
SOIC
Drawing
5962-9579801M2A
5962-9579801MPA
5962-9579801VPA
UC1705J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
FK
20
8
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE Level-NC-NC-NC
JG
A42 SNPB
A42
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
JG
8
JG
8
A42 SNPB
A42 SNPB
UC1705J883B
UC1705L883B
UC2705D
JG
8
FK
20
8
POST-PLATE Level-NC-NC-NC
D
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC2705J
UC2705N
ACTIVE
ACTIVE
CDIP
PDIP
JG
P
8
8
1
TBD
A42 SNPB
Level-NC-NC-NC
50 Green (RoHS & CU NIPDAU Level-NC-NC-NC
no Sb/Br)
UC3705D
UC3705DTR
UC3705DTRG4
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
D
D
D
8
8
8
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC3705J
UC3705N
ACTIVE
ACTIVE
CDIP
PDIP
JG
P
8
8
1
TBD
A42 SNPB
Level-NC-NC-NC
50 Green (RoHS & CU NIPDAU Level-NC-NC-NC
no Sb/Br)
UC3705NG4
UC3705T
ACTIVE
ACTIVE
ACTIVE
PDIP
P
8
5
5
50 Green (RoHS & CU NIPDAU Level-NC-NC-NC
no Sb/Br)
TO-220
TO-220
KC
KC
50 Green (RoHS &
no Sb/Br)
CU SN
Level-NC-NC-NC
UC3705TG3
50 Green (RoHS &
no Sb/Br)
CU SN
Level-NC-NC-NC
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2005
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.063 (1,60)
0.015 (0,38)
0.020 (0,51) MIN
0.200 (5,08) MAX
0.130 (3,30) MIN
Seating Plane
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.430 (10,92)
MAX
0.010 (0,25)
M
0.015 (0,38)
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSOT008B – JANUARY 1995 – REVISED SEPTEMBER 2000
KC (R-PSFM-T5)
PLASTIC FLANGE-MOUNT
0.113 (2,87)
0.103 (2,62)
0.420 (10,67)
0.380 (9,65)
0.185 (4,70)
0.156 (3,96)
DIA
0.175 (4,46)
0.055 (1,40)
0.146 (3,71)
0.045 (1,14)
0.147 (3,73)
0.137 (3,48)
0.340 (8,64)
0.330 (8,38)
1.037 (26,34)
0.997 (25,32)
0.125 (3,18)
(see Note C)
5
1
0.040 (1,02)
0.030 (0,76)
0.010 (0,25)
0.122 (3,10)
0.102 (2,59)
0.067 (1,70)
0.268 (6,81)
0.025 (0,64)
M
0.012 (0,30)
4040208/E 09/00
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Lead dimensions are not controlled within this area.
D. All lead dimensions apply before solder dip.
E. The center lead is in electrical contact with the mounting tab.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
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UC1705-SP 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| UC1705D | TI | High Speed Power Driver | 获取价格 |
|
| UC1705J | TI | High Speed Power Driver | 获取价格 |
|
| UC1705J883B | TI | High Speed Power Driver | 获取价格 |
|
| UC1705JQMLV | TI | 1A BUF OR INV BASED MOSFET DRIVER, CDIP8, HERMETIC SEALED, CERAMIC, DIP-8 | 获取价格 |
|
| UC1705L883B | TI | High Speed Power Driver | 获取价格 |
|
| UC1705N | TI | High Speed Power Driver | 获取价格 |
|
| UC1705T | TI | High Speed Power Driver | 获取价格 |
|
| UC1706 | TI | Dual Output Driver | 获取价格 |
|
| UC1706DW | TI | 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO16, 0.300 INCH, PLASTIC, SOIC-16 | 获取价格 |
|
| UC1706J | TI | Dual Output Driver | 获取价格 |
|
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