SI7911DN-T1-E3
更新时间:2024-11-30 18:22:02
品牌:VISHAY
描述:Trans MOSFET P-CH 20V 4.2A 8-Pin PowerPAK 1212 T/R
SI7911DN-T1-E3 概述
Trans MOSFET P-CH 20V 4.2A 8-Pin PowerPAK 1212 T/R MOS管 功率场效应晶体管
SI7911DN-T1-E3 规格参数
是否无铅: | 不含铅 | 生命周期: | Obsolete |
包装说明: | SMALL OUTLINE, S-XDSO-C6 | 针数: | 8 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
风险等级: | 5.81 | 外壳连接: | DRAIN |
配置: | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | 最小漏源击穿电压: | 20 V |
最大漏极电流 (Abs) (ID): | 4.2 A | 最大漏极电流 (ID): | 4.2 A |
最大漏源导通电阻: | 0.051 Ω | FET 技术: | METAL-OXIDE SEMICONDUCTOR |
JESD-30 代码: | S-XDSO-C6 | JESD-609代码: | e3 |
湿度敏感等级: | 1 | 元件数量: | 2 |
端子数量: | 6 | 工作模式: | ENHANCEMENT MODE |
最高工作温度: | 150 °C | 封装主体材料: | UNSPECIFIED |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE |
峰值回流温度(摄氏度): | 260 | 极性/信道类型: | P-CHANNEL |
最大功率耗散 (Abs): | 2.5 W | 最大脉冲漏极电流 (IDM): | 20 A |
认证状态: | Not Qualified | 子类别: | Other Transistors |
表面贴装: | YES | 端子面层: | Matte Tin (Sn) |
端子形式: | C BEND | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 晶体管应用: | SWITCHING |
晶体管元件材料: | SILICON | Base Number Matches: | 1 |
SI7911DN-T1-E3 数据手册
通过下载SI7911DN-T1-E3数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载Si7911DN
Vishay Siliconix
Dual P-Channel 20-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
•
•
•
Halogen-free Option Available
VDS (V)
RDS(on) (Ω)
ID (A)
- 5.7
- 5.0
- 4.2
TrenchFET® Power MOSFETS: 1.8 V Rated
New Low Thermal Resistance PowerPAK®
Package
0.051 at VGS = - 4.5 V
0.067 at VGS = - 2.5 V
0.094 at VGS = - 1.8 V
RoHS
COMPLIANT
- 20
APPLICATIONS
•
Portable
- PA Switch
- Battery Switch
- Load Switch
PowerPAK 1212-8
S
1
S
2
S1
3.30 mm
3.30 mm
1
G1
2
S2
3
G2
4
D1
G
1
G
2
8
D1
7
D2
6
D2
5
Bottom View
D
2
D
1
Ordering Information: Si7911DN-T1-E3 (Lead (Pb)-free)
Si7911DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted
A
Parameter
Symbol
10 s
Steady State
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
- 20
8
V
VGS
TA = 25 °C
TA = 85 °C
- 5.7
- 4.1
- 4.2
- 3.0
Continuous Drain Current (TJ = 150 °C)a
ID
A
IDM
IS
- 20
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
- 2.1
2.5
- 1.1
1.3
T
T
A = 25 °C
A = 85 °C
Maximum Power Dissipationa
PD
W
1.3
0.85
Operating Junction and Storage Temperature Range
Soldering Recommendationsb, c
TJ, Tstg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
40
Maximum
Unit
t ≤ 10 s
50
94
7
Maximum Junction-to-Ambienta
RthJA
Steady State
Steady State
75
°C/W
Maximum Junction-to-Case
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
RthJC
5.6
b. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 72340
S-81544-Rev. C, 07-Jul-08
www.vishay.com
1
Si7911DN
Vishay Siliconix
SPECIFICATIONS T = 25 °C, unless otherwise noted
J
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
VGS(th)
IGSS
VDS = VGS, ID = - 250 µA
Gate Threshold Voltage
- 0.40
- 1.0
100
- 1
V
VDS = 0 V, VGS
=
8 V
Gate-Body Leakage
nA
VDS = - 20 V, VGS = 0 V
DS = - 20 V, VGS = 0 V, TJ = 85 °C
VDS ≤ - 5 V, VGS = - 4.5 V
VGS = - 4.5 V, ID = - 5.7 A
IDSS
Zero Gate Voltage Drain Current
µA
A
V
- 5
On-State Drain Currenta
ID(on)
- 20
0.040
0.054
0.075
14
0.051
0.067
0.094
Drain-Source On-State Resistancea
RDS(on)
V
V
GS = - 2.5 V, ID = - 5.0 A
GS = - 1.8 V, ID = - 1.1 A
Ω
Forward Transconductancea
Diode Forward Voltagea
Dynamicb
gfs
VDS = - 6 V, ID = - 5.7 A
IS = - 2.3 A, VGS = 0 V
S
V
VSD
- 0.8
- 1.2
15
Qg
Qgs
Qgd
Rg
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
9.5
1.6
2.5
7.2
20
V
DS = - 6 V, VGS = - 4.5 V, ID = - 5.7 A
nC
Ω
td(on)
tr
td(off)
tf
30
55
35
V
DD = - 10 V, RL = 10 Ω
ID ≅ - 1 A, VGEN = - 4.5 V, RG = 6 Ω
Turn-Off DelayTime
Fall Time
70
105
60
ns
40
trr
IF = - 2.1 A, dI/dt = 100 A/µs
Source-Drain Reverse Recovery Time
25
50
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS T = 25 °C, unless otherwise noted
A
20
16
12
8
20
16
12
8
T
= - 55 °C
C
V
= 5 thru 2.5 V
GS
25 °C
2 V
125 °C
1.5 V
4
4
1 V
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0
1
2
3
4
5
V
- Gate-to-Source Voltage (V)
V
- Drain-to-Source Voltage (V)
GS
DS
Output Characteristics
Transfer Characteristics
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Document Number: 72340
S-81544-Rev. C, 07-Jul-08
Si7911DN
Vishay Siliconix
TYPICAL CHARACTERISTICS T = 25 °C, unless otherwise noted
A
1500
1200
900
600
300
0
0.20
0.16
0.12
0.08
0.04
0.00
V
= 1.8 V
GS
C
iss
V
= 2.5 V
GS
V
= 4.5 V
GS
C
oss
C
rss
0
4
8
12
16
20
0
4
8
12
16
20
I
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
D
On-Resistance vs. Drain Current
Capacitance
5
4
3
2
1
0
1.6
1.4
1.2
1.0
0.8
0.6
V
D
= 10 V
V
D
= 4.5 V
DS
GS
I
= 5.7 A
I = 5.7 A
0
2
4
6
8
10
12
- 50 - 25
0
25
50
75
100 125 150
Q
- Total Gate Charge (nC)
T - Junction Temperature (°C)
g
J
Gate Charge
On-Resistance vs. Junction Temperature
0.20
0.16
0.12
0.08
0.04
0.00
20
10
I
D
= 5.7 A
I
D
= 1.1 A
T
= 150 °C
J
T
= 25 °C
J
1
0
1
2
3
4
5
0.0
0.2
0.4
0.6
0.8
1.0
1.2
V
- Gate-to-Source Voltage (V)
GS
V
SD
- Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
Document Number: 72340
S-81544-Rev. C, 07-Jul-08
www.vishay.com
3
Si7911DN
Vishay Siliconix
TYPICAL CHARACTERISTICS T = 25 °C, unless otherwise noted
A
0.4
30
25
0.3
0.2
20
15
10
I
= 250 µA
D
0.1
0.0
- 0.1
- 0.2
5
0
- 50 - 25
0
25
50
75
100 125 150
0.001
0.01
0.1
10
100
600
1
Time (s)
T
- Temperature (°C)
J
Threshold Voltage
100
Single Pulse Power, Junction-to-Ambient
I
Limited
DM
Limited by R
*
DS(on)
10
1
P(t) = 0.0001
P(t) = 0.001
P(t) = 0.01
I
D(on)
Limited
P(t) = 0.1
P(t) = 1
T
= 25 °C
A
P(t) = 10
DC
0.1
Single Pulse
BV
DSS
Limited
0.01
0.1
1
10
100
V
DS
- Drain-to-Source Voltage (V)
* V > minimum V at which R is specified
DS(on)
GS
GS
Safe Operating Area, Junction-to-Ambient
2
1
Duty Cycle = 0.5
0.2
0.1
Notes:
P
DM
0.1
0.05
0.02
t
1
t
2
t
t
1
2
1. Duty Cycle, D =
2. Per Unit Base = R
= 75 °C/W
thJA
(t)
3. T
- T = P Z
A DM thJA
JM
Single Pulse
4. Surface Mounted
0.01
-4
-3
-2
-1
10
10
10
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
10
100
600
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Document Number: 72340
S-81544-Rev. C, 07-Jul-08
Si7911DN
Vishay Siliconix
TYPICAL CHARACTERISTICS T = 25 °C, unless otherwise noted
A
2
1
Duty Cycle = 0.5
0.2
0.1
0.05
0.02
Single Pulse
0.1
0.01
-4
-3
-2
-1
10
10
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
10
1
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?72340.
Document Number: 72340
S-81544-Rev. C, 07-Jul-08
www.vishay.com
5
Legal Disclaimer Notice
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
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typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
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particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 08-Feb-17
Document Number: 91000
1
SI7911DN-T1-E3 替代型号
型号 | 制造商 | 描述 | 替代类型 | 文档 |
SI7913DN-T1-E3 | VISHAY | Dual P-Channel 20-V (D-S) MOSFET | 类似代替 |
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