C317C103K1R5TA 封装和模型
品牌：KEMET
描述：GoldMax 300 Comm X7R, Ceramic, 0.01 uF, 10%, 100 VDC, X7R, GoldMax, Commercial Standard, Lead Spacing = 5.08mm
EDA/CDA模型
原理图符号
PCB 封装图
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