MC33662LEF 封装和模型
品牌：NXP
描述：Transceiver, Physical Layer, LIN 2.1 / SAEJ2602-2, 20kbps,TX/RX symmetry, SOIC 8, Rail
EDA/CDA模型
原理图符号
PCB 封装图
3D模型
其他器件
- MC33375ST-3.3T3G
- MC33262CDR2
- MC33882PEP
- MC33063ADR2G
- MC33288DDHR2
- MC33063ADRJR
- MC33072DR2G
- MC33565D
- MC33931EKR2
- MC33364D2G
- MC33269D-5.0G
- MC33078DGKRG4
- MC33269D-5.0
- MC33269T-5.0
- MC33153DR2G
- MC33201VD
- MC33978AEKR2
- MC33166D2TG
- MC33035DWG
- MC33262PG
- MC33072ADR2G
- MC33172VDR2G
- MC33063AP1
- MC33063ADG4
- MC33771CTA2AE
- MC33064P-5RAG
- MC33580BAPNA
- MC33981BHFK
- MC33030DWR2G
- MC33275MN-5.0R2
- MC33167D2TG
- MC33395DWBR2
- MC33171DG
- MC33204DR2G
- MC33CD1030AE
- MC33151VDR2G
- MC33272ADR2G
- MC33375D-3.3R2G
- MC33275D-3.0R2G
- MC33164D-3G
- MC33067DW
- MC33813AE
- MC33662LEF
- MC33151DG
- MC33364DR2
- MC33164P-005
- MC33275ST-3.3T3G
- MC33897CTEFR2
- MC33163DWR2G
- MC33063AQDRQ1