MC33662LEF 封装和模型
品牌：NXP
描述：Transceiver, Physical Layer, LIN 2.1 / SAEJ2602-2, 20kbps,TX/RX symmetry, SOIC 8, Rail
EDA/CDA模型
原理图符号
PCB 封装图
其他器件
- MC33375ST-2.5T3G
- MC33074ADTBR2G
- MC33342PG
- MC33063ADE4
- MC33166D2T
- MC33272ADG
- MC33375ST-1.8T3G
- MC33911BAC
- MC33269DT-012
- MC33164P-5RPG
- MC33275D-3.0R2G
- MC33202VDR2G
- MC33275D-5.0G
- MC33262DR2G
- MC33201VDG
- MC33063ADRG4
- MC33067DWR2
- MC33166TVG
- MC33364D1R2
- MC33064SN-5T1G
- MC33071DR2G
- MC33174DR2G
- MC33164D-3G
- MC33171PG
- MC33269DTRK-5.0G
- MC33298DW
- MC33078DGKRG4
- MC33201DR2G
- MC33762DM-2525R2
- MC33078DR2G
- MC33275DT-3.3RKG
- MC33174N
- MC33364D
- MC33269D-5.0G
- MC33269DR2-3.3G
- MC33CD1030AE
- MC33375D-2.5G
- MC33063APE4
- MC33PF8100EPES
- MC33364D2R2G
- MC33275MN-3.0R2G
- MC33364DR2
- MC33151VDR2G
- MC33HB2000EK
- MC3303DG
- MC33179DTBR2G
- MC33762DM-3030RG
- MC33275DT-2.5G
- MC33164P-3G
- MC33171DR2G