MC33PF8100EPES 封装和模型
品牌：NXP
描述：12-channel power management integrated circuit for high performance applications
EDA/CDA模型
原理图符号
PCB 封装图
其他器件
- MC33035DWG
- MC33072DR2G
- MC33164P-5RPG
- MC33364D1R2G
- MC33074ADR2G
- MC33975TEK
- MC33164P-5RAG
- MC33025PG
- MC33063ADRE4
- MC33269DT-012G
- MC33164D-5G
- MC33364D2G
- MC33172DT
- MC33269DT-3.3G
- MC33275MN-5.0R2
- MC33897CTEF
- MC33269DR2G
- MC33178DMR2G
- MC33285D
- MC33886PVW
- MC33580BAPNAR2
- MC33275DT-5.0G
- MC33907NAE
- MC33375D-5.0R2G
- MC33975ATEK
- MC33063APE4
- MC33074ADTBR2G
- MC33174DR2G
- MC33166D2T
- MC33151VDR2G
- MC33152DR2G
- MC33063AP1G
- MC3303PT
- MC33074ADG
- MC33153DG
- MC33064D-5R2G
- MC33275DT-3.3G
- MC33161DMR2G
- MC33275ST-2.5T3
- MC33887PEK
- MC33164D-5R2G
- MC33063ADR
- MC33269DTRK-5.0G
- MC33912G5ACR2
- MC33596FCER2
- MC33078DR2G
- MC33395DWB
- MC33030DWG
- MC33911BACR2
- MC33161DG