MC33912BAC 封装和模型
品牌：NXP
描述：System Basis Chip, LIN, 2x 5.0V/60&20mA LDOs, DC Motor Predriver, Isense, QFP 32, Tray
EDA/CDA模型
原理图符号
PCB 封装图
其他器件
- MC33152DG
- MC33269D-3.3
- MC33580BAPNA
- MC33364DR2
- MC33201VDR2G
- MC33HB2000EK
- MC33375ST-2.5T3
- MC33565DG
- MC33275ST-2.5T3G
- MC33269D-3.3G
- MC33164D-5R2G
- MC33342PG
- MC33164P-5G
- MC33772CTP1AE
- MC33202DR2G
- MC33363ADWR2
- MC33039DR2G
- MC33364D1G
- MC33907NAE
- MC33742PEPR2
- MC33912G5ACR2
- MC33762DM-3030RG
- MC33911BACR2
- MC33269DTG
- MC33269T-3.3G
- MC33375D-3.3G
- MC33275DT-5.0G
- MC33275MN-5.0R2
- MC33179DR2
- MC33064DM-5R2G
- MC33565DMR2
- MC33161DMR2G
- MC33972TEWR2
- MC33910G5AC
- MC33364D2R2
- MC33064D-5G
- MC33PF8200A0ES
- MC33275DT-2.5G
- MC33269DR2G
- MC33HB2000AES
- MC33978AES
- MC33030DWG
- MC33285D
- MC33071DR2G
- MC33152VDR2G
- MC33274ADTBR2G
- MC33364D2R2G
- MC33931EKR2
- MC33166TG
- MC33926PNB