MC33912G5ACR2 封装和模型
品牌：NXP
描述：System Basis Chip, LIN, 2x 5.0V/60&20mA LDOs, DC Motor Predriver, Isense, Enhanced EMC, QFP 32, Reel
EDA/CDA模型
原理图符号
PCB 封装图
其他器件
- MC33064D-5R2G
- MC33887PEK
- MC33662LEF
- MC33166TG
- MC33364D1G
- MC33272ADG
- MC33911G5ACR2
- MC33151DG
- MC33166D2TG
- MC33164DM-3R2G
- MC33911BAC
- MC33152PG
- MC33074ADG
- MC33166D2TR4G
- MC33202VDR2G
- MC33978AEKR2
- MC33565DR2G
- MC33364DR2
- MC33151DR2G
- MC33596FCER2
- MC33172DR2G
- MC33275ST-2.5T3
- MC33275ST-3.3T3G
- MC33063ADR
- MC33772CTP1AE
- MC33152VDR2G
- MC33742PEPR2
- MC33975TEK
- MC33298DW
- MC33164P-5G
- MC33FS6522LAE
- MC33908NAE
- MC33166TVG
- MC33275MN-2.5R2G
- MC33060APG
- MC33275D-3.0G
- MC33972TEWR2
- MC33166D2T
- MC33882PVW
- MC33972ATEKR2
- MC33364D2G
- MC33269DR2-3.3G
- MC33269D-3.3G
- MC33174N
- MC33179DR2G
- MC33166D2TR4
- MC33151VDR2G
- MC33275DT-3.3RKG
- MC33580BAPNAR2
- MC33926PNBR2