MC33912G5ACR2 封装和模型
品牌：NXP
描述：System Basis Chip, LIN, 2x 5.0V/60&20mA LDOs, DC Motor Predriver, Isense, Enhanced EMC, QFP 32, Reel
EDA/CDA模型
原理图符号
PCB 封装图
3D模型
其他器件
- MC33275ST-3.0T3G
- MC33072ADG
- MC33064P-5RA
- MC33063AP
- MC33262DR2G
- MC33375ST-5.0T3
- MC33275D-5.0R2G
- MC33174N
- MC33375D-3.3R2G
- MC33364DR2
- MC33164D-3R2G
- MC33064P-5RPG
- MC33912G5ACR2
- MC33030DW
- MC33269D-3.3G
- MC33908NAE
- MC33887PEK
- MC33164D-5R2G
- MC33972ATEWR2
- MC33152DG
- MC33063ADRE4
- MC33375ST-2.5T3
- MC33179DTBR2G
- MC33063ADRJRG4
- MC33PF8200A0ES
- MC33285D
- MC33886PVWR2
- MC33269T-5.0G
- MC33269D-3.3
- MC33152PG
- MC33063AP1
- MC33298DWR2
- MC33067DW
- MC33762DM-3030R2
- MC33064P-5RAG
- MC33164P-5RA
- MC33179DR2G
- MC33064D-5R2G
- MC33911BAC
- MC33269DTG
- MC33269DTRKG
- MC33151VDR2G
- MC33911G5ACR2
- MC33063AVDR2G
- MC33978AEKR2
- MC33HB2000FK
- MC33172DT
- MC33364D1R2
- MC33814AE
- MC33269DR2-5.0G