MC33PF8200DBES 封装和模型
品牌：NXP
描述：12-channel power management integrated circuit for high performance applications
EDA/CDA模型
原理图符号
PCB 封装图
其他器件
- MC33911BACR2
- MC33CD1030AE
- MC33269DR2-3.3G
- MC33762DM-2525R2
- MC33067DWR2G
- MC33269T-5.0
- MC33886PVWR2
- MC33742PEGR2
- MC33395TEWR2
- MC33153DR2G
- MC33886VW
- MC33269T-5.0G
- MC33166D2TR4
- MC33364D1G
- MC33375D-5.0R2G
- MC33HB2000EK
- MC33171DT
- MC33178DMR2G
- MC33761SNT1-050G
- MC33063AD
- MC33897CTEF
- MC33152PG
- MC33064D-5G
- MC33161DG
- MC33025DWG
- MC33972ATEW
- MC33074ADTBR2G
- MC33882PEP
- MC33275MN-3.3R2G
- MC33275MN-5.0R2
- MC33275DT-2.5G
- MC33364D1R2G
- MC33269D-3.3G
- MC33074ADG
- MC33064P-5RPG
- MC33364D2G
- MC33375ST-5.0T3
- MC33363ADWR2
- MC33908NAE
- MC33FS6522LAE
- MC33202DR2G
- MC33074DR2G
- MC33269DT-3.3G
- MC33298DWR2
- MC33164DM-3R2G
- MC33166D2TG
- MC33275MN-2.5R2G
- MC33375ST-1.8T3G
- MC33164P-5RAG
- MC33164D-5G