MC33PF8200DBES 封装和模型
品牌：NXP
描述：12-channel power management integrated circuit for high performance applications
EDA/CDA模型
原理图符号
PCB 封装图
其他器件
- MC33762DM-3030RG
- MC33063AP1G
- MC33063ADRG4
- MC33FS6522LAE
- MC33931VW
- MC33201VD
- MC33269DT-3.3G
- MC33664ATL1EG
- MC33275DT-3.0G
- MC33030DWG
- MC33164P-5RAG
- MC33064SN-5T1G
- MC33174DG
- MC33064P-5RP
- MC33178DMR2G
- MC33152PG
- MC33364DR2G
- MC33161DR2G
- MC33932VW
- MC33269DTRK-3.3G
- MC33364D
- MC33364D1R2
- MC33912BAC
- MC33975ATEK
- MC33911BACR2
- MC33269D-3.3
- MC33166TVG
- MC33269DR2-5.0G
- MC33060APG
- MC33064P-5RA
- MC33064P-5G
- MC33275D-3.0R2G
- MC33174DT
- MC33275MN-2.5R2G
- MC33886VW
- MC33166D2TR4G
- MC33171DT
- MC33886PVWR2
- MC33926PNB
- MC33153PG
- MC3302DR2G
- MC33363APG
- MC33288DDHR2
- MC33202DG
- MC33164P-5RP
- MC33275MN-3.3R2G
- MC33911G5AC
- MC33375ST-3.3T3G
- MC33063ADRJR
- MC33152DR2G