AD9573-EVALZ [ADI]
PCI-Express Clock Generator IC, PLL Core, Dividers, Two Outputs; PCI - Express时钟发生器IC ， PLL内核，分频器，两路输出
| 型号： | AD9573-EVALZ |
| 厂家： | 
ADI |
| 描述： | PCI-Express Clock Generator IC, PLL Core, Dividers, Two Outputs |
| 文件： | 总12页 (文件大小：279K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PCI-Express Clock Generator IC,
PLL Core, Dividers, Two Outputs
AD9573
FEATURES
GENERAL DESCRIPTION
Fully integrated VCO/PLL core
0.54 ps rms jitter from 12 kHz to 20 MHz
Input crystal frequency of 25 MHz
Preset divide ratios for 100 MHz, 33.33 MHz
LVDS/LVCMOS output format
Integrated loop filter
Space saving 4.4 mm × 5.0 mm TSSOP
0.235 W power dissipation
3.3 V operation
The AD9573 provides a highly integrated, dual output clock
generator function including an on-chip PLL core that is
optimized for PCI-e applications. The integer-N PLL design
is based on the Analog Devices, Inc., proven portfolio of high
performance, low jitter frequency synthesizers to maximize line
card performance. Other applications with demanding phase
noise and jitter requirements also benefit from this part.
The PLL section consists of a low noise phase frequency
detector (PFD), a precision charge pump, a low phase noise
voltage controlled oscillator (VCO), and a preprogrammed
feedback divider and output divider.
APPLICATIONS
Line cards, switches, and routers
CPU/PCIe applications
Low jitter, low phase noise clock generation
By connecting an external 25 MHz crystal, output frequencies
of 100 MHz and 33.33 MHz can be locked to the input reference.
The output divider and feedback divider ratios are prepro-
grammed for the required output rates. No external loop filter
components are required, thus conserving valuable design time
and board space.
The AD9573 is available in a 16-lead 4.4 mm × 5.0 mm TSSOP
and can be operated from a single 3.3 V supply. The temperature
range is −40°C to +85°C.
FUNCTIONAL BLOCK DIAGRAM
VDD × 5
LDO
VCO
LVDS
100MHz
XTAL
OSC
LVCMOS
33.33MHz
AD9573
GND × 5
OE
Figure 1.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2009 Analog Devices, Inc. All rights reserved.
AD9573
TABLE OF CONTENTS
Features .............................................................................................. 1
ESD Caution...................................................................................5
Pin Configuration and Function Descriptions..............................6
Typical Performance Characteristics ..............................................7
Terminology.......................................................................................8
Theory of Operation .........................................................................9
Outputs ...........................................................................................9
Phase Frequency Detector (PFD) and Charge Pump ..........9
Power Supply..................................................................................9
LVDS Clock Distribution.......................................................... 10
CMOS Clock Distribution ........................................................ 10
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
PLL Characteristics ...................................................................... 3
Clock Output Jitter....................................................................... 3
Clock Outputs............................................................................... 3
Timing Characteristics ................................................................ 4
Control Pins .................................................................................. 4
Power.............................................................................................. 4
Crystal Oscillator.......................................................................... 4
Timing Diagrams.......................................................................... 4
Absolute Maximum Ratings............................................................ 5
Thermal Resistance ...................................................................... 5
Power and Grounding Considerations and Power Supply
Rejection...................................................................................... 10
Outline Dimensions....................................................................... 11
Ordering Guide .......................................................................... 11
REVISION HISTORY
7/09—Revision 0: Initial Version
Rev. 0 | Page 2 of 12
AD9573
SPECIFICATIONS
Typical (typ) is given for VDD = 3.3 V 10ꢀ, TA = 25°C, unless otherwise noted. Minimum (min) and maximum (max) values are given
over full VDD and TA (−40°C to +85°C) variation.
PLL CHARACTERISTICS
Table 1.
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
NOISE CHARACTERISTICS
PLL Noise (100 MHz Output)
@ 1 kHz
@ 10 kHz
@ 100 kHz
@ 1 MHz
@ 10 MHz
@ 30 MHz
−121
−128
−131
−144
−150
−151
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
PLL Noise (33.33 MHz Output)
@ 1 kHz
@ 10 kHz
@ 100 kHz
@ 1 MHz
@ 5 MHz
Spurious Content
PLL Figure of Merit
−131
−137
−140
−150
−151
−70
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc
−217.5
dBc/Hz
CLOCK OUTPUT JITTER
Table 2.
Parameter
Min
Min
Typ
Max
Max
Unit
Test Conditions/Comments
LVDS OUTPUT ABSOLUTE TIME JITTER
RMS Jitter (100 MHz Output)
540
fsec
12 kHz to 20 MHz
CLOCK OUTPUTS
Table 3.
Parameter
Typ
Unit
Test Conditions/Comments
LVDS CLOCK OUTPUT
Output Frequency
Differential Output Voltage (VOD)
Delta VOD
Output Offset Voltage (VOS)
Delta VOS
Termination = 100 Ω differential
100
700
25
1.375
25
MHz
mV
mV
V
mV
mA
%
500
640
1.25
14
1.125
Short-Circuit Current (ISA, ISB)
Duty Cycle
24
55
Output shorted to GND
45
LVCMOS CLOCK OUTPUT
Output Frequency
Output High Voltage (VOH)
Output Low Voltage (VOL)
Duty Cycle
33.33
MHz
V
V
VS − 0.1
45
Sourcing 1.0 mA current
Sinking 1.0 mA current
0.1
55
%
Rev. 0 | Page 3 of 12
AD9573
TIMING CHARACTERISTICS
Table 4.
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
Termination = 100 Ω differential; CLOAD = 0 pF
20% to 80%, measured differentially
80% to 20%, measured differentially
Termination = open
LVDS
Output Rise Time, tRL
Output Fall Time, tFL
LVCMOS
140
140
200
200
260
260
ps
ps
Output Rise Time, tRC
Output Fall Time, tFC
0.25
0.25
0.60
0.80
2.5
2.5
ns
ns
20% to 80%; CLOAD = 5 pF
80% to 20%; CLOAD = 5 pF
CONTROL PINS
Table 5.
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
INPUT CHARACTERISTICS
OE Pin
OE has a 50 kΩ pull-down resistor.
Logic 1 Voltage
Logic 0 Voltage
Logic 1 Current
Logic 0 Current
2.5
V
V
μA
μA
0.8
120
1.0
POWER
Table 6.
Parameter
Min
Typ
3.3
235
Max
3.6
285
Unit
V
mW
Test Conditions/Comments
Power Supply
Power Dissipation
3.0
CRYSTAL OSCILLATOR
Table 7.
Parameter
CRYSTAL SPECIFICATION
Frequency
Min
Typ
Max
40
Unit
Test Conditions/Comments
Parallel resonant/fundamental mode
25
MHz
Ω
ESR
Load Capacitance
Phase Noise
Stability
18
−138
pF
dBc/Hz
ppm
@ 1 kHz offset
−30
+30
TIMING DIAGRAMS
DIFFERENTIAL
SIGNAL
SINGLE-ENDED
80%
80%
V
OD
50%
20%
CMOS
5pF LOAD
20%
tRL
tFL
tRC
tFC
Figure 3. LVCMOS Timing
Figure 2. LVDS Timing, Differential
Rev. 0 | Page 4 of 12
AD9573
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 8.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Thermal impedance measurements were taken on a 4-layer
board in still air in accordance with EIA/JESD51-7.
Parameter
Rating
VDD, VDDA, VDDX, and VDD33 to GND
XO1, XO2 to GND
−0.3 V to +3.6 V
−0.3 V to VS + 0.3 V
−0.3 V to VS + 0.3 V
150°C
−65°C to +150°C
300°C
100M, 100M, 33M to GND
Junction Temperature1
Storage Temperature Range
Lead Temperature (10 sec)
1 See Table 9 for θJA.
Table 9. Thermal Resistance
Package Type
θJA
Unit
16-Lead TSSOP
90.3
°C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
AD9573
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GNDA
VDDA
VDDX
XO1
OE
0.1µF
1nF
VS
GND
100M
100M
VDD
VS
50Ω
50Ω
R
100Ω
=
T
Cx
0.1µF
0.1µF
VS
XO2
Cx
VS
VDD33
33M
GNDX
GNDA
VDDA
0.1µF
0.1µF
VS
CRYSTAL:
KYOCERA CX-49G
Cx = 33pF
GND33
Figure 4. Typical Application
Rev. 0 | Page 5 of 12
AD9573
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
GNDA
VDDA
VDDX
XO1
OE
GND
100M
100M
VDD
AD9573
TOP VIEW
(Not to Scale)
XO2
GNDX
GNDA
VDDA
VDD33
33M
GND33
Figure 5. Pin Configuration
Table 10. Pin Function Descriptions
Pin No.
1, 7
2, 8
3
4, 5
6
9
10
11
12
Mnemonic
GNDA
VDDA
VDDX
XO1, XO2
GNDX
GND33
33M
Description
Analog Ground.
Analog Power Supply (3.3 V).
Crystal Oscillator Power Supply.
External 25 MHz Crystal.
Crystal Oscillator Ground.
Ground for LVCMOS Output.
LVCMOS Output at 33.33 MHz.
Power Supply for LVCMOS Output.
Power Supply for LVDS Output.
Complementary LVDS Output at 100 MHz.
LVDS Output at 100 MHz.
VDD33
VDD
100M
13
14
100M
15
GND
Ground for LVDS Output.
16
OE
Output Enable (Active Low). Places both outputs in a high impedance state when high. This pin has a 50 kΩ
internal pull-down resistor.
Rev. 0 | Page 6 of 12
AD9573
TYPICAL PERFORMANCE CHARACTERISTICS
–115
–120
–125
–130
–135
–140
–145
–150
–155
–120
–130
–140
–150
–160
1k
10k
100k
1M
10M
100M
1k
10k
100k
1M
10M
100M
FREQUENCY OFFSET (Hz)
FREQUENCY OFFSET (Hz)
Figure 6. 100 MHz Phase Noise
Figure 7. 33.33 MHz Phase Noise
Rev. 0 | Page 7 of 12
AD9573
TERMINOLOGY
Phase Jitter
Time Jitter
An ideal sine wave can be thought of as having a continuous
and even progression of phase with time from 0 degrees to
360 degrees for each cycle. Actual signals, however, display a
certain amount of variation from ideal phase progression over
time. This phenomenon is called phase jitter. Although many
causes can contribute to phase jitter, one major cause is random
noise, which is characterized statistically as gaussian (normal)
in distribution.
Phase noise is a frequency domain phenomenon. In the time
domain, the same effect is exhibited as time jitter. When observing
a sine wave, the time of successive zero crossings is seen to vary.
In a square wave, the time jitter is seen as a displacement of the
edges from their ideal (regular) times of occurrence. In both
cases, the variations in timing from the ideal are the time jitter.
Because these variations are random in nature, the time jitter is
specified in units of seconds root mean square (rms) or 1 sigma
of the gaussian distribution.
This phase jitter leads to a spreading out of the energy of the
sine wave in the frequency domain, producing a continuous
power spectrum. This power spectrum is usually reported as
a series of values whose units are dBc/Hz at a given offset in
frequency from the sine wave (carrier). The value is a ratio
(expressed in dB) of the power contained within a 1 Hz
bandwidth with respect to the power at the carrier frequency.
For each measurement, the offset from the carrier frequency is
also given.
Additive Phase Noise
Additive phase noise is the amount of phase noise that is
attributable to the device or subsystem being measured. The
phase noise of any external oscillators or clock sources has been
subtracted. This makes it possible to predict the degree to which
the device impacts the total system phase noise when used in
conjunction with the various oscillators and clock sources, each
of which contributes its own phase noise to the total. In many
cases, the phase noise of one element dominates the system
phase noise.
Phase Noise
When the total power contained within some interval of offset
frequencies (for example, 12 kHz to 20 MHz) is integrated, it is
called the integrated phase noise over that frequency offset
interval, and it can be readily related to the time jitter due to the
phase noise within that offset frequency interval.
Additive Time Jitter
Additive time jitter is the amount of time jitter that is
attributable to the device or subsystem being measured. The
time jitter of any external oscillators or clock sources has been
subtracted. This makes it possible to predict the degree to which
the device impacts the total system time jitter when used in
conjunction with the various oscillators and clock sources, each
of which contributes its own time jitter to the total. In many
cases, the time jitter of the external oscillators and clock sources
dominates the system time jitter.
Phase noise has a detrimental effect on error rate performance
by increasing eye closure at the transmitter output and reducing
the jitter tolerance/sensitivity of the receiver.
Rev. 0 | Page 8 of 12
AD9573
THEORY OF OPERATION
VDD, GND,
VDD33 GND33
VDDA GNDA
VDDA GNDA
CMOS
33.33MHz
PHASE
FREQUENCY
DETECTOR
XTAL
OSC
DIVIDE
BY 4
DIVIDE
BY 3
33M
OE
LDO
100M
100M
CHARGE
PUMP
DIVIDE
BY 25
LVDS
100MHz
2.5GHz
VCO
AD9573
V
LDO
Figure 8. Detailed Block Diagram
Figure 8 shows a block diagram of the AD9573. The chip
features a PLL core, which is configured to generate the specific
clock frequencies required for PCI-express, without any user
programming. This PLL is based on proven Analog Devices
synthesizer technology, noted for its exceptional phase noise
performance. The AD9573 is highly integrated and includes the
loop filter, a regulator for supply noise immunity, all the
necessary dividers, output buffers, and a crystal oscillator. A
user need only supply a 25 MHz external crystal to implement
an entire PCIe clocking solution, which does not require any
processor intervention.
Table 12. Output Enable Pin Function
OE State
Output State
Enabled
High impedance
0
1
Phase Frequency Detector (PFD) and Charge Pump
The PFD takes inputs from the reference clock and feedback
divider to produce an output proportional to the phase and
frequency difference between them. Figure 10 shows a
simplified schematic.
3.3V
CHARGE
PUMP
OUTPUTS
UP
HIGH
D1 Q1
CLR1
Table 11 provides a summary of the outputs available.
REFCLK
Table 11. Output Formats
Frequency
Format
LVDS
LVCMOS
Copies
CP
100 MHz
33.33 MHz
1
1
The simplified equivalent circuit of the LVDS output is shown
in Figure 9. The 100 MHz output is described as LVDS because
it uses an LVDS driver topology. However, the levels are HCSL
compatible, and therefore do not meet the LVDS standard. The
output current has been increased to provide a larger output
swing than standard LVDS.
CLR2
D2 Q2
DOWN
HIGH
FEEDBACK
DIVIDER
GND
Figure 10. PFD Simplified Schematic and Timing (in Lock)
POWER SUPPLY
6.5mA
The AD9573 requires a 3.3 V 10ꢀ power supply for VDD.
The tables in the Specifications section give the performance
expected from the AD9573 with the power supply voltage
within this range. The absolute maximum range of (−0.3 V) −
(+3.6 V), with respect to GND, must never be exceeded on
the VDD or VDDA pins.
OUT
OUTB
6.5mA
Good engineering practice should be followed in the layout of
power supply traces and the ground plane of the PCB. The
power supply should be bypassed on the PCB with adequate
capacitance (>10 μF). The AD9573 should be decoupled with
adequate capacitors (0.1 μF) at all power pins as close as
possible to these power pins. The layout of the AD9573
Figure 9. LVDS Output Simplified Equivalent Circuit
Both outputs can be placed in a high impedance state by
pin according to Table 12. This pin has
a 50 kΩ pull-down resistor.
OE
connecting the
Rev. 0 | Page 9 of 12
AD9573
evaluation board shows a good example (see the Ordering
Guide for information about the evaluation board).
outputs are limited in terms of the capacitive load or trace
length that they can drive. Typically, trace lengths less than
6 inches are recommended to preserve signal rise/fall times
and preserve signal integrity.
LVDS CLOCK DISTRIBUTION
Low voltage differential signaling (LVDS) is the differential
output for the AD9573. LVDS uses a current mode output stage
with a factory programmed current level. The normal value
(default) for this current is 6.5 mA, which yields a 650 mV
output swing across a 100 Ω resistor.
60.4Ω
1.0 INCH
10Ω
CMOS
MICROSTRIP
5pF
GND
The typical termination circuit for the LVDS outputs is shown
in Figure 11.
Figure 13. Series Termination of CMOS Output
Termination at the far end of the PCB trace is a second option.
The CMOS output of the AD9573 does not supply enough
current to provide a full voltage swing with a low impedance
resistive, far end termination, as shown in Figure 14. The far
end termination network should match the PCB trace
impedance and provide the desired switching point.
50Ω
100Ω
LVDS
LVDS
50Ω
Figure 11. LVDS Output Termination
An alternative method of terminating the output to preserve output
swing but also minimize reflections is shown in Figure 12.
The reduced signal swing may still meet receiver input require-
ments in some applications. This can be useful when driving
long trace lengths on less critical nets.
50Ω
200Ω
200Ω
LVDS
LVDS
V
= 3.3V
PULLUP
50Ω
100Ω
50Ω
Figure 12. Alternative LVDS Output Termination
10Ω
CMOS
3pF
100Ω
CMOS CLOCK DISTRIBUTION
The AD9573 provides a 33.33 MHz clock output, which is a
dedicated CMOS level. Whenever single-ended CMOS clocking
is used, some of the following general guidelines should be
followed.
Figure 14. CMOS Output with Far-End Termination
POWER AND GROUNDING CONSIDERATIONS AND
POWER SUPPLY REJECTION
Point-to-point nets should be designed such that a driver has
one receiver only on the net, if possible. This allows for simple
termination schemes and minimizes ringing due to possible
mismatched impedances on the net. Series termination at the
source is generally required to provide transmission line
matching and/or to reduce current transients at the driver. The
value of the resistor is dependent on the board design and
timing requirements (typically 10 Ω to 100 Ω is used). CMOS
Many applications seek high speed and performance under
less than ideal operating conditions. In these application
circuits, the implementation and construction of the PCB is as
important as the circuit design. Proper RF techniques must be
used for device selection, placement, and routing, as well as for
power supply decoupling and grounding to ensure optimum
performance.
Rev. 0 | Page 10 of 12
AD9573
OUTLINE DIMENSIONS
5.10
5.00
4.90
16
9
8
4.50
4.40
4.30
6.40
BSC
1
PIN 1
1.20
MAX
0.15
0.05
0.20
0.09
0.75
0.60
0.45
8°
0°
0.30
0.19
0.65
BSC
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 15. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
RU-16
AD9573ARUZ1
AD9573-EVALZ1
−40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
Evaluation Board
1 Z = RoHS Compliant Part.
Rev. 0 | Page 11 of 12
AD9573
NOTES
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07500-0-7/09(0)
Rev. 0 | Page 12 of 12
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