ADF4106BRUZ-REEL [ADI]
PLL FREQUENCY SYNTHESIZER, 6000MHz, PDSO16, MO-153AB, TSSOP-16;
| 型号： | ADF4106BRUZ-REEL |
| 厂家： | 
ADI |
| 描述： | PLL FREQUENCY SYNTHESIZER, 6000MHz, PDSO16, MO-153AB, TSSOP-16 光电二极管 |
| 文件： | 总20页 (文件大小：279K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PLL Frequency Synthesizer
ADF4106
FEATURES
GENERAL DESCRIPTION
6.0 GHz Bandwidth
2.7 V to 3.3 V Power Supply
The ADF4106 frequency synthesizer can be used to implement
local oscillators in the upconversion and downconversion sections
of wireless receivers and transmitters. It consists of a low noise
digital PFD (phase frequency detector), a precision charge pump,
a programmable reference divider, programmable A and B
counters, and a dual-modulus prescaler (P/P + 1). The A (6-bit)
and B (13-bit) counters, in conjunction with the dual-modulus
prescaler (P/P + 1), implement an N divider (N = BP + A). In
addition, the 14-bit reference counter (R counter) allows selectable
REFIN frequencies at the PFD input. A complete PLL (phase-
locked loop) can be implemented if the synthesizer is used with
an external loop filter and VCO (voltage controlled oscillator).
Its very high bandwidth means that frequency doublers can be
eliminated in many high frequency systems, simplifying system
architecture and lowering cost.
Separate Charge Pump Supply (VP) Allows Extended
Tuning Voltage in 3 V Systems
Programmable Dual-Modulus Prescaler
8/9, 16/17, 32/33, 64/65
Programmable Charge Pump Currents
Programmable Antibacklash Pulsewidth
3-Wire Serial Interface
Analog and Digital Lock Detect
Hardware and Software Power-Down Modes
APPLICATIONS
Broadband Wireless Access
Instrumentation
Wireless LANs
Base Stations for Wireless Radio
FUNCTIONAL BLOCK DIAGRAM
AV
V
P
DV
DD
CPGND
R
SET
DD
REFERENCE
14-BIT
R COUNTER
REF
IN
PHASE
FREQUENCY
DETECTOR
CHARGE
PUMP
CP
14
R COUNTER
LATCH
LOCK
DETECT
CURRENT
SETTING 1
CURRENT
SETTING 2
CLK
DATA
LE
24-BIT INPUT
REGISTER
FUNCTION
LATCH
CPI3 CPI2 CPI1
CPI6 CPI5 CPI4
HIGH Z
22
AB COUNTER
LATCH
FROM
FUNCTION
LATCH
19
AV
DD
MUXOUT
MUX
13
SD
OUT
N = BP + A
13-BIT
B COUNTER
LOAD
M3 M2 M1
RF
A
B
IN
PRESCALER
P/P + 1
RF
IN
LOAD
6-BIT
A COUNTER
ADF4106
6
CE
AGND DGND
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, norforanyinfringementsofpatentsorotherrightsofthirdpartiesthat
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective companies.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
Fax: 781/326-8703
www.analog.com
© 2003 Analog Devices, Inc. All rights reserved.
(AVDD = DVDD = 3 V ꢀ 10%; AVDD ≤ VP ≤ 5.5 V; AGND = DGND = CPGND = 0 V;
RSET = 5.1 kꢁ; dBm referred to 50 ꢁ; TA = TMIN to TMAX, unless otherwise noted.)
ADF4106–SPECIFICATIONS1
BChips2
B Version1 (Typ)
Parameter
Unit
Test Conditions/Comments
RF CHARACTERISTICS
RF Input Frequency (RFIN)3
RF Input Sensitivity
See Figure 3 for Input Circuit
0.5/6.0
–10/0
0.5/6.0
–10/0
GHz min/max
dBm min/max
Maximum Allowable
Prescaler Output Frequency4
300
300
MHz max
REFIN CHARACTERISTICS
REFIN Input Frequency
20/250
20/250
MHz min/max For f < 20 MHz, Use DC-Coupled
Square Wave (0 to VDD
)
REFIN Input Sensitivity5
0.8/AVDD
0.8/AVDD V p-p min/max AC-Coupled; When DC-Coupled,
0 to VDD max (CMOS Compatible)
REFIN Input Capacitance
REFIN Input Current
10
100
10
100
pF max
µA max
PHASE DETECTOR
Phase Detector Frequency6
56
56
MHz max
CHARGE PUMP
I
CP Sink/Source
High Value
Low Value
Absolute Accuracy
RSET Range
Programmable, See Table V
With RSET = 5.1 kΩ
5
5
mA typ
µA typ
% typ
kΩ typ
nA typ
% typ
% typ
% typ
625
2.5
2.7/10
1
2
1.5
2
625
2.5
2.7/10
1
2
1.5
2
With RSET = 5.1 kΩ
See Table V
ICP Three-State Leakage Current
Sink and Source Current Matching
ICP vs. VCP
0.5 V Յ VCP Յ VP – 0.5 V
0.5 V Յ VCP Յ VP – 0.5 V
VCP = VP/2
ICP vs. Temperature
LOGIC INPUTS
VINH, Input High Voltage
VINL, Input Low Voltage
1.4
0.6
1
1.4
0.6
1
V min
V max
µA max
pF max
I
INH/IINL, Input Current
CIN, Input Capacitance
10
10
LOGIC OUTPUTS
VOH, Output High Voltage
1.4
1.4
V min
Open-Drain Output Chosen 1 kΩ
Pull-up to 1.8 V
VOH, Output High Voltage
IOH
VOL, Output Low Voltage
VDD – 0.4
100
0.4
VDD – 0.4
100
0.4
V min
µA max
V max
CMOS Output Chosen
IOL = 500 µA
POWER SUPPLIES
AVDD
DVDD
VP
2.7/3.3
AVDD
AVDD/5.5
15
0.4
10
2.7/3.3
AVDD
AVDD/5.5 V min/V max
13
0.4
10
V min/V max
AVDD Յ VP Յ 5.5 V
13 mA typ
TA = 25°C
IDD7 (AIDD + DIDD
IP
)
mA max
mA max
µA typ
Power-Down Mode8 (AIDD + DIDD
)
–2–
REV. A
ADF4106
BChips2
B Version1 (Typ)
Parameter
Unit
Test Conditions/Comments
NOISE CHARACTERISTICS
ADF4106 Phase Noise Floor9
–174
–166
–159
–174
–166
–159
dBc/Hz typ
dBc/Hz typ
dBc/Hz typ
@ 25 kHz PFD Frequency
@ 200 kHz PFD Frequency
@ 1 MHz PFD Frequency
@ VCO Output
@ 1 kHz Offset and 200 kHz PFD Frequency
@ 1 kHz Offset and 200 kHz PFD Frequency
@ 1 kHz Offset and 1 MHz PFD Frequency
Phase Noise Performance10
900 MHz Output11
5800 MHz Output12
5800 MHz Output13
Spurious Signals
–93
–74
–84
–93
–74
–84
dBc/Hz typ
dBc/Hz typ
dBc/Hz typ
900 MHz Output11
5800 MHz Output12
5800 MHz Output13
–90/–92
–65/–70
–70/–75
–90/–92
–65/–70
–70/–75
dBc typ
dBc typ
dBc typ
@ 200 kHz/400 kHz and 200 kHz PFD Frequency
@ 200 kHz/400 kHz and 200 kHz PFD Frequency
@ 1 MHz/2 MHz and 1 MHz PFD Frequency
NOTES
1Operating temperature range (B Version) is –40°C to +85°C.
2The BChip specifications are given as typical values.
3Use a square wave for lower frequencies, below the mimimum stated.
4The maximum operating frequency of the CMOS counters. The prescaler value should be chosen to ensure that the RF input is divided down to a frequency
that is less than this value.
5AVDD = DVDD = 3 V.
6Guaranteed by design. Sample tested to ensure compliance.
7TA = 25°C; AVDD = DVDD = 3 V; P = 16; RFIN = 6.0 GHz.
8TA = 25°C; AVDD = DVDD = 3.3 V; R = 16383; A = 63; B = 891; P = 32; RFIN = 6.0 GHz.
9The synthesizer phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20logN (where N is the N divider value).
10The phase noise is measured with the EVAL-ADF4106EB1 evaluation board and the HP8562E spectrum analyzer. The spectrum analyzer provides the REF IN for
the synthesizer (fREFOUT = 10 MHz @ 0 dBm).
11
f
f
f
= 10 MHz; fPFD = 200 kHz; Offset Frequency = 1 kHz; fRF = 900 MHz; N = 4500; Loop B/W = 20 kHz.
= 10 MHz; fPFD = 200 kHz; Offset Frequency = 1 kHz; fRF = 5800 MHz; N = 29000; Loop B/W = 20 kHz.
= 10 MHz; fPFD = 1 MHz; Offset Frequency = 1 kHz; fRF = 5800 MHz; N = 5800; Loop B/W = 100 kHz.
REFIN
REFIN
REFIN
12
13
Specifications subject to change without notice.
(AVDD = DVDD = 3 V ꢂ 10%; AVDD ≤ VP ≤ 5.5 V; AGND = DGND = CPGND = 0 V; RSET = 5.1 kꢁ;
TA = TMIN to TMAX, unless otherwise noted.)
TIMING CHARACTERISTICS
Limit at
TMIN to TMAX
(B Version)
Parameter
Unit
Test Conditions/Comments
t1
t2
t3
t4
t5
t6
10
10
25
25
10
20
ns min
ns min
ns min
ns min
ns min
ns min
DATA to CLOCK Setup Time
DATA to CLOCK Hold Time
CLOCK High Duration
CLOCK Low Duration
CLOCK to LE Setup Time
LE Pulsewidth
NOTES
Guaranteed by design but not production tested.
Specifications subject to change without notice.
t
t
4
3
CLOCK
t
t
2
1
DB1 (CONTROL
BIT C2)
DB0 (LSB)
(CONTROL BIT C1)
DB2
DB23 (MSB)
DB22
DATA
t
6
LE
LE
t
5
Figure 1. Timing Diagram
–3–
REV. A
ADF4106
ABSOLUTE MAXIMUM RATINGS1, 2
(TA = 25°C, unless otherwise noted.)
LFCSP JA Thermal Impedance . . . . . . . . . . . . . . . . 122°C/W
Lead Temperature, Soldering
AVDD to GND3 . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +3.6 V
AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
VP to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.8 V
VP to AVDD . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.8 V
Digital I/O Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V
Analog I/O Voltage to GND . . . . . . . . . . –0.3 V to VP + 0.3 V
REFIN, RFINA, RFINB to GND . . . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . 150°C
TSSOP JA Thermal Impedance . . . . . . . . . . . . . . 150.4°C/W
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2 This device is a high performance RF integrated circuit with an ESD rating of
<2 kV, and it is ESD sensitive. Proper precautions should be taken for handling
and assembly.
3 GND = AGND = DGND = 0 V.
ORDERING GUIDE
Temperature Range
Model
Package Option*
ADF4106BRU
ADF4106BRU-REEL
ADF4106BRU-REEL7 –40°C to +85°C
ADF4106BCP
ADF4106BCP-REEL
ADF4106BCP-REEL7 –40°C to +85°C
EVAL-ADF4106EB1
–40°C to +85°C
–40°C to +85°C
RU-16
RU-16
RU-16
CP-20
CP-20
CP-20
–40°C to +85°C
–40°C to +85°C
*RU = Thin Shrink Small Outline Package (TSSOP).
CP = Lead Frame Chip Scale Package (LFCSP).
Contact the factory for chip availability.
Note that aluminum bond wire should not be used with the ADF4106 die.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADF4106 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
–4–
REV. A
ADF4106
PIN CONFIGURATIONS
TSSOP
LFCSP
1
2
3
4
5
6
7
8
16
V
R
P
SET
15 DV
CP
CPGND
AGND
DD
14
13
12
11
10
9
MUXOUT
PIN 1
15 MUXOUT
14 LE
13 DATA
12 CLK
11 CE
CPGND 1
AGND 2
AGND 3
INDICATOR
ADF4106
LE
TOP VIEW
ADF4106
TOP VIEW
DATA
CLK
CE
RF
B
(Not to Scale)
IN
IN
RF B 4
IN
RF A 5
IN
RF
A
AV
DD
DGND
REF
IN
NOTE: TRANSISTOR COUNT 6425 (CMOS), 303 (BIPOLAR)
PIN FUNCTION DESCRIPTIONS
Mnemonic
Function
RSET
Connecting a resistor between this pin and CPGND sets the maximum charge pump output current. The nominal
voltage potential at the RSET pin is 0.6 V. The relationship between ICP and RSET is
25.5
RSET
ICP MAX
So, with RSET = 5.1 kΩ, ICP MAX = 5 mA.
=
CP
Charge Pump Output. When enabled, this provides
external VCO.
ICP to the external loop filter, which in turn drives the
CPGND
AGND
RFINB
Charge Pump Ground. This is the ground return path for the charge pump.
Analog Ground. This is the ground return path of the prescaler.
Complementary Input to the RF Prescaler. This point must be decoupled to the ground plane with a small bypass
capacitor, typically 100 pF. See Figure 3.
RFINA
AVDD
Input to the RF Prescaler. This small signal input is ac-coupled to the external VCO.
Analog Power Supply. This may range from 2.7 V to 3.3 V. Decoupling capacitors to the analog ground plane
should be placed as close as possible to this pin. AVDD must be the same value as DVDD
.
REFIN
Reference Input. This is a CMOS input with a nominal threshold of VDD/2 and a dc equivalent input resistance of
100 kΩ. See Figure 2. This input can be driven from a TTL or CMOS crystal oscillator, or it can be ac-coupled.
DGND
CE
Digital Ground.
Chip Enable. A logic low on this pin powers down the device and puts the charge pump output into three-state
mode. Taking the pin high powers up the device, depending on the status of the power-down bit F2.
CLK
Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched into the
24-bit shift register on the CLK rising edge. This input is a high impedance CMOS input.
DATA
LE
Serial Data Input. The serial data is loaded MSB first with the 2 LSB being the control bits. This input is a
high impedance CMOS input.
Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one of the four
latches, the latch being selected using the control bits.
MUXOUT
DVDD
VP
This multiplexer output allows either the lock detect, the scaled RF, or the scaled reference frequency to be
accessed externally.
Digital Power Supply. This may range from 2.7 V to 3.3 V. Decoupling capacitors to the digital ground plane
should be placed as close as possible to this pin. DVDD must be the same value as AVDD
.
Charge Pump Power Supply. This should be greater than or equal to VDD. In systems where VDD is 3 V, it can be
set to 5 V and used to drive a VCO with a tuning range of up to 5 V.
REV. A
–5–
ADF4106–Typical Performance Characteristics
–40
–50
KEYWORD –
IMPEDANCE ꢁ
R
FREQ UNIT – GHz
PARAM TYPE –
10dB/DIV
= –40dBc/Hz
RMS NOISE = 0.36
– 50
S
DATA FORMAT – MA
R
L
FREQ MAGS11
0.500 0.89148
0.600 0.88133
0.700 0.87152
0.800 0.85855
0.900 0.84911
1.000 0.83512
1.100 0.82374
1.200 0.80871
1.300 0.79176
1.400 0.77205
1.500 0.75696
1.600 0.74234
1.700 0.72239
1.800 0.69419
1.900 0.67288
2.000 0.66227
2.100 0.64758
2.200 0.62454
2.300 0.59466
2.400 0.55932
2.500 0.52256
2.600 0.48754
2.700 0.46411
2.800 0.45776
2.900 0.44859
3.000 0.44588
3.100 0.43810
3.200 0.43269
ANGS11
–17.2820
–20.6919
–24.5386
–27.3228
–31.0698
–34.8623
–38.5574
–41.9093
–45.6990
–49.4185
–52.8898
–56.2923
–60.2584
–63.1446
–65.6464
–68.0742
–71.3530
–75.5658
–79.6404
–82.8246
–85.2795
–85.6298
–86.1854
–86.4997
–88.8080
–91.9737
–95.4087
–99.1282
FREQ MAGS11
3.300 0.42777
3.400 0.42859
3.500 0.43365
3.600 0.43849
3.700 0.44475
3.800 0.44800
3.900 0.45223
4.000 0.45555
4.100 0.45313
4.200 0.45622
4.300 0.45555
4.400 0.46108
4.500 0.45325
4.600 0.45054
4.700 0.45200
4.800 0.45043
4.900 0.45282
5.000 0.44287
5.100 0.44909
5.200 0.44294
5.300 0.44558
5.400 0.45417
5.500 0.46038
5.600 0.47128
5.700 0.47439
5.800 0.48604
5.900 0.50637
6.000 0.52172
ANGS11
–102.748
–107.167
–111.883
–117.548
–123.856
–130.399
–136.744
–142.766
–149.269
–154.884
–159.680
–164.916
–168.452
–173.462
–176.697
178.824
174.947
170.237
166.617
162.786
158.766
153.195
147.721
139.760
–60
–70
–80
–90
–100
–110
–120
–130
–140
132.657
125.782
121.110
115.400
100Hz
1MHz
FREQUENCY OFFSET FROM 900MHz CARRIER
TPC 1. S-Parameter Data for the RF Input
TPC 4. Integrated Phase Noise (900 MHz, 200 kHz,
and 20 kHz)
0
0
V
= 3V
REF LEVEL = –14.0dBm
DD
= 3V
V
= 3V, V = 5V
V
DD P
–10
–20
–30
–40
–50
–60
–70
–80
P
I
= 5mA
CP
–5
–10
–15
–20
–25
–30
PFD FREQUENCY = 200kHz
LOOP BANDWIDTH = 20kHz
RES BANDWIDTH = 1kHz
VIDEO BANDWIDTH = 1kHz
SWEEP = 2.5 SECONDS
AVERAGES = 30
T
= +85ꢃC
A
–91.0dBc/Hz
T
= +25ꢃC
A
–90
T
= –40ꢃC
A
–100
0
1
2
3
4
5
6
–400kHz
–200kHz
900MHz
200kHz
400kHz
RF INPUT FREQUENCY – GHz
FREQUENCY
TPC 2. Input Sensitivity
TPC 5. Reference Spurs (900 MHz, 200 kHz, and 20 kHz)
0
–10
–20
–30
–40
–50
–60
–70
–80
0
REF LEVEL = –14.3dBm
REF LEVEL = –10dBm
V
= 3V, V = 5V
P
= 5mA
V
= 3V, V = 5V
= 5mA
DD
DD P
–10
–20
–30
–40
–50
–60
–70
–80
I
I
CP
CP
PFD FREQUENCY = 200kHz
LOOP BANDWIDTH = 20kHz
RES BANDWIDTH = 10Hz
VIDEO BANDWIDTH = 10Hz
SWEEP = 1.9 SECONDS
AVERAGES = 10
PFD FREQUENCY = 1MHz
LOOP BANDWIDTH = 100kHz
RES BANDWIDTH = 10Hz
VIDEO BANDWIDTH = 10Hz
SWEEP = 1.9 SECONDS
AVERAGES = 10
–93.0dBc/Hz
–84.0dBc/Hz
–90
–90
–100
–100
–2kHz
–1kHz
900MHz
1kHz
2kHz
–2kHz
–1kHz
5800MHz
1kHz
2kHz
FREQUENCY
FREQUENCY
TPC 3. Phase Noise (900 MHz, 200 kHz, and 20 kHz)
TPC 6. Phase Noise (5.8 GHz, 1 MHz, and 100 kHz)
–6–
REV. A
ADF4106
–40
–50
–5
–15
–25
–35
–45
–55
–65
–75
–85
–95
–105
10dB/DIV
= –40dBc/Hz
RMS NOISE = 1.8
V
= 3V
DD
R
L
V
= 5V
P
–60
–70
–80
–90
–100
–110
–120
–130
–140
100Hz
1MHz
0
1
2
3
4
5
TUNINGVOLTAGE –V
FREQUENCY OFFSET FROM 5800MHz CARRIER
TPC 7. Integrated Phase Noise (5.8 GHz, 1 MHz,
and 100 kHz)
TPC 10. Reference Spurs vs. VTUNE (5.8 GHz,
1 MHz, and 100 kHz)
0
–120
V
= 3V,V = 5V
P
V
= 3V
REF LEVEL = –10.0dBm
DD
DD
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
I
= 5mA
V
= 5V
CP
P
PDF FREQUENCY = 1MHz
LOOP BANDWIDTH = 100kHz
RES BANDWIDTH = 1kHz
VIDEO BANDWIDTH = 1kHz
SWEEP = 13 SECONDS
AVERAGES = 1
–130
–140
–150
–160
–170
–180
–66.0dBc
–65.0dBc
10k
100k
1M
10M
100M
–2
–1
5800
1
2
PHASE DETECTOR FREQUENCY – Hz
FREQUENCY – MHz
TPC 8. Reference Spurs (5.8 GHz, 1 MHz, and 100 kHz)
TPC 11. Phase Noise (Referred to CP Output) vs.
PFD Frequency
10
9
8
7
6
5
4
3
2
1
0
–60
V
V
= 3V
DD
= 5V
P
–70
–80
–90
–100
8/9
16/17
32/33
64/65
–40
–20
0
20
40
60
80
100
PRESCALERVALUE
TEMPERATURE –
C
TPC 9. Phase Noise (5.8 GHz, 1 MHz, and 100 kHz)
vs. Temperature
TPC 12. AIDD vs. Prescaler Value
REV. A
–7–
ADF4106
3.5
6
4
V
V
= 3V
= 3V
DD
P
3.0
2.5
2.0
1.5
1.0
0.5
0
V
I
= 5V
= 5mA
P
CP
2
0
–2
–4
–6
50
100
150
200
250
300
0
0.5
1.0
1.5
2.0
2.5
– V
3.0
3.5
4.0
4.5
5.0
PRESCALER OUTPUT FREQUENCY
V
CP
TPC 13. DIDD vs. Prescaler Output Frequency
TPC 14. Charge Pump Output Characteristics
CIRCUIT DESCRIPTION
PRESCALER (P/P + 1)
REFERENCE INPUT SECTION
The dual-modulus prescaler (P/P + 1), along with the A and B
counters, enables the large division ratio, N, to be realized (N =
BP + A). The dual-modulus prescaler, operating at CML levels,
takes the clock from the RF input stage and divides it down to a
manageable frequency for the CMOS A and B counters. The
prescaler is programmable. It can be set in software to 8/9, 16/17,
32/33, or 64/65. It is based on a synchronous 4/5 core. There is
a minimum divide ratio possible for fully contiguous output
frequencies. This minimum is determined by P, the prescaler
value, and is given by (P2 – P).
The reference input stage is shown in Figure 2. SW1 and SW2
are normally closed switches. SW3 is normally open. When
power-down is initiated, SW3 is closed and SW1 and SW2 are
opened. This ensures that there is no loading of the REFIN pin
on power-down.
POWER-DOWN
CONTROL
100kꢁ
NC
A AND B COUNTERS
SW2
The A and B CMOS counters combine with the dual-modulus
prescaler to allow a wide ranging division ratio in the PLL feed-
back counter. The counters are specified to work when the
prescaler output is 300 MHz or less. Thus, with an RF input
frequency of 4.0 GHz, a prescaler value of 16/17 is valid but a
value of 8/9 is not.
TO R COUNTER
REF
IN
NC
SW1
BUFFER
SW3
NO
NC = NO CONNECT
Pulse Swallow Function
Figure 2. Reference Input Stage
The A and B counters, in conjunction with the dual-modulus
prescaler, make it possible to generate output frequencies that
are spaced only by the reference frequency divided by R. The
equation for the VCO frequency is as follows:
RF INPUT STAGE
The RF input stage is shown in Figure 3. It is followed by a
two-stage limiting amplifier to generate the CML clock levels
needed for the prescaler.
fREFIN
R
fVCO = P × B + A ×
(
)
[
]
BIAS
1.6V
fVCO
P
Output frequency of external voltage controlled
oscillator (VCO).
GENERATOR
AV
DD
Preset modulus of dual-modulus prescaler
(8/9, 16/17, and so on).
500ꢁ
500ꢁ
B
Preset divide ratio of binary 13-bit counter
(3 to 8191).
Preset divide ratio of binary 6-bit swallow
counter (0 to 63).
RF
A
B
IN
A
RF
IN
fREFIN External reference frequency oscillator.
AGND
Figure 3. RF Input Stage
–8–
REV. A
ADF4106
MUXOUT AND LOCK DETECT
N = BP + A
The output multiplexer on the ADF4106 allows the user to access
various internal points on the chip. The state of MUXOUT is
controlled by M3, M2, and M1 in the function latch. Table V
shows the full truth table. Figure 6 shows the MUXOUT section
in block diagram form.
TO PFD
13-BIT B
COUNTER
LOAD
LOAD
6-BIT A
COUNTER
FROM RF
INPUT STAGE
PRESCALER
P/P + 1
Lock Detect
MODULUS
CONTROL
MUXOUT can be programmed for two types of lock detect:
digital lock detect and analog lock detect.
N DIVIDER
Digital lock detect is active high. When LDP in the R counter
latch is set to 0, digital lock detect is set high when the phase
error on three consecutive phase detector cycles is less than 15 ns.
With LDP set to 1, five consecutive cycles of less than 15 ns are
required to set the lock detect. It will stay set high until a phase
error of greater than 25 ns is detected on any subsequent PD cycle.
Figure 4. A and B Counters
R COUNTER
The 14-bit R counter allows the input reference frequency to be
divided down to produce the reference clock to the phase fre-
quency detector (PFD). Division ratios from 1 to 16,383 are
allowed.
The N-channel open-drain analog lock detect should be operated
with an external pull-up resistor of 10 kΩ nominal. When lock
has been detected, this output will be high with narrow low-
going pulses.
PHASE FREQUENCY DETECTOR AND CHARGE PUMP
The PFD takes inputs from the R counter and N counter (N =
BP + A) and produces an output proportional to the phase and
frequency difference between them. Figure 5 is a simplified
schematic. The PFD includes a programmable delay element
that controls the width of the antibacklash pulse. This pulse
ensures that there is no dead zone in the PFD transfer function
and minimizes phase noise and reference spurs. Two bits in the
reference counter latch, ABP2 and ABP1, control the width of
the pulse. See Table III.
DV
DD
ANALOG LOCK DETECT
DIGITAL LOCK DETECT
R COUNTER OUTPUT
N COUNTER OUTPUT
SDOUT
MUX
CONTROL
MUXOUT
V
P
CHARGE
PUMP
UP
Q1
U1
HI
D1
DGND
R DIVIDER
CLR1
Figure 6. MUXOUT Circuit
INPUT SHIFT REGISTER
PROGRAMMABLE
DELAY
U3
CP
The ADF4106 digital section includes a 24-bit input shift register,
a 14-bit R counter, and a 19-bit N counter, comprising a 6-bit A
counter and a 13-bit B counter. Data is clocked into the 24-bit
shift register on each rising edge of CLK. The data is clocked
in MSB first. Data is transferred from the shift register to one
of four latches on the rising edge of LE. The destination latch
is determined by the state of the two control bits (C2, C1) in
the shift register. These are the two LSBs, DB1 and DB0, as
shown in the timing diagram of Figure 1. The truth table for these
bits is shown in Table VI. Table I shows a summary of how
the latches are programmed.
ABP2
ABP1
DOWN
HI
D2 Q2
U2
N DIVIDER
CLR2
CPGND
R DIVIDER
N DIVIDER
Table I. C2, C1 Truth Table
Control Bits
C2
C1
Data Latch
CP OUTPUT
0
0
1
1
0
1
0
1
R Counter
N Counter (A and B)
Function Latch (Including Prescaler)
Initialization Latch
Figure 5. PFD Simplified Schematic and Timing (In Lock)
REV. A
–9–
ADF4106
Table II. Latch Summary
REFERENCE COUNTER LATCH
ANTI-
BACKLASH
WIDTH
TEST
CONTROL
BITS
14-BIT REFERENCE COUNTER
RESERVED
MODE BITS
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6
DB5 DB4 DB3 DB2
R4 R3 R2 R1
DB1
DB0
X
0
0
LDP
T2
T1 ABP2 ABP1
R13 R12
R11 R10
R9
R8
R7
R6
R5
C2 (0) C1 (0)
R14
N COUNTER LATCH
CONTROL
BITS
RESERVED
13-BIT B COUNTER
6-BIT A COUNTER
DB7 DB6 DB5 DB4 DB3 DB2
DB1
DB0
DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8
DB20
B13
DB23 DB22 DB21
G1
B12
B11 B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
A6
A5
A4
A3
A2
A1 C2 (0) C1 (1)
FUNCTION LATCH
CURRENT
SETTING
2
CURRENT
SETTING
1
CONTROL
BITS
TIMER COUNTER
CONTROL
PRESCALER
VALUE
MUXOUT
CONTROL
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4
DB3 DB2
PD1 F1
DB1
DB0
P2
P1
PD2 CPI6 CPI5 CPI4 CPI3 CPI2 CPI1 TC4 TC3
TC2 TC1
F5
F4
F3
F2
M3
M2
M1
C2 (1) C1 (0)
INITIALIZATION LATCH
CURRENT
SETTING
2
CONTROL
BITS
CURRENT
SETTING
1
MUXOUT
PRESCALER
VALUE
TIMER COUNTER
CONTROL
CONTROL
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4
DB3 DB2
PD1 F1
DB1
DB0
C2 (1) C1 (1)
CPI5
F3
F2
P2
P1
PD2
CPI3 CPI2 CPI1 TC4 TC3
TC2 TC1
F4
M3
M2
CPI4
F5
CPI6
M1
–10–
REV. A
ADF4106
Table III. Reference Counter Latch Map
ANTI-
CONTROL
BITS
TEST
BACKLASH
WIDTH
14-BIT REFERENCE COUNTER
RESERVED
MODE BITS
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2
DB1
DB0
ABP1
0
LDP
T2
T1 ABP2
R14 R13
R12 R11
R10
R9
R8
R7
R6
R5
R4
R3
R2
R1
C2 (0) C1 (0)
0
X
X
= DON’T CARE
R14
R13
R12
..........
..........
..........
..........
..........
..........
..........
..........
..........
R3
0
0
0
1
.
.
.
1
R2
R1
DIVIDE RATIO
1
2
3
4
.
.
.
0
0
0
0
.
.
.
1
0
0
0
0
.
.
.
1
0
0
0
0
.
.
.
1
0
1
1
0
.
.
.
0
1
0
1
0
.
.
.
0
16380
1
1
1
1
1
1
1
1
1
..........
..........
..........
1
1
1
0
1
1
1
0
1
16381
16382
16383
ABP2
ABP1
ANTIBACKLASH PULSEWIDTH
0
0
1
1
0
1
0
1
2.9 ns
1.3 ns
6.0 ns
2.9 ns
TEST MODE BITS
SHOULD BE SET
TO 00 FOR NORMAL
OPERATION.
LDP
OPERATION
0
THREE CONSECUTIVE CYCLES OF PHASE DELAY LESS THAN
15 ns MUST OCCUR BEFORE LOCK DETECT IS SET.
FIVE CONSECUTIVE CYCLES OF PHASE DELAY LESS THAN
15 ns MUST OCCUR BEFORE LOCK DETECT IS SET.
1
BOTH OF THESE BITS
MUST BE SET TO 0 FOR
NORMAL OPERATION.
REV. A
–11–
ADF4106
Table IV. AB Counter Latch Map
CONTROL
BITS
13-BIT B COUNTER
RESERVED
6-BIT A COUNTER
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8
DB7 DB6 DB5 DB4 DB3 DB2
DB1 DB0
X
X
G1
B13
B12
B11 B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
A6
A5
A4
A3
A2
A1 C2 (0) C1 (1)
X = DON’T CARE
A COUNTER
A6
A5
..........
A2
0
0
1
1
.
.
.
0
0
1
1
A1
0
1
0
1
.
.
.
0
1
0
1
DIVIDE RATIO
0
1
2
3
.
.
.
60
61
62
63
0
0
0
0
.
.
.
1
1
1
1
0
0
0
0
.
.
.
1
1
1
1
..........
..........
..........
..........
..........
..........
..........
..........
..........
..........
..........
B13
B12
B11
B3
0
0
0
1
.
.
.
1
1
1
1
B2
0
0
1
1
.
.
.
0
0
1
1
B1
B COUNTER DIVIDE RATIO
NOT ALLOWED
NOT ALLOWED
NOT ALLOWED
3
.
.
.
8188
8189
8190
8191
0
0
0
0
.
.
.
1
1
1
1
0
0
0
0
.
.
.
1
1
1
1
0
0
0
0
.
.
.
1
1
1
1
..........
..........
..........
..........
..........
..........
..........
..........
..........
..........
..........
0
1
0
1
.
.
.
0
1
0
1
F4 (FUNCTION LATCH)
FASTLOCK ENABLE
CP GAIN
OPERATION
0
0
1
1
0
1
1
2
0
1
1
CHARGE PUMP CURRENT SETTING
IS PERMANENTLY USED.
CHARGE PUMP CURRENT SETTING
IS PERMANENTLY USED.
CHARGE PUMP CURRENT SETTING
IIS PERMANENTLY USED.
CHARGE PUMP CURRENT IS
SWITCHED TO SETTING 2. THE
TIME SPENT IN SETTING 2 IS
DEPENDENT ON WHICH FASTLOCK
MODE IS USED. SEE FUNCTION
LATCH DESCRIPTION
N = BP + A; P IS PRESCALER VALUE SET IN THE FUNCTION LATCH.
B MUST BE GREATER THAN OR EQUAL TO A. FOR CONTINUOUSLY
ADJACENT VALUES OF (N ꢄ F
), AT THE OUTPUT,
N
, IS (P2 – P).
REF
MIN
THESE BITS ARE NOT USED
BY THE DEVICE AND ARE
DON'T CARE BITS.
–12–
REV. A
ADF4106
Table V. Function Latch Map
CURRENT
SETTING
2
CURRENT
SETTING
1
CONTROL
BITS
PRESCALER
VALUE
MUXOUT
TIMER COUNTER
CONTROL
CONTROL
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4
DB3 DB2 DB1
DB0
C2 (1) C1 (0)
CPI5
F3
F2
P2
P1
PD2
CPI3 CPI2 CPI1 TC4 TC3
TC2 TC1
F4
M3
M2
CPI4
F5
CPI6
M1
PD1 F1
PHASE DETECTOR
POLARITY
NEGATIVE
COUNTER
OPERATION
NORMAL
R, A, B COUNTERS
HELD IN RESET
F2
0
1
F1
0
1
POSITIVE
CHARGE PUMP
OUTPUT
F3
0
1
NORMAL
THREE-STATE
F4
FASTLOCK MODE
F5
0
1
1
FASTLOCK DISABLED
FASTLOCK MODE 1
FASTLOCK MODE 2
X
0
1
M3
0
0
M2
0
0
M1
0
1
OUTPUT
TIMEOUT
(PFD CYCLES)
3
7
THREE-STATE OUTPUT
DIGITAL LOCK DETECT
(ACTIVE HIGH)
TC4
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
TC3
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
TC2
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
TC1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
1
1
0
1
N DIVIDER OUTPUT
11
15
19
23
27
31
35
39
43
47
51
55
59
63
DV
DV
DD
DD
R DIVIDER OUTPUT
N-CHANNEL OPEN-DRAIN
LOCK DETECT
SERIAL DATA OUTPUT
DGND
1
1
0
0
0
1
1
1
1
1
0
1
CPI6
CPI5
CPI4
I
(mA)
CP
CPI3
CPI2
CPI1
3 kꢁ
5.1 kꢁ
11 kꢁ
0.289
0.580
0.870
1.160
1.450
1.730
2.020
2.320
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1.06
2.12
3.18
4.24
5.30
6.36
7.42
8.50
0.625
1.25
1.875
2.5
3.125
3.75
4.375
5.0
CE PIN
PD2
PD1
MODE
0
1
1
1
X
X
0
1
X
0
1
1
ASYNCHRONOUS POWER-DOWN
NORMAL OPERATION
ASYNCHRONOUS POWER-DOWN
SYNCHRONOUS POWER-DOWN
P2
P1
PRESCALER VALUE
0
0
1
1
0
1
0
1
8/9
16/17
32/33
64/65
REV. A
–13–
ADF4106
Table VI. Initialization Latch Map
CURRENT
SETTING
2
CURRENT
SETTING
1
CONTROL
BITS
PRESCALER
VALUE
MUXOUT
TIMER COUNTER
CONTROL
CONTROL
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4
DB3 DB2 DB1
DB0
C2 (1) C1 (1)
CPI5
F3
F2
P2
P1
PD2
CPI3 CPI2 CPI1 TC4 TC3
TC2 TC1
F4
M3
M2
CPI4
F5
CPI6
M1
PD1 F1
PHASE DETECTOR
POLARITY
NEGATIVE
COUNTER
OPERATION
NORMAL
R, A, B COUNTERS
HELD IN RESET
F2
0
1
F1
0
1
POSITIVE
CHARGE PUMP
OUTPUT
F3
0
1
NORMAL
THREE-STATE
F4
FASTLOCK MODE
F5
0
1
1
FASTLOCK DISABLED
FASTLOCK MODE 1
FASTLOCK MODE 2
X
0
1
M3
0
0
M2
0
0
M1
0
1
OUTPUT
TIMEOUT
(PFD CYCLES)
3
7
THREE-STATE OUTPUT
DIGITAL LOCK DETECT
(ACTIVE HIGH)
TC4
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
TC3
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
TC2
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
TC1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
1
1
0
1
N DIVIDER OUTPUT
11
15
19
23
27
31
35
39
43
47
51
55
59
63
DV
DV
DD
DD
R DIVIDER OUTPUT
N-CHANNEL OPEN-DRAIN
LOCK DETECT
SERIAL DATA OUTPUT
DGND
1
1
0
0
0
1
1
1
1
1
0
1
CPI6
CPI5
CPI4
I
(mA)
CP
CPI3
CPI2
CPI1
3 kꢁ
5.1 kꢁ
11 kꢁ
0.289
0.580
0.870
1.160
1.450
1.730
2.020
2.320
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1.06
2.12
3.18
4.24
5.30
6.36
7.42
8.50
0.625
1.25
1.875
2.5
3.125
3.75
4.375
5.0
CE PIN
PD2
PD1
MODE
0
1
1
1
X
X
0
1
X
0
1
1
ASYNCHRONOUS POWER-DOWN
NORMAL OPERATION
ASYNCHRONOUS POWER-DOWN
SYNCHRONOUS POWER-DOWN
P2
P1
PRESCALER VALUE
0
0
1
1
0
1
0
1
8/9
16/17
32/33
64/65
–14–
REV. A
ADF4106
Fastlock Mode 2
FUNCTION LATCH
The charge pump current is switched to the contents of Current
Setting 2. The device enters fastlock by having a 1 written to the
CP gain bit in the AB counter latch. The device exits fastlock
under the control of the timer counter. After the timeout period
determined by the value in TC4 through TC1, the CP gain bit in
the AB counter latch is automatically reset to 0 and the device
reverts to normal mode instead of fastlock. See Table V for the
timeout periods.
With C2, C1 set to 1, 0, the on-chip function latch will be
programmed. Table V shows the input data format for program-
ming the function latch.
Counter Reset
DB2 (F1) is the counter reset bit. When this is 1, the R counter
and the A, B counters are reset. For normal operation, this bit
should be 0. Upon power-up, the F1 bit needs to be disabled (set to 0).
The N counter then resumes counting in close alignment with the R
counter. (The maximum error is one prescaler cycle.)
Timer Counter Control
The user has the option of programming two charge pump
currents. The intent is that the Current Setting 1 is used when the
RF output is stable and the system is in a static state. Current
Setting 2 is meant to be used when the system is dynamic and in a
state of change (e.g., when a new output frequency is pro-
grammed). The normal sequence of events is as follows.
Power-Down
DB3 (PD1) and DB21 (PD2) on the ADF4106 provide program-
mable power-down modes. They are enabled by the CE pin. When
the CE pin is low, the device is immediately disabled regardless of
the states of PD2, PD1. In the programmed asynchronous power-
down, the device powers down immediately after latching a 1 into
bit PD1, with the condition that PD2 has been loaded with a 0. In
the programmed synchronous power-down, the device power-
down is gated by the charge pump to prevent unwanted frequency
jumps. Once the power-down is enabled by writing a 1 into bit
PD1 (on condition that a 1 has also been loaded to PD2), the
device will go into power-down on the occurrence of the next
charge pump event. When a power-down is activated (either
synchronous or asynchronous mode including CE pin-activated
power-down), the following events occur:
Users initially decide what the preferred charge pump currents
will be. For example, they may choose 2.5 mA as Current
Setting 1 and 5 mA as Current Setting 2. At the same time, they
must also decide how long they want the secondary current to stay
active before reverting to the primary current. This is controlled
by the timer counter control bits DB14 to DB11 (TC4 through
TC1) in the function latch. The truth table is provided in Table V.
When users want to program a new output frequency, they can
simply program the AB counter latch with new values for A and B.
At the same time, they can set the CP gain bit to a 1, which sets
the charge pump with the value in CPI6 through CPI4 for a period
of time determined by TC4 through TC1. When this time is up,
the charge pump current reverts to the value set by CPI3 through
CPI1. At the same time, the CP Gain bit in the AB counter latch
is reset to 0 and is ready for the next time the user wants to change
the frequency.
• All active dc current paths are removed.
• The R, N, and timeout counters are forced to their load
state conditions.
• The charge pump is forced into three-state mode.
• The digital lock detect circuitry is reset.
• The RFIN input is debiased.
• The reference input buffer circuitry is disabled.
• The input register remains active and capable of loading
and latching data.
Note that there is an enable feature on the timer counter. It is
enabled when Fastlock Mode 2 is chosen when the fastlock mode
bit (DB10) in the function latch is set to 1.
MUXOUT Control
The on-chip multiplexer is controlled by M3, M2, and M1 on
the ADF4106. Table V shows the truth table.
Charge Pump Currents
CPI3, CPI2, and CPI1 program Current Setting 1 for the charge
pump. CPI6, CPI5, and CPI4 program Current Setting 2 for the
charge pump. The truth table is in Table V.
Fastlock Enable Bit
DB9 of the function latch is the fastlock enable bit. Only when
this is 1 is fastlock enabled.
Prescaler Value
P2 and P1 in the function latch set the prescaler values. The
prescaler value should be chosen so that the prescaler output
frequency is always less than or equal to 300 MHz. Thus, with
an RF frequency of 4 GHz, a prescaler value of 16/17 is valid,
but a value of 8/9 is not.
Fastlock Mode Bit
DB10 of the function latch is the fastlock mode bit. When fastlock
is enabled, this bit determines which fastlock mode is used. If
the fastlock mode bit is 0, Fastlock Mode 1 is selected, and if
the fastlock mode bit is 1, Fastlock Mode 2 is selected.
PD Polarity
Fastlock Mode 1
This bit sets the phase detector polarity bit. See Table V.
The charge pump current is switched to the contents of Current
Setting 2. The device enters fastlock by having a 1 written to the
CP gain bit in the AB counter latch. The device exits fastlock by
having a 0 written to the CP gain bit in the AB counter latch.
CP Three-State
This bit controls the CP output pin. With the bit set high, the
CP output is put into three-state. With the bit set low, the CP
output is enabled.
REV. A
–15–
ADF4106
INITIALIZATION LATCH
Counter Reset Method
• Apply VDD
• Do a function latch load (10 in 2 LSB). As part of
this, load 1 to the F1 bit. This enables the counter reset.
• Do an R counter load (00 in 2 LSB).
• Do an AB counter load (01 in 2 LSB).
• Do a function latch load (10 in 2 LSB). As part of
this, load 0 to the F1 bit. This disables the counter reset.
When C2, C1 = 1, 1, the initialization latch is programmed. This is
essentially the same as the function latch (programmed when C2,
C1 = 1, 0).
.
However, when the initialization latch is programmed, there is
an additional internal reset pulse applied to the R and AB
counters. This pulse ensures that the AB counter is at the load
point when the AB counter data is latched, and the device will
begin counting in close phase alignment.
This sequence provides the same close alignment as the initial-
ization method. It offers direct control over the internal reset.
Note that counter reset holds the counters at load point and
three-states the charge pump but does not trigger synchronous
power-down.
If the latch is programmed for synchronous power-down (CE
pin is high; PD1 bit is high; PD2 bit is low), the internal pulse
also triggers this power-down. The prescaler reference and the
oscillator input buffer are unaffected by the internal reset pulse,
so close phase alignment is maintained when counting resumes.
APPLICATION
When the first AB counter data is latched after initialization, the
internal reset pulse is again activated. However, subsequent AB
counter loads will not trigger the internal reset pulse.
Local Oscillator for LMDS Base Station Transmitter
Figure 7 shows the ADF4106 being used with a VCO to pro-
duce the LO for an LMDS base station operation in the
5.4 GHz to 5.8 GHz band.
DEVICE PROGRAMMING AFTER INITIAL POWER-UP
After the device is initially powered up, there are three ways to
program it.
The reference input signal is applied to the circuit at FREFIN
and, in this case, is terminated in 50 Ω. A typical base station
system would have either a TCXO or an OCXO driving the
reference input without any 50 Ω termination.
Initialization Latch Method
• Apply VDD
.
To have a channel spacing of 1 MHz at the output, the 10 MHz
reference input must be divided by 10, using the on-chip refer-
ence divider of the ADF4106.
• Program the initialization latch (11 in 2 LSB of input
word). Make sure that F1 bit is programmed to 0.
• Do a function latch load (10 in 2 LSB of the control
word), making sure that the F1 bit is programmed to a 0.
• Do an R load (00 in 2 LSB).
The charge pump output of the ADF4106 (Pin 2) drives the
loop filter. In calculating the loop filter component values, a
number of items need to be considered. In this example, the
loop filter was designed so that the overall phase margin for the
system would be 45 degrees. Other PLL system specifications
are given below:
• Do an AB load (01 in 2 LSB).
When the initialization latch is loaded, the following occurs:
1. The function latch contents are loaded.
2. An internal pulse resets the R, A, B, and timeout counters
to load state conditions and three-states the charge pump.
Note that the prescaler band gap reference and the oscilla-
tor input buffer are unaffected by the internal reset pulse,
allowing close phase alignment when counting resumes.
3. Latching the first AB counter data after the initialization
word will activate the same internal reset pulse. Successive
AB loads will not trigger the internal reset pulse unless
there is another initialization.
K
D = 2.5 mA
KV = 80 MHz/V
Loop Bandwidth = 50 kHz
FREF = 1 MHz
N = 5800
Extra Reference Spur Attenuation = 10 dB
All of these specifications are needed and used to come up with
the loop filter component values shown in Figure 7.
CE Pin Method
Figure 7 gives a typical phase noise performance of –83 dBc/Hz
at 1 kHz offset from the carrier. Spurs are better than –62 dBc.
• Apply VDD
.
• Bring CE low to put the device into power-down. This is an
asynchronous power-down (it happens immediately).
• Program the function latch (10).
The loop filter output drives the VCO, which, in turn, is fed
back to the RF input of the PLL synthesizer. It also drives the
RF output terminal. A T-circuit configuration provides 50 Ω
matching between the VCO output, the RF output, and the
RFIN terminal of the synthesizer. Note that the ADF4106 RF
input looks like 50 Ω at 5.8 GHz, so no terminating resistor is
needed. When operating at lower frequencies, however, this is
not the case.
• Program the R counter latch (00).
• Program the AB counter latch (01).
• Bring CE high to take the device out of power-down.
The R and AB counters will then resume counting in close
alignment. Note that after CE goes high, a duration of 1 µs may
be required for the prescaler band gap voltage and oscillator
input buffer bias to reach steady state.
In a PLL system, it is important to know when the system is
locked. In Figure 7, this is accomplished by using the MUXOUT
signal from the synthesizer. The MUXOUT pin can be pro-
grammed to monitor various internal signals in the synthesizer.
One of these is the LD or (lock detect) signal.
CE can be used to power the device up and down to check for
channel activity. The input register does not need to be repro-
grammed each time the device is disabled and enabled as long as it
has been programmed at least once after VDD was initially applied.
–16–
REV. A
ADF4106
V
V
P
DD
RF
OUT
100pF
18ꢁ
18ꢁ
100pF
18ꢁ
V
CP
DV
AV
6.2kꢁ
P
DD
DD
V
1000pF
1000pF
CC
FREF
REF
IN
IN
20pF
100pF
4.3kꢁ
V940ME03
51ꢁ
ADF4106
1, 3, 4, 5, 7, 8,
9, 11, 12, 13
1.5nF
CE
LOCK
DETECT
MUXOUT
CLK
DATA
LE
100pF
RF
RF
A
IN
R
SET
B
IN
5.1kꢁ
100pF
NOTE
DECOUPLING CAPACITORS (0.1
OF THE ADF4106 AND ON V OF THE V940ME03 HAVE
ꢅ
F/10pF) ON AV , DV
,
DD
DD
V
P
CC
BEEN OMITTED FROM THE DIAGRAM TO AID CLARITY.
Figure 7. Local Oscillator for LMDS Station
On first application of power to the ADF4106, three writes are
needed (one to the R counter latch, one to the N counter latch,
and one to the function latch) for the output to become active.
INTERFACING
The ADF4106 has a simple SPI® compatible serial interface for
writing to the device. CLK, DATA, and LE control the data
transfer. When LE (latch enable) goes high, the 24 bits that
have been clocked into the input register on each rising edge of
SCLK get transferred to the appropriate latch. See Figure 1 for
the timing diagram and Table I for the latch truth table.
I/O port lines on the ADuC812 are also used to control
power-down (CE input) and to detect lock (MUXOUT config-
ured as lock detect and polled by the port input).
When operating in the mode described, the maximum SCLOCK
rate of the ADuC812 is 4 MHz. This means that the maximum
rate at which the output frequency can be changed is 166 kHz.
The maximum allowable serial clock rate is 20 MHz. This
means that the maximum update rate possible for the device is
833 kHz or one update every 1.2 µs. This is certainly more than
adequate for systems that have typical lock times in hundreds of
microseconds.
SCLOCK
MOSI
CLK
DATA
ADuC812 Interface
Figure 8 shows the interface between the ADF4106 and the
ADuC812 MicroConverter®. Since the ADuC812 is based on
an 8051 core, this interface can be used with any 8051 based
microcontroller. The MicroConverter is set up for SPI master
mode with CPHA = 0. To initiate the operation, the I/O port
driving LE is brought low. Each latch of the ADF4106 needs a
24-bit word. This is accomplished by writing three 8-bit bytes
from the MicroConverter to the device. When the third byte has
been written, the LE input should be brought high to complete
the transfer.
LE
CE
ADuC812
I/O PORTS
ADF4106
MUXOUT
(LOCK DETECT)
Figure 8. ADuC812 to ADF4106 Interface
REV. A
–17–
ADF4106
ADSP-2181 Interface
SCLOCK
MOSI
CLK
Figure 9 shows the interface between the ADF4106 and the
ADSP-21xx digital signal processor. The ADF4106 needs a 24-bit
serial word for each latch write. The easiest way to accomplish
this using the ADSP-21xx family is to use the autobuffered
transmit mode of operation with alternate framing. This provides
a means for transmitting an entire block of serial data before an
interrupt is generated. Set up the word length for eight bits and use
three memory locations for each 24-bit word. To program each
24-bit latch, store the three 8-bit bytes, enable the autobuffered
mode, and then write to the transmit register of the DSP. This
last operation initiates the autobuffer transfer.
DATA
TFS
LE
CE
ADSP-21xx
ADF4106
I/O FLAGS
MUXOUT
(LOCK DETECT)
Figure 9. ADSP-21xx to ADF4106 Interface
–18–
REV. A
ADF4106
OUTLINE DIMENSIONS
16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
5.10
5.00
4.90
16
9
8
4.50
4.40
4.30
6.40
BSC
1
PIN 1
1.20
MAX
0.15
0.05
0.20
0.09
0.75
0.60
0.45
8ꢃ
0ꢃ
0.30
0.19
0.65
BSC
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MS-153AB
20-Lead Lead Frame Chip Scale Package [LFCSP]
(CP-20)
Dimensions shown in millimeters
0.60
MAX
4.0
BSC SQ
0.60
MAX
16
15
20
1
5
PIN 1
2.25
2.10 SQ
1.95
INDICATOR
TOP
BOTTOM
VIEW
3.75
VIEW
BSC SQ
11
10
0.75
0.55
0.35
6
0.80 MAX
0.65 NOM
0.30
0.23
0.18
12ꢃ MAX
1.00
0.90
0.80
0.05
0.02
0.00
SEATING
PLANE
COPLANARITY
0.08
0.50
BSC
0.20
REF
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
REV. A
–19–
ADF4106
Revision History
Location
Page
5/03—Data Sheet changed from REV. 0 to REV. A.
Edits to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Edits to TPC 11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Update OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
–20–
REV. A
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