EVAL-ADT7301EBZ [ADI]

±1°C Accurate, 13-Bit, Digital Temperature Sensor; 为± 1A ° C精度, 13位,数字温度传感器
EVAL-ADT7301EBZ
型号: EVAL-ADT7301EBZ
厂家: ADI    ADI
描述:

±1°C Accurate, 13-Bit, Digital Temperature Sensor
为± 1A ° C精度, 13位,数字温度传感器

传感器 温度传感器
文件: 总16页 (文件大小:286K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
13-bit temperature-to-digital converter  
−40°C to +150°C operating temperature range  
0.5°C typical accuracy  
BAND GAP  
TEMPERATURE  
SENSOR  
13-BIT  
ANALOG/DIGITAL  
CONVERTER  
0.03125°C temperature resolution  
Shutdown current of 1 μA  
Power dissipation of 0.631 mW at VDD = 3.3 V  
SPI- and DSP-compatible serial interface  
Shutdown mode  
GND  
V
DD  
TEMPERATURE  
VALUE  
REGISTER  
ADT7301  
CS  
SERIAL  
BUS  
INTERFACE  
SCLK  
DIN  
Space-saving SOT-23 and MSOP packages  
Compatible with AD7814  
DOUT  
APPLICATIONS  
Medical equipment  
Automotive  
Figure 1.  
Environmental controls  
Oil temperature  
Hydraulic systems  
Cellular phones  
Hard disk drives  
Personal computers  
Electronic test equipment  
Office equipment  
Domestic appliances  
Process control  
GENERAL DESCRIPTION  
PRODUCT HIGHLIGHTS  
The ADT7301 is a complete temperature monitoring system  
available in SOT-23 and MSOP packages. It contains a band gap  
temperature sensor and a 13-bit ADC to monitor and digitize  
the temperature reading to a resolution of 0.03125°C.  
1. On-chip temperature sensor that allows an accurate  
measurement of the ambient temperature. The measurable  
temperature range is −40°C to +150°C.  
2. Supply voltage of 2.7 V to 5.25 V.  
The ADT7301 has a flexible serial interface that allows easy  
interfacing to most microcontrollers. The interface is compati-  
ble with SPI®, QSPI, and MICROWIREprotocols as well as  
DSPs. The part features a standby mode that is controlled via  
the serial interface. The ADT7301s wide supply voltage range,  
low supply current, and SPI-compatible interface make it ideal  
for a variety of applications including personal computers,  
office equipment, automotive, and domestic appliances. The  
ADT7301 is rated for operation over the −40°C to +150°C  
temperature range. It is not recommended to operate the device  
at temperatures above +125°C for greater than a total of 5%  
(5,000 hours) of the lifetime of the device. Exposure beyond this  
limit affects device reliability.  
3. Space-saving 6-lead SOT-23 and 8-lead MSOP packages.  
4. Typical temperature accuracy of 0.5°C.  
5. 13-bit temperature reading to 0.03125°C resolution.  
6. Shutdown mode that reduces the power consumption to  
4.88 μW with VDD = 3.3 V @ 1 SPS.  
7. Compatible with AD7814.  
Rev. B  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
www.analog.com  
Fax: 781.461.3113 ©2005–2011 Analog Devices, Inc. All rights reserved.  
 
 
 
 
 
ADT7301  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Typical Performance Characteristics ..............................................7  
Theory of Operation .........................................................................9  
Converter Details ..........................................................................9  
Temperature Value Register...................................................... 10  
Serial Interface ............................................................................ 11  
Applications Information .............................................................. 12  
Microprocessor Interfacing....................................................... 12  
Mounting the ADT7301............................................................ 14  
Supply Decoupling ..................................................................... 14  
Outline Dimensions....................................................................... 15  
Ordering Guide .......................................................................... 15  
Applications....................................................................................... 1  
Functional Block Diagram .............................................................. 1  
General Description ......................................................................... 1  
Product Highlights ........................................................................... 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Timing Characteristics ................................................................ 4  
Absolute Maximum Ratings............................................................ 5  
ESD Caution.................................................................................. 5  
Pin Configurations and Function Descriptions ........................... 6  
REVISION HISTORY  
6/11—Rev. A to Rev. B  
Changed Temperature Conversion Time from 800 µs to 1.2 ms.. 3  
Changed Temperature Conversion Time in Converter  
Details Section .................................................................................. 9  
3/10—Rev. 0 to Rev. A  
Change to Autoconversion Update Rate Parameter, Table 1...... 3  
Changes to Converter Details Section ........................................... 9  
Updated Outline Dimensions....................................................... 15  
10/05—Revision 0: Initial Version  
Rev. B | Page 2 of 16  
 
ADT7301  
SPECIFICATIONS  
TA = TMIN to TMAX, VDD = 2.7 V to 5.25 V, unless otherwise noted. All specifications are for −40°C to +150°C, unless otherwise noted.  
Table 1. A Grade Specifications  
Parameter  
Min  
Typ  
Max  
Unit  
Test Conditions/Comments  
VDD = 3.3 V ( 10%) and 5 V ( 5%)  
TA = 0°C to 70°C  
TEMPERATURE SENSOR AND ADC  
Accuracy1  
0.5  
1
°C  
2
°C  
TA = −20°C to +85°C  
3
42  
°C  
°C  
TA = −40°C to +125°C  
TA = −40°C to +150°C  
Temperature Resolution  
Autoconversion Update Rate, tR  
Temperature Conversion Time  
Thermal Time Constant3  
SUPPLIES  
0.03125  
°C  
1.5  
1.2  
2
sec  
ms  
sec  
Temperature measurement every 1.5 second  
Supply Voltage  
2.7  
5.25  
V
For specified performance  
Supply Current  
Normal Mode  
1.6  
190  
1.6  
280  
0.2  
0.4  
2.2  
300  
2.2  
400  
1
mA  
µA  
mA  
µA  
µA  
µA  
µA  
VDD = 3.3 V, powered up and converting  
VDD = 3.3 V, powered up and not converting  
VDD = 5 V, powered up and converting  
VDD = 5 V, powered up and not converting  
VDD = 3.3 V, TA = 0°C to 70°C  
Shutdown Mode  
2
20  
VDD = 5 V, TA = 0°C to 70°C  
VDD = 2.7 V to 5.25 V, TA = −40°C to +150°C  
Power Dissipation  
Normal Mode (Average)  
631  
1.41  
µW  
mW  
VDD = 3.3 V, autoconversion update, tR  
VDD = 5 V, autoconversion update, tR  
Shutdown Mode (Average)4  
1 SPS  
4.88  
7.4  
42.9  
65  
423  
641  
µW  
µW  
µW  
µW  
µW  
µW  
VDD = 3.3 V  
VDD = 5 V  
VDD = 3.3 V  
VDD = 5 V  
VDD = 3.3 V  
VDD = 5 V  
10 SPS  
100 SPS  
DIGITAL INPUT5  
Input High Voltage, VIH  
Input Low Voltage, VIL  
Input Current, IIN  
Input Capacitance, CIN  
DIGITAL OUTPUT5  
2.5  
V
V
µA  
pF  
0.8  
1
10  
VIN = 0 V to VDD  
All digital inputs  
Output High Voltage, VOH  
Output Low Voltage, VOL  
Output Capacitance, COUT  
VDD − 0.3 V  
ISOURCE = ISINK = 200 µA  
IOL = 200 µA  
0.4  
50  
V
pF  
1 The accuracy specifications for 0°C to 70°C are specified to 3.5-Σ performance.  
2 It is not recommended to operate the device at temperatures above 125°C for greater than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure  
beyond this limit affects device reliability.  
3 The thermal time constant is the time it takes for a temperature delta to change to 63.2% of its final value. For example, if the ADT7301 experiences a thermal shock  
from 0°C to 100°C, it would take typically 2 seconds for the ADT7301 to reach 63.2°C.  
4 The ADT7301 is taken out of shutdown mode and a temperature conversion is immediately performed after this write operation. When the temperature conversion is  
complete, the ADT7301 is put back into shutdown mode.  
5 Guaranteed by design and characterization, not production tested.  
Rev. B | Page 3 of 16  
 
 
ADT7301  
TIMING CHARACTERISTICS  
Guaranteed by design and characterization, not production tested. All input signals are specified with tR = tF = 5 ns (10% to 90% of VDD  
and timed from a voltage level of 1.6 V. TA = TMIN to TMAX, VDD = 2.7 V to 5.25 V, unless otherwise noted.  
)
Table 2.  
Parameter1  
Limit  
5
Unit  
Comments  
t1  
t2  
t3  
ns min  
ns min  
ns min  
ns max  
ns min  
ns min  
ns min  
ns max  
CS to SCLK setup time  
25  
25  
35  
20  
5
SCLK high pulse width  
SCLK low pulse width  
Data access time after SCLK falling edge  
Data setup time prior to SCLK rising edge  
Data hold time after SCLK rising edge  
CS to SCLK hold time  
2
t4  
t5  
t6  
t7  
5
2
t8  
40  
CS to DOUT high Impedance  
1 See Figure 14 for the SPI timing diagram.  
2 Measured with the load circuit of Figure 2.  
200µA  
I
OL  
TO  
OUTPUT  
PIN  
1.6V  
C
L
50pF  
200µA  
I
OH  
Figure 2. Load Circuit for Data Access Time and Bus Relinquish Time  
Rev. B | Page 4 of 16  
 
 
ADT7301  
ABSOLUTE MAXIMUM RATINGS  
Table 3.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Parameter  
Rating  
VDD to GND  
−0.3 V to +7 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to VDD + 0.3 V  
−40°C to +150°C  
−65°C to +150°C  
150°C  
Digital Input Voltage to GND  
Digital Output Voltage to GND  
Operating Temperature Range1  
Storage Temperature Range  
Junction Temperature  
6-Lead SOT-23 (RJ-6)  
Power Dissipation2  
1.2  
1.0  
0.8  
3
WMAX = (TJ max − TA )/θJA  
Thermal Impedance  
θJA, Junction-to-Ambient  
(Still Air)  
190.4°C/W  
SOT-23  
8-Lead MSOP (RM-8)  
Power Dissipation2  
Thermal Impedance4  
θJA, Junction-to-Ambient  
(Still Air)  
θJC, Junction-to-Case  
IR Reflow Soldering  
Peak Temperature  
Time at Peak Temperature  
Ramp-Up Rate  
0.6  
3
WMAX = (TJ max − TA )/θJA  
MSOP  
0.4  
0.2  
0
205.9°C/W  
43.74°C/W  
220°C (0°C/5°C)  
10 sec to 20 sec  
3°C/s max  
TEMPERATURE (°C)  
Figure 3. Plot of Maximum Power Dissipation vs. Temperature  
Ramp-Down Rate  
−6°C/s max  
Time 25°C to Peak Temperature  
IR Reflow Soldering—Pb-Free Package  
Peak Temperature  
6 minutes max  
ESD CAUTION  
260°C (0°C)  
Time at Peak Temperature  
Ramp-Up Rate  
20 sec to 40 sec  
3°C/s max  
Ramp-Down Rate  
−6°C/s max  
Time 25°C to Peak Temperature  
8 minutes max  
1 It is not recommended to operate the ADT7301 at temperatures above  
125°C for greater than a total of 5% (5,000 hours) of the lifetime of the  
device. Any exposure beyond this limit affects device reliability.  
2 Values relate to the package being used on a standard 2-layer PCB. Refer  
to Figure 3 for a plot of maximum power dissipation vs. ambient  
temperature (TA).  
3 TA = ambient temperature.  
4 Junction-to-case resistance is applicable to components featuring a  
preferential flow direction, for example, components mounted on a heat  
sink. Junction-to-ambient resistance is more useful for air-cooled,  
PCB-mounted components.  
Rev. B | Page 5 of 16  
 
 
 
ADT7301  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
1
2
3
4
8
7
6
5
NC  
DOUT  
CS  
NC  
ADT7301  
1
2
3
6
5
4
GND  
DIN  
DOUT  
GND  
DIN  
TOP VIEW  
(Not to Scale)  
ADT7301  
TOP VIEW  
(Not to Scale)  
CS  
SCLK  
V
SCLK  
V
DD  
DD  
Figure 4. SOT-23 Pin Configuration  
Figure 5. MSOP Pin Configuration  
Table 4. Pin Function Descriptions  
SOT-23  
Pin No.  
MSOP  
Pin No.  
Mnemonic  
GND  
DIN  
Description  
1
2
7
6
Analog and Digital Ground.  
Serial Data Input. Serial data to be loaded to the part’s control register is provided on this input.  
Data is clocked into the control register on the rising edge of SCLK.  
3
4
5
4
VDD  
SCLK  
Positive Supply Voltage, 2.7 V to 5.25 V.  
Serial Clock Input. This is the clock input for the serial port. The serial clock is used to clock data out  
of the ADT7301’s temperature value register and to clock data into the ADT7301’s control register.  
5
6
3
CS  
Chip Select Input. Logic input. The device is selected when this input is low. The SCLK input is  
disabled when this pin is high.  
Serial Data Output. Logic output. Data is clocked out of the temperature value register at this pin.  
Data is clocked out on the falling edge of SCLK.  
2
DOUT  
NC  
1, 8  
No Connect.  
Rev. B | Page 6 of 16  
 
ADT7301  
TYPICAL PERFORMANCE CHARACTERISTICS  
20  
215  
250mV p-p RIPPLE @ V = 5V  
DD  
210  
15  
10  
5
5.5V  
205  
200  
195  
190  
3.3V  
185  
0
180  
–5  
175  
170  
–10  
10k  
100k  
1M  
10M  
100M  
–45  
5
55  
105  
155  
FREQUENCY (Hz)  
TEMPERATURE (°C)  
Figure 9. Temperature Accuracy vs. Supply Ripple Frequency  
Figure 6. Average Operating Supply Current vs. Temperature  
140  
120  
205  
200  
195  
100  
80  
60  
40  
20  
0
190  
185  
180  
175  
0
5
10  
15  
20  
25  
30  
35  
40  
45  
50  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
TIME (SEC)  
SUPPLY VOLTAGE (V)  
Figure 10. Response to Thermal Shock  
Figure 7. Average Operating Supply Current vs. Supply Voltage @ 30°C  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
0
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
SUPPLY VOLTAGE (V)  
Figure 8. Shutdown Current vs. Supply Voltage @ 30°C  
Rev. B | Page 7 of 16  
 
ADT7301  
5
4
3
2
5
4
3
2
UPPER TEMPERATURE  
ERROR LIMIT  
UPPER TEMPERATURE  
ERROR LIMIT  
1
0
1
0
–1  
–2  
–3  
–1  
–2  
–3  
LOWER TEMPERATURE  
ERROR LIMIT  
LOWER TEMPERATURE  
ERROR LIMIT  
–4  
–5  
–4  
–5  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 11. Temperature Accuracy of 40 ADT7301s @ 3.3 V  
Figure 12. Temperature Accuracy of 40 ADT7301s @ 5 V  
Rev. B | Page 8 of 16  
 
ADT7301  
THEORY OF OPERATION  
The ADT7301 is a 13-bit digital temperature sensor with a 14th  
bit that acts as a sign bit. The part houses an on-chip temperature  
sensor, a 13-bit A/D converter, a reference circuit, and serial  
interface logic functions in SOT-23 and MSOP packages. The  
ADC section consists of a conventional successive approximation  
converter based around a capacitor DAC. The parts run on a  
2.7 V to 5.25 V power supply.  
The ADT7301 can be placed into shutdown mode via the control  
register. This means that the on-chip oscillator is shut down and  
no further conversions are initiated until the ADT7301 is taken  
out of shutdown mode. The ADT7301 can be taken out of  
shutdown mode by writing all 0s into the control register. The  
conversion result from the last conversion prior to shutdown  
can still be read from the ADT7301 even when it is in shutdown  
mode.  
The on-chip temperature sensor allows an accurate measure-  
ment of the ambient device temperature to be made. The  
specified measurement range of the ADT7301 is −40°C to  
+150°C. Greater than 125°C, the ADT7301 is limited to 5%  
of its 55°C operational lifetime. The structural integrity of the  
device may start to deteriorate when continuously operated at  
absolute maximum voltage and temperature specifications.  
In normal conversion mode, the internal clock oscillator is reset  
after every read or write operation. This causes the device to start  
a temperature conversion, the result of which is typically available  
1.2 ms later. Similarly, when the part is taken out of shutdown  
mode, the internal clock oscillator is started and a conversion is  
initiated. The conversion result is available 1.2 ms later. Every  
result is stored in a buffer register and is loaded into the  
temperature value register only at the first falling SCLK edge of  
every serial port activity. Serial port activity does not interfere  
with conversion processes, and every conversion is completed,  
even during a read operation. A conversion has to be completed  
before a read occurs, otherwise its result is not loaded into the  
temperature value register and instead is loaded into the buffer  
register. A new conversion is triggered at the end of each serial  
port activity, except when a conversion is already in progress.  
CONVERTER DETAILS  
The conversion clock for the part is internally generated. No  
external clock is required except when reading from and writing  
to the serial port. In normal mode, an internal clock oscillator  
runs an automatic conversion sequence. During this automatic  
conversion sequence, a conversion is initiated every 1.5 second.  
At this time, the part powers up its analog circuitry and performs  
a temperature conversion. This temperature conversion typically  
takes 1.2 ms, after which the analog circuitry of the part auto-  
matically shuts down. The analog circuitry powers up again when  
the 1.5 second timer times out and the next conversion begins.  
Since the serial interface circuitry never shuts down, the result  
of the most recent temperature conversion is always available in  
the serial output register.  
Rev. B | Page 9 of 16  
 
 
ADT7301  
Temperature Conversion Equations  
Positive Temperature = ADC Code(d)/32  
Negative Temperature = (ADC Code(d)1 − 16384)/32  
TEMPERATURE VALUE REGISTER  
The temperature value register is a 14-bit read-only register that  
stores the temperature reading from the ADC in 13-bit twos  
complement format plus a sign bit. The MSB (DB13) is the sign  
bit. The ADC can theoretically measure a 255°C temperature  
span. The internal temperature sensor is guaranteed to a low  
value limit of −40°C and a high limit of +150°C. The temperature  
data format is shown in Table 5, which shows the temperature  
measurement range of the device (−40°C to +150°C). The  
typical performance curve is shown in Figure 11.  
Negative Temperature = (ADC Code(d)2 − 8192)/32  
01, 0010, 1100, 0000  
75°C  
00, 1001, 0110, 0000  
Table 5. Temperature Data Format  
Temperature  
Digital Output DB13 … DB0  
11, 1011 0000 0000  
11, 1100 0100 0000  
11, 1100 1110 0000  
11, 1110 1100 0000  
11, 1111 1111 1111  
00, 0000 0000 0000  
00, 0000 0000 0001  
00, 0001 0100 0000  
00, 0011 0010 0000  
00, 0110 0100 0000  
00, 1001 0110 0000  
00, 1100 1000 0000  
00, 1111 1010 0000  
01, 0010 1100 0000  
00, 0000, 0000, 0001  
–0.03125°C  
−40°C  
−30°C  
−25°C  
−10°C  
−0.03125°C  
0°C  
+0.03125°C  
+10°C  
+25°C  
+50°C  
11, 1111, 1111, 1111  
11, 1100, 0100, 0000  
TEMPERATURE (°C)  
150°C  
–40°C  
–30°C  
11, 1011, 0000, 0000  
Figure 13. Temperature-to-Digital Transfer Function  
1 ADC code uses all 14 bits of the data byte, including the sign bit.  
2 DB13 (the sign bit) is removed from the ADC code.  
+75°C  
+100°C  
+125°C  
+150°C  
Rev. B | Page 10 of 16  
 
 
ADT7301  
CS  
t1  
t7  
t2  
15  
SCLK  
2
3
4
1
16  
t3  
t8  
t4  
DB0  
DB1  
LEADING ZEROS  
DB13  
t6  
DB12  
DOUT  
DIN  
t5  
POWER-  
DOWN  
Figure 14. Serial Interface Timing Diagram  
SERIAL INTERFACE  
Read Operation  
Figure 14 shows the timing diagram for a serial read from the  
CS  
The serial interface on the ADT7301 consists of four wires:  
CS  
ADT7301. The  
line enables the SCLK input. Thirteen bits of  
, SCLK, DIN, and DOUT. The interface can be operated in  
data plus a sign bit are transferred during a read operation.  
Read operations occur during streams of 16 clock pulses. The  
first 2 bits out are leading zeros and the next 14 bits contain the  
3-wire mode with DIN tied to ground, in which case the inter-  
face has read-only capability, with data being read from the data  
CS  
register via the DOUT line. It is advisable to always use  
to  
CS  
temperature data. If  
remains low and 16 more SCLK cycles  
create a communications window, as shown in Figure 14; this  
improves synchronization between the ADT7301 and the master  
device. The DIN line is used to write the part into standby mode,  
CS  
are applied, the ADT7301 loops around and outputs the two  
leading zeros plus the 14 bits of data that are in the temp-  
CS  
erature value register. When  
returns high, the DOUT line  
if required. The  
line is used to select the device when more  
goes into three-state. Data is clocked out onto the DOUT line  
on the falling edge of SCLK.  
than one device is connected to the serial clock and data lines.  
The part operates in a slave mode and requires an externally  
applied serial clock to the SCLK input to access data from the  
data register. The serial interface on the ADT7301 allows the  
part to be interfaced to systems that provide a serial clock  
synchronized to the serial data, such as the 80C51, 87C51,  
68HC11, 68HC05, and PIC16Cxx microcontrollers as well as  
DSP processors.  
Write Operation  
Figure 14 also shows the timing diagram for a serial write to the  
ADT7301. The write operation takes place at the same time as  
the read operation. Only the third bit in the data stream provides  
a user-controlled function. This third bit is the power-down bit,  
which, when set to 1, puts the ADT7301 into shutdown mode.  
In addition to the power-down bit, all bits in the input data  
stream should be 0 to ensure correct operation of the ADT7301.  
Data is loaded into the control register on the 16th rising SCLK  
edge; the data takes effect at this time. Therefore, if the part is  
A read operation from the ADT7301 accesses data from the  
temperature value register, while a write operation to the part  
writes data to the control register.  
CS  
programmed to go into shutdown, it does so at this point. If  
is brought high before this 16th SCLK edge, the control register  
is not loaded and the power-down status of the part does not  
change. Data is clocked into the ADT7301 on the rising edge  
of SCLK.  
Rev. B | Page 11 of 16  
 
 
ADT7301  
APPLICATIONS INFORMATION  
MICROPROCESSOR INTERFACING  
In the example shown in Figure 16, the ADT7301 is connected  
to the serial port of the 8051. Because the serial interface of the  
8051 contains only one data line, the DIN line of the ADT7301  
is tied low in Figure 16.  
The ADT7301 serial interface allows easy interface to most  
microcomputers and microprocessors. Figure 15 to Figure 18  
show some typical interface circuits. The serial interface on the  
CS  
ADT7301 consists of four wires: , DIN, DOUT, and SCLK.  
For applications that require the ADT7301 power-down feature,  
the serial interface should be implemented using data port lines  
on the 8051. This allows a full-duplex serial interface to be  
implemented. The method involves generating a serial clock on  
one port line while using two other port lines to shift data  
All interface circuits shown use all four interface lines. However,  
it is possible to operate the interface with three wires. If the  
application does not require the power-down facility offered  
by the ADT7301, the DIN line can be tied low permanently.  
Thus, the interface can be operated from just three wires: SCLK,  
CS  
in and out with the fourth port line connecting to . Port  
CS  
, and DOUT.  
lines 1.0 to 1.3 (with P1.1 configured as an input) can be used  
CS  
to connect to SCLK, DOUT, DIN, and , respectively, to  
implement this scheme.  
The serial data transfer to and from the ADT7301 requires a  
16-bit read operation. Many 8-bit microcontrollers have 8-bit  
serial ports, and this 16-bit data transfer is handled as two 8-bit  
transfers. Other microcontrollers and DSP processors transfer  
16 bits of data in a serial data operation.  
8051*  
ADT7301*  
P3.1  
P3.0  
P1.2  
P1.3  
SCLK  
DOUT  
DIN  
ADT7301-to-MC68HC11 Interface  
Figure 15 shows an interface circuit between the ADT7301 and  
the MC68HC11 microcontroller. The MC68HC11 is configured  
in master mode with its CPOL and CPHA bits set to a Logic 1.  
When the MC68HC11 is configured like this, its SCLK line idles  
high between data transfers. Data is transferred to and from the  
ADT7301 in two 8-bit serial data operations. Figure 15 shows  
the full (4-wire) interface. PC1 of the MC68HC11 is configured  
CS  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 16. ADT7301-to-8051 Interface  
ADT7301-to-PIC16C6x/7x Interface  
CS  
as an output and is used to drive the  
input.  
Figure 17 shows an interface circuit between the ADT7301 and  
the PIC16C6x/7x microcontroller. The PIC16C6x/7x synchro-  
nous serial port (SSP) is configured as an SPI master with the  
clock polarity bit set to a Logic 1. In this mode, the serial clock  
line of the PIC16C6x/7x idles high between data transfers. Data  
is transferred to and from the ADT7301 in two 8-bit serial data  
operations. In the example shown in Figure 17, port line RA1 is  
MC68HC11*  
SCLK  
ADT7301*  
SCLK  
DOUT  
DIN  
MISO  
MOSI  
PC1  
CS  
CS  
being used to generate the  
for the ADT7301.  
*ADDITIONAL PINS OMITTED FOR CLARITY  
PIC16C6x/7x*  
SCK  
ADT7301*  
SCLK  
Figure 15. ADT7301-to-MC68HC11 Interface  
ADT7301-to-8051 Interface  
SDO  
SDI  
DOUT  
DIN  
Figure 16 shows an interface circuit between the ADT7301 and  
the microcontroller. The 8051 is configured in its Mode 0 serial  
interface mode. The serial clock line of the 8051 (on P3.1) idles  
high between data transfers. Data is transferred to and from the  
ADT7301 in two 8-bit serial data operations. The ADT7301  
outputs the MSB of its data stream as the first valid bit while the  
8051 expects the LSB first. Thus, the data read into the serial  
buffer needs to be rearranged before the correct data-word from  
the ADT7301 is available in the accumulator.  
RA1  
CS  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 17. ADT7301-to-PIC16C6x/7x Interface  
Rev. B | Page 12 of 16  
 
 
 
 
 
ADT7301  
The following software program shows how to program a  
PIC16F873 to communicate with the ADT7301. The  
PIC16F873 is configured as an SPI master with the Port A.1 pin  
CS  
used as . Any microchip microcontroller can use this  
program by simply exchanging the include file for the device  
that is being used.  
#include <16F873.h>  
#device adc = 8  
#use delay(clock = 4000000)  
#fuses NOWDT,XT, PUT, NOPROTECT, BROWNOUT, LVP  
#BIT CKP = 0x14.4  
#define CS PIN_A1  
void main(){  
int MSByte,LSByte;  
long int ADC_Temp_Code;  
float TempVal,ADC_Temp_Code_dec;  
setup_spi(spi_master);  
CKP = 1;  
//Pic is set up as master device.  
//Idle state of clock is high.  
do{  
delay_ms(10);  
//Allow time for conversions.  
Output_low(CS);  
//Pull CS low.  
delay_us(10);  
MSByte = SPI_Read(0);  
LSByte = SPI_Read(0);  
//CS to SCLK set-up time.  
//The first byte is clocked in.  
//The second byte is clocked in.  
delay_us(10);  
Output_High(CS);  
//SCLK to CS set-up time.  
//Bring CS high.  
ADC_Temp_Code = make16(MSByte,LSByte);  
ADC_Temp_Code_dec = (float)ADC_Temp_Code;  
//16 bit ADC code is stored ADC_Temp_Code.  
//Convert to float for division.  
if ((0x2000 & ADC_Temp_Code) == 0x2000)  
//Check sign bit for negative value.  
{
TempVal = (ADC_Temp_Code_dec - 16384)/32;  
//Conversion formula if negative temperature.  
}
else  
{
TempVal = (ADC_Temp_Code_dec/32);  
}
//Conversion formula if positive temperature.  
//Temperature value stored in TempVal.  
}while(True);  
}
Rev. B | Page 13 of 16  
ADT7301  
ADT7301-to-ADSP-21xx Interface  
MOUNTING THE ADT7301  
Figure 18 shows an interface between the ADT7301 and the  
ADSP-21xx DSP processor. To ensure correct operation of the  
interface, the SPORT control register should be set up as follows:  
The ADT7301 can be used for surface or air temperature  
sensing applications. If the device is cemented to a surface with  
a thermally conductive adhesive, the die temperature will be  
within about 0.1°C of the surface temperature because of the  
ADT7301s low power consumption. Care should be taken to  
insulate the back and leads of the device if the ambient air  
temperature is different from the surface temperature being  
measured.  
TFSW = RFSW = 1, alternate framing  
INVRFS = INVTFS = 1, active low framing signal  
DTYPE = 00, right justify data  
SLEN = 1111, 16-bit data-words  
ISCLK = 1, internal serial clock  
TFSR = RFS = 1, frame every word  
IRFS = 0, RFS configured as input  
ITFS = 1, TFS configured as output  
The ground pin provides the best thermal path to the die;  
therefore, the temperature of the die is close to that of the  
printed circuit ground track. Care should be taken to ensure  
that this is in good thermal contact with the measured surface.  
The interface requires an inverter between the SCLK line of the  
ADSP-21xx and the SCLK input of the ADT7301. On the  
ADSP-21xx interface, the TFS and RFS of the SPORT are tied  
together; TFS is set as an output, and RFS is set as an input. The  
DSP operates in alternate framing mode and the SPORT control  
register is set up as described in this section.  
As in any IC, the ADT7301 and its associated wiring and  
circuits must be kept free from moisture to prevent leakage and  
corrosion, particularly in cold conditions where condensation is  
more likely to occur. Water-resistant varnishes and conformal  
coatings can be used for protection. The small size of the  
ADT7301 allows it to be mounted inside sealed metal probes,  
which provide a safe environment for the device.  
ADSP-21xx*  
ADT7301*  
SCK  
SCLK  
DOUT  
DIN  
SUPPLY DECOUPLING  
DR  
The ADT7301 should be decoupled with a 0.1 µF ceramic  
capacitor between VDD and GND. This is particularly important  
if the ADT7301 mount is remote from the power supply.  
DT  
CS  
RFS  
TFS  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 18. ADT7301-to-ADSP-21xx Interface  
Rev. B | Page 14 of 16  
 
 
 
ADT7301  
OUTLINE DIMENSIONS  
3.00  
2.90  
2.80  
6
1
5
2
4
3
3.00  
2.80  
2.60  
1.70  
1.60  
1.50  
PIN 1  
INDICATOR  
0.95 BSC  
1.90  
BSC  
1.30  
1.15  
0.90  
0.20 MAX  
0.08 MIN  
1.45 MAX  
0.95 MIN  
0.55  
0.45  
0.35  
0.15 MAX  
0.05 MIN  
10°  
4°  
0°  
SEATING  
PLANE  
0.60  
BSC  
0.50 MAX  
0.30 MIN  
COMPLIANT TO JEDEC STANDARDS MO-178-AB  
Figure 19. 6-Lead Small Outline Transistor Package [SOT-23]  
(RJ-6)  
Dimensions shown in millimeters  
3.20  
3.00  
2.80  
8
1
5
4
5.15  
4.90  
4.65  
3.20  
3.00  
2.80  
PIN 1  
IDENTIFIER  
0.65 BSC  
0.95  
0.85  
0.75  
15° MAX  
1.10 MAX  
0.80  
0.55  
0.40  
0.15  
0.05  
0.23  
0.09  
6°  
0°  
0.40  
0.25  
COPLANARITY  
0.10  
COMPLIANT TO JEDEC STANDARDS MO-187-AA  
Figure 20. 8-Lead Mini Small Outline Package [MSOP]  
(RM-8)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model1  
Temperature Range  
−40°C to +150°C  
−40°C to +150°C  
−40°C to +150°C  
−40°C to +150°C  
Temperature Accuracy2 Package Description  
Package Option  
Branding  
T1H  
T1H  
T1H  
T1H  
ADT7301ARTZ-500RL7  
ADT7301ARTZ-REEL7  
ADT7301ARMZ  
ADT7301ARMZ-REEL7  
EVAL-ADT7301EBZ  
1°C  
1°C  
1°C  
1°C  
6-Lead SOT-23  
6-Lead SOT-23  
8-Lead MSOP  
8-Lead MSOP  
Evaluation Board  
RJ-6  
RJ-6  
RM-8  
RM-8  
1 Z = RoHS Compliant Part.  
2 Temperature accuracy is over a 0°C to 70°C temperature range.  
Rev. B | Page 15 of 16  
 
 
ADT7301  
NOTES  
©2005–2011 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D02884–0–6/11(B)  
Rev. B | Page 16 of 16  

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