HMC1022A [ADI]
IC MMIC POWER AMP DIE;
| 型号： | HMC1022A |
| 厂家： | 
ADI |
| 描述： | IC MMIC POWER AMP DIE |
| 文件： | 总3页 (文件大小：675K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HMC1022A
v01.1215
GaAs pHEMT MMIC
0.25 WATT POWER AMPLIFIER, DC - 48 GHz
Typical Applications
Features
Tꢀꢁ hmC1022A ꢂꢃ ꢂdꢁaꢉ ꢋꢆꢅ:
• Tꢁꢃt iꢊꢃtꢅuꢈꢁꢊtatꢂꢆꢊ
• mꢂcꢅꢆꢇavꢁ radꢂꢆ & VsAT
• mꢂꢉꢂtaꢅy & sꢄacꢁ
hꢂgꢀ p1dB outꢄut pꢆꢇꢁꢅ: 22 dBꢈ
hꢂgꢀ pꢃat outꢄut pꢆꢇꢁꢅ: 24 dBꢈ
hꢂgꢀ Gaꢂꢊ: 12 dB
hꢂgꢀ outꢄut ip3: 32 dBꢈ
• Tꢁꢉꢁcꢆꢈ iꢊꢋꢅaꢃtꢅuctuꢅꢁ
• fꢂbꢁꢅ oꢄtꢂcꢃ
suꢄꢄꢉy Vꢆꢉtagꢁ: +10 V @ 150 ꢈA
50 oꢀꢈ matcꢀꢁd iꢊꢄut/outꢄut
Dꢂꢁ sꢂzꢁ: 2.82 x 1.50 x 0.1 ꢈꢈ
Functional Diagram
General Description
Tꢀꢁ hmC122A a GaAꢃ ꢄhemT mmiC Dꢂꢃtꢅꢂb-
utꢁd pꢆꢇꢁꢅ Aꢁꢅ ꢇꢀꢂcꢀ ꢆꢄꢁꢅatꢁꢃ bꢁtꢇꢁꢁꢊ DC
aꢊd 48 Ghz. ꢁ aꢈꢄꢉꢂfiꢁꢅ ꢄꢅꢆvꢂdꢁꢃ 12 dB ꢆꢋ gaꢂꢊ,
32 Bꢈ ꢆutꢄut ip3 aꢊd +22 dBꢈ ꢆꢋ ꢆutꢄut ꢄꢆꢇꢁꢅ at
dB gaꢂꢊ cꢆꢈꢄꢅꢁꢃꢃꢂꢆꢊ ꢇꢀꢂꢉꢁ ꢅꢁquꢂꢅꢂꢊg 150 ꢈA ꢋꢅꢆꢈ
a +0 V ꢃuꢄꢄꢉy. Tꢀꢁ hmC1022A ꢁxꢀꢂbꢂtꢃ a ꢃꢉꢂgꢀtꢉy
ꢄꢆꢃꢂtꢂvꢁ gaꢂꢊ ꢃꢉꢆꢄꢁ ꢋꢅꢆꢈ 10 tꢆ 35 Ghz, ꢈakꢂꢊg
ꢂt ꢂdꢁaꢉ ꢋꢆꢅ ew, eCm, radaꢅ aꢊd tꢁꢃt ꢁquꢂꢄꢈꢁꢊt
aꢄꢄꢉꢂcatꢂꢆꢊꢃ. Tꢀꢁ hmC1022A aꢈꢄꢉꢂfiꢁꢅ i/oꢃ aꢅꢁ
ꢂꢊtꢁꢅꢊaꢉꢉy ꢈatcꢀꢁd tꢆ 50 oꢀꢈꢃ ꢋacꢂꢉꢂtatꢂꢊg ꢂꢊtꢁgꢅa-
tꢂꢆꢊ ꢂꢊtꢆ muꢉtꢂ-Cꢀꢂꢄ-mꢆduꢉꢁꢃ (mCmꢃ). Aꢉꢉ data ꢂꢃ
takꢁꢊ ꢇꢂtꢀ tꢀꢁ cꢀꢂꢄ cꢆꢊꢊꢁctꢁd vꢂa tꢇꢆ 0.025 ꢈꢈ
(1 ꢈꢂꢉ) ꢇꢂꢅꢁ bꢆꢊdꢃ ꢆꢋ ꢈꢂꢊꢂꢈaꢉ ꢉꢁꢊgtꢀ 0.31 ꢈꢈ (12 ꢈꢂꢉꢃ).
Electrical Specifications, TA = +25° C, Vdd = +10 V, Vgg2 = +4.5 V, Idd = 150 mA [1]
paꢅaꢈꢁtꢁꢅ
fꢅꢁquꢁꢊcy raꢊgꢁ
mꢂꢊ.
Tyꢄ.
DC - 16
11.5
0.5
max.
mꢂꢊ.
Tyꢄ.
16 - 36
12
max.
mꢂꢊ.
Tyꢄ.
36 - 48
11.5
1.1
max.
Uꢊꢂtꢃ
Ghz
dB
Gaꢂꢊ
9.5
9.5
9.5
Gaꢂꢊ fꢉatꢊꢁꢃꢃ
0.3
dB
Gaꢂꢊ Vaꢅꢂatꢂꢆꢊ ovꢁꢅ Tꢁꢈꢄꢁꢅatuꢅꢁ
iꢊꢄut rꢁtuꢅꢊ lꢆꢃꢃ
0.012
18
0.018
16
0.041
15
dB/ °C
dB
outꢄut rꢁtuꢅꢊ lꢆꢃꢃ
28
22
18
dB
outꢄut pꢆꢇꢁꢅ ꢋꢆꢅ 1 dB Cꢆꢈꢄꢅꢁꢃꢃꢂꢆꢊ (p1dB)
satuꢅatꢁd outꢄut pꢆꢇꢁꢅ (pꢃat)
outꢄut Tꢀꢂꢅd oꢅdꢁꢅ iꢊtꢁꢅcꢁꢄt (ip3)
nꢆꢂꢃꢁ fꢂguꢅꢁ
20
22
19.5
21.5
23.5
32
16
19
dBꢈ
dBꢈ
dBꢈ
dB
24.5
35
21
29
4
5.5
8
suꢄꢄꢉy Cuꢅꢅꢁꢊt
(idd) (Vdd= 10V, Vgg1= -0.8V Tyꢄ.)
150
150
150
ꢈA
[1] Adjuꢃt Vgg1 bꢁtꢇꢁꢁꢊ -2 tꢆ 0 V tꢆ acꢀꢂꢁvꢁ idd = 150 ꢈA tyꢄꢂcaꢉ.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
1
HMC1022A
v01.1215
GaAs pHEMT MMIC
0.25 WATT POWER AMPLIFIER, DC - 48 GHz
Pad Descriptions
pad nuꢀbꢁꢂ
fuꢃctꢄꢅꢃ
Dꢁꢆcꢂꢄꢇtꢄꢅꢃ
iꢃtꢁꢂꢈacꢁ scꢉꢁꢀatꢄc
Tꢉꢄꢆ ꢇad ꢄꢆ DC cꢅuꢇꢊꢁd aꢃd ꢀatcꢉꢁd
tꢅ 50 oꢉꢀꢆ. Bꢊꢅckꢄꢃg caꢇacꢄtꢅꢂ ꢄꢆ ꢂꢁquꢄꢂꢁd.
1
rfin
Gatꢁ cꢅꢃtꢂꢅꢊ 2 ꢈꢅꢂ aꢀꢇꢊꢄfiꢁꢂ. Attacꢉ byꢇaꢆꢆ
caꢇacꢄtꢅꢂ ꢇꢁꢂ aꢇꢇꢊꢄcatꢄꢅꢃ cꢄꢂcuꢄt ꢉꢁꢂꢁꢄꢃ. fꢅꢂ ꢃꢅꢀꢄꢃaꢊ
ꢅꢇꢁꢂatꢄꢅꢃ +4.5V ꢆꢉꢅuꢊd bꢁ aꢇꢇꢊꢄꢁd tꢅ Vgg2.
2
VGG2
lꢅꢋ ꢈꢂꢁquꢁꢃcy tꢁꢂꢀꢄꢃatꢄꢅꢃ. Attacꢉ byꢇaꢆꢆ
caꢇacꢄtꢅꢂ ꢇꢁꢂ aꢇꢇꢊꢄcatꢄꢅꢃ cꢄꢂcuꢄt ꢉꢁꢂꢁꢄꢃ.
4, 7
3
ACG2, ACG4
ACG1
lꢅꢋ ꢈꢂꢁquꢁꢃcy tꢁꢂꢀꢄꢃatꢄꢅꢃ. Attacꢉ byꢇaꢆꢆ
caꢇacꢄtꢅꢂ ꢇꢁꢂ aꢇꢇꢊꢄcatꢄꢅꢃ cꢄꢂcuꢄt ꢉꢁꢂꢁꢄꢃ.
rf ꢅutꢇut ꢈꢅꢂ aꢀꢇꢊꢄfiꢁꢂ. Cꢅꢃꢃꢁct DC bꢄaꢆ (Vdd) ꢃꢁtꢋꢅk tꢅ
ꢇꢂꢅvꢄdꢁ dꢂaꢄꢃ cuꢂꢂꢁꢃt (idd). sꢁꢁ aꢇꢇꢊꢄcatꢄꢅꢃ cꢄꢂcuꢄt ꢉꢂꢁꢄꢃ.
5
rfoUT & VDD
lꢅꢋ ꢈꢂꢁquꢁꢃcy tꢁꢂꢀꢄꢃatꢄꢅꢃ. Attacꢉ yꢇaꢆꢆ
caꢇacꢄtꢅꢂ ꢇꢁꢂ aꢇꢇꢊꢄcatꢄꢅꢃ cꢄꢂcuꢄt ꢉꢂꢁꢄꢃ.
6
ACG3
Gatꢁ cꢅꢃtꢂꢅꢊ 1 ꢈꢅꢂ aꢊꢄfiꢁꢂ. Attcꢉ byꢇaꢆꢆ
caꢇacꢄtꢅꢂ ꢇꢁꢂ aꢇꢇꢊꢄatꢄꢅꢃ ꢄꢂcuꢄt ꢉꢁꢂꢁꢄꢃ. pꢊꢁaꢆꢁ
ꢈꢅꢊꢊꢅꢋ “mmiC Aꢇꢊꢄfiꢁꢂ Bꢄaꢄꢃg pꢂꢅcꢁduꢂꢁ”
aꢇꢇꢊꢄatꢄꢅꢃ ꢃꢅtꢁ.
8
VGG1
GnD
Dꢄꢁ Bꢅttꢅꢀ
Dꢄꢁ bꢅttꢅꢀ ꢀut bꢁ cꢅꢃꢃꢁctꢁd tꢅ rf/DC gꢂꢅuꢃd.
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
2
Application Support: Phone: 1-800-ANALOG-D
HMC1022A
v01.1215
GaAs pHEMT MMIC
0.25 WATT POWER AMPLIFIER, DC - 48 GHz
Outline Drawing
Die Packaging Information [1]
noTes:
1. All Dimensions in inChes [millimeTers]
2. Die ThiCKness is 0.004 (0.100)
3. TYpiCAl BonD pAD is 0.004 (0.100) sQUAre
4. BonD pAD meTAliZATion: GolD
staꢀdaꢁd
Aꢂtꢃꢁꢀatꢃ
Gp-1 (Gꢃꢂ pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
5. BACKsiDe meTAlliZATion: GolD
6. BACKsiDe meTAl is GroUnD
7. no ConneCTion reQUireD for UnlABeleD BonD pADs
[2] For alternate packaging information contact Hittite
Microwave Corporation.
8. oVerAll Die siZe is .002
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
3
Application Support: Phone: 1-800-ANALOG-D
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