HMC560A [ADI]
HMC560A;
ADI 
HMC560A
v03.0216
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
Typical Applications
Features
The HMC560A is ideal for:
• Test Equipment & Sensors
• Point-to-Point Radios
• Point-to-Multi-Point Radios
• Military & Space
Wide IF Bandwidth: DC - 17 GHz
Input IP3: +21 dBm
High LO/RF Isolation: 35 dB
10
Passive Double Balanced Topology
Leadless RoHS Compliant SMT Package, 25 mm2
Functional Diagram
General Description
The HMC560A is a 24 - 40 GHz passive, double-
balanced MMIC mixein a SMleadless chip carrier
package. The mr is fabricated in a GaAs MESFET
process, and be used as a downconverter or
upconverter. Thwide operating bandwidth allows this
deve to be used across multiple radio bands with a
common platform. Excellent isolations are provided by
on-chip baluns. The HMC560A requires no external
cmponents and no DC bias. All data is with the non-
hermetic, epoxy sealed LM3 package mounted in a 50
Ohm test fixture. Utilizing the HMC560A eliminates the
need for wire bonding, thereby providing a consistent
connection interface for the customer, and allowing
the use of surface mount manufacturing techniques.
Electrical Specifications, TA = +25° C, IF = 1 GHz, LO = +13 dBm*
Parameter
Frequency Range, RF & LO
Frequency Range, IF
Conversion Loss
Min.
Typ.
24 - 36
DC - 17
10
Max.
Min.
Typ.
36 - 40
DC - 17
11
Max.
Units
GHz
GHz
dB
12
12
14
14
Noise Figure (SSB)
LO to RF Isolation
LO to IF Isolation
10
11
dB
25
23
16
35
22
18
20
28
dB
30
25
dB
RF to IF Isolation
20
25
dB
IP3 (Input)
18
21
dBm
dBm
dBm
IP2 (Input)
50
40
1 dB Compression (Input)
13
15
* Unless otherwise noted, all measurements performed as downconverter
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
10 - 1
HMC560A* Product Page Quick Links
Last Content Update: 11/01/2016
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Data Sheet
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• HMC560A: GaAs MMIC Fundamental SMT Mixer, 24 - 40
GHz Preliminary Data Sheet
Technical Support
Submit a technical question or find your regional support
number
Design Resources
• HMC560A Material Declaration
• PCN-PDN Information
• Quality And Reliability
• Symbols and Footprints
* This page was dynamically generated by Analog Devices, Inc. and inserted into this data sheet. Note: Dynamic changes to
the content on this page does not constitute a change to the revision number of the product data sheet. This content may be
frequently modified.
HMC560A
v03.0216
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
MxN Spurious
Outputs as a Down Converter
Absolute Maximum Ratings
RF / IF Input
+25 dBm
nLO
LO Drive
+23 dBm
mRF
0
xx
3
1
-5
0
2
3
4
IF DC Current
Channel Temperature
2 mA
0
1
2
3
4
5
150 °C/W
25
49
73
88
10
Continuous Pdiss (T= 85 °C )
58
48
78
58
63
85
0.344 W
(derate 5.3 mW/ °C above 85 °C)
83
89
Thermal Resistance (RTH
)
188 °C/W
(channel to package bottom)
RF = 24 GHz @ -10 dBm
LO = 25 GHz @ +13 dBm
Storage Temperature
-65 to +150 °C
-55 to +85 °C
Operating Temperature
All values in dBc below IF tput poer level.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
NOTES:
1. MATERIAL: PLASTIC
2. PLATING: GOLD OVER NICKEL
3. ALL DIMENSIONS IN INCHES (MILLIMETERS)
4. ALL TOLERANCES ARE 0.005 ( 0.13)
5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND
6.
INDICATES PIN 1
•
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
10 - 4
Application Support: Phone: 1-800-ANALOG-D
HMC560A
v03.0216
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
Pin Descriptions
Pin Number
Function
Description
Interface Schematic
This pin may be connected to the PCB ground
or left unconnected.
1, 2, 3
N/C
10
This pin is DC coupled
and matched to 50 Ohms.
4
5
6
RF
This pin is DC coupled. For applications not requiring
operation to DC, this port should be DC blocked externally
using a series capacitor whose value has been chosen to
pass the necessary IF frequency range. For operation to DC,
this pin must not source or sink more than 2 mA of currnt or
part non-function and possible part failure will reslt.
IF
This pin is DC coupled
and matched to 50 Oms.
LO
GND
Package bae muse soldereto PCB RF ground.
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
10 - 5
Application Support: Phone: 1-800-ANALOG-D
HMC560A
v03.0216
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
Evaluation PCB
10
The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-Signal-Ground
(GSG) probes for testing. Suggested probe ptch is 400 mm (16 mils).
Evaluation Circuard Layout Design Details
Layout Technique
Material
MicStrip to CPWG
Rogers 4003 with 1/2 oz. Cu
0.008” (0.20 mm)
Dielectric Thickness
Microstrip Line Width
CPWG Line Width
CPWG Line to GND Gap
Ground Via Hole Diameter
0.018” (0.46 mm)
0.016” (0.41 mm)
0.005” (0.13 mm)
0.008” (0.20 mm)
LM3 package mounted to evaluation PCB
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
10 - 6
Application Support: Phone: 1-800-ANALOG-D
HMC560A
v03.0216
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
Suggested LM3 PCB Land Pattern
10
NOTES:
1. DIMENSIONS ARE IN INCHES [MILLIMETERS]
2. PAD WIDTH SHOWN IS FOR SOLDERING ONLY.
BEYOND SOLDERING AREA ALL CONDUCTORS THAT
CARRY RF AND MICROWAVE SIGNALS SHOULD
HAVE 50 OHM CHARACTERISTIC IMPEDANCE.
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
10 - 7
Application Support: Phone: 1-800-ANALOG-D
HMC560A
v03.0216
GaAs MMIC FUNDAMENTAL
SMT MIXER, 24 - 40 GHz
Recommended SMT Attachment Technique
Preparation & Handling of the LM3 Millimeterwave Package for Surface Mounting
225
The HMC LM3 package was designed to be compatible with high
200
volume surface mount PCB assembly processes. The LM3 package
175
requires a specific mounting pattern to allow proper mechanical
10
attachment and to optimize electrical performance at millimeter wave
frequencies. This PCB layout pattern can be found on each LM3
product data sheet. It can also be provided as an electronic drawing
upon request from Hittite Sales & Application Engineering.
150
125
100
75
50
Follow these precautions to avoid permanent damage:
25
Cleanliness: Observe proper handling procedures to ensure clean
devices and PCBs. LM3 devices should remain in their original
0
1
2
3
4
5
6
7
8
TIM(min)
packaging until component placement to ensure no contamination or damge tF, DC & ground contact areas.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
General Handling: Handle the LM3 package on the top wih a vuum collet or along the edges with a sharp pair
of bent tweezers. Avoiding damaging the RF, DC, & ground cntacton the package bottom. Do not apply excess
pressure to the top of the lid.
Solder Materials & Temperature Profile: Follow the information contained in the application note. Hand soldering is not
recommended. Conductive epoxy attachment is norecommended.
Solder Paste: Solder paste should be seleced baed on the user’s experience and be compatible with the metalization
systems used. See the LM3 data sheet Outline drawing for pin & ground contact metalization schemes.
Solder Paste Application: Solder paste erally applied to the PCB using either a stencil printer or dot placement.
The volume of solder paste will be dndenon PCB and component layout and should be controlled to ensure
consistent mechanical & electricperformance. Excess solder may create unwanted electrical parasitics at high
frequencies.
Solder Reflow: The sprocess is usually accomplished in a reflow oven but may also use a vapor phase
process. A solder reflow ofile is suggested above.
Prior to reflowing product, temperature profiles should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and
varying component masses. The final profile should be determined by mounting the thermocouple to the PCB at the
location of the device.
Follow solder paste and oven vendor’s recommendations when developing a solder reflow profile. A standard profile
will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock.
Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to evaporate and the
flux to completely activate. Reflow must then occur prior to the flux being completely driven off. The duration of peak
reflow temperature should not exceed 15 seconds. Packages have been qualified to withstand a peak temperature of
235°C for 15 seconds. Verify that the profile will not expose device to temperatures in excess of 235°C.
Cleaning: A water-based flux wash may be used.
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
10 - 8
Application Support: Phone: 1-800-ANALOG-D
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