CEXPRESS-AL-E3930 [ADLINK]
COM Express Compact Size Type 6 Module;
| 型号： | CEXPRESS-AL-E3930 |
| 厂家： | 
ADLINK |
| 描述： | COM Express Compact Size Type 6 Module |
| 文件： | 总4页 (文件大小：613K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
cExpress-AL
COM Express Compact Size Type 6 Module with Intel Atom® E3900 series
and Pentium®/Celeron® SoC
Features
Intel Atom® E3900 series (formerly Apollo Lake)
●
and Pentium®/Celeron® SOC, supporting full
virtualization (VT-d/VT-x)
●
Supports IEEE 1588 Precision Time Protocol (PTP)
●
Up to 8GB dual channel non-ECC DDR3L at 1867/1600 MHz
●
Two DDI channels, one LVDS (VGA/eDP by build option),
supports up to 3 independent displays
●
Up to Five PCIe x1 Gen2 (by PCIe bridge IC, build option)
●
Two SATA 6 Gb/s, three USB 3.0/2.0, five USB 2.0 and eMMC 5.0
(build option)
●
Extreme Rugged operating temperature: -40°C to +85°C
(build option for E3900 series SKUs)
Specifications
● Core System
CPU
● Audio
Intel Atom® E3900 series (formerly Apollo Lake)/Pentium®/Celeron® SoC on
Chipset
14nm process
Intel® HD Audio integrated in SoC
Atom® E3950 1.6/2.0GHz (Turbo), 12W (4C/1866)
Atom® E3940 1.6/1.8GHz (Turbo), 9W (4C/1866)
Audio Codec
On carrier Express-BASE6 (ALC886 standard support)
Atom® E3930 1.3/1.8GHz (Turbo), 6W (2C/1866)
Pentium® N4200 1.1/2.5GHz (Turbo), 6W (4C/1866)
Celeron® N3350 1.1/2.3GHz (Turbo), 6W (2C/1866)
● Ethernet
Note: Pentium®/Celeron® support by project basis
Intel® Ethernet Controller I210 (Extreme Rugged operating temperature range)
Supports: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® 64
Architecture, IA 32-bit, Intel® AES-NI, dual or quad Out-of-Order Execution
(OOE) processor cores, PCLMULQDQ Instruction DRNG
Notes: Availability of features may vary between processor SKUs. Pentium®/Celeron® supported by
project basis.
Intel® Ethernet Controller I211 (standard operating temperature range)
Supports IEEE 1588 and GbE0_SDP (I210 only)
● Video
GPU Feature Support
Memory
Intel® Gen9 LP Graphics Core, supporting 3 independent and simultaneous
display combinations of DisplayPort/HDMI/LVDS or eDP/VGA outputs
Dual channel 1867/1600 MHz non-ECC DDR3L memory up to 8GB in dual
SODIMM socket
Hardware encode/transcode (including HEVC)
DirectX 12, DirectX 11.3, DirectX 10, DirectX 9.3 support
OpenGL 4.3 and ES 3.0 support
(maximum by 2pcs 4GB or 1pcs 8GB SO-DIMM)
Embedded BIOS
AMI EFI with CMOS backup in 16MB SPI BIOS (dual BIOS by build option)
OpenCL 2.0 support
Expansion Busses
3 PCI Express x1 Gen2 (AB): Lanes 0/1/2 by default
Digital Display Interface
DDI1/2 supporting DisplayPort/HDMI/DVI
Note: 5 PCI Express x1 Gen2 (AB): Lanes 0/1/2/3/4 through PCIe bridge IC by request.
LPC bus, SMBus (system) , I2C (user)
VGA
Build option support through DP-to-VGA IC (in place of DDI2)
SEMA Board Controller
Supports: Voltage/current monitoring, power sequence debug support,
AT/ATX mode control, logistics and forensic information, flat panel control,
general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and fan
control
LVDS
Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC
eDP
Debug Headers
4 lanes support (build option, in place of LVDS)
40-pin multipurpose flat cable connector for use with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS flashing, power
testpoints, debug LEDs
MIPI60 header for ICE debug of CPU/chipset (build option)
Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
Specifications
● I/O Interfaces
● Mechanical and Environmental
USB: 3x USB 3.0 (USB ports 0-2) and 5x USB 2.0 (USB ports 3-7)
USB OTG support on USB 2.0 port 0 with Yocto Linux
SATA: Two ports SATA 6Gb/s (SATA0,1)
Form Factor: PICMG COM.0: Rev 3.0 Type 6
Dimension: Compact size: 95 mm x 95 mm
Operating Temperature
Standard: 0°C to 60°C
Serial: 2 UART ports
eMMC: eMMC 5.0 (8/16/32GB, build option)
GPIO/SD: 4 GPO and 4 GPI
Extreme Rugged: -45°C to +85°C (build option with E3900 series only)
SD signal muxed with GPIO, controlled by BIOS setting
Note: eMMC/SD boot device support dependent on OS.
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
● Super I/O
Supported on carrier if needed (standard support for W83627DHG-P)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table
214-I, Condition D
● TPM (build option)
Chipset
Infineon
HALT
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Type
TPM 2.0
● Operating Systems
Standard Support
Windows 10 64-bit, Yocto project based Linux 64-bit, VxWorks 64-bit
● Power
Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT=12V±5%
Wide Input: ATX = 4.75-20 V / 5Vsb ±5% or AT=4.75-20V (Standard Temp. only)
Management: ACPI 5.0 compliant, Smart Battery support
Extended Support (BSP)
VxWorks
Power States: C1-C6, S0, S3, S4, S5 and S5 ECO mode (Wake on USB S3/S4, WOL
S3/S4/S5)
ECO mode: Supports deep S5 mode for power saving
Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
Functional Diagram
single/dual channel
18/24-bit LVDS
SODIMM
1867/1600 MHz
2-8 GB DDR3L
non-ECC
LVDS
eDP to LVDS
eDP
SODIMM
1867/1600 MHz
2-8 GB DDR3L
non-ECC
eDP x4 lanes (build opꢀon)
VGA
DP to VGA
Note: max. capacity is 8GB
(2x 4GB or 1x 8GB)
(build opꢀon)
Intel Atom®
Intel® Penꢀum®
Intel® Celeron®
8x USB 2.0/1.0 (ports 0-7)
(OTG on port 0, OS dependent)
DDI1 (4 lanes)
DP/HDMI
PCIe x1 (port0)
DDI2 (4 lanes)
DP/HDMI
3 PCI x1 (0/1/2) default
(other config. by request)
PCIe x1 (port1)
PCIe x1 (port2)
“Apollo Lake”
PCIe Bridge
(build opꢀon)
3x USB 3.0 upgrade
(ports 0/1/2)
PCIe x1 (port3)
PCIe x1 (port4)
MIPI60
60-pin
(build opꢀon)
GbE0_SDP (for I210)
GbE
2x SATA 6Gb/s (port 0/1)
HD Audio
eMMC 5.0
8/16/32GB
(build option)
UART0
UART1
TPM 2.0
(build opꢀon)
LPC to
UART
LPC bus
SMBus
SPI 0
BIOS
SD
I2C
GPIO
SPI 1
BIOS
4x GPI, 4x GPO (SD)
DDC I2C
MUX
GP I2C
SEMA
BMC
LM73
SPI_CS#
SPI
Ordering Information
Accessories
●
cExpress-AL-E3950
Heat Spreaders
Compact COM Express Type6 with Intel® Apollo Lake-I Atom®
E3950 (4C)
●
HTS-cAL-B-I
Heatspreader for cExpress-AL Atom® with threaded standoffs
for bottom mounting
●
cExpress-AL-E3940
Compact COM Express Type6 with Intel® Apollo Lake-I Atom®
E3940 (4C)
●
HTS-cAL-BT-I
Heatspreader for cExpress-AL Atom® with through hole
standoffs for top mounting
●
cExpress-AL-E3930
Compact COM Express Type6 with Intel® Apollo Lake-I Atom®
E3930 (2C)
●
HTS-cAL-B
cExpress-AL-N4200
Heatspreader for cExpress-AL Pentium®/Celeron® with
threaded standoffs for bottom mounting
●
Compact COM Express Type6 with Intel® Apollo Lake Pentium®
N4200 (4C)
●
HTS-cAL-BT
Heatspreader for cExpress-AL Pentium®/Celeron® with through
hole standoffs for top mounting
●
cExpress-AL-N3350
Compact COM Express Type6 with Intel® Apollo Lake Celeron®
N3350 (2C)
Passive Heatsinks
Note: “build option” indicates an alternative BOM configuration to support
additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and
this will result in production lead times. Please contact local sales.
●
THS-cAL-B-I
Low profile heatsink for cExpress-AL Atom® with threaded
standoffs for bottom mounting
●
THS-cAL-BT-I
Low profile heatsink for cExpress-AL Atom® with through hole
standoffs for top mounting
Starter Kit
●
●
THS-cAL-B
COM Express Type 6 Starter Kit Plus
Low profile heatsink for cExpress-AL Pentium®/Celeron® with
threaded standoffs for bottom mounting
Starter kit for COM Express Type 6
●
THS-cAL-BT
Low profile heatsink for cExpress-AL Pentium®/Celeron® with
through hole standoffs for top mounting
●
THSH-cAL-B-I
High profile heatsink for cExpress-AL Atom® with threaded
standoffs for bottom mounting
●
THSH-cAL-B
High profile heatsink for cExpress-AL Pentium®/Celeron® with
threaded standoffs for bottom mounting
Active Heatsink
●
THSF-cAL-B-I
High profile heatsink with fan for cExpress-AL Atom® with
threaded standoffs for bottom mounting
●
THSF-cAL-B
High profile heatsink with fan for cExpress-AL Pentium®/
Celeron® with threaded standoffs for bottom mounting
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All products and company names listed are trademarks or trade names of their respective companies.
Updated Dec. 13, 2019. ©2019 ADLINK Technology, Inc. All Rights Reserved.
All specifications are subject to change without further notice.
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