APT5014BFLL_04 [ADPOW]

POWER MOS 7 FREDFET; 功率MOS 7 FREDFET
APT5014BFLL_04
型号: APT5014BFLL_04
厂家: ADVANCED POWER TECHNOLOGY    ADVANCED POWER TECHNOLOGY
描述:

POWER MOS 7 FREDFET
功率MOS 7 FREDFET

文件: 总5页 (文件大小:167K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
APT5014BFLL  
APT5014SFLL  
500V 35A 0.140Ω  
R
POWER MOS 7 FREDFET  
Power MOS 7® is a new generation of low loss, high voltage, N-Channel  
enhancement mode power MOSFETS. Both conduction and switching  
losses are addressed with Power MOS 7® by significantly lowering RDS(ON)  
and Qg. Power MOS 7® combines lower conduction and switching losses  
along with exceptionally fast switching speeds inherent with APT's  
patented metal gate structure.  
D3PAK  
TO-247  
• Lower Input Capacitance  
• Lower Miller Capacitance  
• Lower Gate Charge, Qg  
• Increased Power Dissipation  
• Easier To Drive  
• TO-247 or Surface Mount D3PAK Package  
D
S
G
FAST RECOVERY BODY DIODE  
MAXIMUM RATINGS  
Symbol Parameter  
All Ratings: T = 25°C unless otherwise specified.  
C
APT5014BFLL_SFLL  
UNIT  
VDSS  
ID  
Drain-Source Voltage  
500  
35  
Volts  
Continuous Drain Current @ TC = 25°C  
Amps  
Volts  
1
IDM  
Pulsed Drain Current  
140  
VGS  
VGSM  
Gate-Source Voltage Continuous  
Gate-Source Voltage Transient  
Total Power Dissipation @ TC = 25°C  
Linear Derating Factor  
±30  
±40  
Watts  
W/°C  
403  
PD  
3.22  
-55 to 150  
300  
TJ,TSTG  
TL  
Operating and Storage Junction Temperature Range  
°C  
Amps  
mJ  
Lead Temperature: 0.063" from Case for 10 Sec.  
1
IAR  
Avalanche Current  
(Repetitive and Non-Repetitive)  
35  
1
EAR  
EAS  
Repetitive Avalanche Energy  
Single Pulse Avalanche Energy  
30  
4
1300  
STATICELECTRICALCHARACTERISTICS  
Symbol Characteristic / Test Conditions  
MIN  
TYP  
MAX  
UNIT  
Volts  
Ohms  
BVDSS  
RDS(on)  
Drain-Source Breakdown Voltage (VGS = 0V, ID = 250µA)  
500  
2
Drain-Source On-State Resistance  
(VGS = 10V, 17.5A)  
0.140  
100  
500  
±100  
5
Zero Gate Voltage Drain Current (VDS = 500V, VGS = 0V)  
Zero Gate Voltage Drain Current (VDS = 400V, VGS = 0V, TC = 125°C)  
Gate-Source Leakage Current (VGS = ±30V, VDS = 0V)  
Gate Threshold Voltage (VDS = VGS, ID = 1mA)  
IDSS  
µA  
IGSS  
nA  
VGS(th)  
Volts  
3
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
APT Website - http://www.advancedpower.com  
DYNAMIC CHARACTERISTICS  
APT5014BFLL_SFLL  
Symbol  
Ciss  
Coss  
Crss  
Qg  
MIN  
TYP  
MAX  
Characteristic  
UNIT  
TestConditions  
V
= 0V  
Input Capacitance  
3261  
704  
GS  
V
= 25V  
pF  
Output Capacitance  
DS  
f = 1 MHz  
Reverse Transfer Capacitance  
50  
72  
20  
36  
11  
6
3
V
= 10V  
Total Gate Charge  
GS  
V
= 550V  
Qgs  
nC  
ns  
Gate-Source Charge  
Gate-Drain ("Miller") Charge  
Turn-on Delay Time  
Rise Time  
DD  
I
= 35A @ 25°C  
D
Qgd  
RESISTIVESWITCHING  
td(on)  
tr  
V
= 15V  
GS  
V
= 550V  
DD  
td(off)  
23  
Turn-off Delay Time  
Fall Time  
I
= 35A @ 25°C  
D
tf  
R
= 1.6Ω  
3
G
INDUCTIVESWITCHING@25°C  
6
Eon  
Eoff  
325  
249  
545  
Turn-on Switching Energy  
V
= 333V, V = 15V  
GS  
DD  
I
Turn-off Switching Energy  
= 35A, R = 5Ω  
D
G
µJ  
INDUCTIVESWITCHING@125°C  
6
Eon  
Eoff  
Turn-on Switching Energy  
V
= 333V V = 15V  
GS  
DD  
Turn-off Switching Energy  
I
= 35A, R = 5Ω  
288  
D
G
SOURCE-DRAINDIODERATINGSANDCHARACTERISTICS  
Symbol Characteristic / Test Conditions  
MIN  
TYP  
MAX  
35  
UNIT  
IS  
Continuous Source Current (Body Diode)  
Amps  
1
ISM  
Pulsed Source Current  
Diode Forward Voltage  
(Body Diode)  
140  
1.3  
15  
2
VSD  
Volts  
V/ns  
(VGS = 0V, IS = -35A)  
dv  
/
dv  
5
Peak Diode Recovery  
/
dt  
dt  
Reverse Recovery Time  
(IS = -35A, di/dt = 100A/µs)  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
250  
525  
trr  
ns  
µC  
Reverse Recovery Charge  
(IS = -35A, di/dt = 100A/µs)  
1.6  
6.0  
13  
Qrr  
Peak Recovery Current  
(IS = -35A, di/dt = 100A/µs)  
IRRM  
Amps  
21  
THERMALCHARACTERISTICS  
Symbol Characteristic  
MIN  
TYP  
MAX  
0.31  
40  
UNIT  
RθJC  
RθJA  
Junction to Case  
°C/W  
Junction to Ambient  
1 Repetitive Rating: Pulse width limited by maximum junction  
temperature  
2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%  
3 See MIL-STD-750 Method 3471  
4 Starting T = +25°C, L = 2.12mH, R = 25, Peak I = 35A  
j
G
L
dv  
5
/
numbers reflect the limitations of the test circuit rather than the  
di  
dt  
device itself.  
I
-35A  
/
700A/µs  
V
R 500V T 150°C  
dt  
S
J
6
Eon includes diode reverse recovery. See figures 18, 20.  
APTReservestherighttochange,withoutnotice,thespecificationsandinformationcontainedherein.  
0.35  
0.30  
0.9  
0.25  
0.7  
0.20  
0.5  
0.15  
Note:  
t
1
0.3  
0.10  
t
2
t
1
0.05  
0
Duty Factor D =  
Peak T = P x Z  
/
t
2
+ T  
0.1  
SINGLEPULSE  
J
DM θJC  
C
0.05  
10-5  
10-4  
10-3  
10-2  
10-1  
1.0  
RECTANGULARPULSEDURATION(SECONDS)  
FIGURE1,MAXIMUMEFFECTIVETRANSIENTTHERMALIMPEDANCE,JUNCTION-TO-CASEvsPULSEDURATION  
Typical Performance Curves  
APT5014BFLL_SFLL  
100  
80  
60  
20  
20  
0
15 &10V  
8V  
RC MODEL  
Junction  
temp. (°C)  
7V  
0.119  
0.191  
0.0135F  
0.319F  
6.5V  
Power  
(watts)  
6V  
5.5V  
5V  
Case temperature. (°C)  
0
5
10  
15  
20  
25  
30  
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)  
DS  
FIGURE2, TRANSIENT THERMAL IMPEDANCE MODEL  
FIGURE3,LOW VOLTAGEOUTPUTCHARACTERISTICS  
100  
1.2  
NORMALIZED TO  
V
= 10V  
@
17.5A  
GS  
1.15  
1.10  
80  
60  
40  
V
=10V  
GS  
1.05  
1.0  
V
=20V  
GS  
T
= +125°C  
J
T
= +25°C  
J
20  
0
0.95  
0.90  
T
= -55°C  
8
J
0
1
2
3
4
5
6
7
9
0
10  
20  
30  
40  
50  
60  
V
,GATE-TO-SOURCEVOLTAGE(VOLTS)  
I ,DRAINCURRENT(AMPERES)  
GS  
D
FIGURE4,TRANSFERCHARACTERISTICS  
FIGURE5,R (ON)vsDRAINCURRENT  
DS  
1.15  
1.10  
1.05  
1.00  
35  
30  
25  
20  
15  
10  
0.95  
0.90  
0.85  
5
0
25  
50  
75  
100  
125  
150  
-50 -25  
0
25  
50 75 100 125 150  
T ,CASETEMPERATURE(°C)  
T ,JUNCTIONTEMPERATURE(°C)  
C
J
FIGURE6,MAXIMUMDRAINCURRENTvsCASETEMPERATURE  
FIGURE7,BREAKDOWNVOLTAGEvsTEMPERATURE  
1.2  
2.5  
I
= 17.5A  
= 10V  
D
V
GS  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
2.0  
1.5  
1.0  
0.5  
0.0  
-50 -25  
0
25 50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
T ,JUNCTIONTEMPERATURE(°C)  
T ,CASETEMPERATURE(°C)  
J
C
FIGURE8,ON-RESISTANCEvs.TEMPERATURE  
FIGURE9,THRESHOLDVOLTAGEvsTEMPERATURE  
Typical Performance Curves  
APT5014BFLL_SFLL  
10,000  
1,000  
100  
140  
OPERATIONHERE  
LIMITEDBYR (ON)  
DS  
C
iss  
50  
10  
100µS  
C
oss  
1mS  
C
rss  
T
=+25°C  
C
T =+150°C  
10mS  
J
SINGLEPULSE  
1
10  
1
5
10  
50 100  
500  
0
10  
20  
30  
40  
50  
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)  
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)  
DS  
DS  
FIGURE10,MAXIMUMSAFEOPERATINGAREA  
FIGURE11,CAPACITANCEvsDRAIN-TO-SOURCEVOLTAGE  
16  
14  
12  
10  
8
200  
I
= 35A  
D
100  
50  
V
=100V  
DS  
T =+150°C  
J
T =+25°C  
J
V
=250V  
DS  
V
=400V  
DS  
10  
5
6
4
2
0
1
0
20  
40  
60  
80  
100  
0.3  
0.5  
0.7  
0.9  
1.1  
1.3  
1.5  
Q ,TOTALGATECHARGE(nC)  
g
V
,SOURCE-TO-DRAINVOLTAGE(VOLTS)  
SD  
FIGURE12,GATECHARGESvsGATE-TO-SOURCEVOLTAGE  
FIGURE13,SOURCE-DRAINDIODEFORWARDVOLTAGE  
60  
70  
V
= 333V  
DD  
= 5Ω  
R
T
t
G
d(off)  
60  
50  
40  
30  
20  
10  
0
50  
= 125°C  
J
t
f
L = 100µH  
V
= 333V  
40  
30  
20  
10  
0
DD  
= 5Ω  
R
T
G
= 125°C  
J
L = 100µH  
t
r
t
d(on)  
0
10  
20  
30  
(A)  
40  
50  
60  
0
10  
20  
30  
40  
50  
60  
I
I
(A)  
D
D
FIGURE 14, DELAY TIMES vs CURRENT  
FIGURE 15, RISE AND FALL TIMES vs CURRENT  
1400  
1200  
1000  
800  
600  
400  
200  
0
1000  
800  
600  
400  
V
= 333V  
V
I
= 333V  
DD  
DD  
= 35A  
R
= 5Ω  
G
D
E
off  
T
= 125°C  
T
= 125°C  
J
J
L = 100µH  
L = 100µH  
EON includes  
EON includes  
diode reverse recovery.  
diode reverse recovery.  
E
on  
E
on  
200  
0
E
off  
0
10  
20  
30  
(A)  
40  
50  
60  
0
5
10 15 20 25 30 35 40 45 50  
I
R ,GATERESISTANCE(Ohms)  
D
G
FIGURE16, SWITCHING ENERGYvs CURRENT  
FIGURE 17, SWITCHING ENERGY VS. GATE RESISTANCE  
APT5014BFLL_SFLL  
Gate Voltage  
10 %  
90%  
T
= 125 C  
Gate Voltage  
J
T
= 125 C  
J
t
t
d(on)  
d(off)  
90%  
t
r
Drain Voltage  
Drain Current  
90%  
Drain Current  
t
f
5 %  
10 %  
10%  
0
Drain Voltage  
Switching Energy  
Switching Energy  
Figure19,Turn-offSwitchingWaveformsandDefinitions  
Figure18,Turn-onSwitchingWaveformsandDefinitions  
APT30DF60  
VCE  
IC  
VDD  
G
D.U.T.  
Figure 20, Inductive Switching Test Circuit  
D3PAKPackageOutline  
TO-247 Package Outline  
4.98 (.196)  
4.69 (.185)  
15.95 (.628)  
16.05 (.632)  
13.41 (.528)  
13.51 (.532)  
5.31 (.209)  
5.08 (.200)  
15.49 (.610)  
16.26 (.640)  
1.04 (.041)  
1.15 (.045)  
1.49 (.059)  
2.49 (.098)  
1.47 (.058)  
1.57 (.062)  
5.38 (.212)  
6.20 (.244)  
6.15 (.242) BSC  
Revised  
8/29/97  
11.51 (.453)  
11.61 (.457)  
13.79 (.543)  
13.99 (.551)  
20.80 (.819)  
21.46 (.845)  
3.50 (.138)  
3.81 (.150)  
0.46 (.018)  
0.56 (.022)  
{3 Plcs}  
1.27 (.050)  
1.40 (.055)  
0.020 (.001)  
0.178 (.007)  
2.87 (.113)  
3.12 (.123)  
3.81 (.150)  
4.50 (.177) Max.  
1.98 (.078)  
2.08 (.082)  
4.06 (.160)  
2.67 (.105)  
2.84 (.112)  
(Base of Lead)  
1.65 (.065)  
2.13 (.084)  
1.22 (.048)  
1.32 (.052)  
0.40 (.016)  
0.79 (.031)  
19.81 (.780)  
20.32 (.800)  
Heat Sink (Drain)  
and Leads  
are Plated  
5.45 (.215) BSC  
{2 Plcs.}  
1.01 (.040)  
1.40 (.055)  
Gate  
Drain  
Source  
Source  
Drain  
Gate  
Dimensions in Millimeters (Inches)  
2.21 (.087)  
2.59 (.102)  
5.45 (.215) BSC  
2-Plcs.  
Dimensions in Millimeters and (Inches)  
APT’sproductsarecoveredbyoneormoreofU.S.patents4,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058andforeignpatents. USandForeignpatentspending. AllRightsReserved.  

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