HMMC-3040 [AGILENT]
20-43 GHz Double-Balanced Mixer and LO-Amplifier; 20-43 GHz的双平衡混频器和LO放大器型号: | HMMC-3040 |
厂家: | AGILENT TECHNOLOGIES, LTD. |
描述: | 20-43 GHz Double-Balanced Mixer and LO-Amplifier |
文件: | 总7页 (文件大小:128K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Agilent HMMC-3040
20– 43 GHz Double-Balanced Mixer
and LO-Amplifier
Data Sheet
Features
• Both up and downconverting
functions
• Harmonic LO mixing capability
• Large bandwidth:
RFport:20–43GHz
LOportmatch:DC–43GHz
LOamplifier:20–43GHz
Chip Size:
2520 x 730 µm (99.2 x 28.7 mils)
IFport:DC–5GHz
Chip Size Tolerance:
Chip Thickness:
±10 µm (±0.4 mils)
127 ± 15 µm (5.0 ± 0.6 mils)
• Repeatable conversion loss:
9.5dBtypicalat30GHz
• Low LO drive required
• 50Ω port matching networks
Description
Absolute Maximum Ratings[1]
The HMMC-3040 is a broadband
MMIC Double-Balanced Mixer
(DBM) with an integrated high-
gain LO amplifier. It can be used
as either an up-converter or as a
down-converter in microwave/
millimeter-wave transceivers. If
desired, the LO amplifier can be
biased to function as a frequency
multiplier to enable harmonic
mixing of a LO source.
Symbol
Parameters/Conditions
Units
Min.
Max.
VD1,2
VG1,2
IDD
Drain Supply Voltages
Gate Supply Voltages
Total Drain Current
V
5
V
-3.0
0.5
mA
dBm
°C
°C
°C
°C
400
21
Pin
RF Input Power
Tch
Channel Temperature[2]
Backside Ambient Temperature
Storage Temperature
Max. Assembly Temperature
160
+75
+165
300
TA
-55
-65
Tst
Tmax
This three-port device has input
and output matching circuitry for
use in 50 ohm environments. The
MMIC provides repeatable
conversion loss (requiring no
tuning), thereby making it
suitable for automated assembly
processes.
Notes:
1. Absolute maximum ratings for continuous operation unless otherwise noted.
2. Refer to DC Specifications/Physical Properties table for deratinginformation.
HMMC-3040 DC Specifications/Physical Properties[1]
Symbol
Parameters and Test Conditions
Units
Min.
Typ.
Max.
VD1,2
ID1
Drain Supply Operating Voltages
V
2
4.5
27
5
First Stage Drain Supply Current (VDD = 4.5 V, VG1 -0.8 V)
Total Drain Supply Current for Stage 2 (VDD = 4.5 V, VGG -0.8 V)
Gate Supply Operating Voltages (IDD 150mA)
mA
ID2
mA
123
-0.8
-1.2
62
VG1,2
VP
V
Pinch-off Voltage (VDD = 4.5 V, VDD ≤ 10 mA)
V
-2
-0.8
θch-bs
Tch
Thermal Resistance (Channel-to-Backside at Tch = 160°C)[2]
Channel Temperature (TA = 75°C, MTTF > 106 hrs VDD = 4.5V, IDD = 300 mA)[3]
°C/Watt
°C
160
Notes:
1. Backside ambient operating temperature TA = 25°C, unless otherwise noted.
2. Thermal resistance (°C/Watt) at a channel temperature T(°C) can be estimated using the equation: θ(T) 62x [T(°C)+273]/[160°C+273].
3. Derate MTTF by a factor of two for every 8°C above Tch
.
RF Specifications (TA = 25°C, ZO = 50 Ω, VDD = 4.5 V, IDD = 150 mA)
Symbol
Parameters and Test Conditions
Units
Min.
Typ.
Max.
BW
Operating Bandwidth
RF and LO
IF
GHz
GHz
20
DC
20–43
DC–5
43
5
C.L.
Conversion Loss
LO Drive Level
dB
9.5
2
12
PLO
dBm
dB
LO/RF Isolation
P-1dB
LO-to-RF Isolation[1]
18
Input Power
(@ 1 dB increase in C.L.)
Down-Convert (RF/IF)
Up-Convert (IF/RF)
dBm
dBm
15
8
Note:
1. Reference: LO input. Does not include LO amplifier gain (-20dB).
2
Applications
The LO amplifier has effectively
two gain stages as indicated in
Figure 1. One wire connection is
needed to each DC drain bias
supply pad, VD1 and VD2, and one to DC voltages.
to each DC gate bias pad, VG1 and
The microwave/millimeter-wave
ports are not AC-coupled. A DC
blocking capacitor is required on
any RF port that may be exposed
The HMMC-3040 MMIC is a
broadband double-balanced
mixer (DBM) with an integrated
LO amplifier. It can be used as
either a frequency up-converter
or down-converter. This mixer
was designed specifically for
microwave/millimeter-wave
point-to-point and point-to-
multipoint (including LMDS/
LMCS/MVDS) communication
systems that operated in the
20–43 GHz frequency range.
VG2.
No ground wires are needed be-
cause ground connections are
made with plated through-holes
to the backside of the device.
Harmonic LO mixing is possible
in some limited cases. The inte-
grated LO amplifier’s stages can
be individually biased to provide
optimum harmonic output. When
considering the HMMC-3040 as a
harmonic mixer, it is important
to realize that the integrated dou-
ble balanced mixer diodes need
Assembly Techniques
It is recommended that the elec-
trical connections to the bonding
pads be made using 0.7-1.0 mil
diameter gold wire. The micro-
wave/millimeter-wave connec-
tions should be kept as short as
possible to minimize inductance.
For assemblies requiring long
bond wires, multiple wires can
be attached to the RF bonding
pads.
The LO amplifier can also be
biased to provide frequency
multiplication of the LO source
(Figure 2). The integrated LO
amplifier will provide a good
impedance match to low
frequency input signals. Frequen-
cies below approximately 18 GHz
will not be passed by the LO
network, enhancing LO rejection.
18 dBm (15 to 22 dBm) to
~
obtain optimum mixer conver-
sion. Agilent product note #15,
“HMMC-3040 Multiplier
Operation” provides two
examples of harmonic mixing.
Also, Agilent application note
#50, “HMMC-5040 As a 20 to
40 GHz Multiplier” provides
additional information on
multiplier operation and is a
good reference when considering
the HMMC-3040 as a harmonic
mixer; the HMMC-3040 inte-
grated LO amplifier is similar to
the HMMC-5040. No impedance
matching network is needed
because the LO port provides a
good match to signals having
frequency from DC to approxi-
mately 43 GHz.
GaAs MMICs are ESD sensitive.
ESD preventive measures must
be employed in all aspects of
storage, handling, and assembly.
MMIC ESD precautions, handling
considerations, die attach and
bonding methods are critical fac-
tors in successful GaAs MMIC
performance and reliability.
Biasing and Operation
The recommended DC bias
condition is with all drains
connected to a single 3.5–4.5 volt
supply and all gates connected to
an adjustable negative voltage
supply. The gate voltage is
adjusted for a total drain supply
current of typically 150–230 mA.
An assembly diagram is shown in
Figure 4.
Agilent application note #54,
“GaAs MMIC ESD, Die Attach
and Bonding Guidelines” pro-
vides basic information on these
subjects.
Additional References
DBM
DBM
PN #15, “HMMC-5040 Multiplier
Operation,” and AN # 50,
“HMMC-5040 As a 20-40 GHz
Multiplier.”
IF
RF
IF
RF
V
V
V
V
D2
D1
G2
G1
2
1
V
V
V
V
D2
D1
G2
G1
LO
LO
Figure 1. HMMC-3040 Simplified Block
Diagram.
Figure 2. HMMC-3040 Harmonic Mixing Block
Diagram.
3
0
70
330
860 1190
2020
760
480
660
430
250
80
0
0
0
90
1210
Note:
1. Numbers relate to (X,Y) reference. (Demensions are micrometers)
Figure 3. HMMC-3040 Bonding Pad Positions.
V
DD
>0.1 µF
IF
>100 pF
V
V
D1
D2
LO
RF
V
V
G2
G1
>100 pF
Optional I.F., wire support pads.
(Stitch bond connect IF pad, support pad,
and trans line)
V
GG
>0.1 µF
Figure 4. HMMC-3040 Common Assembly Diagram.
4
Additional HMMC-3040 Performance Characteristics
(Data refer to Figure 1)
VDD = 4.5 V, IDD = 230 mA
13
12
11
10
9
12
11
10
9
12
11
10
9
VDD = 3.0 V, IDD = 150 mA
VDD = 3.5 V, IDD = 230 mA
VDD = 4.5 V, IDD = 230 mA
VDD = 3.0 V, IDD = 150 mA
VDD = 3.5 V, IDD = 230 mA
VDD = 4.5 V, IDD = 230 mA
8
7
8
6
8
7
IF = 3 GHz
LO = 25 GHz, 0 dBm
5
RF = 28 GHz, 0 dBm
LO = 25 GHz, 0 dBm
7
-30
4
6
-12
-20
-10
0
10
20
-20 -15 -10 -5
0
5
10 15 20
-8
-4
0
4
8
RF-INPUT POWER (dBm)
IF-INPUT POWER (dBm)
LO INPUT POWER (dBm)
Figure 6. Down-Conversion Loss vs. RF Input
Power.
Figure 5. Up-Conversion Loss vs. IF Input
Power for Various LO Amplifier Bias
Conditions.
Figure 7. Conversion Loss vs. LO Input Power.
12
IDD = 150 mA
IDD = 230 mA
IDD = 290 mA
10
11
9
8
7
6
RF = 28 GHz, 0 dBm
5
LO = 25 GHz, 0 dBm
4
2
2.5
3
3.5
4
4.5
5
V
DD
(Volt)
Figure 8. Conversion Loss vs. VDD for Various
LO Amplifier Drain Currents.
Note:
All data measured on individual devices
mounted in a 50 GHz test package TA = 25°C
and under Figure 1 condition (except where
noted).
5
6
This data sheet contains a variety of typical and guaranteed performance data. The information supplied should
not be interpreted as a complete list of circuit specifications. In this data sheet the term typical refers to the 50th
percentile performance. For additional information contact your local Agilent Technologies’ sales representative.
www.semiconductor.agilent.com
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes 5988-1906EN
May 20, 2002
5988-6895EN
相关型号:
HMMC-3122
3122 SERIES, PRESCALER, PDSO8, 4.90 X 3.90 MM, 1.55 MM HEIGHT, 1.25 MM PITCH, PLASTIC, MS-012, SOIC-8
AVAGO
HMMC-3122-BLK
Prescaler, 3122 Series, 1-Func, GAAS, PDSO8, 4.90 X 3.90 MM, 1.55 MM HEIGHT, 1.25 MM PITCH, PLASTIC, MS-012, SOIC-8
AGILENT
HMMC-3122-TR1
3122 SERIES, PRESCALER, PDSO8, 4.90 X 3.90 MM, 1.55 MM HEIGHT, 1.25 MM PITCH, PLASTIC, MS-012, SOIC-8
AVAGO
©2020 ICPDF网 联系我们和版权申明