AOI4N60 [AOS]

600V,4A N-Channel MOSFET; 600V , 4A N沟道MOSFET
AOI4N60
型号: AOI4N60
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

600V,4A N-Channel MOSFET
600V , 4A N沟道MOSFET

文件: 总6页 (文件大小:539K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AOD4N60/AOI4N60/AOU4N60  
600V,4A N-Channel MOSFET  
General Description  
Product Summary  
The AOD4N60 & AOI4N60 & AOU4N60 have been  
fabricated using an advanced high voltage MOSFET  
process that is designed to deliver high levels of  
performance and robustness in popular AC-DC  
applications.By providing low RDS(on), Ciss and Crss along  
with guaranteed avalanche capability these parts can be  
adopted quickly into new and existing offline power supply  
designs.  
VDS  
700V@150  
4A  
ID (at VGS=10V)  
RDS(ON) (at VGS=10V)  
< 2.3  
100% UIS Tested!  
100% Rg Tested!  
TO252  
DPAK  
TO251A  
IPAK  
TO251  
Top View  
Bottom View  
Top View  
Bottom View  
Top View  
Bottom View  
D
D
D
G
S
G
S
S
G
D
S
G
G
D
D
S
D
S
G
G
S
AOI4N60  
AOU4N60  
AOD4N60  
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
Drain-Source Voltage  
VDS  
600  
V
V
Gate-Source Voltage  
VGS  
±30  
4
TC=25°C  
Continuous Drain  
CurrentB  
Pulsed Drain Current C  
Avalanche Current C  
ID  
TC=100°C  
2.6  
14  
A
IDM  
IAR  
2.8  
118  
A
Repetitive avalanche energy C  
EAR  
EAS  
dv/dt  
mJ  
Single plused avalanche energy H  
Peak diode recovery dv/dt  
TC=25°C  
235  
5
mJ  
V/ns  
W
W/ oC  
104  
PD  
Power Dissipation B  
Derate above 25oC  
0.83  
Junction and Storage Temperature Range  
TJ, TSTG  
TL  
-50 to 150  
°C  
Maximum lead temperature for soldering  
purpose, 1/8" from case for 5 seconds  
300  
°C  
Thermal Characteristics  
Parameter  
Symbol  
RθJA  
Typical  
Maximum  
Units  
Maximum Junction-to-Ambient A,G  
43  
55  
°C/W  
Maximum Case-to-sink A  
Maximum Junction-to-CaseD,F  
RθCS  
-
0.5  
1.2  
°C/W  
°C/W  
RθJC  
1
Rev2: Jan 2012  
www.aosmd.com  
Page 1 of 6  
AOD4N60/AOI4N60/AOU4N60  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
ID=250A, VGS=0V, TJ=25°C  
ID=250A, VGS=0V, TJ=150°C  
600  
BVDSS  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Zero Gate Voltage Drain Current  
700  
V
BVDSS  
/TJ  
V/ oC  
ID=250A, VGS=0V  
VDS=600V, VGS=0V  
0.67  
1
IDSS  
µA  
10  
VDS=480V, TJ=125°C  
VDS=0V, VGS=±30V  
VDS=5V, ID=250µA  
IGSS  
VGS(th)  
RDS(ON)  
gFS  
±100  
Gate-Body leakage current  
Gate Threshold Voltage  
nΑ  
3.4  
4.1  
1.8  
6
4.5  
2.3  
V
S
V
A
A
VGS=10V, ID=2A  
Static Drain-Source On-Resistance  
Forward Transconductance  
Diode Forward Voltage  
VDS=40V, ID=2A  
IS=1A,VGS=0V  
VSD  
0.76  
4
1
IS  
Maximum Body-Diode Continuous Current  
Maximum Body-Diode Pulsed Current  
ISM  
14  
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
420  
35  
528  
53  
640  
70  
7
pF  
pF  
pF  
VGS=0V, VDS=25V, f=1MHz  
VGS=0V, VDS=0V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
2.5  
1.2  
4.8  
2.5  
3.8  
SWITCHING PARAMETERS  
Qg  
Qgs  
Qgd  
tD(on)  
tr  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
9.5  
2.8  
2.2  
12  
3.6  
4.4  
17  
26  
34  
21  
14.5  
4.5  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
VGS=10V, VDS=480V, ID=4A  
6.6  
VGS=10V, VDS=300V, ID=4A,  
RG=25Ω  
tD(off)  
tf  
trr  
IF=4A,dI/dt=100A/µs,VDS=100V  
IF=4A,dI/dt=100A/µs,VDS=100V  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
150  
1.9  
190  
2.4  
230  
3
ns  
Qrr  
µC  
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.  
B. The power dissipation PD is based on TJ(MAX)=150°C in a TO252 package, using junction-to-case thermal resistance, and is more useful in  
setting the upper dissipation limit for cases where additional heatsinking is used.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C.  
D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a  
maximum junction temperature of TJ(MAX)=150°C.  
G.These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.  
H. L=60mH, IAS=2.8A, VDD=150V, RG=10, Starting TJ=25°C  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Rev2: Jan 2012  
www.aosmd.com  
Page 2 of 6  
AOD4N60/AOI4N60/AOU4N60  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
8
7
6
5
4
3
2
1
0
100  
10  
1
10V  
VDS=40V  
-55°C  
6.5V  
125°C  
6V  
VGS=5.5V  
25°C  
0.1  
0
5
10  
15  
20  
25  
30  
2
4
6
8
10  
VDS (Volts)  
Fig 1: On-Region Characteristics  
VGS(Volts)  
Figure 2: Transfer Characteristics  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
3
2.5  
2
VGS=10V  
ID=2A  
VGS=10V  
1.5  
1
0.5  
0
-100  
-50  
0
50  
100  
150  
200  
0
2
4
6
8
10  
ID (A)  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and Gat
Voltage  
Figure 4: On-Resistance vs. Junction  
Temperature  
1.2  
1.0E+02  
1.0E+01  
125°C  
1.1  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1
0.9  
0.8  
25°C  
-100  
-50  
0
50  
TJ (oC)  
Figure 5: Break Down vs. Junction Temperature  
100  
150  
200  
0.2  
0.4  
0.6  
0.8  
1.0  
VSD (Volts)  
Figure 6: Body-Diode Characteristics  
Rev2: Jan 2012  
www.aosmd.com  
Page 3 of 6  
AOD4N60/AOI4N60/AOU4N60  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
15  
12  
9
10000  
1000  
100  
10  
VDS=480V  
ID=2A  
Ciss  
Coss  
6
3
Crss  
0
1
0
3
6
9
12  
15  
18  
0.1  
1
10  
100  
VDS (Volts)  
Qg (nC)  
Figure 8: Capacitance Characteristics  
Figure 7: Gate-Charge Characteristics  
100  
800  
600  
400  
200  
0
TJ(Max)=150°C  
TC=25°C  
10  
1
10µs  
RDS(ON)  
100µs  
DC  
1ms  
10ms  
0.1  
0.01  
TJ(Max)=150°C  
1
10  
100  
1000  
0.00001 0.0001 0.001  
0.01  
0.1  
1
10  
VDS (Volts)  
Pulse Width (s)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
Figure 10: Single Pulse Power Rating Junction-to-  
Case (Note F)  
10  
1
D=Ton/T  
TJ,PK=TC+PDM.ZθJC.RθJC  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
RθJC=1.2°C/W  
0.1  
PD  
0.01  
Single Pulse  
Ton  
T
0.001  
0.000001  
0.00001  
0.0001  
0.001  
Pulse Width (s)  
0.01  
0.1  
1
10  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Rev2: Jan 2012  
www.aosmd.com  
Page 4 of 6  
AOD4N60/AOI4N60/AOU4N60  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
120  
100  
80  
60  
40  
20  
0
5
4
3
2
1
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
TCASE (°C)  
75  
100  
125  
150  
TCASE (°C)  
Figure 12: Power De-rating (Note B)  
Figure 13: Current De-rating (Note B)  
500  
400  
300  
200  
100  
0
TJ(Max)=150°C  
TA=25°C  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 14: Single Pulse Power Rating Junction-to-Ambient (Note G)  
10  
1
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.RθJA  
θJA=55°C/W  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
R
0.1  
0.01  
0.001  
0.0001  
PD  
Ton  
Single Pulse  
0.01  
T
0.0001  
0.001  
0.1  
Pulse Width (s)  
1
10  
100  
1000  
10000  
Figure 15: Normalized Maximum Transient Thermal Impedance (Note G)  
Rev2: Jan 2012  
www.aosmd.com  
Page 5 of 6  
AOD4N60/AOI4N60/AOU4N60  
Gatte Charge Test Circcuit &Waveform  
Vgss  
Qgg  
1
+
VDC  
+
VVdss  
Q
g
s
Qgd  
VDC  
-
-
DDUT  
Vgs  
Ig  
Chaargee  
Resistiive Swwitching TestCCirrcuit && WWaavveeffoorrmmss  
RRL  
Vdss  
VVds  
9
+
DUTT  
Vdd  
Vgs  
VDC  
RRg  
-
1
Vgs  
Vgss  
t d(on)  
t
r
t d(off)  
t
f
t on  
toff  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
L
2
EAR=1/2LI  
AR  
BVDSS  
Vds  
Id  
Vds  
+
Vgs  
Vdd  
IAR  
Vgs  
VDC  
Id  
Rg  
-
DUT  
Vgs  
Vgs  
Diode RecoveryTestCircuit &Waveforms  
Qrr =- Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
Isd  
trr  
L
IF  
Isd  
dI/dt  
+
IRM  
Vdd  
Vgs  
VDC  
Vdd  
-
Vds  
Rev2: Jan 2012  
www.aosmd.com  
Page 6 of 6  

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