AON6403L [AOS]

P-Channel Power Transistor; P沟道功率晶体管
AON6403L
型号: AON6403L
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

P-Channel Power Transistor
P沟道功率晶体管

晶体 晶体管
文件: 总6页 (文件大小:241K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AON6403L  
P-Channel Power Transistor  
General Description  
Product Summary  
VDS  
-30V  
-85A  
The AON6403L combines advanced trench MOSFET  
technology with a low resistance package to provide  
extremely low RDS(ON). This device is ideal for load switch  
and battery protection applications.  
ID (at VGS= -10V)  
< 3.1mΩ  
< 4.3mΩ  
RDS(ON) (at VGS= -10V)  
RDS(ON) (at VGS = -4.5V)  
100% UIS Tested  
100% Rg Tested  
- RoHS Compliant  
- Halogen Free  
D
Top View  
Fits SOIC8  
footprint !  
G
S
DFN5X6  
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
VDS  
Maximum  
-30  
Units  
Drain-Source Voltage  
V
VGS  
ID  
IDM  
IDSM  
Gate-Source Voltage  
Continuous Drain  
Current G  
±20  
-85  
V
A
TC=25°C  
TC=100°C  
-67  
Pulsed Drain Current C  
-280  
-21  
TA=25°C  
TA=70°C  
Continuous Drain  
Current  
Avalanche Current C  
Repetitive avalanche energy L=0.1mH C  
A
-17  
IAR  
-72  
A
EAR  
259  
83  
mJ  
TC=25°C  
PD  
W
Power Dissipation B  
TC=100°C  
33  
TA=25°C  
2.3  
PDSM  
W
Power Dissipation A  
TA=70°C  
1.4  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 150  
°C  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
14  
40  
1
Max  
17  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
t 10s  
RθJA  
Maximum Junction-to-Ambient A D  
Maximum Junction-to-Case  
55  
Steady-State  
Steady-State  
RθJC  
1.5  
Rev 1: January 2009  
www.aosmd.com  
Page 1 of 6  
AON6403L  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=-250µA, VGS=0V  
-30  
V
VDS=-30V, VGS=0V  
-1  
IDSS  
Zero Gate Voltage Drain Current  
µA  
-5  
TJ=55°C  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
VDS=0V, VGS= ±20V  
VDS=VGS ID=-250µA  
VGS=-10V, VDS=-5V  
±100  
-2.2  
nA  
V
VGS(th)  
ID(ON)  
-1.2  
-1.7  
-280  
A
V
GS=-10V, ID=-20A  
2.6  
3.6  
3.5  
82  
3.1  
4.4  
4.3  
mΩ  
mΩ  
RDS(ON)  
TJ=125°C  
Static Drain-Source On-Resistance  
VGS=-4.5V, ID=-20A  
VDS=-5V, ID=-20A  
IS=-1A,VGS=0V  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
S
V
A
-0.7  
-1  
Maximum Body-Diode Continuous Current  
-85  
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
6100 7600 9120  
pF  
pF  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
930  
630  
1
1320 1720  
1050 1470  
V
GS=0V, VDS=-15V, f=1MHz  
V
GS=0V, VDS=0V, f=1MHz  
GS=-10V, VDS=-15V, ID=-20A  
GS=-10V, VDS=-15V,  
2
4
SWITCHING PARAMETERS  
Qg(10V)  
Total Gate Charge  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
130  
63  
163  
79  
22  
33  
13  
18  
135  
52  
26  
78  
196  
95  
nC  
nC  
nC  
nC  
ns  
Qg(4.5V)  
Qgs  
Qgd  
tD(on)  
tr  
V
V
18  
26  
20  
46  
ns  
tD(off)  
tf  
RL=0.75, RGEN=3Ω  
ns  
ns  
trr  
IF=-20A, dI/dt=500A/µs  
IF=-20A, dI/dt=500A/µs  
21  
63  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
32  
94  
ns  
Qrr  
nC  
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends on  
the user's specific board design, and the maximum temperature of 150°C may be used if the PCB allows it.  
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep initial  
TJ =25°C.Maximum UIS current limited by test equipment.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming  
a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.  
G. The maximum current rating is limited by package.  
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.  
Rev 1: January 2009  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Rev 1: January 2009  
www.aosmd.com  
Page 2 of 6  
AON6403L  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
150  
150  
-3.5V  
VDS=-5V  
-4V  
-10V  
120  
90  
60  
30  
0
120  
90  
60  
30  
0
-3V  
125°C  
2
VGS=-2.5V  
25°C  
0
1
3
4
5
0
1
2
3
4
5
-VGS(Volts)  
-VDS (Volts)  
Figure 2: Transfer Characteristics (Note E)  
Fig 1: On-Region Characteristics (Note E)  
5
4
3
2
1
1.6  
1.4  
1.2  
1
VGS=-10V  
ID=-20A  
VGS=-4.5V  
VGS=-4.5V  
ID=-20A  
VGS=-10V  
0.8  
0
5
10  
15  
20  
25  
30  
0
25  
50  
75  
100  
125  
150  
175  
I
D (A)  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage (Note E)  
Figure 4: On-Resistance vs. Junction Temperature  
(Note E)  
9
8
7
6
5
4
3
2
1
1.0E+02  
1.0E+01  
ID=-20A  
1.0E+00  
125°C  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
125°C  
25°C  
25°C  
0.0  
0.2  
0.4  
-VSD (Volts)  
Figure 6: Body-Diode Characteristics (Note E)  
0.6  
0.8  
1.0  
2
4
6
8
10  
-VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
(Note E)  
Rev 1: January 2009  
www.aosmd.com  
Page 3 of 6  
AON6403L  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
10  
8
12000  
VDS=-15V  
ID=-20A  
10000  
8000  
6000  
4000  
2000  
0
Ciss  
6
4
Coss  
2
Crss  
0
0
30  
60  
90  
Qg (nC)  
120  
150  
180  
0
5
10  
15  
-VDS (Volts)  
20  
25  
30  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
400  
350  
300  
250  
200  
150  
100  
50  
1000.0  
100.0  
10.0  
1.0  
RDS(ON)  
10µs  
TJ(Max)=150°C  
TC=25°C  
limited  
100µs  
1ms  
10ms  
DC  
0.1  
TJ(Max)=150°C  
TC=25°C  
0.0  
0
0.01  
0.1  
1
10  
100  
0.0001  
0.001  
0.01  
0.1  
1
10  
-VDS (Volts)  
Pulse Width (s)  
Figure 9: Maximum Forward Biased  
Safe Operating Area (Note F)  
Figure 10: Single Pulse Power Rating Junction-to-  
Case (Note F)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=Ton/T  
TJ,PK=TC+PDM.ZθJC.RθJC  
RθJC=1.5°C/W  
PD  
0.1  
Ton  
T
Single Pulse  
0.0001  
0.01  
0.00001  
0.001  
0.01  
0.1  
1
10  
100  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Rev 1: January 2009  
www.aosmd.com  
Page 4 of 6  
AON6403L  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
230.0  
200.0  
170.0  
140.0  
110.0  
80.0  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
TA=25°C  
TA=150°C  
TA=100°C  
TA=125°C  
50.0  
20.0  
0
25  
50  
75  
100  
125  
150  
0.000001  
0.00001  
0.0001  
0.001  
Time in avalanche, tA (s)  
TCASE (°C)  
Figure 12: Single Pulse Avalanche capability  
(Note C)  
Figure 13: Power De-rating (Note F)  
10000  
1000  
100  
10  
100  
80  
60  
40  
20  
0
TA=25°C  
1
0.0001  
0.01  
1
100  
10000  
0
25  
50  
75  
100  
125  
150  
T
CASE (°C)  
Pulse Width (s)  
Figure 14: Current De-rating (Note F)  
Figure 15: Single Pulse Power Rating Junction-to-  
Ambient (Note H)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.RθJA  
RθJA=55°C/W  
0.1  
PD  
0.01  
Single Pulse  
Ton  
T
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)  
Rev 1: January 2009  
www.aosmd.com  
Page 5 of 6  
AON6403L  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
-
-10V  
-
VDC  
Qgs  
Qgd  
+
Vds  
VDC  
+
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
toff  
ton  
t
td(off)  
td(on)  
t
r
f
Vgs  
-
90%  
10%  
DUT  
Vdd  
Vgs  
VDC  
+
Rg  
Vgs  
Vds  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
EAR= 1/2 LIA2R  
L
Vds  
Id  
Vgs  
Vds  
-
BVDSS  
Vgs  
Vdd  
VDC  
+
Id  
Rg  
I AR  
DUT  
Vgs  
Vgs  
Diode Recovery Test Circuit & Waveforms  
Q rr = - Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
trr  
L
-Isd  
-IF  
Isd  
Vgs  
dI/dt  
-IRM  
+
Vdd  
VDC  
Vdd  
-
-Vds  
Rev 1: January 2009  
www.aosmd.com  
Page 6 of 6  

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