AON6978 [AOS]
Plastic Encapsulated Device; 塑料封装的器件
| 型号： | AON6978 |
| 厂家： | 
ALPHA & OMEGA SEMICONDUCTORS |
| 描述： | Plastic Encapsulated Device |
| 文件： | 总3页 (文件大小：105K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AOS Semiconductor
Product Reliability Report
AON6978, rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AON6978.
Accelerated environmental tests are performed on a specific sample size, and then followed
by electrical test at end point. Review of final electrical test result confirms that AON6978
passes AOS quality and reliability requirements.
Table of Contents:
I.
Product Description
II.
III.
IV.
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
• Latest Trench Power AlphaMOS (αMOS LV) technology
• Integrated Schottky Diode (SRFET) on Low-Side
• Very Low RDS(on) at 4.5V VGS
• Low Gate Charge
• High Current Capability
Application
• DC/DC Converters in Computing, Servers, and POL
• Isolated DC/DC Converters in Telecom and Industrial
-RoHS Compliant
-Halogen-Free
Detailed information refers to datasheet.
II. Die / Package Information:
AON6978
Process
Standard sub-micron
Low voltage N channel
DFN 5x6B
Bare Cu
Ag Epoxy
Package Type
Lead Frame
Die Attach
Bonding
Cu & Au wire
Mold Material
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
Note * based on information provided by assembler and mold compound supplier
III. Result of Reliability Stress for AON6978
Test Item
Test Condition
Time
Point
Lot
Total
Number
of
Standard
Attribution Sample
size
Failures
0
168hr 85°c
/85%RH +3 cycle
reflow@260°c
-
12 lots
2310pcs
539pcs
JESD22-
A113
MSL
Precondition
168hrs
500 hrs
1000 hrs
1 lot
4 lots
2 lots
0
0
JESD22-
A108
Temp = 150 c,
Vgs=100% of
Vgsmax
HTGB
HTRB
77pcs / lot
539pcs
168hrs
500 hrs
1000 hrs
1 lot
4 lots
2 lots
JESD22-
A108
Temp = 150 c,
Vds=80% of
Vdsmax
77pcs / lot
693pcs
96 hrs
96 hrs
9 lots
0
0
0
JESD22-
A110
130 c, 85%RH,
33.3 psi, Vds =
80% of Vdsmax
HAST
(Note A*)
9 lots
77 pcs / lot
693pcs
JESD22-
A102
121c, 29.7psi,
RH=100%
Pressure Pot
(Note A*)
12 lots
77 pcs / lot
924pcs
250 / 500
cycles
JESD22-
A104
-65c to 150c,
air to air
Temperature
Cycle
(Note A*)
77 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 5.49
MTTF = 20784 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product (AON6978). Failure Rate Determination is based
on JEDEC Standard JESD 85. FIT means one failure per billion hours.
Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)]
= 1.83 x 109 / [2x (2x77x168 +8x77x500 +4x77x1000) x259] = 5.49
MTTF = 109 / FIT = 1.82 x 108hrs = 20784 years
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C )
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
32
100 deg C
13
115 deg C
5.64
130 deg C
2.59
150 deg C
1
Af
259
88
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
K = Boltzmann’s constant, 8.617164 X 10-5eV / K
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