AOU414L [AOS]

N-Channel Enhancement Mode Field Effect Transistor; N沟道增强型网络场效晶体管
AOU414L
型号: AOU414L
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

N-Channel Enhancement Mode Field Effect Transistor
N沟道增强型网络场效晶体管

晶体 晶体管
文件: 总5页 (文件大小:67K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AOU414  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
The AOU414 uses advanced trench technology to  
provide excellent RDS(ON), shoot-through immunity  
and body diode characteristics. This device is ideally  
suited for use as a low side switch in CPU core  
power conversion. Standard Product AOU414 is Pb-  
free (meets ROHS & Sony 259 specifications).  
AOU414L is a Green Product ordering option.  
AOU414 and AOU414L are electrically identical.  
VDS (V) = 30V  
ID = 85A (VGS = 10V)  
R
DS(ON) < 5.7m(VGS = 10V)  
DS(ON) < 7.5m(VGS = 4.5V)  
R
TO-251  
D
S
Top View  
Drain  
Connected to  
Tab  
G
G
D
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
VDS  
Drain-Source Voltage  
30  
V
VGS  
Gate-Source Voltage  
Continuous Drain  
Current B,G  
±20  
85  
V
A
TC=25°C G  
TC=100°C B  
ID  
73  
IDM  
IAR  
EAR  
Pulsed Drain Current  
Avalanche Current C  
Repetitive avalanche energy L=0.1mH C  
200  
30  
A
140  
mJ  
TC=25°C  
Power Dissipation B  
TC=100°C  
100  
PD  
W
50  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 175  
°C  
Thermal Characteristics  
Parameter  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Lead C  
Symbol  
RθJA  
Typ  
Max  
Units  
Steady-State  
Steady-State  
100  
0.7  
125  
1.5  
°C/W  
°C/W  
RθJL  
Alpha & Omega Semiconductor, Ltd.  
AOU414  
Electrical Characteristics (T =25°C unless otherwise noted)  
J
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=250µA, VGS=0V  
30  
V
V
DS=24V, VGS=0V  
0.005  
1
IDSS  
Zero Gate Voltage Drain Current  
µA  
5
TJ=55°C  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
VDS=0V, VGS= ±20V  
VDS=VGS ID=250µA  
VGS=10V, VDS=5V  
VGS=10V, ID=20A  
100  
2.4  
nA  
V
VGS(th)  
ID(ON)  
1.2  
1.8  
200  
A
4.7  
6.5  
6
5.7  
8
mΩ  
RDS(ON)  
Static Drain-Source On-Resistance  
TJ=125°C  
mΩ  
S
V
V
GS=4.5V, ID=20A  
DS=5V, ID=20A  
7.5  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
85  
0.7  
IS=1A,VGS=0V  
1
V
Maximum Body-Diode Continuous Current  
85  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
6060 7000  
638  
pF  
pF  
pF  
V
GS=0V, VDS=15V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
355  
VGS=0V, VDS=0V, f=1MHz  
0.45  
0.6  
SWITCHING PARAMETERS  
Qg(10V)  
Qg(4.5V)  
Qgs  
Total Gate Charge  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
96.4  
46.4  
13.6  
15.6  
15.7  
14.2  
55.5  
14  
115  
55  
nC  
nC  
nC  
nC  
ns  
V
GS=4.5V, VDS=15V, ID=20A  
Qgd  
tD(on)  
tr  
tD(off)  
tf  
21  
21  
75  
21  
38  
29  
VGS=10V, VDS=15V, RL=0.75,  
RGEN=3Ω  
ns  
ns  
ns  
trr  
IF=20A, dI/dt=100A/µs  
IF=20A, dI/dt=100A/µs  
31  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
nC  
Qrr  
24  
A: The value of RθJA is measured with the device in a still air environment with TA =25°C.  
B. The power dissipation P is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
D
dissipation limit for cases where additional heatsinking is used.  
C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a  
maximum junction temperature of TJ(MAX)=175°C.  
G. The maximum current rating is limited by bond-wires.  
Rev2: August 2005  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE  
Alpha & Omega Semiconductor, Ltd.  
AOU414  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
60  
50  
40  
30  
20  
10  
0
60  
50  
40  
30  
20  
10  
0
10V  
4.5V  
VDS=5V  
3.5V  
125°C  
VGS=3V  
25°C  
0
1
2
3
4
5
1
1.5  
2
2.5  
VGS(Volts)  
3
3.5  
4
V
DS (Volts)  
Figure 1: On-Region Characteristics  
Figure 2: Transfer Characteristics  
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
1.8  
1.6  
1.4  
1.2  
1
ID=20A  
VGS=4.5V  
VGS=4.5V  
VGS=10V  
VGS=10V  
0.8  
0
20  
40  
60  
80  
100  
0
25  
50  
75  
100  
125  
150  
175  
ID (A)  
Temperature (°C)  
Figure 4: On-Resistance vs. Junction  
Temperature  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
12  
10  
8
1.0E+02  
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
ID=20A  
125°C  
125°C  
6
25°C  
25°C  
1.0E-03  
4
1.0E-04  
1.0E-05  
2
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
2
4
6
8
10  
V
SD (Volts)  
V
GS (Volts)  
Figure 6: Body-Diode Characteristics  
Figure 5: On-Resistance vs. Gate-Source Voltage  
Alpha & Omega Semiconductor, Ltd.  
AOU414  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
8000  
10  
8
VDS=15V  
ID=20A  
Ciss  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
6
4
Coss  
Crss  
2
0
0
20  
40  
60  
80  
100  
0
5
10  
15  
20  
25  
30  
Qg (nC)  
Figure 7: Gate-Charge Characteristics  
VDS (Volts)  
Figure 8: Capacitance Characteristics  
1000  
100  
10  
1000  
TJ(Max)=175°C  
TA=25°C  
RDS(ON)  
limited  
800  
600  
400  
200  
0
100µs  
10µs  
1ms  
10ms  
DC  
TJ(Max)=175°C  
TA=25°C  
1
0.1  
1E-05 1E-04 0.001 0.01  
0.1  
1
10  
100  
0.1  
1
10  
100  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note F)  
V
DS (Volts)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
10  
D=Ton/T  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
TJ,PK=TA+PDM.ZθJC.RθJC  
RθJC=1.5°C/W  
1
PD  
0.1  
Ton  
T
Single Pulse  
0.0001  
0.01  
0.00001  
0.001  
0.01  
0.1  
1
10  
100  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Alpha & Omega Semiconductor, Ltd.  
AOU414  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
120  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
TA=25°C  
L ID  
tA  
=
BV VDD  
0
25  
50  
75  
CASE (°C)  
Figure 13: Power De-rating (Note B)  
100  
125  
150  
175  
0.00001  
0.0001  
0.001  
0.01  
T
Time in avalanche, tA (s)  
Figure 12: Single Pulse Avalanche capability  
100  
80  
60  
40  
20  
0
0
25  
50  
75  
CASE (°C)  
Figure 14: Current De-rating (Note B)  
100  
125  
150  
175  
T
Alpha & Omega Semiconductor, Ltd.  

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