AOZ8006FI [AOS]
Plastic Encapsulated Device; 塑料封装的器件
| 型号： | AOZ8006FI |
| 厂家： | 
ALPHA & OMEGA SEMICONDUCTORS |
| 描述： | Plastic Encapsulated Device |
| 文件： | 总4页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AOS Semiconductor
Product Reliability Report
AOZ8006FI, rev 1
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
495 Mercury Drive
Sunnyvale, CA 94085
U.S.
Tel: (408) 830-9742
www.aosmd.com
Jun 25, 2007
1
This AOS product reliability report summarizes the qualification result for AOZ8006FI.
Review of the electrical test results confirm that AOZ8006FI pass AOS quality and reliability
requirements for product release. The continuous qualification testing and reliability monitoring
program ensure that all outgoing products will continue to meet AOS quality and reliability standards.
Table of Contents:
I.
Product Description
II.
Package and Die information
Qualification Test Requirements
Qualification Tests Result
Quality Assurance Information
III.
IV.
V.
I. Product Description:
The AOZ8006FI is a transient voltage suppressor array designed to protect high speed data lines from ESD and
lightning. The product comes in RoHS compliant, MSOP10 package and is rated over a -40°C to +85°C ambient
temperature range.
.
Absolute Maximum Ratings
Parameter
VP-VN
6V
5A
Peak Pulse Current (Ipp), tp=8/20uS
Storage Temperature (TS)
ESD Rating per IEC61000-4-2, contact (1)
ESD Rating per IEC61000-4-2, air (2)
ESD Rating per Human Body Model (2)
Junction Temperature (Tj)
Notes:
-65°C to +150°C
±8kV
±15kV
±8kV
-40°C to +125°C
(1) IEC-61000-4-2 discharge with CDischarge=150pF, RDischarge=330Ω
(2) Human Body Discharge per MIL-STD-883, Method 3015 CDischarge=100pF, RDischarge=1.5kΩ
II. Package and Die Information:
AOZ8006FI
UMC 0.5um 5/18V 2P3M process
MSOP10
Product ID
Process
Package Type
Die
UI001A1_EPI (size: 716 x 616 um)
ASM A194FH
Ablestik 8360 epoxy
Au, 1mil
Sumitomo EME-6600D
Matte Tin
L/F material
Die attach material
Die bond wire
Mold Material
Plating Material
2
III. Qualification Tests Requirments
•
•
Same package as AOZ8007FI, therefore, the part will be qual. by extension.
Same package as AOZ8005FI, only difference is the die has BM (back metal) and die attach material is
conductive epoxy. Therefore, AOZ8005FI test data can be used for qual. also.
IV. Qualification Tests Result
Test Item
Test Condition
Sample Size
3 lots (82 /lot)
Result Comment
pass
pass
Per JESD 22-A113
85 C0/85%RH, 3 cyc
reflow@260 0C
Lots 1 (wafer lot# FN646.52-6, marking:
B1002), 82 units, passed pre-con.
Lots 2 (wafer lot# FN646.52-6, marking:
B1003), 82 units, passed pre-con.
Lots 3 (wafer lot# FN646.52-6, marking:
B1004), 82 units, passed pre-conditioning.
Pre-
Conditioning
(qual by
extension, using
AOZ8007FI data
)
)
Per JESD 22-A108_B
Vdd=6V
Lots 1 (wafer lot# F9AN1.51-01 , marking:
Z96R11A ), 80 units, passed 500 hrs .
Lots 2 (wafer lot# F9AN1.51-01 , marking:
Z96R11B ), 80 units, passed 500 hrs .
Lots 3 (wafer lot# F9AN1.51-01 , marking:
B1001 ), 82 units, passed 500 hrs .
3 lots (80 /lot)
HTOL
(pkg qual
burn-in, using
AOZ8005FI data
Temp = 125 0C
pass
pass
Per JESD 22-A108_B
Vdd=6V
IC Qual by extension using AOZ8005CI
which uses the same die.
Lots 1 (wafer lot# FN2MT.01-12, marking:
AC001), 80 units, passed 500 hrs .
Lots 2 (wafer lot# FN646.03-4 marking:
AC003), 80 units, passed 168 hrs .
Lots 1 (wafer lot# F9AN1.51-01 , marking:
Z96R11A), 60 units, passed HAST 100 hr .
Lots 2 (wafer lot# F9AN1.51-01 , marking:
Z96R11B), 60 units, passed HAST 100 h .
Lots 3 (wafer lot# F162T , marking:
B1001), 60 units, passed HAST 100 h rs.
2 lots (80 /lot)
3 lots (60 /lot)
HTOL
(die qual
burn-in, using
Temp = 125 0C
AOZ8005CI data
)
'130 +/- 2 0C, 85%RH, 33.3
psi, at VCC min power
dissapation
HAST
(qual by
extension, using
AOZ8005FI data
)
'-65 0C to +150 0C, air to
air (2cyc/hr)
Lots 1 (wafer lot# FN646.52-6 , marking:
B1002), 82 units, passed TC 500 cycles.
Lots 2 (wafer lot# FN646.52-6 , marking:
B1003), 82 units, passed TC 500 cycles.
Lots 3 (wafer lot# FN646.52-6 , marking:
B1004), 82 units, passed TC 500 cycles.
Lots 1 (wafer lot# FN646.52-6 , marking:
B1002), 82 units, passed PCT 96 hrs.
Lots 2 (wafer lot# FN646.52-6 , marking:
B1003), 82 units, passed PCT 96 hrs.
Lots 3 (wafer lot# FN646.52-6 , marking:
B1004 ), 82 units, passed PCT 96 hrs.
pass
pass
3 lots (82 /lot)
3 lots (82 /lot)
Temperature
Cycle
(qual by
extension, using
AOZ8007FI data
)
121C, 15+/-1 PSIG,
RH= 100%
Pressure Pot
(qual by
extension, using
AOZ8007FI data
)
pass
pass
pass
Per IEC-61000-4-2,
contact
Lot 1 (wafer lot# FN646.52-6 , marking:
B1001 ), 3 units passed ±8kV
3 units
3 units
3 units
ESD Rating
ESD Rating
Latch-up
Per IEC-61000-4-2, air
Lot 1 (wafer lot# FN646.52-6 , marking:
B1001 ), 3 units passed ±15kV
Per JESD78A
Lot 1 (wafer lot# FN646.03-4 , marking:
AC003 ), 3 units passed Latch-up.
(
AOZ8005CI data)
The qualification test results confirm that AOZ8006FI pass AOS quality and reliability
requirements for product release.
3
V. Quality Assurance Information
Acceptable Quality Level for outgoing inspection: 0.1% for electrical and visual. Guaranteed
Outgoing Defect Rate: < 50 ppm
Quality Sample Plan: conform to Mil-Std-105D
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