T6816-TIQ [ATMEL]
40-V Dual Hex Output Driver with Serial Input Control; 带串行输入控制40 -V双六角输出驱动器型号: | T6816-TIQ |
厂家: | ATMEL |
描述: | 40-V Dual Hex Output Driver with Serial Input Control |
文件: | 总15页 (文件大小:173K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Features
• Six High-side and Six Low-side Drivers
• Outputs Freely Configurable as Switch, Half Bridge or H–bridge
• Capable to Switch all Kinds of Loads such as DC Motors, Bulbs, Resistors, Capacitors
and Inductors
• 0.6 A Continuous Current per Switch
• Low-side: RDSon < 1.5 ꢀ versus Total Temperature Range
• High-side: RDSon < 2.0 ꢀ versus Total Temperature Range
• Very Low Quiescent Current Is < 20 µA in Standby Mode
• Outputs Short-circuit Protected
• Overtemperature Prewarning and Protection
• Undervoltage Protection
• Various Diagnosis Functions such as Shorted Output, Open Load, Overtemperature
and Power Supply Fail
• Serial Data Interface
• Operation Voltage up to 40 V
40-V Dual Hex
Output Driver
with Serial Input
Control
• Daisy Chaining Possible
• SO28 Power Package
Description
T6816
The T6816 is a fully protected driver interface designed in 0.8 µm BCDMOS technol-
ogy. It is especially suitable for truck or bus applications and the industrial 24-V supply.
It controls up to 12 different loads via a 16-bit dataword.
Each of the six high-side and six low-side drivers is capable to drive currents up to
600 mA. The drivers are freely configurable and can be controlled separately from a
standard serial data interface. Therefore, all kinds of loads such as bulbs, resistors,
capacitors and inductors can be combined. The IC is also designed to easily build H-
bridges to drive DC motors in motion-control applications.
Protection is guaranteed in terms of short-circuit conditions, overtemperature and
undervoltage. Various diagnosis functions and a very low quiescent current in standby
mode open a wide range of applications.
Overvoltage protection is matched to the requirements of the 24-V industrial voltage
and the 24-V automotive supply. Automotive qualification referring to conducted inter-
ferences, EMC protection and 2 kV ESD protection gives added value and enhanced
quality for the exacting requirements of automotive applications.
Rev. 4595B–BCD–05/03
Figure 1. Block Diagram
HS3
HS5
HS6
HS1
HS2
HS4
3
2
15
13
12
28
5
10
6
VS
VS
Fault
Detect
Fault
Detect
Fault
Detect
Fault
Detect
Fault
Fault
Detect
Detect
26
DI
GND
Osc
7
25
24
S
C
T
O
L
H
S
6
H
S
5
H
S
4
H
S
2
L
S
2
H
L
S
6
L
L
S
4
H
S
3
L
S
3
L
S
1
S
R
R
GND
GND
CLK
S
I
S
5
S
1
D
VS
UV -
protection
8
Control
logic
Input Register
Output Register
CS
9
GND
GND
GND
GND
Thermal
protection
17
18
L
S
6
P
S
F
S
C
D
H
S
6
H
S
5
H
S
4
H
L
S
2
H
S
1
T
P
L
S
5
L
S
4
H
S
3
L
S
3
L
S
1
I
INH
20
N
H
S
2
Power-on
21
22
23
19
-
reset
DO
Vcc
Fault
Detect
Fault
Detect
Fault
Detect
Fault
Detect
Fault
Detect
Fault
Detect
GND
Vcc
Vcc
4
1
16
LS1
14
LS2
11
LS3
27
LS6
LS4
LS5
2
T6816
4595B–BCD–05/03
T6816
Pin Configuration
Figure 2. Pinning SO28
HS6 LS6
28 27
DI
CLK
25
CS GND GND GND GND VCC DO INH
LS1 HS1
16 15
26
24
23
22
21
20
19
18
17
T6816
Lead frame
1
2
3
4
5
6
7
8
9
10
11
12
13
14
GND GND GND GND
LS5 HS5 HS4 LS4 VS
VS LS3 HS3 HS2 LS2
Pin Description
Pin
Symbol
Function
Low-side driver output 5; Power-MOS open drain with internal reverse diode; short-circuit protection; diagnosis for
short and open load
1
LS5
High-side driver output 5; Power-MOS open drain with internal reverse diode; short-circuit protection; diagnosis for
short and open load
2
HS5
3
HS4
LS4
VS
High-side driver output 4; see Pin 2
4
5
Low-side driver output 4; see Pin 1
Power supply output stages HS4, HS5, HS6, internal supply; external connection to Pin 10 necessary
Ground; reference potential; internal connection to Pin 20 - 23; cooling tab
Power supply output stages HS1, HS2 and HS3
Low-side driver output 3; see Pin 1
6, 7, 8, 9
10
GND
VS
11
LS3
HS3
HS2
LS2
HS1
LS1
12
High-side driver output 3; see Pin 2
13
High-side driver output 2; see Pin 2
14
Low-side driver output 2; see Pin 1
15
High-side driver output 1; see Pin 2
16
Low-side driver output 1; see Pin 1
Inhibit input; 5 V logic input with internal pull down; low = standby,
high = normal operating
17
INH
DO
Serial data output; 5 V CMOS logic level tri-state output for output (status) register data; sends 16-bit status
information to the QC (LSB is transferred first). Output will remain tri-stated unless device is selected by CS = low,
therefore, several ICs can operate on one data output line only.
18
19
VCC
GND
Logic supply voltage (5 V)
20, 21, 22,
23
Ground; see Pin 6 – 9
Chip select input; 5 V CMOS logic level input with internal pull up;
low = serial communication is enabled, high = disabled
24
CS
Serial clock input; 5 V CMOS logic level input with internal pull down;
controls serial data input interface and internal shift register (fmax = 2 MHz)
25
CLK
DI
Serial data input; 5 V CMOS logic level input with internal pull down; receives serial data from the control device; DI
expects a 16-bit control word with LSB being transferred first
26
Low-side driver output 6; see Pin 1
High-side driver output 6; see Pin 2
27
28
LS6
HS6
3
4595B–BCD–05/03
Functional Description
Serial Interface
Data transfer starts with the falling edge of the CS signal. Data must appear at DI syn-
chronized to CLK and are accepted on the falling edge of the CLK signal. LSB (bit 0,
SRR) has to be transferred first. Execution of new input data is enabled on the rising
edge of the CS signal. When CS is high, Pin DO is in tri-state condition. This output is
enabled on the falling edge of CS. Output data will change their state with the rising
edge of CLK and stay stable until the next rising edge of CLK appears. LSB (bit 0, TP) is
transferred first.
Figure 3. Data Transfer Input Data Protocol
CS
DI
SRR
0
LS1
HS1
LS2
HS2
LS3
HS3
LS4
HS4
LS5
HS5
10
LS6
11
HS6 OLD SCT
12 13 14
SI
1
2
3
4
5
6
7
8
9
15
CLK
DO
TP
SLS1 SHS1 SLS2 SHS2 SLS3 SHS3 SLS4 SHS4 SLS5 SHS5 SLS6 SHS6 SCD
INH
PSF
Table 1. Input Data Protocol
Bit
Input Register
Function
Status register reset (high = reset; the bits PSF, SCD and
overtemperature shutdown in the output data register are set to
low)
0
SRR
1
2
LS1
HS1
LS2
HS2
LS3
HS3
LS4
HS4
LS5
HS5
LS6
HS6
Controls output LS1 (high = switch output LS1 on)
Controls output HS1 (high = switch output HS1 on)
3
See LS1
See HS1
See LS1
See HS1
See LS1
See HS1
See LS1
See HS1
See LS1
See HS1
4
5
6
7
8
9
10
11
12
4
T6816
4595B–BCD–05/03
T6816
Table 1. Input Data Protocol (Continued)
Bit
Input Register
Function
13
OLD
Open load detection (low = on)
Programmable time delay for short circuit (shutdown delay high/
low = 12 ms/1.5 ms
14
15
SCT
SI
Software inhibit; low = standby, high = normal operation
(data transfer is not affected by standby function because the
digital part is still powered)
Table 2. Output Data Protocol
Output (Status)
Bit
Register
Function
Temperature prewarning: high = warning (overtemperature shut-
down see remark below)
0
TP
Normal operation: high = output is on, low = output is off
Open-load detection: high = open load, low = no open load
(correct load condition is detected if the corresponding output is
switched off)
1
2
Status LS1
Status HS1
Normal operation: high = output is on, low = output is off
Open-load detection: high = open load, low = no open load
(correct load condition is detected if the corresponding output is
switched off)
3
4
Status LS2
Status HS2
Status LS3
Status HS3
Status LS4
Status HS4
Status LS5
Status HS5
Status LS6
Status HS6
Description see LS1
Description see HS1
Description see LS1
Description see HS1
Description see LS1
Description see HS1
Description see LS1
Description see HS1
Description see LS1
Description see HS1
5
6
7
8
9
10
11
12
Short circuit detected: set high, when at least one output is
switched off by a short circuit condition
13
14
SCD
Inhibit: this bit is controlled by software (bit SI in input register)
and hardware inhibit (Pin 17). High = standby, low = normal
operation
INH
15
PSF
Power supply fail: undervoltage at Pin VS detected
Note:
Bit 0 to 15 = high: overtemperature shutdown
Table 3. Status of the Input Register after Power on Reset
Bit 15
(SI)
Bit 14
(SCT)
Bit 13
(OLD)
Bit 12
(HS6)
Bit 11
(LS6)
Bit 10
(HS5)
Bit 9
(LS5)
Bit 8
(HS4)
Bit 7
(LS4)
Bit 6
(HS3)
Bit 5
(LS3)
Bit 4
(HS2)
Bit 3
(LS2)
Bit 2
(HS1)
Bit 1
(LS1)
Bit 0
(SRR)
H
H
H
L
L
L
L
L
L
L
L
L
L
L
L
L
5
4595B–BCD–05/03
Power Supply Fail
In case of undervoltage at Pin VS, an internal timer is started. When the undervoltage
delay time (tdUV) programmed by the SCT bit is reached, the power supply fail bit (PSF)
in the output register is set and all outputs are disabled. When normal voltage is present
again, the outputs are enabled immediately. The PSF bit remains high until it is reset by
the SRR bit in the input register.
Open-load Detection
If the open-load detection bit (OLD) is set to low, a pull-up current for each high-side
switch and a pull-down current for each low-side switch is turned on (open-load detec-
tion current IHS1-6, ILS1-6). If VVS–VHS1-6 or VLS1-6 is lower than the open-load detection
threshold (open-load condition), the corresponding bit of the output in the output register
is set to high. Switching on an output stage with OLD bit set to low disables the open-
load function for this output.
Overtemperature
Protection
If the junction temperature exceeds the thermal prewarning threshold, TjPW set, the tem-
perature prewarning bit (TP) in the output register is set. When the temperature falls
below the thermal prewarning threshold, TjPW reset, the bit TP is reset. The TP bit can be
read without transferring a complete 16-bit data word: with CS = high to low, the state of
TP appears at Pin DO. After the microcontroller has read this information, CS is set high
and the data transfer is interrupted without affecting the state of the input and output
registers.
If the junction temperature exceeds the thermal shutdown threshold, Tj switch off, the out-
puts are disabled and all bits in the output register are set high. The outputs can be
enabled again when the temperature falls below the thermal shutdown threshold,
T j switch on, and when a high has been written to the SRR bit in the input register. Ther-
mal prewarning and shutdown threshold have hysteresis.
Short-circuit Protection
The output currents are limited by a current regulator. Current limitation takes place
when the overcurrent limitation and shutdown threshold (IHS1-6, ILS1-6) are reached.
Simultaneously, an internal timer is started. The shorted output is disabled when during
a permanent short the delay time (tdSd) programmed by the short-circuit timer bit (SCT)
is reached. Additionally, the short-circuit detection bit (SCD) is set. If the temperature
prewarning bit TP in the output register is set during a short, the shorted output is dis-
abled immediately and SCD bit is set. By writing a high to the SRR bit in the input
register, the SCD bit is reset and the disabled outputs are enabled.
Inhibit
There are two ways to inhibit the T6816:
1. Set bit SI in the input register to zero
2. Switch Pin 17 (INH) to 0 V
In both cases, all output stages are turned off but the serial interface stays active. The
output stages can be activated again by bit SI = 1 or by Pin 17 (INH) switched back to
5 V.
6
T6816
4595B–BCD–05/03
T6816
Absolute Maximum Ratings
All values refer to GND pins
Parameter
Symbol
Value
-0.3 to +40
-1
Unit
V
Supply voltage Pins 5, 10
Supply voltage tt0.5 s; ISu-2 A Pins 5, 10
VVS
VVS
V
Supply voltage difference |VS_Pin5 - VS_Pin10
Supply current Pins 5, 10
|
DVVS
150
mV
A
IVS
IVS
1.4
Supply current t < 200 ms Pins 5, 10
Logic supply voltage Pin 19
Input voltage Pin 17
2.6
A
VVCC
-0.3 to +7
-0.3 to +17
-0.3 to VVCC +0.3
-0.3 to VVCC +0.3
-10 to +10
-10 to +10
V
VINH
V
Logic input voltage Pins 24 to 26
Logic output voltage Pin 18
Input current Pins 17, 24 to 26
Output current Pin 18
VDI, VCLK, VCS
VDO
IINH, IDI, ICLK, ICS
IDO
ILS1 to ILS6
IHS1 to IHS6
V
V
mA
mA
Output current Pins 1 to 4, 11 to 16,
Pins 27 and 28
Internal limited, see
output specification
Reverse conducting current Pins 2, 3, 12, 13,
15, (tPulse = 150 ms) 28 towards Pins 5, 10
IHS1 to IHS6
17
A
Junction temperature range
Storage temperature range
Tj
-40 to +150
-55 to +150
LC
LC
TSTG
Thermal Resistance
All values refer to GND pins
Parameter
Test Conditions
Measured to GND
Symbol
Min.
Typ.
Max.
Unit
Junction - pin
RthJP
25
K/W
Pins 6 to 9 and 20 to 23
Junction ambient
RthJA
65
K/W
Operating Range
All values refer to GND pins
Parameter
Test Conditions
Pins 5, 10
Symbol
VVS
Min.
Typ.
Max.
40
Unit
V
(1)
Supply voltage
VUV
4.5
Logic supply voltage
Logic input voltage
Pin 19
VVCC
5
5.5
V
Pin 17, 24 to 26
VINH, VDI,
VCLK, VCS
-0.3
VVCC
V
Serial interface clock frequency
Junction temperature range
Pin 25
fCLK
Tj
2
MHz
-40
150
LC
Note:
1. Threshold for undervoltage detection.
7
4595B–BCD–05/03
Noise and Surge Immunity
Parameter
Test Conditions
Value
Level 4 (1)
Level 5
2 kV
Conducted interferences
Interference Suppression
ESD (Human Body Model)
ESD (Machine Model)
ISO 7637-1
VDE 0879 Part 2
MIL-STD-883D Method 3015.7
EOS/ESD - S 5.2
150 V
Note:
1. Test pulse 5: VSmax = 40 V
Electrical Characteristics
7.5 V < VVS < 40 V; 4.5 V < VVCC < 5.5 V; INH = High; -40°C < Tj < 150°C; unless otherwise specified,
all values refer to GND pins.
No.
1
Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
Current Consumption
1.1
Quiescent current
(VS)
VVS < 28 V, INH or
bit SI = lo
5, 10
19
IVS
40
20
µA
µA
A
A
1.2
1.3
Quiescent current
(VCC)
4.5 V < VVCC < 5.5 V,
INH or bit SI = low
IVCC
VVS < 28 V normal
operating, all output
stages off,
Supply current (VS)
5, 10
IVS
0.8
1.2
mA
A
1.4
1.5
VVS < 28 V normal
operating, all output
stages on, no load
Supply current (VS)
Supply current (VCC)
5, 10
19
IVS
10
mA
µA
A
A
4.5 V < VVCC < 5.5 V,
normal operating Pin
IVCC
150
2
2.1
3
Internal Oscillator Frequency
Frequency (timebase
for delay timers)
fOSC
19
45
kHz
A
Undervoltage Detection, Power-on Reset
Power–on reset
threshold
3.1
19
VVCC
tdPor
VUV
3.4
30
3.9
95
4.4
160
7.0
V
µs
V
A
A
A
A
A
Power–on reset delay
time
After switching on
VVCC
3.2
3.3
3.4
3.5
19
Undervoltage
detection threshold
5, 10
5, 10
5, 10
5.5
Undervoltage
detection hysteresis
ꢁVUV
tdUV
0.4
V
Undervoltage
detection delay
7
21
ms
4
Thermal Prewarning and Shutdown
Thermal prewarning
4.1
4.2
17
17
TjPWset
125
105
145
125
165
145
LC
LC
A
A
Thermal prewarning
TjPWreset
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Notes: 1. Delay time between rising edge of CS after data transmission and switch on output stages to 90% of final level
8
T6816
4595B–BCD–05/03
T6816
Electrical Characteristics (Continued)
7.5 V < VVS < 40 V; 4.5 V < VVCC < 5.5 V; INH = High; -40°C < Tj < 150°C; unless otherwise specified,
all values refer to GND pins.
No.
Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
4.3
Thermal prewarning
hysteresis
DTjPW
20
K
A
4.4
4.5
4.6
Thermal shutdown
Thermal shutdown
17
17
Tj switch off
Tj switch on
150
130
170
150
190
170
LC
LC
A
A
Thermal shutdown
hysteresis
DTj switch off
20
K
A
4.7
4.8
Ratio thermal
shutdown/thermal
prewarning
Tj switch off/
TjPW set
1.05
1.05
1.17
A
Ratio thermal
shutdown/thermal
prewarning
Tj switch on/
TjPW reset
1.2
A
A
5
Output Specification (LS1 - LS6, HS1 - HS6) 7.5 V < VVS < 40 V
5.1
1, 4,
11,
14,
16, 27
RDS OnL
1.5
ꢀ
On resistance
On resistance
IOut = 600 mA
5.2
5.3
5.4
5.5
2, 3,
12,
13,
A
A
A
A
D
RDS OnH
2.0
60
ꢀ
IOut = -600 mA
15, 28
1, 4,
11,
14,
VLS1-6
40
V
Output clamping
voltage
ILS1-6 = 50 mA
16, 27
1, 4,
11,
14,
Output leakage
current
V
LS1–6 = 40 V
ILS1–6
10
µA
all output stages off
16, 27
2, 3,
12,
13,
Output leakage
current
V
HS1-6 = 0 V
IHS1–6
-10
µA
all output stages off
15, 28
5.7
5.8
5.9
1-4,
11-16
27, 28
Woutx
15
mJ
Inductive shutdown
energy
1-4,
11-16
27, 28
dVLS1–6/dt
dVHS1–6/dt
50
200
950
400
mV/µs
mA
A
A
Output voltage edge
steepness
Overcurrent limitation
and shutdown
threshold
1, 4,
11,14
16, 27
ILS1–6
650
1250
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Notes: 1. Delay time between rising edge of CS after data transmission and switch on output stages to 90% of final level
9
4595B–BCD–05/03
Electrical Characteristics (Continued)
7.5 V < VVS < 40 V; 4.5 V < VVCC < 5.5 V; INH = High; -40°C < Tj < 150°C; unless otherwise specified,
all values refer to GND pins.
No.
Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
5.10
Overcurrent limitation
and shutdown
threshold
2, 3,
12,13
15, 28
IHS1–6
-1250
-950
-650
mA
A
5.11
5.12
Overcurrent
shutdown delay time
Input register
bit 14 (SCT) = low
tdSd
1.0
60
1.5
2.0
ms
µA
A
A
1, 4,
11,14
16, 27
Open load detection
current
Input register bit 13
(OLD) =low, output off
ILS1–6
200
5.13
2, 3,
12,13
15, 28
Open load detection
current
Input register bit 13
(OLD) =low, output off
IHS1–6
-150
1.2
-30
µA
A
A
A
5.14
5.15
Open load detection
current ratio
I
LS1–6/IHS1–
6
1, 4,
11,14
16, 27
Open load detection
threshold
Input register bit 13
(OLD) =low, output off
VLS1–6
0.6
4
4
V
V
5.16
2, 3,
12,13
15, 28
Open load detection
threshold
Input register bit 13
(OLD) =low, output off
VVS–
VHS1–6
0.6
A
5.17
5.18
Output switch on
delay 1)
RLoad = 1 kꢀ
RLoad = 1 kꢀ
tdon
tdoff
0.5
1
ms
ms
A
A
Output switch off
delay 1)
6
Inhibit Input
6.1
Input voltage low level
threshold
0.3-
VVCC
17
17
VIL
VIH
V
V
A
A
6.2
6.3
Input voltage high
level threshold
0.7-
VVCC
Hysteresis of input
voltage
17
17
ꢁVI
100
10
700
80
mV
µA
A
A
6.4
7
Pull-down current
VINH = VVCC
IPD
Serial Interface - Logic Inputs DI, CLK, CS
7.1
Input voltage low-
level threshold
0.3-
VVCC
24-26
24-26
24-26
25, 26
24
VIL
VIH
V
V
A
A
A
A
A
7.2
7.3
7.4
7.5
Input voltage high-
level threshold
0.7-
VVCC
Hysteresis of input
voltage
DVI
IPDSI
IPUSI
50
2
500
50
mV
µA
µA
Pull-down current Pin
VDI, VCLK = VVCC
DI, CLK
Pull-up current
Pin CS
VCS= 0 V
-50
-2
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Notes: 1. Delay time between rising edge of CS after data transmission and switch on output stages to 90% of final level
10
T6816
4595B–BCD–05/03
T6816
Electrical Characteristics (Continued)
7.5 V < VVS < 40 V; 4.5 V < VVCC < 5.5 V; INH = High; -40°C < Tj < 150°C; unless otherwise specified,
all values refer to GND pins.
No.
8
Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
Serial Interface - Logic Output DO
8.1
Output voltage low
IOL = 3 mA
level
18
18
18
VDOL
VDOH
IDO
0.5
V
V
A
A
A
8.2
8.3
Output voltage high
IOL = -2 mA
level
VVCC
0.7 V
-
Leakage current
(tri-state)
VCS = VVCC,
0 V < VDO < VVCC
-10
10
µA
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Notes: 1. Delay time between rising edge of CS after data transmission and switch on output stages to 90% of final level
Serial Interface — Timing
Parameters
Test Conditions
CDO = 100 pF
CDO = 100 pF
CDO = 100 pF
CDO = 100 pF
CDO = 100 pF
Timing Chart No.
Symbol
tENDO
tDISDO
tDOf
Min.
Typ.
Max.
200
200
100
100
200
Unit
ns
DO enable after CS falling edge
DO disable after CS rising edge
DO fall time
1
2
ns
–
ns
DO rise time
–
tDOr
ns
DO valid time
10
4
tDOVal
tCSSethl
tCSSetlh
ns
CS setup time
225
225
ns
CS setup time
8
ns
Input register Bit 14
(SCT) = high
CS high time
CS high time
9
9
tCSh
tCSh
16
2
ms
ms
Input register Bit 14
(SCT) = low
CLK high time
CLK low time
CLK period time
CLK setup time
CLK setup time
DI setup time
DI hold time
5
6
tCLKh
tCLKl
225
225
500
225
225
40
ns
ns
ns
ns
ns
ns
ns
–
tCLKp
7
tCLKSethl
tCLKSetlh
tDIset
3
11
12
tDIHold
40
11
4595B–BCD–05/03
Figure 4. Serial Interface Timing with Chart Numbers
1
2
CS
DO
9
CS
4
7
CLK
5
3
6
8
DI
11
CLK
10
12
DO
Inputs DI, CLK, CS: High level = 0.7 x VCC, low level = 0.3 x VCC
Output DO: High level = 0.8 x VCC, low level = 0.2 x VCC
12
T6816
4595B–BCD–05/03
T6816
Figure 5. Application Circuit
Vcc
U5021M
Enable
WATCHDOG
HS1
HS2
HS3
HS4
HS5
HS6
15
13
12
3
2
28
Vs
BYT41
D
VBAT
5
10
6
VS
VS
Fault
Fault
Fault
Fault
Fault
Fault
Detect
Detect
Detect
Detect
Detect
Detect
24V
+
26
25
DI
GND
Osc
7
S
C
T
O
L
H
S
6
L
S
6
H
S
5
L
H
S
4
L
S
4
H
S
3
L
S
3
H
S
2
L
S
2
H
L
S
1
S
GND
GND
CLK
S
I
S
5
S
1
R
R
D
VS
8
Control
logic
UV -
24
Input Register
Output Register
ꢀC
CS
INH
protection
9
GND
GND
Thermal
17
18
L
S
6
P
S
F
S
C
D
H
S
6
H
S
5
L
S
5
H
S
4
L
S
4
H
S
3
L
H
S
2
L
H
S
1
L
T
P
I
protection
20
21
22
23
19
N
H
S
S
S
3
2
1
Power-on
Reset
GND
GND
GND
DO
Vcc
Fault
Fault
Detect
Fault
Fault
Detect
Fault
Detect
Fault
Detect
Detect
Detect
Vcc
Vcc
+
Vcc
Vcc
Vcc
5 V
16
LS1
14
LS2
11
LS3
4
1
27
LS4
LS5
LS6
Vs
Vs
Application Notes
It is strongly recommended to connect the blocking capacitors at VCC and VS as close as
possible to the power supply and GND pins.
Recommended value for capacitors at VS:
electrolythic capacitor C > 22 µF in parallel with a ceramic capacitor C = 100 nF. Value
for electrolytic capacitor depends on external loads, conducted interferences and
reverse conducting current IHSX (see: Absolut Maximum Ratings).
Recommended value for capacitors at VCC
:
electrolythic capacitor C > 10 µF in parallel with a ceramic capacitor C = 100 nF.
To reduce thermal resistance it is recommended to place cooling areas on the PCB as
close as possible to GND pins.
13
4595B–BCD–05/03
Ordering Information
Extended Type Number
Package
Remarks
T6816-TIQ
SO28
Power package, taped and reeled
Package Information
9.15
8.65
Package SO28
Dimensions in mm
18.05
17.80
7.5
7.3
2.35
0.25
0.25
0.10
0.4
10.50
10.20
1.27
16.51
28
15
technical drawings
according to DIN
specifications
1
14
14
T6816
4595B–BCD–05/03
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Corporate Headquarters
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© Atmel Corporation 2003.
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty
which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors
which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does
not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted
by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical
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Other terms and product names may be the trademarks of others.
Printed on recycled paper.
4595B–BCD–05/03
xM
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