T6816-TIQ [ATMEL]

40-V Dual Hex Output Driver with Serial Input Control; 带串行输入控制40 -V双六角输出驱动器
T6816-TIQ
型号: T6816-TIQ
厂家: ATMEL    ATMEL
描述:

40-V Dual Hex Output Driver with Serial Input Control
带串行输入控制40 -V双六角输出驱动器

驱动器
文件: 总15页 (文件大小:173K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
Six High-side and Six Low-side Drivers  
Outputs Freely Configurable as Switch, Half Bridge or H–bridge  
Capable to Switch all Kinds of Loads such as DC Motors, Bulbs, Resistors, Capacitors  
and Inductors  
0.6 A Continuous Current per Switch  
Low-side: RDSon < 1.5 versus Total Temperature Range  
High-side: RDSon < 2.0 versus Total Temperature Range  
Very Low Quiescent Current Is < 20 µA in Standby Mode  
Outputs Short-circuit Protected  
Overtemperature Prewarning and Protection  
Undervoltage Protection  
Various Diagnosis Functions such as Shorted Output, Open Load, Overtemperature  
and Power Supply Fail  
Serial Data Interface  
Operation Voltage up to 40 V  
40-V Dual Hex  
Output Driver  
with Serial Input  
Control  
Daisy Chaining Possible  
SO28 Power Package  
Description  
T6816  
The T6816 is a fully protected driver interface designed in 0.8 µm BCDMOS technol-  
ogy. It is especially suitable for truck or bus applications and the industrial 24-V supply.  
It controls up to 12 different loads via a 16-bit dataword.  
Each of the six high-side and six low-side drivers is capable to drive currents up to  
600 mA. The drivers are freely configurable and can be controlled separately from a  
standard serial data interface. Therefore, all kinds of loads such as bulbs, resistors,  
capacitors and inductors can be combined. The IC is also designed to easily build H-  
bridges to drive DC motors in motion-control applications.  
Protection is guaranteed in terms of short-circuit conditions, overtemperature and  
undervoltage. Various diagnosis functions and a very low quiescent current in standby  
mode open a wide range of applications.  
Overvoltage protection is matched to the requirements of the 24-V industrial voltage  
and the 24-V automotive supply. Automotive qualification referring to conducted inter-  
ferences, EMC protection and 2 kV ESD protection gives added value and enhanced  
quality for the exacting requirements of automotive applications.  
Rev. 4595B–BCD–05/03  
Figure 1. Block Diagram  
HS3  
HS5  
HS6  
HS1  
HS2  
HS4  
3
2
15  
13  
12  
28  
5
10  
6
VS  
VS  
Fault  
Detect  
Fault  
Detect  
Fault  
Detect  
Fault  
Detect  
Fault  
Fault  
Detect  
Detect  
26  
DI  
GND  
Osc  
7
25  
24  
S
C
T
O
L
H
S
6
H
S
5
H
S
4
H
S
2
L
S
2
H
L
S
6
L
L
S
4
H
S
3
L
S
3
L
S
1
S
R
R
GND  
GND  
CLK  
S
I
S
5
S
1
D
VS  
UV -  
protection  
8
Control  
logic  
Input Register  
Output Register  
CS  
9
GND  
GND  
GND  
GND  
Thermal  
protection  
17  
18  
L
S
6
P
S
F
S
C
D
H
S
6
H
S
5
H
S
4
H
L
S
2
H
S
1
T
P
L
S
5
L
S
4
H
S
3
L
S
3
L
S
1
I
INH  
20  
N
H
S
2
Power-on  
21  
22  
23  
19  
-
reset  
DO  
Vcc  
Fault  
Detect  
Fault  
Detect  
Fault  
Detect  
Fault  
Detect  
Fault  
Detect  
Fault  
Detect  
GND  
Vcc  
Vcc  
4
1
16  
LS1  
14  
LS2  
11  
LS3  
27  
LS6  
LS4  
LS5  
2
T6816  
4595B–BCD–05/03  
T6816  
Pin Configuration  
Figure 2. Pinning SO28  
HS6 LS6  
28 27  
DI  
CLK  
25  
CS GND GND GND GND VCC DO INH  
LS1 HS1  
16 15  
26  
24  
23  
22  
21  
20  
19  
18  
17  
T6816  
Lead frame  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
GND GND GND GND  
LS5 HS5 HS4 LS4 VS  
VS LS3 HS3 HS2 LS2  
Pin Description  
Pin  
Symbol  
Function  
Low-side driver output 5; Power-MOS open drain with internal reverse diode; short-circuit protection; diagnosis for  
short and open load  
1
LS5  
High-side driver output 5; Power-MOS open drain with internal reverse diode; short-circuit protection; diagnosis for  
short and open load  
2
HS5  
3
HS4  
LS4  
VS  
High-side driver output 4; see Pin 2  
4
5
Low-side driver output 4; see Pin 1  
Power supply output stages HS4, HS5, HS6, internal supply; external connection to Pin 10 necessary  
Ground; reference potential; internal connection to Pin 20 - 23; cooling tab  
Power supply output stages HS1, HS2 and HS3  
Low-side driver output 3; see Pin 1  
6, 7, 8, 9  
10  
GND  
VS  
11  
LS3  
HS3  
HS2  
LS2  
HS1  
LS1  
12  
High-side driver output 3; see Pin 2  
13  
High-side driver output 2; see Pin 2  
14  
Low-side driver output 2; see Pin 1  
15  
High-side driver output 1; see Pin 2  
16  
Low-side driver output 1; see Pin 1  
Inhibit input; 5 V logic input with internal pull down; low = standby,  
high = normal operating  
17  
INH  
DO  
Serial data output; 5 V CMOS logic level tri-state output for output (status) register data; sends 16-bit status  
information to the QC (LSB is transferred first). Output will remain tri-stated unless device is selected by CS = low,  
therefore, several ICs can operate on one data output line only.  
18  
19  
VCC  
GND  
Logic supply voltage (5 V)  
20, 21, 22,  
23  
Ground; see Pin 6 – 9  
Chip select input; 5 V CMOS logic level input with internal pull up;  
low = serial communication is enabled, high = disabled  
24  
CS  
Serial clock input; 5 V CMOS logic level input with internal pull down;  
controls serial data input interface and internal shift register (fmax = 2 MHz)  
25  
CLK  
DI  
Serial data input; 5 V CMOS logic level input with internal pull down; receives serial data from the control device; DI  
expects a 16-bit control word with LSB being transferred first  
26  
Low-side driver output 6; see Pin 1  
High-side driver output 6; see Pin 2  
27  
28  
LS6  
HS6  
3
4595B–BCD–05/03  
Functional Description  
Serial Interface  
Data transfer starts with the falling edge of the CS signal. Data must appear at DI syn-  
chronized to CLK and are accepted on the falling edge of the CLK signal. LSB (bit 0,  
SRR) has to be transferred first. Execution of new input data is enabled on the rising  
edge of the CS signal. When CS is high, Pin DO is in tri-state condition. This output is  
enabled on the falling edge of CS. Output data will change their state with the rising  
edge of CLK and stay stable until the next rising edge of CLK appears. LSB (bit 0, TP) is  
transferred first.  
Figure 3. Data Transfer Input Data Protocol  
CS  
DI  
SRR  
0
LS1  
HS1  
LS2  
HS2  
LS3  
HS3  
LS4  
HS4  
LS5  
HS5  
10  
LS6  
11  
HS6 OLD SCT  
12 13 14  
SI  
1
2
3
4
5
6
7
8
9
15  
CLK  
DO  
TP  
SLS1 SHS1 SLS2 SHS2 SLS3 SHS3 SLS4 SHS4 SLS5 SHS5 SLS6 SHS6 SCD  
INH  
PSF  
Table 1. Input Data Protocol  
Bit  
Input Register  
Function  
Status register reset (high = reset; the bits PSF, SCD and  
overtemperature shutdown in the output data register are set to  
low)  
0
SRR  
1
2
LS1  
HS1  
LS2  
HS2  
LS3  
HS3  
LS4  
HS4  
LS5  
HS5  
LS6  
HS6  
Controls output LS1 (high = switch output LS1 on)  
Controls output HS1 (high = switch output HS1 on)  
3
See LS1  
See HS1  
See LS1  
See HS1  
See LS1  
See HS1  
See LS1  
See HS1  
See LS1  
See HS1  
4
5
6
7
8
9
10  
11  
12  
4
T6816  
4595B–BCD–05/03  
T6816  
Table 1. Input Data Protocol (Continued)  
Bit  
Input Register  
Function  
13  
OLD  
Open load detection (low = on)  
Programmable time delay for short circuit (shutdown delay high/  
low = 12 ms/1.5 ms  
14  
15  
SCT  
SI  
Software inhibit; low = standby, high = normal operation  
(data transfer is not affected by standby function because the  
digital part is still powered)  
Table 2. Output Data Protocol  
Output (Status)  
Bit  
Register  
Function  
Temperature prewarning: high = warning (overtemperature shut-  
down see remark below)  
0
TP  
Normal operation: high = output is on, low = output is off  
Open-load detection: high = open load, low = no open load  
(correct load condition is detected if the corresponding output is  
switched off)  
1
2
Status LS1  
Status HS1  
Normal operation: high = output is on, low = output is off  
Open-load detection: high = open load, low = no open load  
(correct load condition is detected if the corresponding output is  
switched off)  
3
4
Status LS2  
Status HS2  
Status LS3  
Status HS3  
Status LS4  
Status HS4  
Status LS5  
Status HS5  
Status LS6  
Status HS6  
Description see LS1  
Description see HS1  
Description see LS1  
Description see HS1  
Description see LS1  
Description see HS1  
Description see LS1  
Description see HS1  
Description see LS1  
Description see HS1  
5
6
7
8
9
10  
11  
12  
Short circuit detected: set high, when at least one output is  
switched off by a short circuit condition  
13  
14  
SCD  
Inhibit: this bit is controlled by software (bit SI in input register)  
and hardware inhibit (Pin 17). High = standby, low = normal  
operation  
INH  
15  
PSF  
Power supply fail: undervoltage at Pin VS detected  
Note:  
Bit 0 to 15 = high: overtemperature shutdown  
Table 3. Status of the Input Register after Power on Reset  
Bit 15  
(SI)  
Bit 14  
(SCT)  
Bit 13  
(OLD)  
Bit 12  
(HS6)  
Bit 11  
(LS6)  
Bit 10  
(HS5)  
Bit 9  
(LS5)  
Bit 8  
(HS4)  
Bit 7  
(LS4)  
Bit 6  
(HS3)  
Bit 5  
(LS3)  
Bit 4  
(HS2)  
Bit 3  
(LS2)  
Bit 2  
(HS1)  
Bit 1  
(LS1)  
Bit 0  
(SRR)  
H
H
H
L
L
L
L
L
L
L
L
L
L
L
L
L
5
4595B–BCD–05/03  
Power Supply Fail  
In case of undervoltage at Pin VS, an internal timer is started. When the undervoltage  
delay time (tdUV) programmed by the SCT bit is reached, the power supply fail bit (PSF)  
in the output register is set and all outputs are disabled. When normal voltage is present  
again, the outputs are enabled immediately. The PSF bit remains high until it is reset by  
the SRR bit in the input register.  
Open-load Detection  
If the open-load detection bit (OLD) is set to low, a pull-up current for each high-side  
switch and a pull-down current for each low-side switch is turned on (open-load detec-  
tion current IHS1-6, ILS1-6). If VVS–VHS1-6 or VLS1-6 is lower than the open-load detection  
threshold (open-load condition), the corresponding bit of the output in the output register  
is set to high. Switching on an output stage with OLD bit set to low disables the open-  
load function for this output.  
Overtemperature  
Protection  
If the junction temperature exceeds the thermal prewarning threshold, TjPW set, the tem-  
perature prewarning bit (TP) in the output register is set. When the temperature falls  
below the thermal prewarning threshold, TjPW reset, the bit TP is reset. The TP bit can be  
read without transferring a complete 16-bit data word: with CS = high to low, the state of  
TP appears at Pin DO. After the microcontroller has read this information, CS is set high  
and the data transfer is interrupted without affecting the state of the input and output  
registers.  
If the junction temperature exceeds the thermal shutdown threshold, Tj switch off, the out-  
puts are disabled and all bits in the output register are set high. The outputs can be  
enabled again when the temperature falls below the thermal shutdown threshold,  
T j switch on, and when a high has been written to the SRR bit in the input register. Ther-  
mal prewarning and shutdown threshold have hysteresis.  
Short-circuit Protection  
The output currents are limited by a current regulator. Current limitation takes place  
when the overcurrent limitation and shutdown threshold (IHS1-6, ILS1-6) are reached.  
Simultaneously, an internal timer is started. The shorted output is disabled when during  
a permanent short the delay time (tdSd) programmed by the short-circuit timer bit (SCT)  
is reached. Additionally, the short-circuit detection bit (SCD) is set. If the temperature  
prewarning bit TP in the output register is set during a short, the shorted output is dis-  
abled immediately and SCD bit is set. By writing a high to the SRR bit in the input  
register, the SCD bit is reset and the disabled outputs are enabled.  
Inhibit  
There are two ways to inhibit the T6816:  
1. Set bit SI in the input register to zero  
2. Switch Pin 17 (INH) to 0 V  
In both cases, all output stages are turned off but the serial interface stays active. The  
output stages can be activated again by bit SI = 1 or by Pin 17 (INH) switched back to  
5 V.  
6
T6816  
4595B–BCD–05/03  
T6816  
Absolute Maximum Ratings  
All values refer to GND pins  
Parameter  
Symbol  
Value  
-0.3 to +40  
-1  
Unit  
V
Supply voltage Pins 5, 10  
Supply voltage tt0.5 s; ISu-2 A Pins 5, 10  
VVS  
VVS  
V
Supply voltage difference |VS_Pin5 - VS_Pin10  
Supply current Pins 5, 10  
|
DVVS  
150  
mV  
A
IVS  
IVS  
1.4  
Supply current t < 200 ms Pins 5, 10  
Logic supply voltage Pin 19  
Input voltage Pin 17  
2.6  
A
VVCC  
-0.3 to +7  
-0.3 to +17  
-0.3 to VVCC +0.3  
-0.3 to VVCC +0.3  
-10 to +10  
-10 to +10  
V
VINH  
V
Logic input voltage Pins 24 to 26  
Logic output voltage Pin 18  
Input current Pins 17, 24 to 26  
Output current Pin 18  
VDI, VCLK, VCS  
VDO  
IINH, IDI, ICLK, ICS  
IDO  
ILS1 to ILS6  
IHS1 to IHS6  
V
V
mA  
mA  
Output current Pins 1 to 4, 11 to 16,  
Pins 27 and 28  
Internal limited, see  
output specification  
Reverse conducting current Pins 2, 3, 12, 13,  
15, (tPulse = 150 ms) 28 towards Pins 5, 10  
IHS1 to IHS6  
17  
A
Junction temperature range  
Storage temperature range  
Tj  
-40 to +150  
-55 to +150  
LC  
LC  
TSTG  
Thermal Resistance  
All values refer to GND pins  
Parameter  
Test Conditions  
Measured to GND  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Junction - pin  
RthJP  
25  
K/W  
Pins 6 to 9 and 20 to 23  
Junction ambient  
RthJA  
65  
K/W  
Operating Range  
All values refer to GND pins  
Parameter  
Test Conditions  
Pins 5, 10  
Symbol  
VVS  
Min.  
Typ.  
Max.  
40  
Unit  
V
(1)  
Supply voltage  
VUV  
4.5  
Logic supply voltage  
Logic input voltage  
Pin 19  
VVCC  
5
5.5  
V
Pin 17, 24 to 26  
VINH, VDI,  
VCLK, VCS  
-0.3  
VVCC  
V
Serial interface clock frequency  
Junction temperature range  
Pin 25  
fCLK  
Tj  
2
MHz  
-40  
150  
LC  
Note:  
1. Threshold for undervoltage detection.  
7
4595B–BCD–05/03  
Noise and Surge Immunity  
Parameter  
Test Conditions  
Value  
Level 4 (1)  
Level 5  
2 kV  
Conducted interferences  
Interference Suppression  
ESD (Human Body Model)  
ESD (Machine Model)  
ISO 7637-1  
VDE 0879 Part 2  
MIL-STD-883D Method 3015.7  
EOS/ESD - S 5.2  
150 V  
Note:  
1. Test pulse 5: VSmax = 40 V  
Electrical Characteristics  
7.5 V < VVS < 40 V; 4.5 V < VVCC < 5.5 V; INH = High; -40°C < Tj < 150°C; unless otherwise specified,  
all values refer to GND pins.  
No.  
1
Parameters  
Test Conditions  
Pin  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Type*  
Current Consumption  
1.1  
Quiescent current  
(VS)  
VVS < 28 V, INH or  
bit SI = lo  
5, 10  
19  
IVS  
40  
20  
µA  
µA  
A
A
1.2  
1.3  
Quiescent current  
(VCC)  
4.5 V < VVCC < 5.5 V,  
INH or bit SI = low  
IVCC  
VVS < 28 V normal  
operating, all output  
stages off,  
Supply current (VS)  
5, 10  
IVS  
0.8  
1.2  
mA  
A
1.4  
1.5  
VVS < 28 V normal  
operating, all output  
stages on, no load  
Supply current (VS)  
Supply current (VCC)  
5, 10  
19  
IVS  
10  
mA  
µA  
A
A
4.5 V < VVCC < 5.5 V,  
normal operating Pin  
IVCC  
150  
2
2.1  
3
Internal Oscillator Frequency  
Frequency (timebase  
for delay timers)  
fOSC  
19  
45  
kHz  
A
Undervoltage Detection, Power-on Reset  
Power–on reset  
threshold  
3.1  
19  
VVCC  
tdPor  
VUV  
3.4  
30  
3.9  
95  
4.4  
160  
7.0  
V
µs  
V
A
A
A
A
A
Power–on reset delay  
time  
After switching on  
VVCC  
3.2  
3.3  
3.4  
3.5  
19  
Undervoltage  
detection threshold  
5, 10  
5, 10  
5, 10  
5.5  
Undervoltage  
detection hysteresis  
VUV  
tdUV  
0.4  
V
Undervoltage  
detection delay  
7
21  
ms  
4
Thermal Prewarning and Shutdown  
Thermal prewarning  
4.1  
4.2  
17  
17  
TjPWset  
125  
105  
145  
125  
165  
145  
LC  
LC  
A
A
Thermal prewarning  
TjPWreset  
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter  
Notes: 1. Delay time between rising edge of CS after data transmission and switch on output stages to 90% of final level  
8
T6816  
4595B–BCD–05/03  
T6816  
Electrical Characteristics (Continued)  
7.5 V < VVS < 40 V; 4.5 V < VVCC < 5.5 V; INH = High; -40°C < Tj < 150°C; unless otherwise specified,  
all values refer to GND pins.  
No.  
Parameters  
Test Conditions  
Pin  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Type*  
4.3  
Thermal prewarning  
hysteresis  
DTjPW  
20  
K
A
4.4  
4.5  
4.6  
Thermal shutdown  
Thermal shutdown  
17  
17  
Tj switch off  
Tj switch on  
150  
130  
170  
150  
190  
170  
LC  
LC  
A
A
Thermal shutdown  
hysteresis  
DTj switch off  
20  
K
A
4.7  
4.8  
Ratio thermal  
shutdown/thermal  
prewarning  
Tj switch off/  
TjPW set  
1.05  
1.05  
1.17  
A
Ratio thermal  
shutdown/thermal  
prewarning  
Tj switch on/  
TjPW reset  
1.2  
A
A
5
Output Specification (LS1 - LS6, HS1 - HS6) 7.5 V < VVS < 40 V  
5.1  
1, 4,  
11,  
14,  
16, 27  
RDS OnL  
1.5  
On resistance  
On resistance  
IOut = 600 mA  
5.2  
5.3  
5.4  
5.5  
2, 3,  
12,  
13,  
A
A
A
A
D
RDS OnH  
2.0  
60  
IOut = -600 mA  
15, 28  
1, 4,  
11,  
14,  
VLS1-6  
40  
V
Output clamping  
voltage  
ILS1-6 = 50 mA  
16, 27  
1, 4,  
11,  
14,  
Output leakage  
current  
V
LS1–6 = 40 V  
ILS1–6  
10  
µA  
all output stages off  
16, 27  
2, 3,  
12,  
13,  
Output leakage  
current  
V
HS1-6 = 0 V  
IHS1–6  
-10  
µA  
all output stages off  
15, 28  
5.7  
5.8  
5.9  
1-4,  
11-16  
27, 28  
Woutx  
15  
mJ  
Inductive shutdown  
energy  
1-4,  
11-16  
27, 28  
dVLS1–6/dt  
dVHS1–6/dt  
50  
200  
950  
400  
mV/µs  
mA  
A
A
Output voltage edge  
steepness  
Overcurrent limitation  
and shutdown  
threshold  
1, 4,  
11,14  
16, 27  
ILS1–6  
650  
1250  
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter  
Notes: 1. Delay time between rising edge of CS after data transmission and switch on output stages to 90% of final level  
9
4595B–BCD–05/03  
Electrical Characteristics (Continued)  
7.5 V < VVS < 40 V; 4.5 V < VVCC < 5.5 V; INH = High; -40°C < Tj < 150°C; unless otherwise specified,  
all values refer to GND pins.  
No.  
Parameters  
Test Conditions  
Pin  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Type*  
5.10  
Overcurrent limitation  
and shutdown  
threshold  
2, 3,  
12,13  
15, 28  
IHS1–6  
-1250  
-950  
-650  
mA  
A
5.11  
5.12  
Overcurrent  
shutdown delay time  
Input register  
bit 14 (SCT) = low  
tdSd  
1.0  
60  
1.5  
2.0  
ms  
µA  
A
A
1, 4,  
11,14  
16, 27  
Open load detection  
current  
Input register bit 13  
(OLD) =low, output off  
ILS1–6  
200  
5.13  
2, 3,  
12,13  
15, 28  
Open load detection  
current  
Input register bit 13  
(OLD) =low, output off  
IHS1–6  
-150  
1.2  
-30  
µA  
A
A
A
5.14  
5.15  
Open load detection  
current ratio  
I
LS1–6/IHS1–  
6
1, 4,  
11,14  
16, 27  
Open load detection  
threshold  
Input register bit 13  
(OLD) =low, output off  
VLS1–6  
0.6  
4
4
V
V
5.16  
2, 3,  
12,13  
15, 28  
Open load detection  
threshold  
Input register bit 13  
(OLD) =low, output off  
VVS–  
VHS1–6  
0.6  
A
5.17  
5.18  
Output switch on  
delay 1)  
RLoad = 1 kꢀ  
RLoad = 1 kꢀ  
tdon  
tdoff  
0.5  
1
ms  
ms  
A
A
Output switch off  
delay 1)  
6
Inhibit Input  
6.1  
Input voltage low level  
threshold  
0.3-  
VVCC  
17  
17  
VIL  
VIH  
V
V
A
A
6.2  
6.3  
Input voltage high  
level threshold  
0.7-  
VVCC  
Hysteresis of input  
voltage  
17  
17  
VI  
100  
10  
700  
80  
mV  
µA  
A
A
6.4  
7
Pull-down current  
VINH = VVCC  
IPD  
Serial Interface - Logic Inputs DI, CLK, CS  
7.1  
Input voltage low-  
level threshold  
0.3-  
VVCC  
24-26  
24-26  
24-26  
25, 26  
24  
VIL  
VIH  
V
V
A
A
A
A
A
7.2  
7.3  
7.4  
7.5  
Input voltage high-  
level threshold  
0.7-  
VVCC  
Hysteresis of input  
voltage  
DVI  
IPDSI  
IPUSI  
50  
2
500  
50  
mV  
µA  
µA  
Pull-down current Pin  
VDI, VCLK = VVCC  
DI, CLK  
Pull-up current  
Pin CS  
VCS= 0 V  
-50  
-2  
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter  
Notes: 1. Delay time between rising edge of CS after data transmission and switch on output stages to 90% of final level  
10  
T6816  
4595B–BCD–05/03  
T6816  
Electrical Characteristics (Continued)  
7.5 V < VVS < 40 V; 4.5 V < VVCC < 5.5 V; INH = High; -40°C < Tj < 150°C; unless otherwise specified,  
all values refer to GND pins.  
No.  
8
Parameters  
Test Conditions  
Pin  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Type*  
Serial Interface - Logic Output DO  
8.1  
Output voltage low  
IOL = 3 mA  
level  
18  
18  
18  
VDOL  
VDOH  
IDO  
0.5  
V
V
A
A
A
8.2  
8.3  
Output voltage high  
IOL = -2 mA  
level  
VVCC  
0.7 V  
-
Leakage current  
(tri-state)  
VCS = VVCC,  
0 V < VDO < VVCC  
-10  
10  
µA  
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter  
Notes: 1. Delay time between rising edge of CS after data transmission and switch on output stages to 90% of final level  
Serial Interface — Timing  
Parameters  
Test Conditions  
CDO = 100 pF  
CDO = 100 pF  
CDO = 100 pF  
CDO = 100 pF  
CDO = 100 pF  
Timing Chart No.  
Symbol  
tENDO  
tDISDO  
tDOf  
Min.  
Typ.  
Max.  
200  
200  
100  
100  
200  
Unit  
ns  
DO enable after CS falling edge  
DO disable after CS rising edge  
DO fall time  
1
2
ns  
ns  
DO rise time  
tDOr  
ns  
DO valid time  
10  
4
tDOVal  
tCSSethl  
tCSSetlh  
ns  
CS setup time  
225  
225  
ns  
CS setup time  
8
ns  
Input register Bit 14  
(SCT) = high  
CS high time  
CS high time  
9
9
tCSh  
tCSh  
16  
2
ms  
ms  
Input register Bit 14  
(SCT) = low  
CLK high time  
CLK low time  
CLK period time  
CLK setup time  
CLK setup time  
DI setup time  
DI hold time  
5
6
tCLKh  
tCLKl  
225  
225  
500  
225  
225  
40  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tCLKp  
7
tCLKSethl  
tCLKSetlh  
tDIset  
3
11  
12  
tDIHold  
40  
11  
4595B–BCD–05/03  
Figure 4. Serial Interface Timing with Chart Numbers  
1
2
CS  
DO  
9
CS  
4
7
CLK  
5
3
6
8
DI  
11  
CLK  
10  
12  
DO  
Inputs DI, CLK, CS: High level = 0.7 x VCC, low level = 0.3 x VCC  
Output DO: High level = 0.8 x VCC, low level = 0.2 x VCC  
12  
T6816  
4595B–BCD–05/03  
T6816  
Figure 5. Application Circuit  
Vcc  
U5021M  
Enable  
WATCHDOG  
HS1  
HS2  
HS3  
HS4  
HS5  
HS6  
15  
13  
12  
3
2
28  
Vs  
BYT41  
D
VBAT  
5
10  
6
VS  
VS  
Fault  
Fault  
Fault  
Fault  
Fault  
Fault  
Detect  
Detect  
Detect  
Detect  
Detect  
Detect  
24V  
+
26  
25  
DI  
GND  
Osc  
7
S
C
T
O
L
H
S
6
L
S
6
H
S
5
L
H
S
4
L
S
4
H
S
3
L
S
3
H
S
2
L
S
2
H
L
S
1
S
GND  
GND  
CLK  
S
I
S
5
S
1
R
R
D
VS  
8
Control  
logic  
UV -  
24  
Input Register  
Output Register  
C  
CS  
INH  
protection  
9
GND  
GND  
Thermal  
17  
18  
L
S
6
P
S
F
S
C
D
H
S
6
H
S
5
L
S
5
H
S
4
L
S
4
H
S
3
L
H
S
2
L
H
S
1
L
T
P
I
protection  
20  
21  
22  
23  
19  
N
H
S
S
S
3
2
1
Power-on  
Reset  
GND  
GND  
GND  
DO  
Vcc  
Fault  
Fault  
Detect  
Fault  
Fault  
Detect  
Fault  
Detect  
Fault  
Detect  
Detect  
Detect  
Vcc  
Vcc  
+
Vcc  
Vcc  
Vcc  
5 V  
16  
LS1  
14  
LS2  
11  
LS3  
4
1
27  
LS4  
LS5  
LS6  
Vs  
Vs  
Application Notes  
It is strongly recommended to connect the blocking capacitors at VCC and VS as close as  
possible to the power supply and GND pins.  
Recommended value for capacitors at VS:  
electrolythic capacitor C > 22 µF in parallel with a ceramic capacitor C = 100 nF. Value  
for electrolytic capacitor depends on external loads, conducted interferences and  
reverse conducting current IHSX (see: Absolut Maximum Ratings).  
Recommended value for capacitors at VCC  
:
electrolythic capacitor C > 10 µF in parallel with a ceramic capacitor C = 100 nF.  
To reduce thermal resistance it is recommended to place cooling areas on the PCB as  
close as possible to GND pins.  
13  
4595B–BCD–05/03  
Ordering Information  
Extended Type Number  
Package  
Remarks  
T6816-TIQ  
SO28  
Power package, taped and reeled  
Package Information  
9.15  
8.65  
Package SO28  
Dimensions in mm  
18.05  
17.80  
7.5  
7.3  
2.35  
0.25  
0.25  
0.10  
0.4  
10.50  
10.20  
1.27  
16.51  
28  
15  
technical drawings  
according to DIN  
specifications  
1
14  
14  
T6816  
4595B–BCD–05/03  
Atmel Headquarters  
Atmel Operations  
Corporate Headquarters  
2325 Orchard Parkway  
San Jose, CA 95131  
TEL 1(408) 441-0311  
FAX 1(408) 487-2600  
Memory  
RF/Automotive  
2325 Orchard Parkway  
San Jose, CA 95131  
TEL 1(408) 441-0311  
FAX 1(408) 436-4314  
Theresienstrasse 2  
Postfach 3535  
74025 Heilbronn, Germany  
TEL (49) 71-31-67-0  
FAX (49) 71-31-67-2340  
Europe  
Microcontrollers  
Atmel Sarl  
2325 Orchard Parkway  
San Jose, CA 95131  
TEL 1(408) 441-0311  
FAX 1(408) 436-4314  
1150 East Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906  
TEL 1(719) 576-3300  
Route des Arsenaux 41  
Case Postale 80  
CH-1705 Fribourg  
Switzerland  
FAX 1(719) 540-1759  
TEL (41) 26-426-5555  
FAX (41) 26-426-5500  
La Chantrerie  
BP 70602  
44306 Nantes Cedex 3, France  
TEL (33) 2-40-18-18-18  
FAX (33) 2-40-18-19-60  
Biometrics/Imaging/Hi-Rel MPU/  
High Speed Converters/RF Datacom  
Avenue de Rochepleine  
BP 123  
38521 Saint-Egreve Cedex, France  
TEL (33) 4-76-58-30-00  
FAX (33) 4-76-58-34-80  
Asia  
Room 1219  
Chinachem Golden Plaza  
77 Mody Road Tsimhatsui  
East Kowloon  
ASIC/ASSP/Smart Cards  
Zone Industrielle  
Hong Kong  
TEL (852) 2721-9778  
FAX (852) 2722-1369  
13106 Rousset Cedex, France  
TEL (33) 4-42-53-60-00  
FAX (33) 4-42-53-60-01  
Japan  
1150 East Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906  
TEL 1(719) 576-3300  
9F, Tonetsu Shinkawa Bldg.  
1-24-8 Shinkawa  
Chuo-ku, Tokyo 104-0033  
Japan  
FAX 1(719) 540-1759  
TEL (81) 3-3523-3551  
FAX (81) 3-3523-7581  
Scottish Enterprise Technology Park  
Maxwell Building  
East Kilbride G75 0QR, Scotland  
TEL (44) 1355-803-000  
FAX (44) 1355-242-743  
e-mail  
literature@atmel.com  
Web Site  
http://www.atmel.com  
© Atmel Corporation 2003.  
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty  
which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors  
which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does  
not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted  
by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical  
components in life support devices or systems.  
Atmel® is the registered trademark of Atmel.  
Other terms and product names may be the trademarks of others.  
Printed on recycled paper.  
4595B–BCD–05/03  
xM  

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