HFCT-5951ATLZ [AVAGO]

FIBER OPTIC TRANSCEIVER, 1270-1570nm, 622Mbps(Tx), 622Mbps(Rx), BOARD/PANEL MOUNT, LC CONNECTOR, ROHS COMPLIANT, PLASTIC, DIP-10;
HFCT-5951ATLZ
型号: HFCT-5951ATLZ
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

FIBER OPTIC TRANSCEIVER, 1270-1570nm, 622Mbps(Tx), 622Mbps(Rx), BOARD/PANEL MOUNT, LC CONNECTOR, ROHS COMPLIANT, PLASTIC, DIP-10

文件: 总18页 (文件大小:335K)
中文:  中文翻译
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HFCT-5951TLZ/TGZ/ATLZ/ATGZ and  
HFCT-5952TLZ/TGZ/ATLZ/ATGZ  
Single Mode SFF Transceivers for SONET OC-12/SDH STM-4 (S4.1)  
Part of the Avago METRAK family  
Datasheet  
Description  
Features  
The HFCT-595xTLZ/TGZ/ATLZ/ATGZ SFF  
transceivers are high performance, cost effective  
modules for serial optical data communication  
applications specified at SONET/SDH 622 Mbit/s  
for Intermediate Reach links.  
RoHS Compliant  
HFCT-595xTLZ/TGZ/ATLZ/ATGZ are compliant to the  
intermediate reach SONET OC-12/SDH STM-4 (S4.1)  
specifications  
Multisourced 2 x 5 and 2 x 10 package styles with LC  
receptacle  
Single +3.3 V power supply  
Temperature range:  
0°C to +70 °C  
-40 °C to +85 °C  
Wave solder and aqueous wash process compatible  
Manufactured in an ISO9002 certified facility  
Performance  
HFCT-595xTLZ/TGZ/ATLZ/ATGZ:  
Links of 15 km with 9/125 µm SMF  
Fully Class 1 CDRH/IEC 825 compliant  
Pin Outs:  
All modules are designed for single mode fiber and  
operate at a nominal wavelength of 1300 nm. They  
incorporate high performance, reliable, long  
wavelength optical device and proven circuit  
technology to give long life and consistent service.  
HFCT-595xTLZ/TGZ:  
HFCT-595xATLZ/ATGZ  
The transmitter section consists of a Fabry Perot  
Laser (FP). The transmitter has full IEC 825 and  
CDRH Class 1 eye safety.  
The receiver section uses a MOVPE grown planar  
PIN photodetector for low dark current and  
excellent responsivity.  
HFCT-5951TLZ/TGZ/ATLZ/ATGZ  
HFCT-5952TLZ/TGZ/ATLZ/ATGZ  
2 x 5  
2 x 10  
A pseudo-ECL logic interface simplifies interface  
to external circuitry.  
Applications  
These transceivers are supplied in 2 x 5 and 2 x  
10 DIP style footprint with the LC fiber connector  
interface and are fully compliant with SFF Multi  
Source Agreement (MSA).  
SONET/SDH equipment interconnect,  
STS-12/SDH STM-4 rate  
Intermediate reach (up to 15 km) ATM links  
Functional Description  
Receiver Section  
Noise Immunity  
The receiver includes internal circuit components  
to filter power supply noise. However under some  
conditions of EMI and power supply noise,  
external power supply filtering may be necessary  
(see application section).  
Design  
ThereceiversectioncontainsanInGaAs/InPphoto  
detector and a preamplifier mounted in an optical  
subassembly. This optical subassembly is coupled  
to a postamp/decision circuit.  
The Signal Detect Circuit  
The signal detect circuit works by sensing the peak  
level of the received signal and comparing this  
level to a reference. The SD output is low voltage  
TTL.  
The postamplifier is ac coupled to the preamplifier  
as illustrated in Figure 1. The coupling capacitors  
are large enough to pass the SONET/SDH test  
pattern at 622 MBd without significant distortion  
or performance penalty. If a lower signal rate, or  
a code which has significantly more low frequency  
content is used, sensitivity, jitter and pulse  
distortion could be degraded.  
Figure 1 also shows a filter function which limits  
the bandwidth of the preamp output signal. The  
filter is designed to bandlimit the preamp output  
noise and thus improve the receiver sensitivity.  
Thesecomponentswillreducethesensitivityofthe  
receiver as the signal bit rate is increased above  
622 Mb/s.  
The device incorporates a photodetector bias  
circuit. This output must be connected to V and  
CC  
can be monitored by connecting through a series  
resistor (see application section).  
PHOTODETECTOR  
BIAS  
DATA OUT  
FILTER  
TRANS-  
IMPEDANCE  
PRE-  
PECL  
OUTPUT  
BUFFER  
AMPLIFIER  
AMPLIFIER  
DATA OUT  
GND  
TTL  
OUTPUT  
BUFFER  
SIGNAL  
DETECT  
CIRCUIT  
SD  
Figure 1 - Receiver Block Diagram  
2
Functional Description  
Transmitter Section  
Design  
The transmitter section uses a Fabry Perot (FP)  
laser as its optical source, see Figure 2. The  
package has been designed to be compliant with  
IEC 825 eye safety requirements under any single  
fault condition. The optical output is controlled  
by a custom IC that detects the laser output via  
the monitor photodiode. This IC provides both dc  
and ac current drive to the laser to ensure correct  
modulation, eye diagram and extinction ratio over  
temperature, supply voltage and operating life.  
The transmitter section also includes monitor  
circuitry for both the laser diode bias current and  
laser diode optical power.  
PHOTODIODE  
(rear facet monitor)  
Note 1  
FP  
LASER  
DATA  
DATA  
LASER  
MODULATOR  
PECL  
INPUT  
LASER BIAS  
DRIVER  
BMON(+)  
BMON(-)  
Note 1  
LASER BIAS  
CONTROL  
PMON(+)  
PMON(-)  
Note 1  
Note 1: THESE FUNCTIONS ONLY AVAILABLE ON 2 x 10 PINOUT DESIGN  
Figure 2 - Simplified Transmitter Schematic  
3
Package  
The optical subassemblies are each attached to  
their respective transmit or receive electrical  
subassemblies. These two units are than fitted  
within the outer housing of the transceiver that is  
molded of filled nonconductive plastic to provide  
mechanical strength. The housing is then encased  
with a metal EMI protective shield. Four ground  
connections are provided for connecting the EMI  
shield to signal ground.  
TheoverallpackageconceptfortheAvagotransceiver  
consists of four basic elements; two optical  
subassemblies and two electrical subassemblies.  
Theyarehousedasillustratedintheblockdiagram  
in Figure 3.  
The package outline drawing and pin out are  
shown in Figures 4, 5 and 6. The details of this  
package outline and pin out are compliant with the  
multisource definition of the 2 x 5 and 2 x 10 DIP.  
The PCB’s for the two electrical subassemblies  
bothcarrythesignalpinsthatexitfromthebottom  
of the transceiver. The solder posts are fastened  
into the molding of the device and are designed to  
provide the mechanical strength required to  
withstand the loads imposed on the transceiver by  
mating with the LC connectored fiber cables.  
Although they are not connected electrically to the  
transceiver, it is recommended to connect them to  
chassis ground.  
The electrical subassemblies consist of high  
volume multilayer printed circuit boards on which  
the IC and various surface-mounted passive  
circuit elements are attached.  
The receiver electrical subassembly includes an  
internal shield for the electrical and optical  
subassemblies to ensure high immunity to external  
EMI fields.  
RX SUPPLY  
Note 3  
PHOTO DETECTOR  
BIAS Note 2  
DATA OUT  
PIN PHOTODIODE  
PREAMPLIFIER  
SUBASSEMBLY  
QUANTIZER IC  
DATA OUT  
RX GROUND  
SIGNAL  
DETECT  
LC  
TX GROUND  
RECEPTACLE  
Note 1  
LASER BIAS  
DATA IN  
DATA IN  
Tx DISABLE  
MONITORING  
LASER  
OPTICAL  
SUBASSEMBLY  
LASER DRIVER  
AND CONTROL  
CIRCUIT  
B
B
MON(+) Note 1  
MON(-) Note 1  
LASER DIODE  
OUTPUT POWER  
MONITORING  
Note 1  
PMON(+) Note 1  
MON(-) Note 1  
P
TX SUPPLY  
CASE  
Note 1: THESE FUNCTIONS ONLY AVAILABLE ON 2 x 10 PINOUT DESIGN  
Note 2: CONNECTED TO RXVCC IN 2 x 5 DESIGN  
Note 3: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.  
Figure 3 - Block Diagram.  
4
+ 0  
- 0.2  
+0  
13.59  
0.535  
13.59  
(0.535)  
MAX  
15.0 0.2  
(0.591 0.008)  
(
)
-0.008  
TOP VIEW  
48.5 0.2  
(1.91 0.008)  
6.25  
(0.246)  
4.06 0.1  
(0.16 0.004)  
10.8 0.2  
(0.425 0.008)  
9.8  
(0.386)  
MAX  
3.81 0.15  
(0.15 0.006)  
Ø 1.07 0.1  
(0.042 0.004)  
9.6 0.2  
(0.378 0.008)  
1
0.1  
0.25 0.1  
(0.01 0.004)  
20 x 0.5 0.2  
(0.02 0.008)  
(0.039 0.004)  
10.16 0.1  
(0.4 0.004)  
1
0.1  
19.5 0.3  
(0.768 0.012)  
(0.039 0.004)  
BACK VIEW  
FRONT VIEW  
SIDE VIEW  
1.78 0.1  
(0.07 0.004)  
48.5 0.2  
(1.91 0.008)  
9.8  
(0.386)  
MAX  
G MODULE - NO EMI NOSE SHIELD  
3.81 0.1  
(0.15 0.004)  
0.25 0.1  
(0.01 0.004)  
20 x 0.5 0.2  
(0.02 0.008)  
1.78 0.1  
(0.07 0.004)  
Ø 1.07 0.1  
(0.042 0.004)  
1
0.1  
19.5 0.3  
(0.768 0.012)  
(0.039 0.004)  
SIDE VIEW  
20 x 0.25 0.1 (PIN THICKNESS)  
(0.01 0.004)  
NOTE: END OF PINS  
CHAMFERED  
BOTTOM VIEW  
DIMENSIONS IN MILLIMETERS (INCHES)  
DIMENSIONS SHOWN ARE NOMINAL. ALL DIMENSIONS MEET THE MAXIMUM PACKAGE OUTLINE DRAWING IN THE SFF MSA.  
Figure 4 - HFCT-595xTLZ/TGZ/ATLZ/ATGZ Package Outline Drawing (2 x 10 Design shown)  
5
Connection Diagram (HFCT-5952TLZ/TGZ/ATLZ/ATGZ)  
Pin 11 Transmitter Power Supply  
TX:  
V
CC  
RX  
TX  
Provide +3.3 V dc via the recommended transmitter  
power supply filter circuit. Locate the power supply  
Mounting Studs/  
Solder Posts  
filter circuit as close as possible to the V TX pin.  
CC  
Package  
Grounding Tabs  
Pins 12, 16 Transmitter Signal Ground V TX:  
EE  
Directly connect these pins to the transmitter signal  
ground plane.  
o
o
o
o
o
o
o
o
o
o
o
PHOTO DETECTOR BIAS  
RECEIVER SIGNAL GROUND  
RECEIVER SIGNAL GROUND  
NOT CONNECTED  
1
2
3
4
5
6
7
8
9
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
LASER DIODE OPTICAL POWER MONITOR - POSITIVE END  
LASER DIODE OPTICAL POWER MONITOR - NEGATIVE END  
LASER DIODE BIAS CURRENT MONITOR - POSITIVE END  
LASER DIODE BIAS CURRENT MONITOR - NEGATIVE END  
TRANSMITTER SIGNAL GROUND  
TRANSMITTER DATA IN BAR  
TRANSMITTER DATA IN  
TRANSMITTER DISABLE  
TRANSMITTER SIGNAL GROUND  
o
o
o
o
o
o
o
o
o
Top  
View  
Pin 13 Transmitter Disable T  
:
DIS  
NOT CONNECTED  
Optional feature, connect this pin to +3.3 V TTL logic  
high1todisablemodule. Toenablemoduleconnect  
to TTL logic low “0”.  
RECEIVER SIGNAL GROUND  
RECEIVER POWER SUPPLY  
SIGNAL DETECT  
RECEIVER DATA OUTPUT BAR  
RECEIVER DATA OUTPUT  
10  
TRANSMITTER POWER SUPPLY  
Pin 14 Transmitter Data In TD+:  
No internal terminations are provided. See  
recommended circuit schematic.  
Figure 5 - Pin Out Diagram (Top View)  
Pin Descriptions:  
Pin 15 Transmitter Data In Bar TD-:  
Pin 1 Photo Detector Bias, VpdR:  
No internal terminations are provided. See  
recommended circuit schematic.  
Pin 1 must be connected to VCC for the receiver to  
work. This pin enables monitoring of photo detector  
bias current. It must be connected directly to V RX,  
CC  
Pin 17 Laser Diode Bias Current Monitor - Negative End  
or to V RX through a resistor (Max 200 R) for  
CC  
B –  
MON  
monitoring photo detector bias current.  
Thelaserdiodebiascurrentisaccessiblebymeasuring  
the voltage developed across pins 17 and 18. Dividing  
Pins 2, 3, 6 Receiver Signal Ground V RX:  
EE  
the  
voltage  
by  
Directly connect these pins to the receiver ground  
plane.  
10Ohms(internal)willyieldthevalueofthelaserbias  
current.  
Pins 4, 5 DO NOT CONNECT  
Pin 18 Laser Diode Bias Current Monitor - Positive End  
Pin 7 Receiver Power Supply V RX:  
CC  
B +  
MON  
Provide +3.3 V dc via the recommended receiver  
power supply filter circuit. Locate the power supply  
See pin 17 description.  
Pin 19 Laser Diode Optical Power Monitor - Negative End  
filter  
circuit  
as  
P
MON  
close as possible to the V RX pin. Note: the filter  
CC  
The back facet diode monitor current is accessible by  
measuring the voltage developed across pins 19 and  
20. The voltage across a 200 Ohm internal resistor  
between pins 19 and 20 will be proportional to the  
photo current.  
circuit should not cause V to drop below minimum  
specification.  
CC  
Pin 8 Signal Detect SD:  
Normal optical input levels to the receiver result in  
a logic “1” output.  
Pin 20 Laser Diode Optical Power Monitor - Positive End  
Lowopticalinputlevelstothereceiverresultinalogic  
“0” output.  
P +  
MON  
See pin 19 description.  
This Signal Detect output can be used to drive a low  
voltage TTL input on an upstream circuit, such as  
Signal Detect input or Loss of Signal-bar.  
Mounting Studs/Solder Posts  
The two mounting studs are provided for transceiver  
mechanical attachment to the circuit board. It is  
recommended that the holes in the circuit board be  
connected to chassis ground.  
Pin 9 Receiver Data Out Bar RD-:  
No internal terminations are provided. See  
recommended circuit schematic.  
Package Grounding Tabs  
Connectfourpackagegroundingtabstosignalground.  
Pin 10 Receiver Data Out RD+:  
No internal terminations are provided. See  
recommended circuit schematic.  
6
Connection Diagram (HFCT-5951TLZ/TGZ/ATLZ/ATGZ)  
RX  
TX  
Mounting Studs/  
Solder Posts  
Package  
Grounding Tabs  
Top  
View  
o
o
o
o
o
o
o
o
o
o
RECEIVER SIGNAL GROUND  
RECEIVER POWER SUPPLY  
SIGNAL DETECT  
RECEIVER DATA OUT BAR  
RECEIVER DATA OUT  
1
2
3
4
5
10  
9
8
7
6
TRANSMITTER DATA IN BAR  
TRANSMITTER DATA IN  
TRANSMITTER DISABLE  
TRANSMITTER SIGNAL GROUND  
TRANSMITTER POWER SUPPLY  
Figure 6 - Pin Out Diagram (Top View)  
Pin Descriptions:  
Pin 6 Transmitter Power Supply  
TX:  
Provide +3.3 V dc via the recommended transmitter  
power supply filter circuit. Locate the power supply  
V
CC  
Pin 1 Receiver Signal Ground V RX:  
Directlyconnectthispintothereceivergroundplane.  
EE  
filter circuit as close as possible to the V TX pin.  
CC  
Pin 2 Receiver Power Supply V RX:  
CC  
Provide +3.3 V dc via the recommended receiver  
power supply filter circuit. Locate the power supply  
Pin 7 Transmitter Signal Ground  
V
EE  
TX:  
filter circuit as close as possible to the V RX pin.  
CC  
Directly connect this pin to the transmitter signal  
ground plane.  
Note: the filter circuit should not cause V to drop  
CC  
below minimum specification.  
Pin 8 Transmitter Disable T  
:
DIS  
Pin 3 Signal Detect SD:  
Normal optical input levels to the receiver result in  
a logic “1” output.  
Optional feature, connect this pin to +3.3 V TTL logic  
high1todisablemodule. Toenablemoduleconnect  
to TTL logic low “0”.  
Lowopticalinputlevelstothereceiverresultinalogic  
“0” output.  
Pin 9 Transmitter Data In TD+:  
No internal terminations are provided. See  
recommended circuit schematic.  
This Signal Detect output can be used to drive a low  
voltage TTL input on an upstream circuit, such as  
Signal Detect input or Loss of Signal-bar.  
Pin 10 Transmitter Data In Bar TD-:  
No internal terminations are provided. See  
recommended circuit schematic.  
Pin 4 Receiver Data Out Bar RD-:  
No internal terminations are provided. See  
recommended circuit schematic.  
Mounting Studs/Solder Posts  
The two mounting studs are provided for transceiver  
mechanical attachment to the circuit board. It is  
recommended that the holes in the circuit board be  
connected to chassis ground.  
Pin 5 Receiver Data Out RD+:  
No internal terminations are provided. See  
recommended circuit schematic.  
Package Grounding Tabs  
Connectfourpackagegroundingtabstosignalground.  
7
Application Information  
Electrical and Mechanical Interface  
The Applications Engineering Group at Avago is Recommended Circuit  
available to assist you with technical understanding Figures7and8showstherecommendedinterfacefor  
anddesigntrade-offsassociatedwiththesetransceivers. deploying the Avago transceivers in a +3.3 V system.  
You can contact them through your Avago sales  
representative.  
Data Line Interconnections  
Avago’s HFCT-595xTLZ/TGZ/ATLZ/ATGZ fiber-optic  
transceivers are designed to couple to +3.3 V PECL  
signals. The transmitter driver circuit regulates the  
output optical power. The regulated light output will  
maintain a constant output optical power provided  
the data pattern is reasonably balanced in duty cycle.  
Ifthedatadutycyclehaslong, continuousstatetimes  
(low or high data duty cycle), then the output optical  
powerwillgraduallychangeitsaverageoutputoptical  
power level to its preset value.  
Thefollowinginformationisprovidedtoanswersome  
of the most common questions about the use of the  
parts.  
Optical Power Budget and Link Penalties  
Theworst-caseOpticalPowerBudget(OPB)indBfor  
a fiber-optic link is determined by the difference  
between the minimum transmitter output optical  
power (dBm avg) and the lowest receiver sensitivity  
(dBm avg). This OPB provides the necessary optical  
signal range to establish a working fiber-optic link.  
The OPB is allocated for the fiber-optic cable length  
and the corresponding link penalties. For proper link  
performance, all penalties that affect the link  
performance must be accounted for within the link  
optical power budget.  
See Figure 7a  
V
(+3.3 V)  
CC  
82  
Z = 50 Ω  
V
(+3.3 V)  
CC  
100 nF  
100 nF  
T
(LVTTL)  
-
DIS  
V
(+3.3 V)  
CC  
130 Ω  
B
B
130 Ω  
MON  
82 Ω  
TD-  
Z = 50 Ω  
+
MON  
NOTE A  
130 Ω  
130 Ω  
P
-
MON  
TD+  
P
+
MON  
20 19 18 17 16 15 14 13 12 11  
V
(+3.3 V)  
CC  
1 µH  
10 µF  
T
C2  
C1  
C3  
X
V
(+3.3 V)  
CC  
R
X
1 µH  
RD+  
RD-  
10 µF  
1
2
3
4
5
6
7
8
9
10  
Z = 50 Ω  
V
RX (+3.3 V)  
CC  
100 Ω  
NOTE B  
100 nF  
100 nF  
200 Ω  
Z = 50 Ω  
NOTE C  
10 nF  
3 k  
130 Ω  
130 Ω  
SD  
LVTTL  
Note: C1 = C2 = C3 = 10 nF or 100 nF  
Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT  
Note B: CIRCUIT ASSUMES HIGH IMPENDANCE INTERNAL BIAS @ V - 1.3 V.  
CC  
Note C: THE BIAS RESISTOR FOR VpdR SHOULD NOT EXCEED 200 OHM.  
Figure 7 - Recommended Interface Circuit (HFCT-5952TLZ/TGZ/ATLZ/ATGZ)  
8
The transmitter electrical termination schemes termination and biasing requirements are met.  
shown in Figure 7 and 8 maybe replaced by an Figure 7b shows an alternative scheme for low  
alternativelow-currentschemeaspertheevaluation currentdcbiasingwherea100ohmdifferential(50  
board (see Figures 7a and 7b).  
ohm single ended) termination of the data lines is  
required.  
The termination scheme in Figure 7a provides a  
minimum component count to ensure LVPECL  
V
(+3.3 V)  
V
(+3.3 V)  
CC  
CC  
RI  
3K3  
82  
100 nF  
100 nF  
100 nF  
100 nF  
PIN 15  
PIN 14  
TD-  
TD-  
V
(+3.3 V)  
R2  
CC  
V
(+3.3 V)  
CC  
100  
R5  
5KI  
130 Ω  
82 Ω  
R3  
3K3  
TD+  
TD+  
130 Ω  
R4  
5K1  
Figure 7a.LVPECL termination and biasing scheme  
Figure 7b. Low current dc biasing scheme  
See Figure 7a  
VCC (+3.3 V)  
100 nF  
82  
Z = 50 Ω  
Z = 50 Ω  
VCC (+3.3 V)  
100 nF  
TDIS (LVTTL)  
130 Ω  
130 Ω  
82 Ω  
130 Ω  
6
TD-  
100 nF  
NOTE A  
130 Ω  
TD+  
10  
9
8
7
VCC (+3.3 V)  
VCC (+3.3 V)  
1 µH  
TX  
10 µF  
1 µH  
C2  
C1  
C3  
100 nF  
VCC (+3.3 V)  
82 Ω  
82 Ω  
RX  
RD+  
C4 *  
10 µF  
1
2
3
4
5
Z = 50 Ω  
130 Ω  
NOTE B  
100 nF  
100 nF  
RD-  
Z = 50 Ω  
130  
130 Ω  
130 Ω  
SD  
LVTTL  
Note: C1 = C2 = C3 = 10 nF or 100 nF  
Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT  
Note B: WHEN INTERNAL BIAS IS PROVIDED REPLACE SPLIT RESISTORS WITH 100WTERMINATION  
* C4 IS AN OPTIONAL BYPASS CAPACITOR FOR ADDITIONAL LOW FREQUENCY NOISE FILTERING.  
Figure 8 - Recommended Interface Circuit (HFCT-5951TLZ/TGZ/ATLZ/ATGZ)  
9
TheHFCT-595xTLZ/TGZ/ATLZ/ATGZhaveatransmit The HFCT-5952TLZ/TGZ/ATLZ/ATGZ offers the  
disable function which is a single-ended +3.3 V TTL designer the option of monitoring the PIN photo  
input which is dc-coupled to pin 13 on the HFCT- detector bias current. Figures 7 and 8 show a resistor  
5952TLZ/TGZ/ATLZ/ATGZ and pin 8 on HFCT- network,whichcouldbeusedtodothis.Notethatthe  
5951TLZ/TGZ/ATLZ/ATGZ. In addition the HFCT- photo detector bias current pin must be connected to  
5952TLZ/TGZ/ATLZ/ATGZ offers the designer the  
V . Avago also recommends that a decoupling  
CC  
option of monitoring the laser diode bias current and capacitor is used on this pin.  
the laser diode optical power. The voltage measured  
Power Supply Filtering and Ground Planes  
Itisimportanttoexercisecareincircuitboardlayout  
between pins 17 and 18 is proportional to the bias  
currentthroughaninternal10resistor.Similarlythe  
optical power rear facet monitor circuit provides a  
photo current which is proportional to the voltage  
measured between pins 19 and 20 on the 2 x 10  
version, this voltage is measured across an internal  
200 resistor.  
to achieve optimum performance from these  
transceivers. Figures 7 and 8 show the power supply  
circuit which complies with the small form factor  
multisource agreement. It is further recommended  
that a continuous ground plane be provided in the  
circuitboarddirectlyunderthetransceivertoprovide  
a low inductance ground for signal return current.  
This recommendation is in keeping with good high  
frequency board layout practices.  
As for the receiver section, it is internally ac-coupled  
betweenthepreamplifierandthepostamplifierstages.  
The actual Data and Data-bar outputs of the  
postamplifier are dc-coupled to their respective  
output pins (pins 9 and 10 on the HFCT-5951TLZ/  
TGZ/ATLZ/ATGZ and pins 14 and 15 on the HFCT-  
5952TLZ/TGZ/ATLZ/ATGZ). The two data outputs of  
the receiver should be terminated with identical load  
circuits to avoid unnecessarily large ac currents in  
Package footprint and front panel considerations  
TheAvagotransceivercomplieswiththecircuitboard  
“CommonTransceiverFootprintholepatterndefined  
in the current multisource agreement which defined  
the 2 x 5 and 2 x 10 package styles. This drawing is  
reproduced in Figure 9 with the addition of ANSI  
Y14.5Mcompliantdimensioningtobeusedasaguide  
in the mechanical layout of your circuit board. Figure  
10 shows the front panel dimensions associated with  
such a layout.  
V . If the outputs are loaded identically the ac  
CC  
current is largely nulled.  
SignalDetectisasingle-ended,+3.3VTTLcompatible  
outputsignalthatisdc-coupledtopin3ontheHFCT-  
5951TLZ/TGZ/ATLZ/ATGZ and pin 8 on the HFCT-  
5952TLZ/TGZ/ATLZ/ATGZ modules. Signal Detect  
should not be ac-coupled externally to the follow-on  
circuits because of its infrequent state changes.  
8.89  
(0.35)  
3.56  
(0.14)  
DIMENSIONS IN MILLIMETERS (INCHES)  
2 x Ø 2.29 MAX. 2 x Ø 1.4 0.1  
2 x Ø 1.4 0.1  
(0.055 0.004)  
7.11  
(0.28)  
(0.09)  
(0.055 0.004)  
NOTES:  
1. THISFIGUREDESCRIBESTHERECOMMENDED  
CIRCUIT BOARD LAYOUT FOR THE SFF  
TRANSCEIVER.  
4 x Ø 1.4 0.1  
(0.055 0.004)  
2. THEHATCHEDAREASAREKEEP-OUTAREAS  
RESERVEDFORHOUSINGSTANDOFFS.NO  
METALTRACESORGROUNDCONNECTIONIN  
KEEP-OUTAREAS.  
10.16  
(0.4)  
13.34  
(0.525)  
3. 2x10TRANSCEIVERMODULEREQUIRES26  
PCB HOLES (20 I/O PINS, 2 SOLDER POSTS  
AND4PACKAGEGROUNDINGTABS).  
PACKAGEGROUNDINGTABSSHOULDBE  
CONNECTEDTOSIGNALGROUND.  
4. 2x5TRANSCEIVERMODULEREQUIRES16PCB  
HOLES (10 I/O PINS, 2 SOLDER POSTS AND 4  
PACKAGEGROUNDINGTABS).PACKAGE  
GROUNDINGTABSSHOULDBECONNECTED  
TOSIGNALGROUND.  
7.59  
(0.299)  
9.59  
(0.378)  
2
(0.079)  
9 x 1.78  
(0.07)  
2
3
3
2 x Ø 2.29  
(0.079)  
(0.118)  
(0.118)  
(0.09)  
5. THEMOUNTINGSTUDSSHOULDBESOLDERED  
TOCHASSISGROUNDFORMECHANICAL  
INTEGRITYANDTOENSUREFOOTPRINT  
COMPATIBILITYWITHOTHERSFF  
4.57  
(0.18)  
20 x Ø 0.81 0.1  
(0.032 0.004)  
6
16  
3.08  
(0.236)  
(0.63)  
(0.121)  
TRANSCEIVERS.  
6. HOLESFORHOUSINGLEADSMUSTBETIEDTO  
SIGNALGROUND.  
Figure 9 - Recommended Board Layout Hole Pattern  
10  
Eye Safety Circuit  
Electromagnetic Interference (EMI)  
Foranopticaltransmitterdevicetobeeye-safeinthe One of a circuit board designer’s foremost concerns  
event of a single fault failure, the transmitter must is the control of electromagnetic emissions from  
either maintain eye-safe operation or be disabled.  
electronicequipment.Successincontrollinggenerated  
ElectromagneticInterference(EMI)enablesthedesigner  
to pass a governmental agency’s EMI regulatory  
standard and more importantly, it reduces the  
possibility of interference to neighboring equipment.  
Avago has designed the HFCT-595xTLZ/TGZ/ATLZ/  
ATGZtoprovideexcellentEMIperformance.TheEMI  
performance of a chassis is dependent on physical  
design and features which help improve EMI  
suppression. Avago encourages using standard RF  
suppressionpracticesandavoidingpoorlyEMI-sealed  
enclosures.  
The HFCT-595xTLZ/TGZ/ATLZ/ATGZ is intrinsically  
eye safe and does not require shut down circuitry.  
Signal Detect  
The Signal Detect circuit provides a de-asserted  
outputsignalwhentheopticallinkisbroken(orwhen  
the remote transmitter is OFF). The Signal Detect  
threshold is set to transition from a high to low state  
between the minimum receiver input optional power  
and -45 dBm avg. input optical power indicating a  
definiteopticalfault(e.g.unpluggedconnectorforthe  
receiverortransmitter,brokenfiber,orfailedfar-end  
transmitterordatasource).TheSignalDetectdoesnot  
detect receiver data error or error-rate. Data errors  
can be determined by signal processing offered by  
upstream PHY ICs.  
Avago’s HFCT-5951ATLZ/TLZ/ HFCT-5952ATLZ/TLZ  
OC-12/STM-4 LC transceivers have nose shields  
which provide a convenient chassis connection to the  
nose of the transceiver. This nose shield improves  
system EMI performance by closing off the LC  
aperture. Localized shielding is also improved by  
tying the four metal housing package grounding tabs  
to signal ground on the PCB. Though not obvious by  
inspection, the nose shield and metal housing are  
electrically separated for customers who do not wish  
to directly tie chassis and signal grounds together.  
Figure 10 shows the recommended positioning of the  
transceivers with respect to the PCB and faceplate.  
15.24  
(0.6)  
10.16 0.1  
(0.4 0.004)  
TOP OF PCB  
B
B
DETAIL A  
1
(0.039)  
15.24  
(0.6)  
A
SOLDER POSTS  
14.22 0.1  
(0.56 0.004)  
15.75 MAX. 15.0 MIN.  
(0.62 MAX. 0.59 MIN.)  
SECTION B - B  
DIMENSIONS IN MILLIMETERS (INCHES)  
1. FIGURE DESCRIBES THE RECOMMENDED FRONT PANEL OPENING FOR A LC OR SG SFF TRANSCEIVER.  
2. SFF TRANSCEIVER PLACED AT 15.24 mm (0.6) MIN. SPACING.  
Figure 10 - Recommended Panel Mounting  
11  
Package and Handling Instructions  
Flammability  
Recommended Cleaning/ Degreasing Chemicals  
Alcohols: methyl, isopropyl, isobutyl.  
The HFCT-595xTLZ/TGZ/ATLZ/ATGZ transceivers Aliphatics: hexane, heptane Other: naphtha.  
housingconsistofhighstrength,heatresistantandUL  
94 V-0 flame retardant plastic and metal packaging.  
Do not use partially halogenated hydrocarbons such  
as 1,1.1 trichloroethane, ketones such as MEK,  
Recommended Solder and Wash Process  
The HFCT-595xTLZ/TGZ/ATLZ/ATGZ are compatible phenol,  
acetone,chloroform,ethylacetate,methylenedichloride,  
methylene chloride, or  
with industry-standard wave processes.  
N-methylpyrolldone.Also,Avagodoesnotrecommend  
theuseofcleanersthatusehalogenatedhydrocarbons  
because of their potential environmental harm.  
Process plug  
The transceivers are supplied with a process plug for  
protectionoftheopticalportwithintheLCconnector LC SFF Cleaning Recommendations  
receptacle. This process plug prevents contamination In the event of contamination of the optical ports, the  
during wave solder and aqueous rinse as well as recommended cleaning process is the use of forced  
during handling, shipping and storage. It is made of nitrogen. If contamination is thought to have  
a high-temperature, molded sealing material.  
remained,theopticalportscanbecleanedusingaNTT  
international Cletop stick type (diam. 1.25 mm) and  
HFE7100 cleaning fluid.  
Recommended Solder fluxes  
Solder fluxes used with the HFCT-595xTLZ/TGZ/  
ATLZ/ATGZ should be water-soluble, organic fluxes.  
Recommended solder fluxes include Lonco 3355-11  
fromLondonChemicalWest,Inc.ofBurbank,CA,and  
100 Flux from Alpha-Metals of Jersey City, NJ.  
12  
Regulatory Compliance  
Electromagnetic Interference (EMI)  
TheRegulatoryCompliancefortransceiverperformance Most equipment designs utilizing these high-speed  
isshowninTable1.Theoverallequipmentdesignwill transceiversfromAvago willberequiredtomeetFCC  
determine the certification level. The transceiver regulations in the United States, CENELEC EN55022  
performance is offered as a figure of merit to assist (CISPR22)inEuropeandVCCIinJapan.RefertoEMI  
the designer in considering their use in equipment section (page 9) for more details.  
designs.  
Immunity  
Electrostatic Discharge (ESD)  
TherearetwodesigncasesinwhichimmunitytoESD electromagnetic fields following the IEC 61000-4-3  
damage is important. test method.  
Transceivers will be subject to radio-frequency  
The first case is during handling of the transceiver Eye Safety  
prior to mounting it on the circuit board. It is These laser-based transceivers are classified as AEL  
importanttousenormalESDhandlingprecautionsfor ClassI(U.S.21CFR(J)andAELClass1perEN60825-  
ESD sensitive devices. These precautions include 1(+A11).Theyareeyesafewhenusedwithinthedata  
using grounded wrist straps, work benches, and floor sheet limits per CDRH. They are also eye safe under  
mats in ESD controlled areas.  
normaloperatingconditionsandunderallreasonably  
foreseeable single fault conditions per EN60825-1.  
Avagohastestedthetransceiverdesignforcompliance  
with the requirements listed below under normal  
operatingconditionsandundersinglefaultconditions  
where applicable. TUV Rheinland has granted  
certification to these transceivers for laser eye safety  
and use in EN 60950 and EN 60825-2 applications.  
Theirperformanceenablesthetransceiverstobeused  
withoutconcernforeyesafetyupto3.6Vtransmitter  
Thesecondcasetoconsiderisstaticdischargestothe  
exterior of the equipment chassis containing the  
transceiverparts.TotheextentthattheLCconnector  
receptacle is exposed to the outside of the equipment  
chassis it may be subject to whatever system-level  
ESD test criteria that the equipment is intended to  
meet.  
V
CC  
.
Table 1: Regulatory Compliance - Targeted Specification  
Feature  
Electrostatic Discharge  
(ESD) to the  
Test Method  
MIL-STD-883  
Method 3015  
Performance  
Class 2 (>2 kV).  
Electrical Pins  
Electrostatic Discharge  
(ESD) to the LC  
Receptacle  
Variation of IEC 61000-4-2  
Tested to 8 kV contact discharge.  
Electromagnetic  
Interference (EMI)  
FCC Class B  
CENELEC EN55022 Class B  
(CISPR 22A)  
Margins are dependent on customer board and chassis  
designs.  
VCCI Class I  
Immunity  
Variation of IEC 61000-4-3  
Typically show no measurable effect from a  
10 V/m field swept from 27 to 1000 MHz applied to the  
transceiver without a chassis enclosure.  
Accession Number: ) 9521220  
Laser Eye Safety  
and Equipment Type  
Testing  
FDA CDRH 21-CFR 1040  
Class 1  
IEC 60825-1  
Amendment 2 2001-01  
License Number: ) 933/510216  
Component  
Recognition  
Underwriters Laboratories and  
Canadian Standards Association  
Joint Component Recognition  
for Information Technology  
Equipment Including Electrical  
Business Equipment.  
UL File. E173874  
13  
CAUTION:  
There are no user serviceable parts nor any  
maintenance required for the HFCT-595xTLZ/  
TGZ/ATLZ/ATGZ. All adjustments are made at the  
factorybeforeshipmenttoourcustomers.Tampering  
with or modifying the performance of the HFCT-  
595xTLZ/TGZ/ATLZ/ATGZ will result in voided  
product warranty. It may also result in improper  
operation of the HFCT-595xTLZ/TGZ/ATLZ/ATGZ  
circuitry, and possible overstress of the laser  
source. Device degradation or product failure may  
result.  
ConnectionoftheHFCT-595xTLZ/TGZ/ATLZ/ATGZ  
to a non-approved optical source, operating above  
the recommended absolute maximum conditions  
or operating the HFCT-595xTLZ/TGZ/ATLZ/ATGZ  
in a manner inconsistent with their design and  
functionmayresultinhazardousradiationexposure  
and may be considered an act of modifying or  
manufacturing a laser product. The person(s)  
performing such an act is required by law to  
recertifyandreidentifythelaserproductunderthe  
provisions of U.S. 21 CFR (Subchapter J).  
14  
Absolute Maximum Ratings  
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in  
isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting values  
of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for extended  
periods can adversely affect device reliability.  
Parameter  
Symbol  
Min.  
-40  
Typ.  
Max.  
+85  
3.6  
Unit  
°C  
V
Reference  
Storage Temperature  
Supply Voltage  
TS  
VCC  
VI  
-0.5  
-0.5  
1
Data Input Voltage  
Data Output Current  
Relative Humidity  
VCC  
50  
V
ID  
mA  
%
RH  
85  
Recommended Multirate Operating Conditions  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Reference  
Ambient Operating Temperature  
HFCT-595xTLZ/TGZ  
HFCT-595xATLZ/ATGZ  
Supply Voltage  
TA  
TA  
VCC  
0
-40  
3.14  
+70  
+85  
3.47  
°C  
°C  
V
2
2
Power Supply Rejection  
PSR  
VD  
100  
50  
mVPk-Pk  
V
3
Transmitter Differential Input Voltage  
Data Output Load  
0.3  
1.6  
1.0  
0.6  
W
RDL  
TTL Signal Detect Output Current - Low  
TTL Signal Detect Output Current - High  
Transmit Disable Input Voltage - Low  
Transmit Disable Input Voltage - High  
Transmit Disable Assert Time  
IOL  
mA  
µA  
V
IOH  
-400  
2.2  
TDIS  
TDIS  
V
TASSERT  
TDEASSERT  
10  
µs  
4
5
Transmit Disable Deassert Time  
1.0  
ms  
Process Compatibility  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Reference  
Wave Soldering and Aqueous Wash  
TSOLD/tSOLD  
+260/10 °C/sec.  
6
Notes:  
1. The transceiver is class 1 eye safe up to V = 3.6 V.  
2. Ambient operating temperature utilizes air flow of 2 ms over the device.  
CC  
-1  
3. Tested with a sinusoidal signal in the frequency range from 10 Hz to 1 MHz on the V supply with the recommended power supply filter in place.  
CC  
Typically less than a 1 dB change in sensitivity is experienced.  
4. Time delay from Transmit Disable Assertion to laser shutdown.  
5. Time delay from Transmit Disable Deassertion to laser start-up.  
6. Aqueous wash pressure <110 psi.  
15  
Transmitter Electrical Characteristics  
HFCT-595xTLZ/TGZ: T = 0°C to +70 °C, V = 3.14 V to 3.47 V  
A
CC  
HFCT-595xATLZ/ATGZ: T = -40 °C to +85 °C, V = 3.14 V to 3.47 V  
A
CC  
Parameter  
Symbol  
ICCT  
Min.  
Typ.  
30  
Max.  
120  
Unit  
mA  
W
Reference  
Supply Current  
Power Dissipation  
1
PDIST  
0.10  
800  
0.42  
930  
Data Input Voltage Swing (single-ended)  
VIH - VIL  
250  
mV  
Transmitter Differential  
Data Input Current - Low  
IIL  
-350  
µA  
Transmitter Differential  
Data Input Current - High  
Laser Diode Bias Monitor Voltage  
IIH  
350  
700  
200  
µA  
mV  
mV  
2, 3  
2, 3  
Power Monitor Voltage  
10  
Receiver Electrical Characteristics  
HFCT-595xTLZ/TGZ: T = 0°C to +70 °C, V = 3.14 V to 3.47 V  
A
CC  
HFCT-595xATLZ/ATGZ: T = -40 °C to +85 °C, V = 3.14 V to 3.47 V  
A
CC  
Parameter  
Symbol  
Min.  
Typ.  
70  
Max.  
110  
0.38  
930  
0.5  
Unit  
mA  
W
Reference  
Supply Current  
Power Dissipation  
ICCR  
1
4
5
6
6
7
7
PDISR  
VOH - VOL  
tr  
0.23  
800  
Data Output Voltage Swing (single-ended)  
Data Output Rise Time  
575  
mV  
ns  
ns  
V
Data Output Fall Time  
tf  
0.5  
Signal Detect Output Voltage - Low  
Signal Detect Output Voltage - High  
Signal Detect Assert Time (OFF to ON)  
Signal Detect Deassert Time (ON to OFF)  
VOL  
0.8  
VOH  
2.0  
2.3  
V
ASMAX  
ANSMAX  
100  
100  
µs  
µs  
Notes:  
1. Excludes data output termination currents.  
2. The laser bias monitor current and laser diode optical power are calculated as ratios of the corresponding voltages to their current sensing resistors,  
10 W and 200 W (see Figure 7). On the 2 x 10 version only.  
3. On the 2 x 10 version only.  
4. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of V and I minus the sum of the  
CC  
CC  
products of the output voltages and currents.  
5. These outputs are compatible with 10 k, 10 kH, and 100 k ECL and PECL inputs.  
6. These are 20-80% values.  
7. SD is LVTTL compatible.  
16  
Transmitter Optical Characteristics  
HFCT-595xTLZ/TGZ: T = 0 °C to +70 °C, V = 3.14 V to 3.47 V  
A
CC  
HFCT-595xATLZ/ATGZ: T = -40 °C to +85 °C, V = 3.14 V to 3.47 V  
A
CC  
Parameter  
Symbol  
Min.  
-15  
Typ.  
Max.  
-8  
Unit  
dBm  
nm  
Reference  
Output Optical Power 9 µm SMF  
Center Wavelength  
Spectral Width - rms  
Optical Rise Time  
POUT  
lC  
1
1274  
1356  
2.5  
s
nm rms  
ps  
2
3
3
tr  
250  
250  
1000  
1000  
Optical Fall Time  
tf  
ps  
Extinction Ratio  
ER  
8.2  
dB  
Output Optical Eye  
Back Reflection Sensitivity  
Jitter Generation  
Compliant with eye mask Bellcore GR-CORE-000253 and ITU-T G.957  
-8.5  
70  
7
dB  
4
5
5
pk to pk  
RMS  
25  
2
mUI  
mUI  
Receiver Optical Characteristics  
HFCT-595xTLZ/TGZ: T = 0 °C to +70 °C, V = 3.14 V to 3.47 V  
A
CC  
HFCT-595xATLZ/ATGZ: T = -40 °C to +85 °C, V = 3.14 V to 3.47 V  
A
CC  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Reference  
Receiver Sensitivity  
Receiver Overload  
P
P
l
IN MIN  
-32  
-28  
dBm avg. 6, 7  
dBm avg. 6  
nm  
IN MAX  
-8  
Input Operating Wavelength  
Signal Detect - Asserted  
Signal Detect - Deasserted  
Signal Detect - Hysteresis  
Optical Return Loss, ORL  
1270  
1570  
-28  
PA  
PD  
PH  
-34  
dBm avg.  
dBm avg.  
dB  
-45  
0.5  
-34.3  
1.7  
4
-35  
-14  
dB  
Notes:  
1. The output power is coupled into a 1 m single-mode fiber. Minimum output optical level is at end of life.  
2. The relationship between FWHM and RMS values for spectral width can be derived from the assumption of a Gaussian shaped spectrum which  
results in RMS = FWHM/2.35.  
3. These are unfiltered 20-80% values. The typical value is for OC-12 operation only.  
4. This meets the “desired” requirement in SONET specification (GR253). The figure given is the allowable mismatch for 1 dB degradation in receiver  
sensitivity.  
23  
5. For the jitter measurements, the device was driven with SONET OC-12C data pattern filled with a 2 -1 PRBS payload.  
23  
6. Minimum sensitivity and saturation levels for a 2 -1 PRBS with 72 ones and 72 zeros inserted. Over the range the receiver is guaranteed to provide  
-10  
output data with a Bit Error Rate better than or equal to 1 x 10  
7. Beginning of life sensitivity at +25 °C is -29 dBm.  
.
17  
Design Support Materials  
Avago has created a number of reference designs  
withmajorPHYICvendorsinordertodemonstrate  
full functionality and interoperability. Such design  
information and results can be made available to  
the designer as a technical aid. Please contact your  
Avago representative for further information if  
required.  
Ordering Information  
Temperature range 0 °C to +70 °C,  
HFCT-5951TLZ  
HFCT-5952TLZ  
HFCT-5951TGZ  
HFCT-5952TGZ  
2
x
5
footprint - with EMI nose shield  
2 x 10 footprint - with EMI nose shield  
2 x 5 footprint - without EMI nose shield  
2 x 10 footprint - without EMI nose shield  
Temperature range -40 °C to +85 °C,  
HFCT-5951ATLZ  
HFCT-5952ATLZ  
HFCT-5951ATGZ  
HFCT-5952ATGZ  
2
x
5
footprint - with EMI nose shield  
2 x 10 footprint - with EMI nose shield  
2 x 5 footprint - without EMI nose shield  
2 x 10 footprint - without EMI nose shield  
Class 1 Laser Product: This product conforms to the  
applicable requirements of 21 CFR 1040 at the date of  
manufacture  
Date of Manufacture:  
Avago Technologies Inc., No 1 Yishun Ave 7, Singapore  
Handling Precautions  
1. The HFCT-595xTLZ/TGZ/ATLZ/ATGZ can be damaged by current surges or overvoltage.  
Power supply transient precautions should be taken.  
2. Normal handling precautions for electrostatic sensitive devices  
should be taken.  
For product information and a complete list of distributors, please go to our web site: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.  
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.  
5989-4771EN - January 25, 2006  

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