HSMN-A400-S8QM2 [AVAGO]
SMT LED Surface Mount LED Indicator High brightness using AlInGaP and InGaN dice; SMT LED表面贴装LED指示灯高亮度使用的AlInGaP和InGaN骰子
| 型号： | HSMN-A400-S8QM2 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | SMT LED Surface Mount LED Indicator High brightness using AlInGaP and InGaN dice |
| 文件： | 总11页 (文件大小：347K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HSMx-A4xx-xxxxx
SMT LED Surface Mount LED Indicator
Data Sheet
Description
Features
•
•
•
Industry standard PLCC-4
High reliability LED package
High brightness using AlInGaP and InGaN dice
technologies
High optical efficiency
Avago Power PLCC-4 is an extension of our PLCC-2 SMT
LEDs. The package can be driven at higher current due to
its superior package design. The product is able to dissi-
pate heat more efficiently compared to the conventional
PLCC-2 SMT LEDs. In proportion to the increase in driving
current, this family of LEDs is able to produce higher light
output compared to the conventional PLCC-2 SMT LEDs.
•
•
Higher ambient temperature at the same current
possible compared to PLCC-2
These SMT LEDs have higher reliability and better perfor-
mance and are designed to work under a wide range of
environmental conditions. This higher reliability makes
them suitable for use under harsh environment and con-
ditions like automotive. In addition, they are also suitable
to be used in electronic signs and signals.
•
•
•
•
•
•
Available in full selection of colors
Super wide viewing angle at 120˚
Available in 8mm carrier tape on 7-inch reel
Compatible with both IR and TTW soldering process
JEDEC MSL 2a
High reliability LED package due to enhanced silicone
resin material for InGaN family
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel will be
shipped in single intensity and color bin (except for red
color), to provide close uniformity.
Applications
•
Interior automotive
– Instrument panel backlighting
– Central console backlighting
– Cabin backlighting
– Navigation and audio system
– Dome lighting
These LEDs are compatible with IR solder reflow process.
Due to the high reliability feature of these products, they
also can be mounted using through-the-wave soldering
process.
– Push button backlighting
Exterior automotive
– Turn signals
– CHMSL
– Rear combination lamp
– Puddle light
There are a variety of colors and various viewing angles
(30°, 60° and 120°) available in these SMT LEDs. Ideally, the
30° parts are suitable for light piping where focused inten-
sities are required. As for the 60° and 120°, they are most
suitable for automotive interior and exterior lighting and
electronic signs applications.
•
•
•
Electronic signs and signals
– Interior full color sign
– Variable message sign
Office automation, home appliances, industrial
equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
CAUTION: HSMN-, HSMK-, HSMM-A40x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate
precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Dimensions
2.8 0.2
2.2 0.2
ꢀ.9 0.2
0.ꢀ TYP.
0.8 0.ꢀ
A
C
3.2 0.2
3.5 0.2
0.8 0.3
C
C
0.5 0.ꢀ
0.7 0.ꢀ
CATHODE MARKING
NOTES:
ALL DIMENSIONS IN mm.
ELECTRICAL CONNECTION BETWEEN ALL CATHODES IS RECOMMENDED.
Device Selection Guide
Color
Part Number
Min. I (mcd)
Max. I (mcd)
Test Current (mA) Dice Technology
V
V
Red
HSMC-A400-S30M1
HSMC-A401-U80M1
HSMJ-A401-T40M1
HSMJ-A401-U40M1
HSML-A401-U40M1
HSMA-A401-U45M1
HSME-A401-P4PM1
HSMN-A400-S8QM2
HSMN-A400-S8PM2
HSMN-A400-S4QM2
HSMM-A400-U4QM2
HSMM-A400-V8QM2
180.00
560.00
285.00
450.00
450.00
450.00
45.00
355.00
1400.00
715.00
1125.00
1125.00
1125.00
112.50
560.00
560.00
450.00
1125.00
2240.00
50
50
50
50
50
50
50
30
30
30
30
30
AlInGaP
AllnGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
InGaN
Red Orange
Orange
Amber
Emerald Green
Blue
224.00
224.00
180.00
450.00
900.00
InGaN
InGaN
Green
InGaN
InGaN
Notes:
1. The luminous intensity I , is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
V
aligned with this axis.
2. I tolerance = 12 ꢀ.
V
2
Part Numbering System
HSM x – A x x x – x x x x x
5 6 7 8 9
1
2
3 4
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
Absolute Maximum Ratings (T = 25°C)
A
Parameters
HSMC/J/L/A/E
70 mA[3,4]
200 mA
HSMZ/V/U
70 mA[3,4]
200 mA
HSMM/K/N
30 mA
DC Forward Current[1]
Peak Forward Current [2]
Power Dissipation
Reverse Voltage
90 mA
180 mW
240 mW
114 mW
5 V
Junction Temperature
Operating Temperature
Storage Temperature
110°C
–40°C to +100°C
–40°C to +100°C
Notes:
1. Derate linearly as shown in figure 5.
2. Duty factor = 10ꢀ, Frequency = 1 kHz.
3. Drive current between 10 mA and 70 mA is recommended for best long-term performance.
4. Operation at currents below 5 mA is not recommended.
3
Optical Characteristics (T = 25°C)
A
Peak
Dominant
Luminous
Efficacy η
(lm/W)
Luminous Intensity/
Total Flux
[3]
Wavelength
(nm)
Wavelength
Viewing Angle
v
[1]
[2]
Part
Number
λ
λ
(nm)
2θ
(Degrees)
I (mcd)/Φ (mlm)
PEAK
D
1/2
v
v
Color
Typ.
635
639
621
623
609
592
594
576
568
518
502
468
Typ.
626
630
615
617
605
590
592
575
567
525
505
470
Typ.
120
120
120
120
120
120
120
120
120
120
120
120
Typ.
Typ.
Red
HSMC
HSMZ
HSMJ
HSMV
HSML
HSMA
HSMU
HSME
HSME
HSMM
HSMK
HSMN
150
155
240
263
320
480
500
560
610
500
300
75
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
Red Orange
Orange
Amber
Yellow Green
Emerald Green
Green
Cyan
Blue
Notes:
1. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the device.
D
2. θ is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1/2
3. Radiant intensity, I in watts/steradian, may be calculated from the equation I = I /η , where I is the luminous intensity in candelas and η is the
e
e
v
v
v
v
luminous efficacy in lumens/watt.
Electrical Characteristics (T = 25°C)
A
Forward Voltage
V (Volts) @ I = 50 mA
Reverse Voltage
V @ 100 µA
F
F
R
Part Number
HSMC/J/L/A/E
HSMZ/V/U
Typ.
2.2
2.8
Max.
Min.
2.5
5
3.4
5
Forward Voltage
Reverse Voltage
V @ 10 µA
R
V (Volts) @ I = 30 mA
F
F
Part Number
Typ.
Max.
Min.
HSMM/K/N
3.8
4.6
5
1.0
BLUE
EMERALD GREEN
YELLOW GREEN
0.9
0.8
0.7
0.6
0.5
0.4
0.3
CYAN
GREEN
AMBER
ORANGE
RED ORANGE
RED
0.2
0.1
0
380
430
480
530
580
630
680
730
780
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength
4
1.2
1.0
0.8
0.6
0.4
0.2
0
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
80
70
60
50
40
30
20
10
0
HSMC/J/L/A/E
HSMZ/V/U
HSMM/K/N
4 5
0
5
10 15 20 25
30 35
0
1
2
3
0
10 20 30 40 50 60 70 80
FORWARD CURRENT – mA
FORWARD CURRENT – mA
FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage
Figure 3. Relative intensity vs. forward current
(AlInGaP)
Figure 4. Relative intensity vs. forward current
(InGaN)
35
80
70
60
540
530
30
300C/W
InGaN GREEN
520
25
300C/W
350C/W
50
350C/W
20
510
40
470C/W
15
500
490
480
470
460
InGaN CYAN
470C/W
30
10
5
20
10
0
InGaN BLUE
0
0
20
40
60
80
100 120
0
20
40
60
80
100 120
0
5
10 15 20 25 30 35
CURRENT – mA
AMBIENT TEMPERATURE – C
AMBIENT TEMPERATURE – C
Figure 5a. Maximum forward current vs. ambi-
ent temperature, derated based on TJmax =
110°C (AlInGaP)
Figure 5b. Maximum forward current vs. ambi-
ent temperature, derated based on TJmax =
110°C (InGaN)
Figure 6. Dominant wavelength vs. forward
current – InGaN devices
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-70
-50
-30
-10
10
30
50
70
90
ANGLE – DEGREES
Figure 7. Radiation pattern
5
X
X
2.60
(0.103)
0.40 (0.016)
1.10
(0.043)
Y
Y
0.50
(0.020)
4.50 (0.178)
1.50 (0.059)
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
DIMENSIONS IN mm (INCHES).
SOLDER RESIST
Figure 8a. Recommended soldering pad pattern
X
X
0.5 (0.020)
6.1 (0.240)
2.8 (0.110)
Y
2.0 (0.079)
6.0 (0.236)
1.0 (0.039)
Y
2.0 (0.079)
3.0 (0.118)
DIMENSIONS IN mm (INCHES).
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
Thermal Resistance
300°C/W
350°C/W
Solder Pad Area (xy)
>16 mm2
>12 mm2
>8 mm2
470°C/W
Figure 8b. Recommended soldering pad pattern (TTW)
6
10 to 20 SEC.
+5 °C
-0 °C
255 °C
217 °C
3 °C/SEC. MAX.
125 °C 25 °C
6 °C/SEC. MAX.
MAX. 120 SEC.
60 to 150 SEC.
TIME
Figure 9. Recommended Pb-free reflow soldering profile.
Note: For detailed information on reflow soldering of Avago surface mount LEDs,
refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
200
150
100
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
FLUXING
SOLDER: SN63; FLUX: RMA
50
30
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
PREHEAT
0
10
20
30
40
50
60
70
80
90 100
TIME – SECONDS
Figure 10. Recommended wave soldering profile
ID
Note : Diameter "ID" should
be bigger than 2.3mm
Figure 11. Recommended Pick and Place Nozzle Size for InGaN Family
7
TRAILER
COMPONENT
LEADER
200 mm MIN. FOR Ø180 REEL.
200 mm MIN. FOR Ø330 REEL.
480 mm MIN. FOR Ø180 REEL.
960 mm MIN. FOR Ø330 REEL.
C
A
USER FEED DIRECTION
Figure 12. Tape leader and trailer dimensions
+ꢀ0.
–ꢀ
2
ꢀ0ꢀꢁ
4
ꢀ0.
306 ꢀ0.
Ø.0ꢁ
B
.07ꢁ ꢀ0.
C
C
C
ꢁ0ꢁ ꢀ0ꢀꢁ
A
A
308 ꢀ0.
+ꢀ03
–ꢀ0.
.2
A
+ꢀ0.
–ꢀ
Ø.
B
8
ꢀ0.
ꢀ0229 ꢀ0ꢀ.
VIEW B-B
304ꢁ ꢀ0.
VIEW A-A
ALL DIMENSIONS IN mm0
Figure 13. Tape dimensions
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 14. Reeling orientation
8
Intensity Bin Select (X X )
Color Bin Select (X )
5 6
7
Individual reel will contain parts from one half bin only.
Individual reel will contain parts from one full bin only.
X7
X5
Min. Iv Bin
0
Full Distribution
A and B only
X6
0
2
3
4
5
6
7
8
9
Z
Y
W
V
U
T
Full Distribution
B and C only
2 half bins starting from X51
3 half bins starting from X51
4 half bins starting from X51
5 half bins starting from X51
2 half bins starting from X52
3 half bins starting from X52
4 half bins starting from X52
5 half bins starting from X52
C and D only
D and E only
E and F only
F and G only
S
G and H only
Q
P
N
M
L
A, B and C only
B, C and D only
C, D and E only
D, E and F only
E, F and G only
F, G and H only
A, B, C and D only
E, F, G and H only
B, C, D and E only
C, D, E and F only
A, B, C, D and E only
B, C, D, E and F only
K
1
Intensity Bin Limits
Bin ID
N1
N2
P1
Min. (mcd)
28.50
Max. (mcd)
35.50
2
3
35.50
45.00
4
45.00
56.00
5
P2
56.00
71.50
6
Q1
Q2
R1
71.50
90.00
90.00
112.50
140.00
180.00
224.00
285.00
355.00
450.00
560.00
715.00
900.00
1125.00
1400.00
1800.00
2240.00
2850.00
112.50
140.00
180.00
224.00
285.00
355.00
450.00
560.00
715.00
900.00
1125.00
1400.00
1800.00
2240.00
R2
S1
S2
T1
T2
U1
U2
V1
V2
W1
W2
X1
X2
Tolerance of each bin limit = 12ꢀ
9
Color Bin Limits
Blue
A
Color Bin Limits
Orange
Min. (nm)
460.0
Max. (nm)
465.0
Min. (nm)
597.0
Max. (nm)
600.0
A
B
C
D
E
B
465.0
470.0
600.0
603.0
C
470.0
475.0
603.0
606.0
D
475.0
480.0
606.0
609.0
609.0
612.0
Cyan
A
Min. (nm)
490.0
Max. (nm)
495.0
Red
Orange
A
B
Min. (nm)
611.0
Max. (nm)
616.0
B
495.0
500.0
C
500.0
505.0
616.0
620.0
D
505.0
510.0
Red
Min. (nm)
Max. (nm)
Green
A
B
Min. (nm)
515.0
Max. (nm)
520.0
Full Distribution
Tolerance of each bin limit = 1 nm
520.0
525.0
C
D
525.0
530.0
530.0
535.0
Packaging Option (X X )
Emerald
Green
A
B
8 9
Min. (nm)
552.5
Max. (nm)
555.5
Test
Package
Reel
Option
M1
Current
Type
Size
50 mA
30 mA
Top Mount
Top Mount
7 inch
7 inch
555.5
558.5
C
D
558.5
561.5
M2
561.5
564.5
Yellow
Green
E
Min. (nm)
564.5
Max. (nm)
567.5
Forward Voltage Bin Table
For HSMZ/V/U – A4xx-xxxxx only
F
567.5
570.5
G
H
570.5
573.5
BIN
VA
VB
VC
VD
VE
MIN.
1.9
2.2
2.5
2.8
3.1
MAX.
2.2
2.5
2.8
3.1
3.4
573.5
576.5
Amber/
Yellow
Min. (nm)
582.0
584.5
587.0
589.5
592.0
594.5
Max. (nm)
584.5
A
B
C
D
E
587.0
Tolerance of each bin limit = 0.1
589.5
592.0
594.5
F
597.0
10
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a per
JEDEC J-STD-020. Precaution when handling this moisture
sensitive product is important to ensure the reliability of
the product. Refer to Avago Application Note AN 5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
D. Control of assembled boards
– If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
needs to be stored in sealed MBB with desiccant
or in desiccator at <5ꢀ RH to ensure no LEDs have
exceeded their floor life of 672 hours.
A. Storage before use
E. Baking is required if:
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90ꢀ RH for 12 months. If the actual shelf life
has exceeded 12 months and the HIC indicates that
baking is not required, then it is safe to reflow the
LEDs per the original MSL rating.
– “10ꢀ”is Not blue and “5ꢀ”HIC indicator turns pink.
– The LEDs are exposed to conditions of >30°C/60ꢀ
RH at any time.
– The LEDs' floor life exceeds 672 hours.
Recommended baking conditions: 60 5°C for 20 hours.
– It is not recommended to open the MBB prior to
assembly (e.g., for IQC).
Handling Precautions
B. Control after opening the MBB
The encapsulation material of the InGaN family product
is made of silicone for better reliability of the product.
As silicone is a soft material, please do not press on the
silicone or poke a sharp object onto the silicone. These
might damage the product and cause premature failure.
During assembly or handling, the unit should be held on
the body only. Please refer to Avago Application Note AN
5288 for detail information.
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C/60ꢀ RH at all
times and all high temperature related processes,
including soldering, curing or rework, need to be
completed within 672 hours.
C. Control of unfinished reel
– Unused LEDs need to be stored in sealed MBB with
desiccant or in desiccator at <5ꢀ RH.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes AV01-0312EN
AV02-0479EN - March 20, 2013
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