DAC2904Y/250 [BB]

Dual, 14-Bit, 125MSPS DIGITAL-TO-ANALOG CONVERTER; 双通道, 14位, 125MSPS数位类比转换器
DAC2904Y/250
型号: DAC2904Y/250
厂家: BURR-BROWN CORPORATION    BURR-BROWN CORPORATION
描述:

Dual, 14-Bit, 125MSPS DIGITAL-TO-ANALOG CONVERTER
双通道, 14位, 125MSPS数位类比转换器

转换器 PC
文件: 总19页 (文件大小:453K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DAC2904  
DAC2904  
SBAS198B – NOVEMBER 2003  
Dual, 14-Bit, 125MSPS  
DIGITAL-TO-ANALOG CONVERTER  
FEATURES  
125MSPS UPDATE RATE  
APPLICATIONS  
COMMUNICATIONS:  
Base Stations, WLL, WLAN  
Baseband I/Q Modulation  
SINGLE SUPPLY: +3.3V or +5V  
HIGH SFDR: 78dB at fOUT = 10MHz  
LOW GLITCH: 2pVs  
MEDICAL/TEST INSTRUMENTATION  
ARBITRARY WAVEFORM GENERATORS (ARB)  
DIRECT DIGITAL SYNTHESIS (DDS)  
LOW POWER: 310mW  
INTERNAL REFERENCE  
POWER-DOWN MODE: 23mW  
The DAC2904 combines high dynamic performance with a  
high update rate to create a cost-effective solution for a wide  
variety of waveform-synthesis applications:  
DESCRIPTION  
The DAC2904 is a monolithic, 14-bit, dual-channel,  
high-speed Digital-to-Analog Converter (DAC), and is opti-  
mized to provide high dynamic performance while dissipating  
only 310mW.  
• Pin compatibility between family members provides 10-bit  
(DAC2900), 12-bit (DAC2902), and 14-bit (DAC2904)  
resolution.  
Operating with high update rates of up to 125MSPS, the  
DAC2904 offers exceptional dynamic performance, and  
enables the generation of very-high output frequencies suit-  
able for “Direct IF” applications. The DAC2904 has been  
optimized for communications applications in which sepa-  
rate I and Q data are processed while maintaining tight-gain  
and offset matching.  
• Pin compatible to the AD9767 dual DAC.  
• Gain matching is typically 0.5% of full-scale, and offset  
matching is specified at 0.02% max.  
• The DAC2904 utilizes an advanced CMOS process; the  
segmented architecture minimizes output-glitch energy,  
and maximizes the dynamic performance.  
• All digital inputs are +3.3V and +5V logic compatible. The  
DAC2904 has an internal reference circuit, and allows use  
in a multiplying configuration.  
Each DAC has a high-impedance differential-current output,  
suitable for single-ended or differential analog-output con-  
figurations.  
• The DAC2904 is available in a TQFP-48 package, and is  
specified over the extended industrial temperature range of  
–40°C to +85°C.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2002-2003, Texas Instruments  
Incorporated  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
www.ti.com  
ABSOLUTE MAXIMUM RATINGS  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
This integrated circuit can be damaged by ESD. Texas Instru-  
ments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling  
and installation procedures can cause damage.  
+VA to AGND ........................................................................ –0.3V to +6V  
+VD to DGND ........................................................................ –0.3V to +6V  
AGND to DGND ................................................................. –0.3V to +0.3V  
+VA to +VD ............................................................................... –6V to +6V  
CLK, PD to DGND ...................................................... –0.3V to VD + 0.3V  
D0-D9 to DGND .......................................................... –0.3V to VD + 0.3V  
IOUT, IOUT to AGND ........................................................ –1V to VA + 0.3V  
BW, BYP to AGND ..................................................... –0.3V to VA + 0.3V  
REFIN, FSA to AGND ................................................. –0.3V to VA + 0.3V  
INT/EXT to AGND ...................................................... –0.3V to VA + 0.3V  
Junction Temperature .................................................................... +150°C  
Case Temperature ......................................................................... +100°C  
Storage Temperature ..................................................................... +125°C  
ESD damage can range from subtle performance degrada-  
tion to complete device failure. Precision integrated circuits  
may be more susceptible to damage because very small  
parametric changes could cause the device not to meet its  
published specifications.  
PACKAGE/ORDERING INFORMATION  
PACKAGE  
SPECIFIED  
DRAWING  
NUMBER  
PACKAGE  
DESIGNATOR  
TEMPERATURE  
RANGE  
PACKAGE  
MARKING  
ORDERING  
NUMBER(1)  
TRANSPORT  
MEDIA  
PRODUCT  
PACKAGE  
DAC2904Y  
TQFP-48  
355  
PFB  
–40°C to +85°C  
DAC2904Y  
DAC2904Y/250  
DAC2904Y/1K  
Tape and Reel  
Tape and Reel  
"
"
"
"
"
"
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /1K indicates 1000 devices per reel). Ordering 1000 pieces  
of “DAC2904Y/1K” will get a single 1000-piece Tape and Reel.  
PRODUCT  
EVM ORDERING NUMBER  
COMMENT  
DAC2904  
DAC2904-EVM  
Fully populated evaluation board. See user manual for details.  
ELECTRICAL CHARACTERISTICS  
TMIN to TMAX, +VA = +5V, +VD = +3.3V, differential transformer coupled output, 50ý doubly-terminated, unless otherwise noted. Independant Gain Mode.  
DAC2904Y  
PARAMETER  
RESOLUTION  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
14  
Bits  
Output Update Rate (fCLOCK  
)
125  
MSPS  
STATIC ACCURACY(1)  
Differential Nonlinearity (DNL)  
Integral Nonlinearity (INL)  
TA = +25°C  
TA = +25°C  
±4.0  
±5.0  
LSB  
LSB  
DYNAMIC PERFORMANCE  
Spurious-Free Dynamic Range (SFDR)  
fOUT = 1MHz, fCLOCK = 50MSPS  
To Nyquist  
0dBFS Output  
–6dBFS Output  
–12dBFS Output  
71  
82  
77  
72  
82  
81  
81  
78  
72  
80  
69  
69  
64  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
fOUT = 1MHz, fCLOCK = 26MSPS  
fOUT = 2.18MHz, fCLOCK = 52MSPS  
fOUT = 5.24MHz, fCLOCK = 52MSPS  
fOUT = 10.4MHz, fCLOCK = 78MSPS  
fOUT = 15.7MHz, fCLOCK = 78MSPS  
fOUT = 5.04MHz, fCLOCK = 100MSPS  
fOUT = 20.2MHz, fCLOCK = 100MSPS  
fOUT = 20.1MHz, fCLOCK = 125MSPS  
fOUT = 40.2MHz, fCLOCK = 125MSPS  
Spurious-Free Dynamic Range within a Window  
fOUT = 1.0MHz, fCLOCK = 50MSPS  
fOUT = 5.24MHz, fCLOCK = 52MSPS  
fOUT = 5.26MHz, fCLOCK = 78MSPS  
fOUT = 5.04MHz, fCLOCK = 125MSPS  
Total Harmonic Distortion (THD)  
fOUT = 1MHz, fCLOCK = 50MSPS  
fOUT = 5.24MHz, fCLOCK = 52MSPS  
fOUT = 5.26MHz, fCLOCK = 78MSPS  
fOUT = 5.04MHz, fCLOCK = 125MSPS  
Multitone Power Ratio  
fOUT = 2.0MHz to 2.99MHz, fCLOCK = 65MSPS  
Signal-to-Noise Ratio (SNR)  
fOUT = 5.02MHz, fCLOCK = 50MHz  
Signal-to-Noise and Distortion (SINAD)  
fOUT = 5.02MHz, fCLOCK = 50MHz  
2MHz Span  
10MHz Span  
10MHz Span  
10MHz Span  
80  
90  
88  
88  
88  
dBc  
dBc  
dBc  
dBc  
–79  
–77  
–76  
–75  
–70  
dBc  
dBc  
dBc  
dBc  
8 Tone with 110kHz Spacing  
0dBFS Output  
80  
68  
67  
dBc  
dBc  
dBc  
0dBFS Output  
0dBFS Output  
DAC2904  
SBAS198B  
2
ELECTRICAL CHARACTERISTICS (Cont.)  
TMIN to TMAX, +VA = +5V, +VD = +3.3V, differential transformer coupled output, 50ý doubly terminated, unless otherwise noted. Independant Gain Mode.  
DAC2904Y  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
DYNAMIC PERFORMANCE (Cont.)  
Channel Isolation  
fOUT = 1MHz, fCLOCK = 52MSPS  
fOUT = 20MHz, fCLOCK = 125MSPS  
Output Settling Time(2)  
Output Rise Time(2)  
85  
77  
30  
2
dBc  
dBc  
ns  
to 0.1%  
10% to 90%  
10% to 90%  
ns  
Output Fall Time(2)  
2
ns  
Glitch Impulse  
2
pV-s  
DC ACCURACY  
Full-Scale Output Range(3)(FSR)  
Output Compliance Range  
Gain Error—Full-Scale  
Gain Error  
All Bits HIGH, IOUT  
2
20  
+1.25  
+5  
mA  
V
–1.0  
–5  
With Internal Reference  
With External Reference  
With Internal Reference  
With Internal Reference  
With Internal Reference  
With Internal Reference  
+5V, ±10%  
±1  
±1  
%FSR  
%FSR  
%FSR  
ppmFSR/°C  
%FSR  
ppmFSR/°C  
%FSR/V  
%FSR/V  
pA/ Hz  
pA/šHz  
k  
–2.5  
–2.0  
+2.5  
+2.0  
Gain Matching  
0.5  
±50  
Gain Drift  
Offset Error  
–0.02  
+0.02  
Offset Drift  
±0.2  
Power-Supply Rejection, +VA  
Power-Supply Rejection, +VD  
Output Noise  
–0.2  
+0.2  
+3.3V, ±10%  
–0.025  
+0.025  
IOUT = 20mA, RLOAD = 50Ω  
IOUT = 2mA  
50  
30  
200  
6
Output Resistance  
Output Capacitance  
I
OUT, IOUT to Ground  
pF  
REFERENCE/CONTROL AMP  
Reference Voltage  
+1.18  
+0.5  
+1.25  
±50  
100  
0.3  
+1.31  
+1.25  
V
Reference Voltage Drift  
ppmFSR/°C  
Reference Output Current  
Reference Multiplying Bandwidth  
Input Compliance Range  
nA  
MHz  
V
DIGITAL INPUTS  
Logic Coding  
Straight Binary  
Logic High Voltage, VIH  
Logic Low Voltage, VIL  
Logic High Voltage, VIH  
Logic Low Voltage, VIL  
+VD = +5V  
+VD = +5V  
+VD = 3.3V  
+VD = 3.3V  
+VD = 3.3V  
+VD = 3.3V  
3.5  
2
5
0
V
V
1.2  
0.8  
3
V
0
V
(4)  
Logic High Current, IIH  
±10  
±10  
5
µA  
µA  
pF  
Logic Low Current  
Input Capacitance  
POWER SUPPLY  
Supply Voltages  
+VA  
+3.0  
+3.0  
+5  
+5.5  
+5.5  
V
V
+VD  
+3.3  
Supply Current  
(5)  
IVA  
+VA = +5V, lOUT = 20mA  
Power-Down Mode  
58  
1.7  
4.2  
17  
65  
3
mA  
mA  
(5)  
IVA  
(5)  
IVD  
7
mA  
(6)  
IVD  
19.5  
350  
390  
mA  
Power Dissipation(5)  
Power Dissipation(6)  
Power Dissipation(5)  
Power Dissipation  
Thermal Resistance, TQFP-48  
θJA  
+VA = +5V, +VD = 3.3V, lOUT = 20mA  
+VA = +5V, +VD = 3.3V, lOUT = 20mA  
+VA = +5V, +VD = 3.3V, lOUT = 2mA  
Power-Down Mode  
310  
348  
130  
23  
mW  
mW  
mW  
mW  
38  
60  
13  
°C/W  
°C/W  
θJC  
TEMPERATURE RANGE  
Specified  
Ambient  
Ambient  
–40  
–40  
+85  
+85  
°C  
°C  
Operating  
NOTES: (1) At output lOUT, while driving a virtual ground. (2) Measured single-ended into 50ý load. (3) Nominal full-scale output current is 32 • IREF; see Application  
section for details. (4) Typically 45µA for the PD pin, which has an internal pull-down resistor. (5) Measured at fCLOCK = 25MSPS and fOUT = 1MHz. (6) Measured  
at fCLOCK = 100MSPS and fOUT = 40MHz.  
DAC2904  
SBAS198B  
3
PIN CONFIGURATION  
Top View  
TQFP-48  
48 47 46 45 44 43 42 41 40 39 38 37  
D13_1 (MSB)  
1
2
3
4
5
6
7
8
9
36 D0-2  
35 D1-2  
34 D2_2  
33 D3_2  
32 D4_2  
31 D5_2  
30 D6_2  
29 D7_2  
28 D8_2  
27 D9_2  
26 D10_2  
25 D11_2  
D12_1  
D11_1  
D10_1  
D9_1  
D8_1  
D7_1  
D6_1  
D5_1  
DAC2904  
D4_1 10  
D3_1 11  
D2_1 12  
13 14 15 16 17 18 19 20 21 22 23 24  
PIN DESCRIPTIONS  
PIN  
DESIGNATOR  
DESCRIPTION  
1-14  
15  
D[13:0]_1  
DGND  
+VD  
Data Port DAC1, Data Bit 13 (MSB) to Bit 0 (LSB).  
Digital Ground  
16  
Digital Supply, +3.0V to +5.5V  
DAC1 Input Latches Write Signal  
Clock Input DAC1  
17  
WRT1  
CLK1  
18  
19  
CLK2  
Clock Input DAC2  
20  
WRT2  
DGND  
+VD  
DAC2 Input Latches Write Signal  
Digital Ground  
21  
22  
Digital Supply, +3.0V to +5.5V  
Data Port DAC2, Data Bit 13 (MSB) to Bit 0 (LSB).  
23-36  
37  
D[13:0]_2  
PD  
Power-Down Function Control Input; “H” = DAC in power-down mode; “L” = DAC in normal operation (Internal pull-down for default “L”).  
Analog Ground  
38  
AGND  
39  
IOUT  
IOUT  
2
2
Current Output DAC2. Full-scale with all bits of data port 2 high.  
Complementary Current Output DAC2. Full-scale with all bits of data port 2 low.  
Full-Scale Adjust, DAC2. Connect External RSET Resistor  
40  
41  
FSA2  
GSET  
REFIN  
42  
Gain-Setting Mode (H = 1 Resistor, L = 2 Resistors)  
43  
Internal Reference Voltage output; External Reference Voltage input. Bypass with 0.1µF to AGND for internal reference  
operation.  
44  
45  
46  
47  
48  
FSA1  
Full-Scale Adjust, DAC1. Connect External RSET Resistor  
IOUT  
IOUT  
1
1
Complementary Current Output DAC1. Full-scale with all bits of data port 1 low.  
Current Output DAC1. Full-scale with all bits of data port 1 high.  
Analog Supply, +3.0V to +5.5V  
+VA  
NC  
No Connection  
DAC2904  
SBAS198B  
4
TIMING DIAGRAM  
tS  
tH  
DATA IN  
D[13:0](n)  
D[13:0](n + 1)  
tLPW  
WRT1  
WRT2  
tCPW  
CLK1  
CLK2  
tSET  
IOUT  
1
IOUT  
IOUT  
50%  
(n)  
(n + 1)  
I
OUT2  
tPD  
SYMBOL  
DESCRIPTION  
MIN  
TYP  
MAX  
UNITS  
tS  
tH  
Input Setup Time  
Input Hold Time  
Latch/Clock Pulsewidth  
Delay Rising CLK Edge to  
Rising WRT Edge  
2
1.5  
3.5  
0
ns  
ns  
ns  
ns  
t
LPW, tCPW  
4
tCW  
tPW – 2  
tPD  
tSET  
Propagation Delay  
Settling Time (0.1%)  
1
30  
ns  
ns  
DIGITAL INPUTS AND TIMING  
The two converter channels within the DAC2904 consist of  
two independent, 14-bit, parallel data ports. Each DAC-  
channel is controlled by its own set of write (WRT1, WRT2)  
and clock (CLK1, CLK2) inputs. Here, the WRT lines  
control the channel input latches and the CLK lines control  
the DAC latches. The data is first loaded into the input latch  
by a rising edge of the WRT line. This data is presented to  
the DAC latch on the following falling edge of the WRT  
signal. On the next rising edge of the CLK line, the DAC is  
updated with the new data and the analog output signal will  
change accordingly. The double latch architecture of the  
DAC2904 results in a defined sequence for the WRT and  
CLK signals, expressed by parameter ‘tCW’. A correct tim-  
ing is observed when the rising edge of CLK occurs at the  
same time, or before, the rising edge of the WRT signal. This  
condition can simply be met by connecting the WRT and  
CLK lines together. Note that all specifications were mea-  
sured with the WRT and CLK lines connected together.  
The data input ports of the DAC2904 accepts a standard  
positive coding with data bit D13 being the most significant  
bit (MSB). The converter outputs support a clock rate of up  
to 125MSPS. The best performance will typically be achieved  
with a symmetric duty cycle for write and clock; however,  
the duty cycle may vary as long as the timing specifications  
are met. Also, the set-up and hold times may be chosen  
within their specified limits.  
All digital inputs of the DAC2904 are CMOS compatible.  
The logic thresholds depend on the applied digital supply  
voltages, such that they are set to approximately half the  
supply voltage; Vth = +VD/2 (±20% tolerance). The DAC2904  
is designed to operate with a digital supply (+VD) of +3.0V  
to +5.5V.  
DAC2904  
SBAS198B  
5
TYPICAL CHARACTERISTICS  
TA = 25°C, +VD = +3.3V, +VA = +5V, differential transformer coupled, IOUT = 20mA, 50ý double terminated load, SFDR up to Nyquist, unless otherwise noted.  
TYPICAL DNL  
TYPICAL INL  
6
5
4
3
4
2
3
1
2
0
1
0
–1  
–2  
–3  
–4  
–1  
–2  
–3  
–4  
0
0
0
2k  
4k  
6k  
8k  
10k  
12k  
14k  
16k  
0
2k  
4k  
6k  
8k  
10k  
12k  
14k  
16k  
Code  
Code  
SFDR vs fOUT AT 52MSPS  
SFDR vs fOUT AT 26MSPS  
90  
85  
80  
75  
70  
65  
60  
90  
85  
80  
75  
70  
65  
60  
–6dBFS  
0dBFS  
0dBFS  
–6dBFS  
–12dBFS  
–12dBFS  
5
10  
15  
20  
25  
0
2
4
6
8
10  
12  
fOUT (MHz)  
f
OUT (MHz)  
SFDR vs fOUT AT 100MSPS  
SFDR vs fOUT AT 78MSPS  
85  
80  
75  
70  
65  
60  
55  
50  
85  
80  
75  
70  
65  
60  
55  
0dBFS  
–6dBFS  
–6dBFS  
–12dBFS  
–12dBFS  
0dBFS  
5
10  
15  
20  
25  
30  
35  
40  
45  
0
5
10  
15  
20  
25  
30  
35  
fOUT (MHz)  
f
OUT (MHz)  
DAC2904  
SBAS198B  
6
TYPICAL CHARACTERISTICS (Cont.)  
TA = 25°C, +VD = +3.3V, +VA = +5V, differential transformer coupled, IOUT = 20mA, 50ý double terminated load, SFDR up to Nyquist, unless otherwise noted.  
SFDR vs IOUTFS and fOUT at 78MSPS, 0dBFS  
SFDR vs fOUT AT 125MHz  
85  
80  
75  
70  
65  
60  
55  
50  
82  
80  
78  
76  
74  
72  
70  
68  
66  
64  
62  
20mA  
10mA  
–6dBFS  
–12dBFS  
5mA  
0dBFS  
0
10  
20  
30  
OUT (MHz)  
40  
50  
60  
0
5
10  
15  
OUT (MHz)  
20  
25  
f
f
SFDR AT 125MSPS vs TEMPERATURE  
2MHz  
GAIN AND OFFSET DRIFT  
Offset Error  
0.8  
0.6  
0.004  
0.003  
0.002  
0.001  
0
90  
85  
80  
75  
70  
65  
60  
55  
50  
0.4  
10MHz  
0.2  
20MHz  
40MHz  
0
–0.2  
–0.4  
–0.6  
–0.8  
–0.001  
–0.002  
–0.003  
–0.004  
Gain Error  
–40  
–20  
0
20  
40  
60  
80  
100  
–40  
–20  
0
20  
40  
60  
80 85  
Temperature (°C)  
Temperature (°C)  
IVD vs RATIO AT +VD = +3.3V  
125MSPS  
IVA vs IOUTFS  
25  
20  
15  
10  
5
60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
100MSPS  
78MSPS  
52MSPS  
26MSPS  
0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45  
0
5
10  
15  
20  
25  
Ratio (FOUT/FCLK  
)
I
OUTFS (mA)  
DAC2904  
SBAS198B  
7
TYPICAL CHARACTERISTICS (Cont.)  
TA = 25°C, +VD = +3.3V, +VA = +5V, differential transformer coupled, IOUT = 20mA, 50ý double terminated load, SFDR up to Nyquist, unless otherwise noted.  
SINGLE-TONE SFDR  
SINGLE-TONE SFDR  
10  
0
10  
0
fCLOCK = 100MSPS  
OUT = 20.2MHz  
Amplitude = 0dBFS  
fCLOCK = 52MSPS  
OUT = 5.23MHz  
Amplitude = 0dBFS  
f
f
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
0
5.2  
10.4  
15.6  
20.8  
26  
0
10  
20  
30  
40  
50  
Frequency (MHz)  
Frequency (MHz)  
DUAL-TONE SFDR  
FOUR-TONE SFDR  
10  
0
10  
0
fCLOCK = 78MSPS  
fCLOCK = 50MSPS  
f
OUT1 = 9.44MHz  
OUT2 = 10.44MHz  
Amplitude = 0dBFS  
f
f
f
f
OUT1 = 6.25MHz  
OUT2 = 6.75MHz  
OUT3 = 7.25MHz  
OUT4 = 7.75MHz  
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–10  
f
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
Amplitude = 0dBFS  
0
7.8  
15.6  
23.4  
31.2  
39  
0
5
10  
15  
20  
25  
Frequency (MHz)  
Frequency (MHz)  
WCDMA-ACPR  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
fCLOCK = 61.44MSPS  
PCHANNEL = –13dBm  
ACPR = –69.2dB  
–100  
–110  
–120  
–130  
Center 15.36MHz; Span 14MHz  
DAC2904  
SBAS198B  
8
DAC TRANSFER FUNCTION  
APPLICATION INFORMATION  
THEORY OF OPERATION  
Each of the DACs in the DAC2904 has a set of complemen-  
tary current output, IOUT1 and IOUT2. The full-scale output  
current, IOUTFS, is the summation of the two complementary  
output currents:  
The architecture of the DAC2904 uses the current steering  
technique to enable fast switching and a high update rate.  
The core element within the monolithic DAC is an array of  
segmented current sources that are designed to deliver a full-  
scale output current of up to 20mA, as shown in Figure 1. An  
internal decoder addresses the differential current switches  
each time the DAC is updated and a corresponding output  
current is formed by steering all currents to either output  
summing node, IOUT or IOUT. The complementary outputs  
deliver a differential output signal, which improves the  
dynamic performance through reduction of even-order har-  
monics, common-mode signals (noise), and double the peak-  
to-peak output signal swing by a factor of two, compared to  
single-ended operation.  
IOUTFS = IOUT + IOUT  
(1)  
The individual output currents depend on the DAC code and  
can be expressed as:  
IOUT = IOUTFS • (Code/16384)  
(2)  
(3)  
IOUT = IOUTFS • (16383 - Code/16384)  
where ‘Code’ is the decimal representation of the DAC data  
input word. Additionally, IOUTFS is a function of the refer-  
ence current IREF, which is determined by the reference  
The segmented architecture results in a significant reduction  
of the glitch energy, improves the dynamic performance  
(SFDR), and DNL. The current outputs maintain a very high  
output impedance of greater than 200ký.  
voltage and the external setting resistor, RSET  
.
The full-scale output current is determined by the ratio of the  
internal reference voltage (1.25V) and an external resistor,  
RSET. The resulting IREF is internally multiplied by a factor  
of 32 to produce an effective DAC output current that can  
IOUTFS = 32 • IREF = 32 • VREF/RSET  
(4)  
In most cases the complementary outputs will drive resistive  
loads or a terminated transformer. A signal voltage will  
develop at each output according to:  
range from 2mA to 20mA, depending on the value of RSET  
.
The DAC2904 is split into a digital and an analog portion,  
each of which is powered through its own supply pin. The  
digital section includes edge-triggered input latches and the  
decoder logic, while the analog section comprises the cur-  
rent source array with its associated switches, and the  
reference circuitry.  
VOUT = IOUT • RLOAD  
VOUT = IOUT • RLOAD  
(5)  
(6)  
+VD  
+VD  
+VA  
l
OUT1  
Data Input  
Port 1  
D[13:0]_1  
DAC1  
Segmented Switches  
Current Sources  
Input  
Latch 1  
DAC  
Latch 1  
lOUT1  
REFIN  
WRT1  
CLK1  
CLK2  
WRT2  
FSA1  
FSA2  
GSET  
PD  
Reference  
Control Amplifier  
DAC2904  
lOUT  
2
Data Input  
Port 2  
D[13:0]_2  
DAC2  
Segmented Switches  
Current Sources  
Input  
Latch 2  
DAC  
Latch 2  
lOUT2  
DGND  
DGND  
AGND  
FIGURE 1. Block Diagram of the DAC2904.  
DAC2904  
SBAS198B  
9
The value of the load resistance is limited by the output  
compliance specification of the DAC2904. To maintain  
specified linearity performance, the voltage for IOUT and  
IOUT should not exceed the maximum allowable compliance  
range.  
be adapted to the output of the DAC2904 by selecting a  
suitable transformer while maintaining optimum voltage  
levels at IOUT and IOUT. Furthermore, using the differential  
output configuration in combination with a transformer will  
be instrumental for achieving excellent distortion perfor-  
mance. Common-mode errors, such as even-order harmon-  
ics or noise, can be substantially reduced. This is particularly  
the case with high output frequencies.  
The two single-ended output voltages can be combined to  
find the total differential output swing:  
For those applications requiring the optimum distortion and  
noise performance, it is recommended to select a full-scale  
output of 20mA. A lower full-scale range down to 2mA may  
be considered for applications that require a low power  
consumption, but can tolerate a slightly reduced perfor-  
mance level.  
(2Code16383)  
VOUTDIFF=VOUT– V  
=
IOUTFSR  
LOAD(7)  
OUT  
16384  
ANALOG OUTPUTS  
The DAC2904 provides two complementary current out-  
puts, IOUT and IOUT. The simplified circuit of the analog  
output stage representing the differential topology is shown  
in Figure 2. The output impedance of IOUT and IOUT results  
from the parallel combination of the differential switches,  
along with the current sources and associated parasitic  
capacitances.  
OUTPUT CONFIGURATIONS  
The current outputs of the DAC2904 allow for a variety of  
configurations, some of which are illustrated in Table I. As  
mentioned previously, utilizing the converter’s differential  
outputs will yield the best dynamic performance. Such a  
differential output circuit may consist of an RF transformer  
or a differential amplifier configuration. The transformer  
configuration is ideal for most applications with ac coupling,  
while op amps will be suitable for a DC-coupled configura-  
tion.  
+VA  
DAC2904  
INPUT CODE (D13 - D0)  
IOUT  
IOUT  
11 1111 1111 1111  
10 0000 0000 0000  
00 0000 0000 0000  
20mA  
10mA  
0mA  
0mA  
10mA  
20mA  
TABLE I. Input Coding versus Analog Output Current.  
IOUT  
RL  
IOUT  
RL  
The single-ended configuration may be considered for appli-  
cations requiring a unipolar output voltage. Connecting a  
resistor from either one of the outputs to ground will convert  
the output current into a ground-referenced voltage signal.  
To improve on the DC linearity by maintaining a virtual  
ground, an I-to-V or op-amp configuration may be consid-  
ered.  
FIGURE 2. Equivalent Analog Output.  
The signal voltage swing that may develop at the two  
outputs, IOUT and IOUT, is limited by a negative and positive  
compliance. The negative limit of –1V is given by the  
breakdown voltage of the CMOS process, and exceeding it  
will compromise the reliability of the DAC2904, or even  
cause permanent damage. With the full-scale output set to  
20mA, the positive compliance equals 1.25V, operating with  
an analog supply of +VA = 5V. Note that the compliance  
range decreases to about 1V for a selected output current of  
IOUTFS = 2mA. Care should be taken that the configuration  
of DAC2904 does not exceed the compliance range to avoid  
degradation of the distortion performance and integral lin-  
earity.  
DIFFERENTIAL WITH TRANSFORMER  
Using an RF transformer provides a convenient way of convert-  
ing the differential output signal into a single-ended signal  
while achieving excellent dynamic performance (see Figure 3).  
The appropriate transformer should be carefully selected based  
on the output frequency spectrum and impedance requirements.  
The differential transformer configuration has the benefit of  
significantly reducing common-mode signals, thus improving  
the dynamic performance over a wide range of frequencies.  
Furthermore, by selecting a suitable impedance ratio (winding  
ratio), the transformer can be used to provide optimum imped-  
ance matching while controlling the compliance voltage for the  
converter outputs. The model shown, ADTT1-1 (by Mini-  
Circuits), has a 1:1 ratio and may be used to interface the  
DAC2904 to a 50load. This results in a 25load for each of  
the outputs, IOUT and IOUT. The output signals are AC coupled  
and inherently isolated because of its magnetic coupling.  
Best distortion performance is typically achieved with the  
maximum full-scale output signal limited to approximately  
0.5Vp-p. This is the case for a 50doubly terminated load  
and a 20mA full-scale output current. A variety of loads can  
DAC2904  
SBAS198B  
10  
As shown in Figure 3, the transformer’s center tap is con-  
nected to ground. This forces the voltage swing on IOUT and  
IOUT to be centered at 0V. In this case the two resistors, RL,  
may be replaced with one, RDIFF, or omitted altogether. This  
approach should only be used if all components are close to  
each other, and if the VSWR is not important. A complete  
power transfer from the DAC output to the load can be  
realized, but the output compliance range should be ob-  
served. Alternatively, if the center tap is not connected, the  
signal swing will be centered at RL • IOUTFS/2. However, in  
this case, the two resistors, RL, must be used to enable the  
necessary DC-current flow for both outputs.  
The OPA680 is configured for a gain of two. Therefore,  
operating the DAC2904 with a 20mA full-scale output will  
produce a voltage output of ±1V. This requires the amplifier  
to operate off of a dual power supply (±5V). The tolerance  
of the resistors typically sets the limit for the achievable  
common-mode rejection. An improvement can be obtained  
by fine tuning resistor R4.  
This configuration typically delivers a lower level of AC  
performance than the previously discussed transformer solu-  
tion because the amplifier introduces another source of  
distortion. Suitable amplifiers should be selected based on  
their slew-rate, harmonic distortion, and output swing capa-  
bilities. High-speed amplifiers like the OPA680 or OPA687  
may be considered. The AC performance of this circuit may  
be improved by adding a small capacitor, CDIFF, between the  
outputs IOUT and IOUT (see Figure 4). This will introduce a  
real pole to create a low-pass filter in order to slew-limit the  
DAC’s fast output signal steps, which otherwise could drive  
the amplifier into slew-limitations or into an overload con-  
dition; both would cause excessive distortion. The differ-  
ence amplifier can easily be modified to add a level shift for  
applications requiring the single-ended output voltage to be  
unipolar, i.e., swing between 0V and +2V.  
ADTT1-1  
(Mini-Circuits)  
1:1  
IOUT  
RL  
50  
RS  
RDIFF  
DAC2904  
50Ω  
100Ω  
IOUT  
RL  
50Ω  
DUAL TRANSIMPEDANCE OUTPUT CONFIGURATION  
FIGURE 3. Differential Output Configuration Using an RF  
Transformer.  
The circuit example of Figure 5 shows the signal output  
currents connected into the summing junctions of the dual  
voltage-feedback op amp OPA2680 that is set up as a  
transimpedance stage, or ‘I-to-V converter’. With this cir-  
cuit, the DAC’s output will be kept at a virtual ground,  
minimizing the effects of output impedance variations, which  
results in the best DC linearity (INL). As mentioned previ-  
ously, care should be taken not to drive the amplifier into  
slew-rate limitations, and produce unwanted distortion.  
DIFFERENTIAL CONFIGURATION USING AN OP AMP  
If the application requires a DC-coupled output, a difference  
amplifier may be considered, as shown in Figure 4. Four  
external resistors are needed to configure the voltage-feed-  
back op amp OPA680 as a difference amplifier performing  
the differential to single-ended conversion. Under the shown  
configuration, the DAC2904 generates a differential output  
signal of 0.5Vp-p at the load resistors, RL. The resistor  
values shown were selected to result in a symmetric 25Ω  
loading for each of the current outputs since the input  
impedance of the difference amplifier is in parallel to resis-  
tors RL, and should be considered.  
+5V  
50  
1/2  
OPA2680  
–VOUT = IOUT • RF1  
RF1  
CF1  
DAC2904  
R2  
402Ω  
IOUT  
CD1  
R1  
200Ω  
IOUT  
RF2  
CF2  
VOUT  
DAC2904  
OPA680  
IOUT  
CD2  
IOUT  
R3  
200Ω  
COPT  
–5V +5V  
1/2  
OPA2680  
RL  
28.7Ω  
R4  
402Ω  
RL  
26.1Ω  
–VOUT = IOUT • RF2  
50Ω  
–5V  
FIGURE 4. Difference Amplifier Provides Differential to  
Single-Ended Conversion and DC-Coupling.  
FIGURE 5. Dual, Voltage-Feedback Amplifier OPA2680  
Forms Differential Transimpedance Amplifier.  
DAC2904  
SBAS198B  
11  
The DC gain for this circuit is equal to feedback resistor RF.  
At high frequencies, the DAC output impedance (CD1, CD2)  
will produce a zero in the noise gain for the OPA2680 that  
may cause peaking in the closed-loop frequency response.  
CF is added across RF to compensate for this noise gain  
peaking. To achieve a flat transimpedance frequency re-  
sponse, the pole in each feedback network should be set to:  
IOUTFS = 20mA  
VOUT = 0V to +0.5V  
IOUT  
DAC2904  
IOUT  
50  
50Ω  
25Ω  
(8)  
FIGURE 6. Driving a Doubly Terminated 50Cable Directly.  
with GBP = Gain Bandwidth Product of OPA  
Different load resistor values may be selected as long as the  
output compliance range is not exceeded. Additionally, the  
output current, IOUTFS, and the load resistor, may be mutu-  
ally adjusted to provide the desired output signal swing and  
performance.  
which will give a corner frequency f-3dB of approximately:  
(9)  
INTERFACING ANALOG  
QUADRATURE MODULATORS  
The full-scale output voltage is simply defined by the prod-  
uct of IOUTFS • RF, and has a negative unipolar excursion. To  
improve on the ac performance of this circuit, adjustment of  
RF and/or IOUTFS should be considered. Further extensions of  
this application example may include adding a differential  
filter at the OPA2680’s output followed by a transformer, in  
order to convert to a single-ended signal.  
One of the main applications for the dual-channel DAC is  
baseband I- and Q-channel transmission for digital commu-  
nications. In this application, the DAC is followed by an  
analog quadrature modulator, modulating an IF carrier with  
the baseband data, as shown in Figure 7. Often, the input  
stages of these quadrate modulators consist of npn-type  
transistors that require a DC bias (base) voltage of > 0.8V.  
The wide output compliance range (–10V to +1.25V) allows  
for a direct DC–coupling between the DAC2902 and the  
quadrature modulator.  
SINGLE-ENDED CONFIGURATION  
Using a single load resistor connected to one of the DAC  
outputs, a simple current-to-voltage conversion can be ac-  
complished. The circuit in Figure 6 shows a 50resistor  
connected to IOUT, providing the termination of the further  
connected 50cable. Therefore, with a nominal output  
current of 20mA, the DAC produces a total signal swing of  
0V to 0.5V into the 25load.  
Figure 8 shows an example of a DC-coupled interface with  
DC level-shifting, using a precision resistor network. An ac-  
coupled interface, see Figure 9, has the advantage that the  
common-mode levels at the input of the modulator can be set  
independently of those at the output of the DAC. Further-  
more, no voltage loss is obtained in this setup.  
VOUT ~ 0Vp to 1.20Vp  
VIN ~ 0.6Vp to 1.8Vp  
IIN  
IREF  
IIN  
DAC2904  
IOUT  
1
IREF  
I
OUT1  
Signal  
Conditioning  
RF  
QIN  
IOUT  
2
QREF  
I
OUT2  
Quadrature Modulator  
FIGURE 7. Generic Interface to a Quadrature Modulator. Signal Conditioning (Level-Shifting) May Be Required to Ensure  
Correct DC Common-Mode Levels At the Input of the Quadrature Modulator.  
DAC2904  
SBAS198B  
12  
ence current, IREF, which is determined by the ratio of VREF  
and RSET (see Equation 10). The full-scale output current,  
IOUTFS, results from multiplying IREF by a fixed factor of 32.  
VDC  
Using the internal reference, a 2kresistor value results in  
a full-scale output of approximately 20mA. Resistors with a  
tolerance of 1% or better should be considered. Selecting  
higher values, the output current can be adjusted from 20mA  
down to 2mA. Operating the DAC2904 at lower than 20mA  
output currents may be desirable for reasons of reducing the  
total power consumption, improving the distortion perfor-  
mance, or observing the output compliance voltage limita-  
tions for a given load condition.  
R3  
VOUT  
VOUT  
1
1
R4  
IOUT  
1
DAC2904  
IOUT  
1
1
It is recommended to bypass the REFIN pin with a ceramic chip  
capacitor of 0.1µF or more. The control amplifier is internally  
compensated, and its small signal bandwidth is approximately  
0.3MHz.  
IOUT  
1
IOUT  
R5  
+5V  
FIGURE 8. DC-Coupled Interface to Quadrature Modulator  
Applying Level Shifting.  
+VA  
DAC2904  
VREF  
IREF  
=
INTERNAL REFERENCE OPERATION  
RSET  
FSA  
The DAC2904 has an on-chip reference circuit which com-  
prises a 1.25V bandgap reference and two control amplifi-  
Ref  
Current  
Sources  
Control  
Amp  
REFIN  
RSET  
2k  
ers, one for each DAC. The full-scale output current, IOUTFS  
,
of the DAC2904 is determined by the reference voltage,  
VREF, and the value of resistor RSET. IOUTFS can be calcu-  
lated by:  
0.1µF  
+1.25V Ref.  
IOUTFS = 32 • IREF = 32 • VREF / RSET  
(10)  
As shown in Figure 10, the external resistor RSET connects  
to the FSA pin (Full-Scale Adjust). The reference control  
amplifier operates as a V-to-I converter producing a refer-  
FIGURE 10. Internal Reference Configuration.  
VDC  
R1  
IOUT  
1
DAC2904  
0.01µF  
IOUT  
1
VOUT  
VOUT  
1
1
IOUT  
1
0.01µF  
I
OUT1  
50Ω  
50Ω  
RLOAD  
R2  
FIGURE 9. AC-Coupled Interface to Quadrature Modulator Applying Level Shifting.  
DAC2904  
SBAS198B  
13  
GAIN SETTING OPTIONS  
EXTERNAL REFERENCE OPERATION  
The full-scale output current on the DAC2904 can be set two  
ways: either for each of the two DAC channels independently  
or for both channels simultaneously. For the independent gain  
set mode, the GSET pin (pin 42) must be LOW (i.e. connected  
to AGND). In this mode, two external resistors are required—  
one RSET connected to the FSA1 pin (pin 44) and the other to  
the FSA2 pin (pin 41). In this configuration, the user has the  
flexibility to set and adjust the full-scale output current for each  
DAC independently, allowing for the compensation of possible  
gain mismatches elsewhere within the transmit signal path.  
The internal reference can be disabled by simply applying an  
external reference voltage into the REFIN pin, which in this  
case functions as an input, as shown in Figure 8. The use of  
an external reference may be considered for applications that  
require higher accuracy and drift performance, or to add the  
ability of dynamic gain control.  
While a 0.1µF capacitor is recommended to be used with the  
internal reference, it is optional for the external reference  
operation. The reference input, REFIN, has a high input  
impedance (1M) and can easily be driven by various  
sources. Note that the voltage range of the external reference  
should stay within the compliance range of the reference  
input.  
Alternatively, bringing the GSET pin HIGH (i.e. connected to  
+VA), the DAC2904 will switch into the simultaneous gain set  
mode. Now the full-scale output current of both DAC chan-  
nels is determined by only one external RSET resistor con-  
nected to the FSA1 pin. The resistor at the FSA2 pin may be  
removed, however this is not required since this pin is not  
functional in this mode and the resistor has no effect to the  
gain equation. The formula for deriving the correct RSET  
remains unchanged, e.g. RSET = 2ký will result in a 20mA  
output for both DACs.  
POWER-DOWN MODE  
The DAC2904 features a power-down function which can  
be used to reduce the total supply current to less than 6mA  
over the specified supply range of 3.0V to 5.5V. Applying  
a logic HIGH to the PD pin will initiate the power-down  
mode, while a logic LOW enables normal operation. When  
left unconnected, an internal active pull-down circuit will  
enable the normal operation of the converter.  
+5V  
+VA  
DAC2904  
VREF  
IREF  
=
RSET  
FSA  
Ref  
Control  
Amp  
Current  
Sources  
REFIN  
External  
Reference  
RSET  
+1.25V Ref.  
FIGURE 11. External Reference Configuration.  
DAC2904  
SBAS198B  
14  
GROUNDING, DECOUPLING AND  
LAYOUT INFORMATION  
Low noise is required for all supply and ground connections  
to the DAC2904. It is recommended to use a multilayer PCB  
utilizing separate power and ground planes. Mixed signal  
designs require particular attention to the routing of the  
different supply currents and signal traces. Generally, analog  
supply and ground planes should only extend into analog  
signal areas, such as the DAC output signal and the refer-  
ence signal. Digital supply and ground planes must be  
confined to areas covering digital circuitry, including the  
digital input lines connecting to the converter, as well as the  
clock signal. The analog and digital ground planes should be  
joined together at one point underneath the DAC. This can  
be realized with a short track of approximately 1/8 inch  
(3mm).  
Proper grounding and bypassing, short lead length, and the use  
of ground planes are particularly important for high-frequency  
designs. Multilayer PCBs are recommended for best perfor-  
mance since they offer distinct advantages such as minimiza-  
tion of ground impedance, separation of signal layers by  
ground layers, etc.  
The DAC2904 uses separate pins for its analog and digital  
supply and ground connections. The placement of the decou-  
pling capacitor should be such that the analog supply (+VA)  
is bypassed to the analog ground (AGND), and the digital  
supply bypassed to the digital ground (DGND). In most  
cases 0.1µF ceramic chip capacitors at each supply pin are  
adequate to provide a low impedance decoupling path. Keep  
in mind that their effectiveness largely depends on the  
proximity to the individual supply and ground pins. There-  
fore they should be located as close as physically possible to  
those device leads. Whenever possible, the capacitors should  
be located immediately under each pair of supply/ground  
pins on the reverse side of the pc board. This layout ap-  
proach will minimize the parasitic inductance of component  
leads and PCB runs.  
The power to the DAC2904 should be provided through the  
use of wide pcb runs or planes. Wide runs will present a  
lower trace impedance, further optimizing the supply decou-  
pling. The analog and digital supplies for the converter  
should only be connected together at the supply connector of  
the pc board. In the case of only one supply voltage being  
available to power the DAC, ferrite beads along with bypass  
capacitors may be used to create an LC filter. This will  
generate a low-noise analog supply voltage, which can then  
be connected to the +VA supply pin of the DAC2904.  
Further supply decoupling with surface-mount tantalum ca-  
pacitors (1µF to 4.7µF) may be added as needed in proxim-  
ity of the converter.  
While designing the layout, it is important to keep the analog  
signal traces separated from any digital line, in order to  
prevent noise coupling onto the analog signal path.  
DAC2904  
SBAS198B  
15  
PACKAGE DRAWINGS  
DAC2904  
SBAS198B  
16  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Feb-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
TQFP  
TQFP  
Drawing  
DAC2904Y/1K  
DAC2904Y/250  
ACTIVE  
ACTIVE  
PFB  
48  
48  
1000  
250  
None  
None  
Call TI  
Call TI  
Call TI  
Call TI  
PFB  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional  
product content details.  
None: Not yet available Lead (Pb-Free).  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,  
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MTQF019A – JANUARY 1995 – REVISED JANUARY 1998  
PFB (S-PQFP-G48)  
PLASTIC QUAD FLATPACK  
0,27  
0,17  
0,50  
M
0,08  
36  
25  
37  
24  
48  
13  
0,13 NOM  
1
12  
5,50 TYP  
7,20  
SQ  
Gage Plane  
6,80  
9,20  
SQ  
8,80  
0,25  
0,05 MIN  
0°7°  
1,05  
0,95  
0,75  
0,45  
Seating Plane  
0,08  
1,20 MAX  
4073176/B 10/96  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-026  
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