CSPEMI400G [CALMIRCO]
SIM Card EMI Filter Array with ESD Protection; 带ESD保护SIM卡的EMI滤波器阵列
| 型号： | CSPEMI400G |
| 厂家： | 
CALIFORNIA MICRO DEVICES CORP |
| 描述： | SIM Card EMI Filter Array with ESD Protection |
| 文件： | 总8页 (文件大小：477K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CSPEMI400
SIM Card EMI Filter Array with ESD Protection
Product Description
Features
•
Three channels of EMI filtering, each with ESD
CAMD's CSPEMI400 is an EMI filter array with ESD
protection, which integrates three pi filters (C-R-C) and
two additional channels of ESD protection. The
CSPEMI400 has component values of 20pF-47Ω-
20pF, and 20pF-100Ω-20pF. The parts include ava-
lanche-type ESD diodes on every pin, which provide a
very high level of protection for sensitive electronic
components that may be subjected to electrostatic dis-
charge (ESD). The ESD diodes connected to the filter
ports safely dissipate ESD strikes of ±10kV, exceeding
the maximum requirement of the IEC 61000-4-2 inter-
national standard. Using the MIL-STD-883 (Method
3015) specification for Human Body Model (HBM)
ESD, the pins are protected for contact discharges at
greater than ±25kV.
protection
•
•
Two additional channels of ESD-only protection
±10kV ESD protection (IEC 61000-4-2, contact
discharge)
±25kV ESD protection (HBM)
Greater than 30dB of attenuation at 1GHz
10-bump, 1.960mm x 1.330mm footprint Chip
Scale Package (CSP)
•
•
•
•
Lead-free version available
Applications
•
•
SIM Card slot in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs, etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers
The ESD diodes on pins A4 and C4 ports are designed
and characterized to safely dissipate ESD strikes of
±10kV, well beyond the maximum requirement of the
IEC 61000-4-2 international standard.
•
This device is particularly well suited for portable elec-
tronics (e.g. mobile handsets, PDAs, notebook com-
puters) because of its small package format and easy-
to-use pin assignments. In particular, the CSPEMI400
is ideal for EMI filtering and protecting data lines from
ESD for the SIM card slot in mobile handsets.
The CSPEMI400 is available in a space-saving, low-
profile Chip Scale Package with optional lead-free fin-
ishing.
Electrical Schematic
R1
R2
A1
C1
A2
A4
C2
C4
C
C
C
C
C
C
C
GND
C3
R1
A3
C
R =100
Ω
1
R =47
Ω
2
B2,B4
© 2005 California Micro Devices Corp. All rights reserved.
09/28/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
1
CSPEMI400
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
1
2
3
4
Orientation
Marking
A
B
C
A4
C4
A3
C3
A2
C2
A1
C1
A 1
B2
B1
AG
CSPEMI400
CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
TYPE
PIN
A1
C1
A2
C2
B1
B2
A3
C3
A4
DESCRIPTION
EMI Filter with ESD Protection for RST Signal
EMI Filter with ESD Protection for RST Signal
EMI Filter with ESD Protection for CLK Signal
EMI Filter with ESD Protection for CLK Signal
Device Ground
EMI
Filter
EMI
Filter
Device
Ground
Device Ground
DAT EMI Filter with ESD Protection
DAT EMI Filter with ESD Protection
ESD Proection Channel - VCC Supply
EMI
Filter
ESD Channel
ESD Channel
C4
ESD Proection Channel
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish2
Ordering Part
Number1
Ordering Part
Number1
Bumps
Package
Part Marking
Part Marking
10
CSP
CSPEMI400
AG
CSPEMI400G
AG
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 09/28/05
CSPEMI400
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
-65 to +150
100
UNITS
°C
Storage Temperature Range
DC Power per Resistor
DC Package Power Rating
mW
mW
300
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
1
ELECTRICAL OPERATING CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R1
Resistance of R1
80
100
47
120
Ω
R2
C
Resistance of R2
Capacitance
38
16
56
24
Ω
VIN = 2.5VDC, 1MHz,
30mV ac
20
pF
VSTANDOFF Stand-off Voltage
ILEAK Diode Leakage Current
VSIG Signal Voltage
Positive Clamp
I = 10μA
6.0
V
VBIAS = 3.3V
300
nA
I
LOAD = 10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
ILOAD = -10mA
Negative Clamp
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
Notes 2,4 and 5
25
10
kV
kV
b) Contact Discharge per IEC
61000-4-2
VCL
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Notes 2,3,4 and 5
+12
-7
V
V
Negative Transients
fC1
fC2
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
R = 100Ω, C = 20pF
R = 47Ω, C = 20pF
77
85
MHz
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: The parameters are guaranteed by design.
© 2005 California Micro Devices Corp. All rights reserved.
09/28/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
3
CSPEMI400
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. A1-C1 EMI Filter Performance
Figure 2. A2-C2 EMI Filter Performance
© 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 09/28/05
CSPEMI400
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. A3-C3 EMI Filter Performance
Figure 4. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5VDC)
© 2005 California Micro Devices Corp. All rights reserved.
09/28/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
5
CSPEMI400
Application Information
The CSPEMI400 provides a bidirectional filter and protec-
tor for all the signals and the power line on the SIM (sub-
scriber identity module) card connector. SIM cards are
found in all GSM cellular phones and in some other hand-
held devices or card readers. The ESD diodes protect the
controller against possible ESD strikes that may occur
when the connector pins are exposed during direct con-
tact, or during insertion of the SIM card into the card slot.
The EMI filter suppresses all high-frequency noise, pre-
venting the unwanted EMI signals from both entering and
exiting the main board. The signals that interface with the
SIM card are the Reset, the Clock and the bidirectional
data I/O, as shown in Figure 5.
CSPEMI400
SIM Card Connector
100ohm
RST
Reset
47ohm
CLK
Clock
Controller
with logic
level
100ohm
translator
I/O
Data I/O
VCC
VCC
supply
(5V,
3.3V or
1.8V)
5V/3V/1.8V
1uF
GND
GND
Note: One channel of the CSPEMI400 with a zener
diode is not shown on the diagram.
Figure 5. Typical Application Diagram for the SIM Card Interface
For best filter and ESD performance, both GND bumps
(B1, B2) of the CSPEMI400 should be directly con-
nected to the Ground plane. A small capacitor of about
For information on the assembly of the CSPEMI400 to
the PCB (printed circuit board), please refer to the Chip
Scale Package (CSP) Application Note AP217, or con-
tact factory at 800-325-4966 for technical support.
1μF is required next to the V pin of the SIM connec-
CC
tor in order to improve stability of the SIM card supply
rail.
© 2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 09/28/05
CSPEMI400
Application Information (cont’d)
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
0.275mm Round
Non-Solder Mask defined pads
0.325mm Round
0.125 - 0.150mm
0.330mm Round
50/50 by volume
No Clean
Pad Size on PCB
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
OSP (Entek Cu Plus 106A)
+50μm
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Eutectic Devices using Eutectic Solder Paste
Maximum Soldering Temperature for Lead-free Devices using Lead-free Solder Paste
60 seconds
240°C
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 6. Recommended Non-Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 7. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 8. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
09/28/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
7
CSPEMI400
CSP Mechanical Specifications
Mechanical Package Diagrams
The CSPEMI400 is supplied in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CSP, see the California Micro
Devices CSP Package Information document.
BOTTOM VIEW
A1
SIDE
VIEW
C1
B2
B1
PACKAGE DIMENSIONS
C
B
A
Package
Bumps
Custom CSP
10
Millimeters
Nom Max
Inches
Nom
Dim
Min
Min
Max
1
2
3
4
D1
D2
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
1.915 1.960 2.005 0.0754 0.0772 0.0789
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.091 0.0110
0.562 0.606 0.650 0.0221 0.0239 0.0256
0.356 0.381 0.406 0.0140 0.0150 0.0160
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for CSPEMI400
Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm)
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
B0 X A0 X K0
P0
P1
PART NUMBER
CHIP SIZE (mm)
CSPEMI400
1.96 X 1.33 X 0.606
2.08 X 1.45 X 0.71
8mm
178mm (7")
3500
4mm 4mm
10 Pitches cumulative
tolerance on tape
0.2 mm
Po
±
Top
Cover
Tape
Ao
W
Bo
Ko
For tape feeder reference
Embossment
only including draft.
P1
Center lines
of cavity
Concentric around B.
User direction of feed
Figure 9. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 09/28/05
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