CSPEMI607 [CALMIRCO]
4-Channel LCD EMI Filter Array with ESD Protection plus 4-Channel of ESD Protection Array; 带ESD保护的ESD保护阵列以及4通道4通道LCD EMI滤波器阵列
| 型号： | CSPEMI607 |
| 厂家： | 
CALIFORNIA MICRO DEVICES CORP |
| 描述： | 4-Channel LCD EMI Filter Array with ESD Protection plus 4-Channel of ESD Protection Array |
| 文件： | 总5页 (文件大小：199K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRELIMINARY
California Micro Devices
430 N.McCarthy Blvd
Milpitas, CA 95035
CSPEMI607
4-Channel LCD EMI Filter Array with ESD Protection plus
4-Channel of ESD Protection Array
Features
Applications
•
•
•
Four channels of EMI filtering
Four channels of ESD Protection
±15kV ESD protection
•
•
LCD data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
•
EMI filtering for data ports in cell phones, PDAs or
notebook computers.
(IEC 61000-4-2, contact discharge)
±30kV ESD protection (HBM)
•
•
Better than 30dB of attenuation at 1GHz for 15pF-
100Ω-15pF filter configuration
•
Chip scale packaging features extremely low lead
inductance for optimum filter and ESD
performance
General Description
CAMD’s CSPEMI607 is an EMI filter array with ESD protection, which integrates four Pi- filters (C-R-
C) and 4 channels of ESD protection. The CSPEMI607 has component values of 15pF-100Ω-15pF
). The parts include avalanche-type ESD diodes on every pin, which provide a very high level of
protection for sensitive electronic components that may be subjected to electrostatic discharge
(ESD). The ESD diodes connected to the filter ports and the standalone ESD diode channels are
designed and characterized to safely dissipate ESD strikes of ±15kV, beyond the maximum
requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at
greater than ±30kV.
This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook
computers) because of its small package format and easy-to-use pin assignments. In particular, the
CSPEMI607 is ideal for EMI filtering and protecting data lines from ESD for the LCD display in
mobile handsets.
The CSPEMI607 is available in a space-saving, low-profile, chip-scale package, and is fabricated
with one of California Micro Devices’ semiconductor processes.
Package Diagram
11/18/03 Tel: (408) 263-3214 • Fax: (408) 263-7846 • Website: www.calmicro.com
1
PRELIMINARY
California Micro Devices
430 N.McCarthy Blvd
Milpitas, CA 95035
Figure 1. Dimensions of CSPEMI607.
Schematic Diagram
Pin Number Pin Description
Pin Number
Pin Description
GND
ESD Channel #3
Filter #1
A1
A2
A3
A4
A5
A6
B1
B2
ESD Channel #1
B3
C1
C2
C3
C4
C5
C6
Filter #1
Filter #2
Filter #3
Filter #4
Filter #2
Filter #3
Filter #4
ESD Channel #2
GND
ESD Channel #4
GND
Specifications: (At 25°C unless specified otherwise)
Resistance R1
Min.
80
Typ.
100
Max. Unit
120
18
Ω
pF
V
Capacitance C1 at 2.5V dc; 1MHz, 30mV ac
Stand-off Voltage, I = 10µA
12
5.5
15
Diode Leakage at +/-3.3V reverse bias voltage
100
nA
Signal Clamp Voltage:
Positive Clamp, 10mA
Negative Clamp, -10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
In-system ESD withstand voltage*:
Human Body Model (MIL-STD-883, method 3015)
IEC 61000-4-2, contact discharge method
kV
kV
±30
±15
Clamping voltage during ESD discharge*
MIL-STD-883 (Method 3015), 8kV
Temperature Range:
Operating
Positive
Negative
12
-7
V
V
-40
-65
85
150
°C
Storage
DC Power per Resistor:
DC Package Power Rating:
0.1
0.5
W
W
* ESD applied to input / output pins with respect to GND, one at a time. Clamping voltage is
measured at the opposite side of the EMI filter to the ESD pin (i.e. if ESD is applied to pin A1
then clamping voltage is measured at pin C1). Unused pins are left open. These parameters
are guaranteed by design.
11/18/03 Tel: (408) 263-3214 • Fax: (408) 263-7846 • Website: www.calmicro.com
2
PRELIMINARY
California Micro Devices
430 N.McCarthy Blvd
Milpitas, CA 95035
Typical EMI filter performance (2.5V d.c., 50Ω environment)
Cut-off Frequency
R1
C1
20dB Attenuation
Over 25dB Range
(MHz)
(MHz)
(pF)
(MHz)
(Ω)
118
100
15
533
738 - 3000
All parameters in the table are typical values.
Typical diode capacitance vs. input voltage (normalized to 2.5V d.c.)
11/18/03 Tel: (408) 263-3214 • Fax: (408) 263-7846 • Website: www.calmicro.com
3
PRELIMINARY
California Micro Devices
430 N.McCarthy Blvd
Milpitas, CA 95035
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Pad size in PCB
0.275mm
Pad Shape
Round
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
Solder Flux Ratio
Non Solder Mask Defined Pads
0.325mm Round
0.125mm - 0.150mm
0.330mm (round)
50/50 by volume
No Clean
Solder Paste Type
Bond Trace Finish
Tolerance – Edge to Corner Ball
OSP (Entek Cu Plus 106A)
±50µm
Solder Ball Side Coplanarity
±20µm
Soldering Minimum Temperature
Maximum Dwell Time above Liquidous (183°C)
Soldering Maximum Temperature
205’C for at least 30 seconds
60 seconds
240’C for at less than 2 minutes
Solder Reflow Profile
11/18/03 Tel: (408) 263-3214 • Fax: (408) 263-7846 • Website: www.calmicro.com
4
PRELIMINARY
California Micro Devices
430 N.McCarthy Blvd
Milpitas, CA 95035
Tape & Reel Information
CMD PART # CHIP SIZE
POCKET SIZE
(mm)
TAPE
WIDTH
W
REEL
DIAMETER
QTY PER
REEL
(mm)
P0
P1
Bo x Ao x Ko
CSPEMI607
2.96 x 1.33 x 0.6
TBD
8mm
178mm (7”)
3500
4mm
4mm
11/18/03 Tel: (408) 263-3214 • Fax: (408) 263-7846 • Website: www.calmicro.com
5
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