CY7C1046B [CYPRESS]

1M x 4 Static RAM; 1M ×4静态RAM
CY7C1046B
型号: CY7C1046B
厂家: CYPRESS    CYPRESS
描述:

1M x 4 Static RAM
1M ×4静态RAM

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中文:  中文翻译
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046B  
CY7C1046B  
1M x 4 Static RAM  
sion is provided by an active LOW Chip Enable (CE), an active  
LOW Output Enable (OE), and three-state drivers. Writing to  
the device is accomplished by taking Chip Enable (CE) and  
Write Enable (WE) inputs LOW. Data on the four I/O pins (I/O0  
through I/O3) is then written into the location specified on the  
address pins (A0 through A19).  
Features  
• High speed  
— tAA = 12 ns  
• Low active power  
— 935 mW (max.)  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing Write  
Enable (WE) HIGH. Under these conditions, the contents of  
the memory location specified by the address pins will appear  
on the I/O pins.  
• Low CMOS standby power (L version)  
— 2.75 mW (max.)  
2.0V Data Retention (400 µW at 2.0V retention)  
Automatic power-down when deselected  
TTL-compatible inputs and outputs  
Easy memory expansion with CE and OE features  
The four input/output pins (I/O0 through I/O3) are placed in a  
high-impedance state when the device is deselected (CE  
HIGH), the outputs are disabled (OE HIGH), or during a write  
operation (CE LOW, and WE LOW).  
Functional Description  
The CY7C1046B is available in a standard 400-mil-wide  
32-pin SOJ package with center power and ground (revolu-  
tionary) pinout.  
The CY7C1046B is a high-performance CMOS static RAM or-  
ganized as 1,048,576 words by 4 bits. Easy memory expan-  
Logic Block Diagram  
Pin Configuration  
SOJ  
Top View  
A0  
A1  
32  
31  
30  
29  
28  
1
2
3
4
5
A19  
A18  
A17  
A16  
A15  
A2  
A3  
A4  
CE  
I/O0  
VCC  
27  
26  
25  
6
7
8
9
10  
11  
OE  
I/O3  
GND  
VCC  
I/O2  
A14  
A13  
A12  
A11  
A10  
NC  
INPUT BUFFER  
A
0
24  
23  
GND  
I/O1  
WE  
A
1
A
2
22  
21  
20  
19  
18  
17  
I/O  
0
A
A5  
A6  
A7  
A8  
A9  
3
4
12  
13  
14  
15  
16  
A
A
I/O  
I/O  
I/O  
5
6
1
2
3
1M x 4  
A
ARRAY  
A
7
A
8
A
9
A
10  
1046B2  
POWER  
DOWN  
COLUMN  
DECODER  
CE  
WE  
1046B1  
OE  
Selection Guide  
7C1046B-12  
7C1046B-15  
7C1046B-20  
Maximum Access Time (ns)  
12  
170  
8
15  
150  
8
20  
130  
8
Maximum Operating Current (mA)  
Maximum CMOS Standby  
Current (mA)  
Coml  
L version  
0.5  
0.5  
0.5  
Shaded areas contain advance information.  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05144 Rev. **  
Revised September 6, 2001  
CY7C1046B  
Current into Outputs (LOW) ........................................ 20 mA  
Maximum Ratings  
Static Discharge Voltage ........................................... >2001V  
(per MIL-STD-883, Method 3015)  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Latch-Up Current..................................................... >200 mA  
Storage Temperature .................................65°C to +150°C  
Ambient Temperature with  
Power Applied.............................................55°C to +125°C  
Operating Range  
Ambient  
Supply Voltage on VCC to Relative GND[1] .... 0.5V to +7.0V  
Range  
Temperature[2]  
VCC  
DC Voltage Applied to Outputs  
Commercial  
0°C to +70°C  
4.5V5.5V  
in High Z State[1]....................................0.5V to VCC + 0.5V  
DC Input Voltage[1] ................................0.5V to VCC + 0.5V  
Electrical Characteristics Over the Operating Range  
Parameter  
Description  
Test Conditions  
7C1046B-12 7C1046B-15 7C1046B-20  
Min. Max. Min. Max. Min. Max. Unit  
VOH  
VOL  
VIH  
Output HIGH Voltage  
Output LOW Voltage  
Input HIGH Voltage  
VCC = Min., IOH = 4.0 mA  
2.4  
2.2  
2.4  
2.4  
V
V
V
VCC = Min., IOL = 8.0 mA  
0.4  
0.4  
0.4  
VCC  
+ 0.3  
2.2  
VCC  
+ 0.3  
2.2  
VCC  
+ 0.3  
VIL  
IIX  
Input LOW Voltage[1]  
Input Load Current  
0.3  
1  
0.8  
+1  
+1  
0.3  
1  
0.8  
+1  
+1  
0.3  
1  
0.8  
+1  
+1  
V
GND < VI < VCC  
µA  
µA  
IOZ  
Output Leakage  
Current  
GND < VOUT < VCC  
Output Disabled  
,
1  
1  
1  
ICC  
VCC Operating  
Supply Current  
VCC = Max.,  
f = fMAX = 1/tRC  
170  
20  
150  
20  
130  
20  
mA  
mA  
ISB1  
Automatic CE  
Power-Down Current  
TTL Inputs  
Max. VCC, CE > VIH  
VIN > VIH or  
VIN < VIL, f = fMAX  
ISB2  
Automatic CE  
Power-Down Current  
CMOS Inputs  
Max. VCC  
,
Coml  
8
8
8
mA  
CE > VCC 0.3V,  
VIN > VCC 0.3V,  
or VIN < 0.3V, f = 0  
L version  
0.5  
0.5  
0.5  
Shaded areas contain advance information.  
Capacitance[3]  
Parameter  
Description  
Test Conditions  
TA = 25°C, f = 1 MHz,  
VCC = 5.0V  
Max.  
Unit  
pF  
CIN  
Input Capacitance  
I/O Capacitance  
6
6
COUT  
pF  
Note:  
1. VIL (min.) = 2.0V for pulse durations of less than 20 ns.  
2. A is the Instant Oncase temperature.  
T
3. Tested initially and after any design or process changes that may affect these parameters.  
Document #: 38-05144 Rev. **  
Page 2 of 8  
CY7C1046B  
AC Test Loads and Waveforms  
ALL INPUT PULSES  
90%  
10%  
R1 481Ω  
R1 481  
Vcc  
5V  
5V  
OUTPUT  
90%V  
CC  
10%V  
OUTPUT  
CC  
GND  
R2  
R2  
255 Ω  
30 pF  
5 pF  
255 Ω  
Rise Time:1 V/ns  
Fall Time:1 V/ns  
INCLUDING  
JIG AND  
SCOPE  
INCLUDING  
JIG AND  
SCOPE  
1046B4  
(b)  
1046B3  
(a)  
THÉ  
Equivalent to:  
VENIN EQUIVALENT  
167Ω  
1.73V  
OUTPUT  
Switching Characteristics[4] Over the Operating Range  
7C1046B-12  
7C1046B-15  
7C1046B-20  
Parameter  
Description  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
READ CYCLE  
tpower  
tRC  
VCC(typical) to the first access[5]  
1
1
1
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Read Cycle Time  
12  
15  
20  
tAA  
Address to Data Valid  
Data Hold from Address Change  
CE LOW to Data Valid  
OE LOW to Data Valid  
OE LOW to Low Z[7]  
OE HIGH to High Z[6, 7]  
CE LOW to Low Z[7]  
CE HIGH to High Z[6, 7]  
CE LOW to Power-Up  
CE HIGH to Power-Down  
12  
15  
20  
tOHA  
tACE  
tDOE  
tLZOE  
tHZOE  
tLZCE  
tHZCE  
tPU  
3
3
3
12  
6
15  
7
20  
8
0
3
0
0
3
0
0
3
0
6
6
7
7
8
8
tPD  
12  
15  
20  
WRITE CYCLE[8, 9]  
tWC  
tSCE  
tAW  
tHA  
Write Cycle Time  
12  
8
15  
10  
10  
0
20  
15  
15  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CE LOW to Write End  
Address Set-Up to Write End  
Address Hold from Write End  
Address Set-Up to Write Start  
WE Pulse Width  
8
0
tSA  
0
0
0
tPWE  
tSD  
8
10  
8
12  
10  
0
Data Set-Up to Write End  
Data Hold from Write End  
WE HIGH to Low Z[7]  
6
tHD  
0
0
tLZWE  
3
3
3
tHZWE  
WE LOW to High Z[6, 7]  
6
7
8
Notes:  
4. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified  
IOL/IOH and 30-pF load capacitance.  
5. This part has a voltage regulator which steps down the voltage from 5V to 3.3V internally. tpower time has to be provided initially before a read/write operation  
is started.  
6.  
tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage.  
7. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.  
8. The internal write time of the memory is defined by the overlap of CE LOW, and WE LOW. CE and WE must be LOW to initiate a write, and the transition of either of  
these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write.  
9. The minimum write cycle time for Write Cycle no. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD  
.
Document #: 38-05144 Rev. **  
Page 3 of 8  
CY7C1046B  
Data Retention Characteristics Over the Operating Range  
Parameter  
VDR  
Description  
VCC for Data Retention  
Conditions[10]  
Min.  
Max Unit  
2.0  
V
ICCDR  
Data Retention Current  
Coml  
VCC = VDR = 2.0V,  
CE > VCC 0.3V  
VIN > VCC 0.3V or VIN < 0.3V  
200  
µA  
ns  
µs  
[3]  
tCDR  
Chip Deselect to Data Retention Time  
Operation Recovery Time  
0
tR  
200  
Data Retention Waveform  
DATA RETENTION MODE  
> 2V  
3.0V  
3.0V  
V
V
DR  
CC  
t
t
R
CDR  
CE  
1046B5  
Switching Waveforms  
Read Cycle No. 1[11, 12]  
t
RC  
ADDRESS  
t
AA  
t
OHA  
DATA OUT  
PREVIOUS DATA VALID  
DATA VALID  
1046B6  
Read Cycle No. 2 (OE Controlled)[12, 13]  
ADDRESS  
CE  
t
RC  
t
ACE  
OE  
t
HZOE  
t
DOE  
t
HZCE  
t
LZOE  
HIGH  
IMPEDANCE  
HIGH IMPEDANCE  
DATA OUT  
DATA VALID  
t
LZCE  
t
PD  
I
t
PU  
CC  
V
CC  
50%  
50%  
SUPPLY  
CURRENT  
I
SB  
1046B7  
Notes:  
10. No input may exceed VCC + 0.5V.  
11. Device is continuously selected. OE, CE = VIL.  
12. WE is HIGH for read cycle.  
13. Address valid prior to or coincident with CE transition LOW.  
Document #: 38-05144 Rev. **  
Page 4 of 8  
CY7C1046B  
Switching Waveforms (continued)  
Write Cycle No. 1 (CE Controlled)[14, 15]  
t
WC  
ADDRESS  
CE  
t
SCE  
t
SA  
t
SCE  
t
t
HA  
AW  
t
PWE  
WE  
t
t
HD  
SD  
DATA I/O  
DATA VALID  
1046B8  
Write Cycle No. 2 (WE Controlled, OE HIGH During Write)[14, 15]  
t
WC  
ADDRESS  
CE  
t
SCE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
OE  
t
t
SD  
HD  
DATA VALID  
DATA I/O  
IN  
NOTE 16  
t
HZOE  
1046B9  
Notes:  
14. Data I/O is high impedance if OE = VIH  
.
15. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.  
16. During this period the I/Os are in the output state and input signals should not be applied.  
Document #: 38-05144 Rev. **  
Page 5 of 8  
CY7C1046B  
Switching Waveforms (continued)  
Write Cycle No. 3 (WE Controlled, OE LOW)[15]  
t
WC  
ADDRESS  
CE  
t
SCE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
t
t
HD  
SD  
NOTE 16  
DATA I/O  
DATA VALID  
t
t
LZWE  
HZWE  
1046B10  
Ordering Information  
Speed  
Package  
Name  
Operating  
Range  
(ns)  
12  
15  
20  
12  
15  
20  
Ordering Code  
CY7C1046B-12VC  
CY7C1046B-15VC  
CY7C1046B-20VC  
CY7C1046BL-12VC  
CY7C1046BL-15VC  
CY7C1046BL-20VC  
Package Type  
V33  
V33  
V33  
V33  
V33  
V33  
32-Lead (400-Mil) Molded SOJ  
32-Lead (400-Mil) Molded SOJ  
32-Lead (400-Mil) Molded SOJ  
32-Lead (400-Mil) Molded SOJ  
32-Lead (400-Mil) Molded SOJ  
32-Lead (400-Mil) Molded SOJ  
Commercial  
Shaded areas contain advance information.  
Document #: 38-05144 Rev. **  
Page 6 of 8  
CY7C1046B  
Package Diagram  
32-Lead (400-Mil) Molded SOJ V33  
51-85033-A  
Document #: 38-05144 Rev. **  
Page 7 of 8  
© Cypress Semiconductor Corporation, 2001. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize  
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.  
CY7C1046B  
Document Title: CY7C1046B 1M x 4 Static RAM  
Document Number: 38-05144  
Issue  
ECN NO. Date  
Orig. of  
Change  
REV.  
Description of Change  
**  
109888  
09/22/01  
SZV  
Change from Spec number: 38-00948 to 38-05144  
Document #: 38-05144 Rev. **  
Page 8 of 8  

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