MB39C326PW [CYPRESS]
Switching Regulator, Voltage-mode, 0.8A, 6400kHz Switching Freq-Max, PBGA20,;
| 型号： | MB39C326PW |
| 厂家： | 
CYPRESS |
| 描述： | Switching Regulator, Voltage-mode, 0.8A, 6400kHz Switching Freq-Max, PBGA20, 开关 |
| 文件： | 总25页 (文件大小：2003K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MB39C326
6MHz Synchronous Rectification
Buck-Boost DC/DC Converter IC
The MB39C326 is a high efficiency, low noise synchronous, Buck-boost DC/DC converter designed for powering
the radio frequency power amplifiers (RFPA) in 3G/GSM mobile handsets and other mobile applications.
Features
High efficiency
: Up to 93%
Input voltage range
: 2.5V to 5.5V
: 0.8V to 5.0V
Adjustable output voltage range
Maximum output current
(Buck, PWM mode)
: 1200 mA (VIN = 5.0V to 5.5V, at Vo=5.0V)
: 1200 mA (VIN = 3.6V to 5.5V, at Vo=3.6V)
: 1200 mA (VIN = 3.3V to 5.5V, at Vo=3.3V)
: 900 mA (VIN = 3.7V to 5.0V, at Vo=5.0V)
: 700 mA (VIN = 2.5V to 3.6V, at Vo=3.6V)
: 800 mA (VIN = 2.5V to 3.3V, at Vo=3.3V)
: 600 mA (VIN = 5.0V to 5.5V, at Vo=5.0V)
: 600 mA (VIN = 3.6V to 5.5V, at Vo=3.6V)
: 600 mA (VIN = 3.3V to 5.5V, at Vo=3.3V)
: 500 mA (VIN = 3.7V to 5.0V, at Vo=5.0V)
: 400 mA (VIN = 2.5V to 3.6V, at Vo=3.6V)
: 500 mA (VIN = 2.5V to 3.3V, at Vo=3.3V)
(Boost, PWM mode)
(Buck, Power save mode,
ILIMSEL=H)
(Boost, Power save mode,
ILIMSEL=H)
Quiescent current : 50 µA
6 MHz PWM operation allows 0.5 µH small form inductor
Automatic Transition between Buck mode and boost mode
Power save Mode for improved efficiency at light load current
Selectable output voltage with external resistor
Built-in Over temperature protection circuit
Built-in Under voltage lockout protection circuit
Package: WL-CSP (20pin 0.4 mm-ball-pitch 2.15 × 1.94 mm)
Note: This product supports the web-based design simulation tool, Easy DesignSim. It can easily select external
components and can display useful information. Please access from http://cypress.transim.com/login.aspx
Applications
Products that use 1-cell lithium batteries for the power supply
RF power amplifier
Cell-phone
RF-PC card and PDA
Cypress Semiconductor Corporation
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Document Number: 002-08348 *A
Revised February 10, 2016
MB39C326
Contents
1. Pin Assignments.....................................................................................................................................3
2. Pin Descriptions .....................................................................................................................................3
3. Block Diagram.........................................................................................................................................4
4. Function...................................................................................................................................................4
5. Absolute Maximum Ratings...................................................................................................................6
6. Recommended Operating Conditions...................................................................................................6
7. Electrical Characteristics.......................................................................................................................8
8. Typical Applications Circuit (RF Power Amplifier)...............................................................................8
9. Application Notes ...................................................................................................................................9
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
Inductor Selection.............................................................................................................................11
Input Capacitor Selection.................................................................................................................11
Output Capacitor Selection..............................................................................................................11
Thermal Information .........................................................................................................................11
Notes on Board Layout ....................................................................................................................12
Example of Standard Operation Characteristics............................................................................13
Usage Precaution .............................................................................................................................16
Notes on Mounting ...........................................................................................................................16
Ordering Information........................................................................................................................17
EV Board Ordering Information.......................................................................................................17
RoHS Compliance Information of Lead (Pb) Free Version............................................................18
Marking..............................................................................................................................................18
Labeling Sample ...............................................................................................................................19
MB39C326PW Recommended Conditions of Moisture Sensitivity Level ....................................22
Package Dimensions........................................................................................................................23
Major Changes..................................................................................................................................24
Document History.........................................................................................................................................24
Document Number: 002-08348 *A
Page 2 of 25
MB39C326
1. Pin Assignments
TOP VIEW
4
3
2
1
EN
ILIMSEL VSEL VSELSW GND
VCC
XPS
GND
GND
FB
VDD SWOUT DGND SWIN
VOUT
VDD SWOUT DGND
SWIN
D
VOUT
E
A
B
C
2. Pin Descriptions
Pin No.
Pin Name
I/O
Description
A4
E3
EN
FB
I
IC Enable input pin (H: Enable, L: Shutdown)
Voltage feedback pin
I
C3, D3, E4
B4
GND
Control / Logic ground pins
ILIMSEL
SWOUT
SWIN
DGND
VSEL
I
I
I
Inductor peak current limit pin
B1, B2
D1, D2
C1, C2
C4
Connection pins for Inductor
Connection pins for Inductor
Power ground pins
I
Output voltage select pin (H: Using R3 L: No using R3)
Connection pin for output voltage setting resistor R3
D4
VSELSW
VDD
A1, A2
A3
I
Electric power input pin for DCDC converter output voltage
Electric power input pin for IC control block
VCC
I
B3
XPS
I
Power save mode pin (H: PWM mode, L: Power save mode)
Buck-boost converter output pins
E1, E2
VOUT
O
Document Number: 002-08348 *A
Page 3 of 25
MB39C326
3. Block Diagram
L1
SWOUT
SW1
SWIN
SW5
VDD
VOUT
CIN
COU
SW4
Current
Sensor
SW2
SW3
Vbatt
DGND
AGND
FB
VCC
EN
Gate Controller
Err
Amp
BGR
UVLO
Device
Control
R1
R2
ILIMSEL
XPS
R3
VSELSW
Over Temp
Protection
Oscillator
VSEL
4. Function
(1) Gate Controller
It is controlled the synchronous rectification operation of built-in 2-P-ch MOS FETs and 2-N-ch MOS FETs
according to frequency (6 MHz) set with a oscillator at the normal operation.
(2) Error Amp & phase compensation circuit
This compares the feedback voltage and the reference voltage (VREF). This IC contains the phase compensation
circuit which optimizes the IC operation. Therefore, it is unnecessary to consideration of the phase compensation
circuit, and external parts for the phase compensation.
(3) Band gap reference circuit
A high accuracy reference voltage is generated with BGR (band gap reference) circuit.
(4) Oscillator
The internal oscillator output a 6 MHz clock signal to set a switching frequency.
(5) Over temperature protection circuit
The over temperature protection circuit is built-in as a protection circuit. When junction temperature reaches
+125°C, the over temperature protection circuit turns off all N-ch MOS FETs and P-ch MOS FETs. Also, when the
junction temperature falls to +110°C, this IC operates normally.
(6) Inductor peak current limit circuit (Current Sensor + Device Control)
The inductor peak current limit circuit detects the current (ILX) which flows from built-in P-ch MOS FET connected
to VDD into an external inductor and limits the inductor peak current (IPK).
(7) Power save mode operation
Power save mode is used to improve efficiency at the light load. By setting the XPS pin to "L" level, power save
mode is set and the operation is performed in PWM mode or PFM mode depending on the load current. At this
time, if the load current is low, this IC operates with PFM (PulseFrequency Modulation). It should be used above
VOUT = 0.8V. If the output voltage becomes lower than the setting value at the light load, switching is performed
several times and the output voltage rises. If the output voltage reaches the setting value, it changes to the stop
state, all of the four FETs are turned off, and the switching loss and the dissipation power for the circuit are
suppressed.
Consumption current in stop state at the power save mode becomes about 50μA.
Document Number: 002-08348 *A
Page 4 of 25
MB39C326
Function Table
Input Voltage
Range[V]
Inductor peak Current
Output Voltage Range[V]
Min Max
Mode
XPS
ILIMSEL
Limit (IPK
)
[A]
Min
Max
PWM mode
H
L
L
3.1
H
L
2.5
5.5
0.8
5.0
1.3
Power save mode
0.49
Note: Input of (XPS, ILIMSEL = H, H) is prohibited.
(8) EN pin
When the EN pin is set to "H" level, the device operation is enabled. When the EN pin is set to GND, the device is
switched to shutdown mode.
When the EN pin is set to "L" level, the device is switched to shutdown mode.
In shutdown mode, the regulator stops switching, all FET switches are turned off, and the load is disconnected
from the input.
(9) VSEL pin
MB39C326 has a function to change the output voltage with the VSEL pin and additional resistance.
For details of the output voltage settings, see the section 2. of "Programming the Output Voltage" in
9. Application .
(10) Buck-Boost operations
MB39C326 operates in Buck or Boost mode by monitoring the VCC/VOUT voltage with a newly developed PWM
controller.
The transition between buck and boost mode is smooth and the efficiency is high.
During Buck mode (VCC > VOUT), SW1 and SW2 perform switching while SW3 is fixed to OFF and SW4 and 5
are fixed to ON.
During Boost mode (VCC < VOUT), SW3, SW4 and SW5 perform switching while SW1 is fixed to ON and SW2 is
fixed to OFF.
The voltage values of VCC and VDD at the switching between buck and boost vary depending on the load
current, the environmental temperature and the process variations.
(11) Startup circuit
MB39C326 has the soft-start function to prevent rush current upon turning on of the power.
The startup time is approximately 100μ seconds.
Document Number: 002-08348 *A
Page 5 of 25
MB39C326
5. Absolute Maximum Ratings
Rating
Max
Parameter
Symbol
Condition
Unit
Min
-0.3
-0.3
-
Power supply voltage
Signal input voltage
Power dissipation
VMAX
VINMAX
PD
VDD, VCC
+7.0
V
EN, XPS, VSEL, ILIMSEL
VDD + 0.3
1080
V
Ta ≤ +25°C
mW
°C
Storage temperature
TSTG
-
-65
+150
Human Body Model
(100 pF, 1.5 kΩ)
VESDH
-2000
+2000
V
ESD Voltage
VESDM
VESDC
Machine Model (200 pF, 0Ω)
-200
+200
V
V
Charged device model
-1000
+1000
Maximum junction
temperature
Tj-MAX
-
-
+95
°C
WARNING:
Semiconductor devices may be permanently damaged by application of stress (including, without limitation,
voltage, current or temperature) in excess of absolute maximum ratings. Do not exceed any of these ratings.
6. Recommended Operating Conditions
Value
Parameter
Symbol
VDD
Condition
Unit
Min
Typ
3.7
Max
5.5(*1)
VDD
1200
1200
1200
1200
1200
1200
1200
1200
1200
700
Power supply voltage
Signal input voltage
VDD, VCC
2.5(*1)
V
VIDD
EN, XPS, VSEL, ILIMSEL
0.0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
Io (Max1)
Io (Max2)
VIN = 5.5, Vo = 5.0V, XPS = H, ILIMSEL = L
VIN = 5.5, Vo = 4.4V, XPS = H, ILIMSEL = L
VIN = 5.5, Vo = 3.6V, XPS = H, ILIMSEL = L
VIN = 4.2, Vo = 3.6V, XPS = H, ILIMSEL = L
VIN = 5.5, Vo = 3.3V, XPS = H, ILIMSEL = L
VIN = 3.7, Vo = 3.3V, XPS = H, ILIMSEL = L
VIN = 5.5, Vo = 2.0V, XPS = H, ILIMSEL = L
VIN = 3.7, Vo = 2.0V, XPS = H, ILIMSEL = L
VIN = 2.5, Vo =2 .0V, XPS = H, ILIMSEL = L
VIN = 5.5, Vo = 1.2V, XPS = H, ILIMSEL = L
VIN = 3.7, Vo = 1.2V, XPS = H, ILIMSEL = L
VIN = 2.5, Vo = 1.2V, XPS = H, ILIMSEL = L
VIN = 5.5, Vo = 0.8V, XPS = H, ILIMSEL = L
VIN = 3.7, Vo = 0.8V, XPS = H, ILIMSEL = L
VIN = 2.5, Vo = 0.8V, XPS = H, ILIMSEL = L
VIN = 2.5V, Vo = 3.3V, XPS = H, ILIMSEL = L
VIN = 2.5V, Vo = 3.6V, XPS = H, ILIMSEL = L
VIN = 3.7V, Vo = 4.4V, XPS = H, ILIMSEL = L
VIN = 2.5V, Vo = 4.4V, XPS = H, ILIMSEL = L
VIN = 3.7V, Vo = 5V, XPS = H, ILIMSEL = L
VIN = 2.5V, Vo = 5V, XPS = H, ILIMSEL = L
VIN = 5.5, Vo = 5.0V, XPS = L, ILIMSEL = H
VIN = 5.5, Vo = 4.4V, XPS = L, ILIMSEL = H
VIN = 5.5, Vo = 3.6V, XPS = L, ILIMSEL = H
VIN = 4.2, Vo = 3.6V, XPS = L, ILIMSEL = H
VIN = 5.5, Vo = 3.3V, XPS = L, ILIMSEL = H
VIN = 3.7, Vo = 3.3V, XPS = L, ILIMSEL = H
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
-
-
Io (Max3)
Io (Max4)
-
-
-
-
Output current (Buck)
PWM mode
Io (Max5)
Io (Max6)
Io (Max7)
-
-
-
-
600
-
600
-
600
-
500
-
250
Io (Max8)
Io (Max9)
-
800
-
700
-
1000
700
Output current (Boost)
PWM mode
Io (Max10)
Io (Max11)
-
-
900
-
600
Io (Max12)
Io (Max13)
-
600
-
600
Output current (Buck)
Power save mode,
ILIMSEL=H
-
600
Io (Max14)
Io (Max15)
-
600
-
600
-
600
Document Number: 002-08348 *A
Page 6 of 25
MB39C326
Value
Typ
Parameter
Symbol
Condition
Unit
Max
Min
VIN = 5.5, Vo = 2.0V, XPS = L, ILIMSEL = H
VIN = 3.7, Vo = 2.0V, XPS = L, ILIMSEL = H
VIN = 2.5, Vo = 2.0V, XPS = L, ILIMSEL = H
VIN = 5.5, Vo = 1.2V, XPS = L, ILIMSEL = H
VIN = 3.7, Vo = 1.2V, XPS = L, ILIMSEL = H
VIN = 2.5, Vo = 1.2V, XPS = L, ILIMSEL = H
VIN = 5.5, Vo = 0.8V, XPS = L, ILIMSEL = H
VIN = 3.7, Vo = 0.8V, XPS = L, ILIMSEL = H
VIN = 2.5, Vo = 0.8V, XPS = L, ILIMSEL = H
VIN = 2.5V, Vo = 3.3V, XPS = L, ILIMSEL = H
VIN = 2.5V, Vo = 3.6V, XPS = L, ILIMSEL = H
VIN = 3.7V, Vo = 4.4V, XPS = L, ILIMSEL = H
VIN = 2.5V, Vo = 4.4V, XPS = L, ILIMSEL = H
VIN = 3.7V, Vo = 5V, XPS = L, ILIMSEL = H
VIN = 2.5V, Vo = 5V, XPS = L, ILIMSEL = H
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
600
500
500
400
300
300
400
200
200
500
400
600
350
500
300
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
Io (Max16)
Io (Max17)
Io (Max18)
Io (Max19)
Io (Max20)
Output current (Boost)
Power save mode,
ILIMSEL=H
Io (Max21)
Io (Max22)
Output current (Buck)
Power save mode,
ILIMSEL=L
Io (Max23)
VIN = 3.7, Vo = 3.3V, XPS = L, ILIMSEL = L
-
-
-
160
mA
Output current (Boost)
Power save mode,
ILIMSEL=L
Io (Max24)
Ta
VIN = 2.5, Vo = 5V, XPS = L, ILIMSEL = L
-
-
60
mA
°C
Operating Ambient
temperature
-
-40
+85
Junction temperature
range
Tj
L
-
-
-
-40
-
+95
°C
µH
kΩ
Inductor value
-
-
0.5
620
-
-
Feedback resistor
value
R1
*1: Depending on the setting condition. See "Function Table" in "4. Function (7) Power save mode operation".
WARNING:
1. The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device's electrical characteristics are warranted when the device is operated
under these conditions.
2. Any use of semiconductor devices will be under their recommended operating condition.
3. Operation under any conditions other than these conditions may adversely affect reliability of device and could
result in device failure.
4. No warranty is made with respect to any use, operating conditions or combinations not represented on this
data sheet. If you are considering application under any conditions other than listed herein, please contact
sales representatives beforehand.
Document Number: 002-08348 *A
Page 7 of 25
MB39C326
7. Electrical Characteristics
The specifications apply under the recommended operating condition.
Value
Typ
Parameter
Symbol
Condition
Unit
Min
0.8
490
-
Max
Output voltage range
Feedback voltage
Line Regulation
VO
-
-
-
5.0
510
-
V
VFB
500
0.2
0.3
3.10
1.30
0.49
5.8
-
mV
%
VLINE
VLOAD
IO = 0 to 800 mA
IO = 0 to 800 mA
XPS = H, ILIMSEL = L
XPS = L, ILIMSEL = H
XPS = L, ILIMSEL = L
-
Load Regulation
-
-
%
2.50
1.05
0.36
5.2
-
3.75
1.60
0.60
6.4
2
A
Inductor peak current limit
IPK
A
A
Oscillation frequency
Shutdown current
fOSC
ISD
MHz
μA
EN = L
EN = H, XPS = L,
VIN = 3.7V, VO = 3.3V,
IO = 0 mA
Quiescent current
IQ
-
50
-
μA
SW1
SW2
-
63.5
124
82
84
-
175
116
164
72
SW FET ON
resistance
VDD = 3.7V, VO = 3.3V, Ta =
+25°C
SW3
Rdson
-
mΩ
SW4
SW5
-
123
51
-
TOTPH
TOTPL
VUVLOH
VUVLOL
VIL
-
-
135(*1)
110(*1)
2.0
1.9
-
-
°C
°C
V
Over temperature protection
-
-
-
-
1.9
1.8
0.0
1.5
-
2.1
2.0
0.25
VDD
0.1
UVLO
Threshold voltage
-
V
EN, XPS, VSEL, ILIMSEL
EN, XPS, VSEL, ILIMSEL
EN, XPS, VSEL, ILIMSEL
V
Signal input threshold voltage
Signal input current
VIH
-
V
ICTL
-
μA
*1: This parameter is not be specified. This should be used as a reference to support designing the circuits.
8. Typical Applications Circuit (RF Power Amplifier)
0.5µH
CIN
SWOUT
VDD
SWIN
VOUT
VBATT
VO
10µF
COUT
2.2µF
VCC
FB
EN
VSELSW
VSEL
Pout
Pin
DGND
AGND
PA
MB39C326
DAC
Document Number: 002-08348 *A
Page 8 of 25
MB39C326
9. Application Notes
Programming the Output Voltage
Output voltage is calculated using the equation (1) below.
Use R1 resistor value of 620 kΩ. Built-in phase compensation circuit is generated according to this resistor value.
1. Not using a selectable voltage option
R1 + R2
VO = VFB
×
R2
(VFB = 500 mV)
L1
SWOUT
SWIN
VOUT
VBATT
VO
VDD
VCC
EN
CIN
R1
R2
COUT
FB
VSELSW
DGND
XPS
VSEL
ILIMSEL
GND
2. Using a selectable voltage option
When VSEL = L
R1 + R2
R2
VO = VFB
×
When VSEL = H
VO = VFB
R1
(R2//R3)
+
×
R2//R3
L1
SWOUT
SWIN
VOUT
VBATT
VO
VDD
VCC
CIN
R1
R2
COUT
FB
VSELSW
DGND
EN
R3
XPS
VSEL
ILIMSEL
GND
L or H
Document Number: 002-08348 *A
Page 9 of 25
MB39C326
3. When the output variable is dynamically performed
R1
R3
R1
R3
R1
R2
× VDAC + VFB
(
×
VO = -
+
+1)
(VFB = 500 mV)
SWOUT
SWIN
VBATT
VO
VDD
VCC
VOUT
CIN
R1
R2
COUT
FB
VSELSW
DGND
EN
R3
XPS
VSEL
ILIMSEL
GND
DAC
Relationship between DAC and output when setting to R1 = 620 kΩ, R2 = 110 kΩ and R3 = 330 kΩ
VO - DAC
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
0.000
0.500
1.000
1.500
2.000
2.500
DAC voltage (V)
Document Number: 002-08348 *A
Page 10 of 25
MB39C326
10.Inductor Selection
The recommended inductor is 0.5 μH (0.47 μH).
To acquire a high-efficiency, select an inductor with low ESR.
Confirm in use conditions that the coil current does not exceed the rated saturation current.
It is recommended that the switch current limit value is considered.
Note that the permissible current value might be low about some products with high ESR because of the device
temperature increasing.
The following table shows the recommended inductor.
Size
DCR[Ω]
Isat[A]
(-30%)
Vendor
Part #
(max)
L[mm]
W[mm]
H[mm]
1.0
1.0
Coilcraft
ALPS
XPL2010-501ML
GLCHKR4701A
1.9
2.0
2.0
1.6
0.045
0.035
2.64
3.6
Coilcraft : Coilcraft, Inc.
ALPS : Alps Green Devices Co., Ltd
11.Input Capacitor Selection
It is recommended to place a low ESR ceramic bypass capacitor at least 10 μF close to VDD and GND because
the input capacitor is the power-supply voltage.
The execution capacity of some ceramic capacitors greatly decreases when adding bias.
Select a product by checking the part characteristics of manufacturer because small size parts or low voltage
rating parts tend to have that characteristic.
12.Output Capacitor Selection
The recommended standard capacity of the output capacitor is 2.2 μF in PWM mode.
When using in power save mode, the capacitor with larger capacity (around 22 μF) is recommended to reduce the
ripple voltage at PFM operation.
To suppress the decrease of output voltage during the load change, adjust with a larger capacitor.
Larger capacitors and low ESR capacitors is useful to reduce the ripple.
13.Thermal Information
Power dissipation is 1080 mW Max.
Thermal resistance(θja) is 65°C /W (JEDEC). This value can be used to calculate the chip temperature.
Thermal resistance is calculated based on the usage of JEDEC standard boards. It is recommended to consider
for the thermal design that the value may vary depending on the area of the board and the positions of the vias.
See "Power dissipation vs. Operation ambient temperature" in "15. Example of Standard Operation ".
Document Number: 002-08348 *A
Page 11 of 25
MB39C326
14.Notes on Board Layout
A suitable board layout is required for stable operations of this IC.
Place the peripheral component, input capacitance CIN and the output capacitance COUT close to this IC as much
as possible, and connect them with the shortest routes.
The routes with large current, in particular, the routes with variable current must be placed on the front surface
with the shortest routes.
Separate DGND from GND and connect GND at one point close to COUT
.
Provide the ground plane as much as possible on the IC mounted face. It is useful for heat dissipation.
R
FB
C
C
R
VCC
VDD
R
Vout
C
C
C
DGND
L
Document Number: 002-08348 *A
Page 12 of 25
MB39C326
15.Example of Standard Operation Characteristics
Efficiency vs. Load Current
(VIN = 3.7V, Power save mode, ILIMSEL=H)
Efficiency vs. Load Current (VIN = 3.7V, PWM mode)
Load Current (A)
Load Current (A)
Efficiency vs. Load Current
(VO = 3.3V, Power save mode, ILIMSEL=H)
Efficiency vs. Load Current (VO = 3.3V, PWM mode)
100%
90%
80%
70%
60%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
XPS=H
50%
40%
30%
20%
10%
0%
XPS=L
ILIMSEL=H
ILIMSEL=L
Input voltage =
5.5V
Input voltage =
5.5V
3.7V
3.7V
2.5V
2.5V
0.001
0.010
0.100
1.000
0.001
0.010
0.100
1.000
Load Current (A)
Load Current (A)
Efficiency vs. Load Current
(VO = 5.0V, Power save mode, ILIMSEL=H)
Efficiency vs. Load Current (VO = 5.0V, PWM mode)
100%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
XPS=H
ILIMSEL=L
XPS=L
ILIMSEL=H
Input voltage =
5.5V
Input voltage =
5.5V
3.7V
2.5V
3.7V
2.5V
0.001
0.010
0.100
1.000
0.001
0.010
0.100
1.000
Load Current (A)
Load Current (A)
Document Number: 002-08348 *A
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MB39C326
Maximum Output Current vs. Input Voltage
(PWM mode)
Maximum Output Current vs. Input Voltage
(Power save mode, ILIMSEL=H)
Input Voltage [V]
Input Voltage [V]
Load sudden change waveform
VIN=3.7V
IO=0 0.4A
COUT=2.2μF
XPS=H,
ILIMSEL=L
VO, 100mV/div, AC
1
Output Current, 200mA/div
100μs/div
Startup (PWM mode)
Startup (Power save mode, ILIMSEL=H)
EN, 2V/div
EN, 2V/div
VIN=3.7V, VO=3.3V,
IO=0A
VIN=3.7V, VO=3.3V,
IO=0A
VO, 1V/div
VO, 1V/div
XPS=H
XPS=L
ILIMSEL=L
20μs/div
ILIMSEL=H
20μs/div
20μs/div
20μs/div
Document Number: 002-08348 *A
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MB39C326
VO step response (Rise)
VO step response (Fall)
VIN=3.7V,
VO=4.0V→0.8V
Rload=11Ω
XPS=H
VO, 1V/div
ILIMSEL=L
10μs/div
VIN=3.7V,
VO=0.8V→4.0V
Rload=11Ω
XPS=H
VO, 1V/div
ILIMSEL=L
10μs/div
DAC, 2V/div
DAC, 2V/div
10μs/div
10μs/div
Power consumption vs.
Operating ambient temperature
Temperature [°C]
Document Number: 002-08348 *A
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MB39C326
16.Usage Precaution
Do not configure the IC over the maximum ratings.
If the IC is used over the maximum ratings, the LSI may be permanently damaged.
It is preferable for the device to be normally operated within the recommended usage conditions. Usage outside of
these conditions can have a bad effect on the reliability of the LSI.
Use the devices within recommended operating conditions.
The recommended operating conditions are the recommended values that guarantee the normal operations of
LSI.
The electrical ratings are guaranteed when the device is used within the recommended operating conditions and
under the conditions stated for each item.
Printed circuit board ground lines should be set up with consideration for common impedance.
Take appropriate measures against static electricity.
Containers for semiconductor materials should have anti-static protection or be made of conductive
material.
After mounting, printed circuit boards should be stored and shipped in conductive bags or containers.
Work platforms, tools, and instruments should be properly grounded.
Working personnel should be grounded with resistance of 250 kΩ to 1 MΩ in series between body and
ground.
Do not apply negative voltages.
The use of negative voltages below -0.3V may cause the parasitic transistor to be activated on LSI lines, which
can cause malfunctions.
17.Notes on Mounting
In general, the underfill material and sealing method affect the reliability of mounting.
Cypress does not evaluate the mounting using the underfill material.
It is advisable for each customer to evaluate the mounting enough.
WL-CSP has a surface boundary between silicon and resin at the side of the package.
Resin may be pulled by the board because of the underfill material and its shape and the state, and stress may
occur at the surface boundary.
The result may vary depending on the board and the underfill material used by each customer; therefore, it is
advisable for each customer to evaluate the mounting enough in order to apply to the products.
When using the underfill materials, be sure to apply the underfill to the silicon side surface as shown below (fillet
formation).
Ensuring wettability of
the silicon
Silicon
Underfill fillet
Resin
Underfill
Document Number: 002-08348 *A
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MB39C326
18.Ordering Information
Part Number
Package
20-pin plastic WLP
(WLP-20P-M01)
Remarks
MB39C326PW
19.EV Board Ordering Information
EV Board Number
MB39C326-EVBSK-01
EV Board Version No.
Remarks
MB39C326-EVB-01 REV1.2
MB39C326-EVB-01 REV1.2
20pin-WL-CSP, Power save mode
20pin-WL-CSP, PWM mode
MB39C326-EVBSK-02
Document Number: 002-08348 *A
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MB39C326
20.RoHS Compliance Information of Lead (Pb) Free Version
The LSI products of Cypress with "E1" are compliant with RoHS Directive, and has observed the standard of lead,
cadmium, mercury, Hexavalent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl ethers
(PBDE). A product whose part number has trailing characters "E1" is RoHS compliant.
21.Marking
XXXXX
26C
INDEX
Document Number: 002-08348 *A
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MB39C326
22.Labeling Sample
Figure 22-1 Inner box label [Q-Pack label (4 × 8.5inch)]
Ordering Part Number
(P)+Part No.
Quantity
Mark lot information
Label spec
: Conformable JEDEC
Barcode form : Code 39
Document Number: 002-08348 *A
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MB39C326
Figure 22-2 Al(Aluminum) bag label [2-in-1 label (4 × 8.5inch)]
Ordering Part Number
(P)+Part No.
Mark lot information
Quantity
Caution
JEDEC MSL, if available.
Document Number: 002-08348 *A
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MB39C326
Figure 22-3 Reel label [Reel label (4 × 2.5inch)]
Ordering Part Number
(P)+Part No.
Mark lot information
Quantity
Figure 22-4 Reel label [Dry pack & Reel label (4 × 2.5inch)]
Figure 22-5 Outer box label [Shopping label (4 × 8.5inch)]
Quantity
Ordering Part Number : (1P)+Part No.
Document Number: 002-08348 *A
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MB39C326
23.MB39C326PW Recommended Conditions of Moisture Sensitivity Level
[Cypress Recommended Mounting Conditions]
Item
Condition
Mounting Method
Mounting times
IR (infrared reflow), warm air reflow
2 times
Before opening
Please use it within two years after
manufacture.
Storage period
From opening to the 2nd reflow
Storage conditions
5°C to 30°C, 70% RH or less (the lowest possible humidity)
[Parameters for Each Mounting Method]
IR (infrared reflow)
260 °C
255 °C
170 °C
to
190 °C
(b)
(c)
(d)
(e)
RT
(a)
(d')
H rank: 260°C Max
(a) Temperature Increase gradient
(b) Preliminary heating
(c) Temperature Increase gradient
(d) Actual heating
: Average 1°C/s to 4°C/s
: Temperature 170°C to 190°C, 60s to 180s
: Average 1°C/s to 4°C/s
: Temperature 260°C Max; 255°C or more, 10s or less
: Temperature 230°C or more, 40s or less
or
(d’)
Temperature 225°C or more, 60s or less
or
Temperature 220°C or more, 80s or less
: Natural cooling or forced cooling
(e) Cooling
Note : Temperature : the top of the package body
Document Number: 002-08348 *A
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MB39C326
24.Package Dimensions
20-pin plastic WLP
Lead pitch
0.4 mm
2.15 mm × 1.94
Soldering ball
Print
Package width ×
package length
Lead shape
Sealing method
Mounting height
Weight
0.625 mm Max.
0.005 g
Code
(Reference)
S-WF BGA20-2.15 × 1.94-0.40
(WLP-20P-M01)
20-pin plastic WLP
(WLP-20P-M01)
2.15 ± 0.05(.085 ± .002)
(1.60(.063))
0.40(.016)TYP
X
4
3
2
1
1.94 ± 0.05
(.076 ± .002)
(1.20(.047))
Y
0.40(.016)
TYP
E
D
C
B
A
INDEX (Laser Marking)
1-0.13 (.005
)
20-ø0.26 ± 0.04
(20-ø.010±.002)
M
ø0.05(.002) XYZ
0.625(.025)MAX
Z
0.21 ± 0.04
(.008 ± .002)
0.05(.002) Z
Dimensions in mm (inches).
Note: The values in parenthesesare reference values.
C
2011 FUJITSU SEMICONDUCTOR LIMITED W20001Sc-1-1
Document Number: 002-08348 *A
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MB39C326
25.Major Changes
Spansion Publication Number: MB39C326_ DS405-00001
Page
Section
Change Results
Revision 1.0
-
-
Initial release
NOTE: Please see “Document History” about later revised information.
Document History
Document Title: MB39C326 6MHz Synchronous Rectification Buck-Boost DC/DC Converter IC
Document Number: 002-08348
Orig. of Submission
Revision
ECN
Description of Change
Change
Date
Migrated to Cypress and assigned document number 002-08348.
No change to document contents or format.
**
TAOA
01/31/2014
*A
5131396
TAOA
02/10/2016 Updated to Cypress template
Document Number: 002-08348 *A
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MB39C326
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and
distributors. To find the office closest to you, visit us at Cypress Locations.
Products
PSoC® Solutions
Automotive
Clocks & Buffers
Interface
cypress.com/go/automotive
cypress.com/go/clocks
psoc.cypress.com/solutions
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP
Cypress Developer Community
cypress.com/go/interface
Lighting & Power Control cypress.com/go/powerpsoc
Community | Forums | Blogs | Video | Training
Technical Support
Memory
cypress.com/go/memory
cypress.com/go/psoc
cypress.com/go/touch
cypress.com/go/USB
cypress.com/go/wireless
PSoC
Touch Sensing
USB Controllers
Wireless/RF
cypress.com/go/support
Spansion Products cypress.com/spansion products
Cypress®, the Cypress logo, Spansion®, the Spansion logo, MirrorBit®, MirrorBit® EclipseTM, ORNANDTM, Easy DesignSimTM, TraveoTM and combinations thereof, are
trademarks and registered trademarks of Cypress Semiconductor Corp. ARM and Cortex are the registered trademarks of ARM Limited in the EU and other countries. All
other trademarks or registered trademarks referenced herein are the property of their respective owners.
© Cypress Semiconductor Corporation, 2014-2016. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no
responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress
products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written
agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may
reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
This Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection
(United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable
license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and
or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction,
modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO,
THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further
notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does
not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to
the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies
Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 002-08348 *A
Page 25 of 25
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