DMP2035UFDF-13 [DIODES]

Small Signal Field-Effect Transistor,;
DMP2035UFDF-13
型号: DMP2035UFDF-13
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Small Signal Field-Effect Transistor,

文件: 总7页 (文件大小:456K)
中文:  中文翻译
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DMP2035UFDF  
P-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features and Benefits  
0.6mm Profile Ideal for Low Profile Applications  
PCB Footprint of 4mm2  
ID Max  
V(BR)DSS  
RDS(ON) Max  
TA = +25°C  
Low Gate Threshold Voltage  
29mΩ @ VGS = -4.5V  
39mΩ @ VGS = -2.5V  
-6.9A  
-5.9A  
Low On-Resistance  
-20V  
ESD Protected Gate  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
Mechanical Data  
Description and Applications  
Case: U-DFN2020-6 (Type F)  
This MOSFET is designed to minimize the on-state resistance  
(RDS(ON)), yet maintain superior switching performance, making it  
ideal for high efficiency power management applications.  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish NiPdAu over Copper Leadframe.  
Battery Management Application  
Power Management Functions  
DC-DC Converters  
e4  
Solderable per MIL-STD-202, Method 208  
Weight: 0.0065 grams (Approximate)  
D
U-DFN2020-6 (Type F)  
G
ESD PROTECTED  
Pin1  
Gate Protection  
S
Pin Out  
Bottom View  
Diode  
Top View  
Bottom View  
Equivalent Circuit  
Ordering Information (Note 4)  
Part Number  
DMP2035UFDF-7  
DMP2035UFDF-13  
Case  
Packaging  
3,000/Tape & Reel  
10,000/Tape & Reel  
U-DFN2020-6 (Type F)  
U-DFN2020-6 (Type F)  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.  
Marking Information  
P8 = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: D = 2016)  
P8  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2016  
2017  
2018  
2019  
2020  
2021  
2022  
2023  
Code  
D
E
F
G
H
I
J
K
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 7  
www.diodes.com  
June 2016  
© Diodes Incorporated  
DMP2035UFDF  
Document number: DS37736 Rev. 1 - 2  
DMP2035UFDF  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
-20  
Units  
V
V
Gate-Source Voltage  
±8  
VGSS  
Steady  
State  
TA = +25°C  
-6.9  
-5.5  
A
A
ID  
TA = +70°C  
TA = +25°C  
TA = +70°C  
Continuous Drain Current (Note 6) VGS = -4.5V  
-8.1  
-6.5  
t<10s  
ID  
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)  
Continuous Source-Drain Diode Current (Note 6)  
Avalanche Current (Note 7) L = 0.1mH  
-40  
-2.5  
-21  
23  
A
A
IDM  
IS  
IAS  
A
Avalanche Energy (Note 7) L = 0.1mH  
mJ  
EAS  
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
Value  
0.66  
Units  
TA = +25°C  
Total Power Dissipation (Note 5)  
W
PD  
RθJA  
PD  
0.42  
180  
135  
TA = +70°C  
Steady State  
t<10s  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
°C/W  
W
2.03  
TA = +25°C  
TA = +70°C  
Steady State  
t<10s  
1.31  
63  
43  
17.5  
Thermal Resistance, Junction to Ambient (Note 6)  
RθJA  
°C/W  
°C  
Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
Steady State  
RθJC  
-55 to +150  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 8)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-20  
-1  
V
BVDSS  
IDSS  
VGS = 0V, ID = -250μA  
VDS = -16V, VGS = 0V  
VGS = ±8V, VDS = 0V  
µA  
µA  
Zero Gate Voltage Drain Current TJ = +25°C  
Gate-Source Leakage  
±10  
IGSS  
ON CHARACTERISTICS (Note 8)  
Gate Threshold Voltage  
-0.4  
20  
-1.0  
29  
V
mΩ  
V
VGS(TH)  
RDS(ON)  
VSD  
VDS = VGS, ID = -250μA  
VGS = -4.5V, ID = -6.4A  
VGS = -2.5V, ID = -4.8A  
VGS = -1.8V, ID = -2.5A  
VGS = -1.5V, ID = -1.5A  
VGS = 0V, IS = -1.0A  
24  
39  
Static Drain-Source On-Resistance  
31  
60  
40  
120  
-1.2  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 9)  
Input Capacitance  
-0.7  
1,808  
155  
117  
32  
CISS  
COSS  
CRSS  
RG  
VDS = -15V, VGS = 0V,  
f = 1.0MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
Gate Resistance  
VDS = 0V, VGS = 0V, f = 1MHz  
20.5  
2.8  
Total Gate Charge (VGS = -4.5V)  
Gate-Source Charge  
QG  
VDS = -10V, VGS = -4.5V,  
ID = -4.0A  
nC  
QGS  
QGD  
tD(ON)  
tR  
4.1  
Gate-Drain Charge  
9.1  
Turn-On Delay Time  
12.3  
120  
54  
Turn-On Rise Time  
VDS = -10V, VGS = -4.5V,  
RG = 6, ID = -1.0A  
ns  
Turn-Off Delay Time  
tD(OFF)  
tF  
Turn-Off Fall Time  
Reverse Recovery Time  
Reverse Recovery Charge  
23.1  
8.3  
ns  
tRR  
IF = -1.0A, di/dt = 100A/μs  
IF = -1.0A, di/dt = 100A/μs  
nC  
QRR  
Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate.  
7. I and E rating are based on low frequency and duty cycles to keep T = +25°C.  
AS  
AS  
J
8. Short duration pulse test used to minimize self-heating effect.  
9. Guaranteed by design. Not subject to product testing.  
2 of 7  
www.diodes.com  
June 2016  
© Diodes Incorporated  
DMP2035UFDF  
Document number: DS37736 Rev. 1 - 2  
DMP2035UFDF  
30 V  
25  
20  
15  
10  
5
30  
25  
20  
15  
V
= -2.0V  
= -8V  
GS  
GS  
V
= -4.5V  
GS  
V
= -5.0V  
DS  
V
= -2.5V  
GS  
V
= -1.8V  
GS  
T
= 150°C  
A
V
= -1.5V  
GS  
T
= 25°C  
A
10  
5
T
= 125°C  
A
T
= -55°C  
A
T
= 85°C  
A
V
= -1.2V  
GS  
0
0
0
0.5  
1
1.5  
2
2.5  
3
0.4 0.6 0.8  
1.2 1.4 1.6 1.8  
2
2.2  
1
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 1 Typical Output Characteristic  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 2 Typical Transfer Characteristics  
0.03  
0.1  
0.08  
0.06  
0.04  
0.028  
0.026  
0.024  
0.022  
0.02  
I
= -8A  
D
V
= -2.5V  
GS  
I
= -6A  
D
V
= -4.5V  
GS  
0.02  
0
0.018  
0.016  
1
3
5
7
9
11 13 15 17 19 21  
0
2
4
6
8
10  
ID, DRAIN-SOURCE CURRENT (A)  
Figure 3 Typical On-Resistance vs.  
Drain Current and Gate Voltage  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 4 Typical Drain-Source On-Resistance  
vs. Gate-Source Voltage  
0.026  
0.022  
1.5  
1.3  
1.1  
0.9  
0.7  
V
= -10V  
GS  
T
= 150°C  
= 125°C  
A
V
= -2.5V  
GS  
I
= -7A  
D
T
A
V
I
= -4.5V  
T
= 85°C  
= 25°C  
GS  
A
= -8A  
D
0.018  
0.014  
0.01  
T
A
T
= -55°C  
A
0
5
10  
15  
20  
25  
30  
-50 -25  
TJ, JUNCTION TEMPERATURE (C)  
Figure 6 On-Resistance Variation with Temperature  
0
25  
50  
75 100 125 150  
ID, DRAIN CURRENT (A)  
Figure 5 Typical On-Resistance vs.  
Drain Current and Temperature  
3 of 7  
www.diodes.com  
June 2016  
© Diodes Incorporated  
DMP2035UFDF  
Document number: DS37736 Rev. 1 - 2  
DMP2035UFDF  
0.04  
0.035  
0.03  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
V
I
= -4.5V  
GS  
= -8A  
D
I
= -1mA  
D
I
= -250µA  
D
0.025  
0.02  
V
I
= -2.5V  
GS  
= -7A  
D
0.015  
0.01  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
TA, AMBIENT TEMPERATURE (°C)  
TJ, JUNCTION TEMPERATURE (C)  
Figure 8 Gate Threshold Variation vs. Ambient Temperature  
Figure 7 On-Resistance Variation with Temperature  
30  
25  
20  
15  
10  
5
10000  
f=1MHz  
C
iss  
1000  
100  
10  
T
= 150°C  
A
T = 25°C  
A
C
C
oss  
T
= 125°C  
= 85°C  
A
T
= -55°C  
A
rss  
T
A
0
0
0.3  
0.6  
0.9  
1.2  
1.5  
0
5
10  
15  
20  
VSD, SOURCE-DRAIN VOLTAGE (V)  
Figure 9 Diode Forward Voltage vs. Current  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 10 Typical Junction Capacitance  
8
6
100  
10  
1
R
DS(on)  
Limited  
P
= 100µs  
W
DC  
P
= 10s  
4
2
W
P
= 1s  
W
P
= 100ms  
W
V
I
= -10V  
DS  
TJ(max) = 150°C  
TA = 25°C  
P
= 10ms  
W
0.1  
= -4A  
D
P
= 1ms  
W
VGS = -4.5V  
Single Pulse  
DUT on 1 * MRP Board  
0.01  
0
0
5
10  
15  
20  
25  
30  
0.01  
0.1  
1
10  
100  
Qg, TOTAL GATE CHARGE (nC)  
Figure 11 Gate Charge  
VDS , DRAIN-SOURCE VOLTAGE (V)  
Figure 12 SOA, Safe Operation Area  
4 of 7  
www.diodes.com  
June 2016  
© Diodes Incorporated  
DMP2035UFDF  
Document number: DS37736 Rev. 1 - 2  
DMP2035UFDF  
1
0.1  
0.01  
RJA(t) = r(t) * RJA  
RJA = 179°C/W  
Duty Cycle, D = t1/ t2  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 13 Transient Thermal Resistance  
5 of 7  
www.diodes.com  
June 2016  
© Diodes Incorporated  
DMP2035UFDF  
Document number: DS37736 Rev. 1 - 2  
DMP2035UFDF  
Package Outline Dimensions  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
U-DFN2020-6 (Type F)  
U-DFN2020-6  
(Type F)  
Min Max  
0.570.63  
0.00 0.05  
A3  
A1  
Dim  
A
A1  
A3  
b
Typ  
0.60  
0.03  
0.15  
0.30  
2.00  
0.95  
0.38  
2.00  
1.15  
0.70  
A
Seating Plane  
-
-
0.25 0.35  
1.95 2.05  
0.85 1.05  
D
D
D2  
e3  
k2  
e4  
D2a 0.33 0.43  
E
E2  
E2a  
e
1.95 2.05  
1.05 1.25  
0.65 0.75  
0.65 BSC  
D2a  
E2a  
z2  
e2  
e3  
e4  
k
0.863 BSC  
0.70 BSC  
0.325 BSC  
0.37 BSC  
D2  
E
E2  
k1  
k2  
L
0.15 BSC  
0.36 BSC  
0.225 0.325 0.275  
0.20 BSC  
k1  
e2  
L
k
z1  
z
z1  
z2  
0.110 BSC  
0.20 BSC  
e
b
All Dimensions in mm  
z(4x)  
Suggested Pad Layout  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
U-DFN2020-6 (Type F)  
X3  
Y
C
X
Value  
Dimensions  
(in mm)  
C
X
0.650  
0.400  
0.480  
0.950  
1.700  
0.425  
0.800  
1.150  
1.450  
2.300  
X1  
X2  
X3  
Y
Y1  
Y2  
Y3  
Y4  
Y3  
Y2  
Y1 Y4  
X1  
Pin1  
X2  
6 of 7  
www.diodes.com  
June 2016  
© Diodes Incorporated  
DMP2035UFDF  
Document number: DS37736 Rev. 1 - 2  
DMP2035UFDF  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2016, Diodes Incorporated  
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June 2016  
© Diodes Incorporated  
DMP2035UFDF  
Document number: DS37736 Rev. 1 - 2  

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