ZXMN4A06KTC [DIODES]

40V N-channel enhancement mode MOSFET; 40V N沟道增强型MOSFET
ZXMN4A06KTC
型号: ZXMN4A06KTC
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

40V N-channel enhancement mode MOSFET
40V N沟道增强型MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲
文件: 总8页 (文件大小:559K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ZXMN4A06K  
40V N-channel enhancement mode MOSFET  
Summary  
V
= -40V; R  
= 0.05; I = 10.9A  
DS(ON) D  
(BR)DSS  
Description  
This new generation of trench MOSFETs from Zetex utilizes a unique  
structure that combines the benefits of low on-resistance with fast  
switching speed. This makes them ideal for high efficiency, low voltage,  
power management applications.  
Features  
D
S
Low on-resistance  
Fast switching speed  
Low threshold  
G
Low gate drive  
DPAK package  
Applications  
DC - DC converters  
Audio output stages  
Relay and solenoid driving  
Motor control  
Ordering information  
Device  
Reel size Tape width Quantity  
(inches)  
(mm)  
per reel  
ZXMN4A06KTC  
13  
16  
2,500  
Device marking  
Pinout - Top view  
ZXMN  
4A06  
Issue 1 - March 2006  
© Zetex Semiconductors plc 2005  
1
www.zetex.com  
ZXMN4A06K  
Absolute maximum ratings  
Parameter  
Symbol  
Limit  
Unit  
Drain-source voltage  
V
40  
V
DSS  
GS  
Gate-source voltage  
V
20  
V
Continuous drain current:  
(b)  
10.9  
8.7  
A
A
A
V
V
V
=10V; T =25°C  
A
GS  
GS  
GS  
I
D
(b)  
(a)  
=10V; T =70°C  
A
7.2  
=10V; T =25°C  
A
(c)  
I
I
35.3  
10.8  
A
A
DM  
Pulsed drain current  
Continuous source current (body diode)  
S
(b)  
(c)  
I
35.3  
A
Pulsed source current (body diode)  
SM  
(a)  
P
P
P
4.2  
33.6  
W
mW/°C  
Power dissipation at T =25°C  
Linear derating factor  
D
D
D
A
(b)  
(d)  
9.5  
76  
W
mW/°C  
Power dissipation at T =25°C  
A
Linear derating factor  
2.15  
17.2  
W
mW/°C  
Power dissipation at T =25°C  
A
Linear derating factor  
Operating and storage temperature range T :T  
-55 to +150  
°C  
j
stg  
Thermal resistance  
Parameter  
Symbol  
Value  
Unit  
(a)  
R
R
R
30  
°C/W  
Junction to ambient  
JA  
JA  
JA  
(b)  
13.2  
58  
°C/W  
°C/W  
Junction to ambient  
(d)  
Junction to ambient  
NOTES:  
(a) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in  
still air conditions.  
(b)For a device surface mounted on FR4 PCB measured at t 10 sec.  
(c) Repetitive rating 50mm x 50mm x 1.6mm FR4 PCB, D=0.02 pulse width=300 s - pulse width limited by maximum  
junction temperature.  
(d)For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in  
still air conditions.  
Issue 1 - March 2006  
© Zetex Semiconductors plc 2005  
2
www.zetex.com  
ZXMN4A06K  
Characteristics  
Issue 1 - March 2006  
© Zetex Semiconductors plc 2005  
3
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ZXMN4A06K  
Electrical characteristics (at T = 25°C unless otherwise stated)  
A
Parameter  
Static  
Symbol  
Min.  
Typ.  
Max.  
Unit Conditions  
Drain-source breakdown  
voltage  
V
40  
V
I =250A, V =0V  
D GS  
(BR)DSS  
Zero gate voltage drain current I  
1
A  
nA  
V
V
=40V, V =0V  
GS  
DSS  
DS  
Gate-body leakage  
I
100  
V
= 20V, V =0V  
DS  
GSS  
GS  
Gate-source threshold voltage V  
1.0  
I =250A, V = V  
D DS GS  
GS(th)  
Static drain-source on-state  
R
0.050  
0.075  
V
=10V, I =4.5A  
D
DS(on)  
GS  
GS  
DS  
(*)  
resistance  
V
V
=4.5V, I =3.2A  
D
(‡)  
g
11.5  
S
=15V,I =4.5A  
D
Forward transconductance  
fs  
(‡)  
Dynamic  
Input capacitance  
C
C
C
827  
133  
84  
pF  
pF  
pF  
iss  
V
=20 V, V =0V,  
GS  
DS  
Output capacitance  
oss  
rss  
f=1MHz  
Reverse transfer capacitance  
(†) (‡)  
Switching  
Turn-on delay time  
Rise time  
t
t
t
t
3.2  
3.8  
ns  
ns  
ns  
ns  
nC  
nC  
nC  
d(on)  
r
V
=20V, I =1A  
D
DD  
Turn-off delay time  
Fall time  
23.3  
10.9  
17.1  
2.41  
3.4  
R =6.0, V =10V  
(refer to test circuit)  
d(off)  
f
G
GS  
Total gate charge  
Gate-source charge  
Gate-drain charge  
Q
Q
Q
g
V
=20V,V =10V,  
DS  
GS  
gs  
gd  
I =4.5A  
D
(refer to test circuit)  
Source-drain diode  
(*)  
V
0.83  
0.95  
V
T =25°C, I =4.5A,  
J S  
SD  
Diode forward voltage  
V
=0V  
GS  
(†)  
16  
9
ns  
T =25°C, I =4A,  
J F  
di/dt= 100A/s  
Reverse recovery time  
t
rr  
(‡)  
Q
nC  
rr  
Reverse recovery charge  
NOTES:  
(*) Measured under pulsed conditions. Width 300s. Duty cycle 2%.  
(†) Switching characteristics are independent of operating junction temperature.  
(‡) For design aid only, not subject to production testing.  
Issue 1 - March 2006  
© Zetex Semiconductors plc 2005  
4
www.zetex.com  
ZXMN4A06K  
Typical charactersitics  
Issue 1 - March 2006  
© Zetex Semiconductors plc 2005  
5
www.zetex.com  
ZXMN4A06K  
Typical characteristics  
Current  
regulator  
QG  
50k  
Same as  
D.U.T  
12V  
QGS  
QGD  
VG  
VDS  
IG  
D.U.T  
ID  
VGS  
Charge  
Basic gate charge waveform  
Gate charge test circuit  
VDS  
90%  
RD  
VGS  
VDS  
RG  
VCC  
10%  
VGS  
td(on)  
tr  
td(off)  
tr  
t(on)  
t(on)  
Switching time waveforms  
Switching time test circuit  
Issue 1 - March 2006  
© Zetex Semiconductors plc 2005  
6
www.zetex.com  
ZXMN4A06K  
Intentionally left blank  
Issue 1 - March 2006  
© Zetex Semiconductors plc 2005  
7
www.zetex.com  
ZXMN4A06K  
Package details - DPAK  
Package dimensions  
Dim.  
Inches  
Min.  
0.086  
-
Millimeters  
Dim.  
Inches  
Min. Max.  
0.090 BSC  
Millimeters  
Max.  
0.094  
0.005  
0.035  
0.045  
0.215  
0.024  
0.023  
0.245  
-
Min.  
2.18  
-
Max.  
2.39  
0.127  
0.89  
1.14  
5.46  
0.61  
0.584  
6.22  
-
Min.  
Max.  
A
A1  
b
b2  
b3  
c
c2  
D
D1  
E
e
H
L
2.29 BSC  
0.370  
0.055  
0.410  
0.070  
9.40  
1.40  
10.41  
1.78  
0.020  
0.030  
0.205  
0.018  
0.018  
0.213  
0.205  
0.250  
0.170  
0.508  
0.762  
5.21  
0.457  
0.457  
5.41  
5.21  
6.35  
4.32  
L1  
L2  
L3  
L4  
L5  
1°  
°  
-
0.108 REF  
0.020 BSC  
2.74 REF  
0.508 BSC  
0.035  
0.065  
0.040  
0.060  
10°  
0.89  
1.65  
1.016  
1.52  
10°  
0.025  
0.045  
0°  
0.635  
1.14  
0°  
0.265  
-
6.73  
-
0°  
15°  
0°  
15°  
E1  
-
-
-
-
Note: Controlling dimensions are in inches. Approximate dimensions are provided in millimeters  
Europe  
Americas  
Asia Pacific  
Corporate Headquarters  
Zetex GmbH  
Zetex Inc  
Zetex (Asia Ltd)  
Zetex Semiconductors plc  
Zetex Technology Park, Chadderton  
Oldham, OL9 9LL  
Streitfeldstraße 19  
D-81673 München  
Germany  
700 Veterans Memorial Highway  
Hauppauge, NY 11788  
USA  
3701-04 Metroplaza Tower 1  
Hing Fong Road, Kwai Fong  
Hong Kong  
United Kingdom  
Telefon: (49) 89 45 49 49 0  
Fax: (49) 89 45 49 49 49  
europe.sales@zetex.com  
Telephone: (1) 631 360 2222  
Fax: (1) 631 360 8222  
usa.sales@zetex.com  
Telephone: (852) 26100 611  
Fax: (852) 24250 494  
asia.sales@zetex.com  
Telephone: (44) 161 622 4444  
Fax: (44) 161 622 4446  
hq@zetex.com  
For international sales offices visit www.zetex.com/offices  
Zetex products are distributed worldwide. For details, see www.zetex.com/salesnetwork  
This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or  
reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned.  
The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.  
Issue 1 - March 2006  
© Zetex Semiconductors plc 2005  
8
www.zetex.com  

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