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4322-025-14101 [ETC]

CORE FULL EFD10-3C90 PAIR ; CORE FULL EFD10-3C90 PAIR\n
4322-025-14101
型号： 4322-025-14101
厂家： ETC    ETC
描述：

CORE FULL EFD10-3C90 PAIR
CORE FULL EFD10-3C90 PAIR\n
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technical note  
Philips Magnetic Products  
SMD Coil Formers and Cores  
Philips  
Components  
SMD Coil Formers  
and Cores  
Contents  
Introduction  
Ferrite Material Properties  
Range Overview  
E5.3/2.7/2  
E6.3/2.9/2  
EFD10  
3
6
7
8
10  
12  
14  
16  
18  
20  
22  
24  
26  
28  
30  
32  
34  
EFD12  
EFD15  
EFD20  
EP7  
ER9.5  
ER11  
RM4/I  
RM5/I  
RM6S/I  
RM6S/ILP  
Tag plate TGPS-9  
1
Philips Magnetic Products  
Range of SMD accessories and cores  
2
Philips Magnetic Products  
Introduction  
With its new range of surface-mount coil formers, Philips  
Components offers a real solution to circuit designers  
wishing to take maximum advantage of surface-mount  
technology in their designs.  
The trend toward full surface-mount technology has been  
hampered by the problems of introducing inductive  
components (inductors and transformers for example) in  
surface-mount execution.  
These devices, consisting of cores, coil-formers and  
windings held together by clips, were not easily converted  
to surface-mount versions, and former designs, based on  
"gull-wing" terminations (see Fig.1) have not been entirely  
satisfactory.  
Disadvantages of "gull-wing" pins  
In particular, tensions introduced by the winding wire,  
> 0.1 mm  
which is wrapped around the upper part of the gull-wing  
terminations, can severely degrade the coplanarity of the  
solder pads. The use of thin wire windings is a partial  
solution to this problem but this introduces limitations on  
coil design. Furthermore, during soldering of the winding  
wire to the termination, spillage of solder onto the solder  
pad can further degrade coplanarity. However, for very  
small coil formers gull-wing pins are the only possible  
design due to space limitations. For small to medium sized  
coil formers there is a better solution: U-pins.  
Fig.1 The “gull-wing” design.  
3
Philips Magnetic Products  
Advantages of the U-pin design  
The introduction of Philips' new range of surface-mount,  
coil formers, however, solves all these problems. These  
feature "U-pin" terminations (Fig.2) securely embedded in  
the plastic coil former body. These pins are thicker and  
wider than most gull-wing pins and therefore stronger.  
The solder pads, located beneath the plastic body and in  
contact with it, form a rigid structure with a guaranteed  
coplanarity of less than 0.1 mm, according to  
IEC 191-2Q.  
The upper part of the U-pins protrude from the plastic  
body and offer a large area on which to terminate the  
windings. Since these are physically separated from the  
solder pads, tension introduced by the winding wire will  
not affect coplanarity, and neither will solder used to attach  
the winding wires spill onto the solder pads. The contact  
surface of the pads is also much larger than typical gull-  
wing solder pads, making them ideal for these relatively  
heavy components.  
clean solder pads  
Moreover, with this design, the thickness of the winding  
wire is no longer a limitation, allowing circuit designers far  
more freedom in their choice of wire.  
High-grade plastic  
The coil former body is of high-grade liquid-crystal  
polymer (LCP) offering excellent thermal stability. The  
body is exceptionally tough and can withstand soldering  
o
temperatures up to 350 C and operating temperatures up  
< 0.1 mm  
o
to 180 C.  
Excellent ferrites  
In combination with Philips' extensive range of ferrite  
cores, these new coil formers provide surface-mount  
solutions in a host of applications from wide-band signal  
transformers to power transformers.  
When assembled with windings, coil-formers, cores and a  
newly-designed clip with a flat upper surface (ideal for  
vacuum pickup), the products can easily be inserted by a  
pick and place assembly line.  
Fig.2 The U-pin design  
4
Philips Magnetic Products  
5
Philips Magnetic Products  
Ferrite material properties  
PARAMETER  
SYMBOL UNIT  
TEST CONDITIONS  
3F3  
3F4  
4F1  
3E4  
3E5  
3E6  
Initial permeability  
µ
-
f = ≤10 kHz, B < 0.1mT, 1800  
900  
80  
4700 10000 12000  
i
o
T = 25 C  
f = 10 kHz, T = 25 C  
o
Saturation flux density B  
at Field strength  
Remanence  
mT  
A/m  
mT  
500  
3000  
150  
15  
450  
3000  
150  
60  
330  
3000  
200  
170  
-
360  
250  
100  
10  
360  
250  
80  
5
-
400  
250  
100  
s
H
o
B
T = 25 C  
r
o
Coercivity  
H
A/m  
T = 25 C  
4
-
c
3
Power loss density  
(typical, sine wave  
excitation)  
P
kW/m  
f = 25kHz, B = 200mT  
70  
-
v
f = 100kHz, B = 100mT 50  
f = 500kHz, B = 50mT 180  
200  
180  
140  
240  
≥220  
10  
-
-
-
-
-
-
f = 1MHz, B = 30mT  
f = 3MHz, B = 10mT  
-
300  
-
≥200  
2
300  
150  
≥260  
-
-
-
-
o
Curie temperature  
Resistivity (DC)  
Density  
T
C
≥125 ≥125 ≥130  
c
o
5
ρ
Ωm  
g/cm  
T = 25 C  
10  
1
4.8  
0.5  
4.9  
0.5  
4.9  
3
o
T = 25 C  
4.8  
4.7  
4.6  
6
Philips Magnetic Products  
Range overview  
Core Type  
Core materials  
SMD  
3F3  
3F4  
3E4  
3E5  
3E6  
coil former  
E5.3/2.7/2  
E6.3/2.9/2  
EFD10  
EFD12  
EFD15  
EFD20  
EP7  
ER9.5  
ER11  
RM4/I  
RM5/I  
RM6/I  
RM6/ILP  
EFD assembly  
7
Philips Magnetic Products  
E5.3/2.7/2  
± 0.1  
3.6  
2.3  
1.2  
± 0.1  
+0.1  
0
3.7  
-0,15  
1.5  
0
2.6min.  
0.5  
0.6  
3.7  
4.9  
1.85  
5.3max.  
7.85max.  
Fig. 1 SMD coil former for E5.3/2.7/2  
Winding data  
Number of  
sections  
Number of  
solder pads  
Winding area  
Winding width Average length  
Type number  
2
(mm )  
(mm)  
of turn (mm)  
1
2
6
6
1.5  
2 × 0.6  
2.6  
2 × 1.0  
12.6  
13  
CPHS E5.3/2-1S-6P  
CPHS E5.3/2-2S-6P  
Coil former data  
Coil former material  
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance  
with UL94V-0.  
Solder pad material  
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
o
Maximum operating temperature  
Resistance to soldering heat  
Solderability  
155 C, IEC 85 class F  
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.  
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s  
Clip data  
1.5  
6
Clip material  
Clamping force  
Type number  
stainless (CrNi) steel  
5N  
CLM-E5.3/2  
Fig. 2 Clamp for E5.3/2.7/2  
Cover data  
Cover material  
Liquid crystal polymer  
(LCP)  
Type number  
COV-E5.3/2  
4.8 max  
1.6 max  
Fig. 3 Cover for E5.3/2.7/2  
8
Philips Magnetic Products  
E5.3/2.7/2  
Effective core parameters  
symbol  
parameter  
value  
unit  
+0.2  
0
3.8  
1.4  
-1  
Σ (l/A)  
core factor (C1)  
effective volume  
effective length  
effective area  
5.13  
31.4  
12.7  
2.5  
mm  
mm  
mm  
mm  
mm  
g
0
-0.1  
3
V
e
l
e
2
2
A
e
A
minimum area  
mass of core half  
2.3  
0.08  
min  
m
±
0.1  
5.25  
Fig. 3 E5.3/2.7/2 core half  
Core halves for general purpose transformers and power applications  
Grade  
A (nH)  
µ
Airgap (µm)  
Type number  
L
e
3F3  
3F4  
3E5  
3E6  
265 ±25%  
165 ±25%  
1400 +40/-30%  
1600 +40/-30%  
1080  
675  
5700  
6520  
0
0
0
0
E5.3/2.7/2-3F3  
E5.3/2.7/2-3F4  
E5.3/2.7/2-3E5  
E5.3/2.7/2-3E6  
Properties of core sets under power conditions  
B(mT) at  
H = 250 A/m  
f = 25kHz  
Core loss at  
f = 100 kHz  
B = 100mT  
Core loss at  
f = 400 kHz  
B = 50mT  
Core loss at  
Core loss at  
f = 3MHz  
B = 10mT  
Grade  
f = 1MHz  
B = 30mT  
o
o
o
o
o
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
3F3  
3F4  
≥ 300  
≥ 250  
≤ 0.005  
≤ 0.008  
-
-
-
-
≤ 0.006  
≤ 0.010  
9
Philips Magnetic Products  
E6.3/2.9/2  
4.4  
1.6  
5.5  
3.5 ± 0.08  
0
- 0.1  
3.5  
2.3 ± 0.05  
+0.1  
2.7 min.  
1.5  
0
0.6  
1.2  
5.08  
8.6 max.  
2.54  
6.4 max.  
Fig. 1 SMD coil former for E6.3/2.9/2  
Winding data  
Number of  
sections  
Number of  
solder pads  
Winding area  
Winding width Average length  
Type number  
2
(mm )  
(mm)  
of turn (mm)  
1
2
6
6
1.62  
2 × 0.45  
2.7  
2 × 0.75  
12.8  
12.8  
CPHS-E6.3/2-1S-6P  
CPHS-E6.3/2-2S-6P  
Coil former data  
Coil former material  
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance  
with UL94V-0.  
Solder pad material  
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
o
Maximum operating temperature  
Resistance to soldering heat  
Solderability  
155 C, IEC 85 class F  
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.  
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s  
Cover data  
7.7 max  
5.1 max.  
Cover material  
Liquid crystal polymer  
(LCP)  
Type number  
COV-E6.3/2  
Fig. 2 Cover for E6.3/2.9/2  
10  
Philips Magnetic Products  
E6.3/2.9/2  
Effective core parameters  
+ 0.2  
0
3.6  
symbol  
parameter  
value  
unit  
0
- 0.1  
1.4  
-1  
Σ (l/A)  
core factor (C1)  
effective volume  
effective length  
effective area  
3.67  
40.6  
12.2  
3.3  
mm  
mm  
mm  
mm  
mm  
g
3
V
e
l
e
2
2
A
e
A
minimum area  
mass of core half  
2.6  
0.12  
min  
m
0
6.3  
- 0.25  
Fig. 3 E6.3/2.9/2 core half  
Core halves for general purpose transformers and power applications  
Grade  
A (nH)  
µ
Airgap (µm)  
Type number  
L
e
3F3  
3F4  
3E5  
3E6  
360 ±25%  
225 ±25%  
1700 +40/-30%  
2100 +40/-30%  
1050  
660  
4960  
6130  
0
0
0
0
E6.3/2.9/2-3F3  
E6.3/2.9/2-3F4  
E6.3/2.9/2-3E5  
E6.3/2.9/2-3E6  
Properties of core sets under power conditions  
B(mT) at  
H = 250 A/m  
f = 25kHz  
Core loss at  
f = 100 kHz  
B = 100mT  
Core loss at  
f = 400 kHz  
B = 50mT  
Core loss at  
Core loss at  
f = 3MHz  
B = 10mT  
Grade  
f = 1MHz  
B = 30mT  
o
o
o
o
o
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
3F3  
3F4  
≥ 300  
≥ 250  
≤ 0.007  
≤ 0.010  
−
−
-
−
≤ 0.008  
≤ 0.013  
11  
Philips Magnetic Products  
EFD10  
1.8  
7.3-0.15  
5.7-0.1  
4.8+0.1  
7.1-0.15  
6.05min.  
0.8  
1.8  
12  
14.7max.  
3
2
9
11.7max.  
3
MBW122  
Fig. 1 SMD coil former for EFD10  
Winding data  
Number of  
sections  
Number of  
solder pads  
Winding area  
Winding width Average length  
Type number  
2
(mm )  
(mm)  
of turn (mm)  
1
8
4.2  
6.05  
14.8  
CPHS-EFD10-1S-8P  
Coil former data  
Coil former material  
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance  
with UL94V-0.  
Solder pad material  
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
o
Maximum operating temperature  
Resistance to soldering heat  
Solderability  
155 C, IEC 85 class F  
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.  
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s  
Clamp data  
12 - 0.3  
± 0.2  
10.5  
9.4  
8
Clamp material  
Clamping force  
Type number  
stainless(CrNi) steel  
15N  
CLM-EFD10  
8
10 - 0.3  
4
MBW128  
Fig. 2 Clamp for EFD10  
12  
Philips Magnetic Products  
EFD10  
Effective core parameters  
symbol  
parameter  
value  
unit  
-1  
Σ (l/A)  
core factor (C1)  
effective volume  
effective length  
effective area  
3.29  
171  
23.7  
7.2  
mm  
mm  
mm  
3
V
e
l
e
2
A
mm  
e
2
A
minimum area  
mass of core half  
6.5  
0.45  
mm  
g
min  
m
10.5 ± 0.3  
7.65 ± 0.25  
4.55 ± 0.15  
MBW131  
Fig. 3 EFD10 core half  
Core sets for general purpose transformers and power applications  
Grade  
A (nH)  
µ
Airgap (µm)  
Type number  
L
e
3F3  
25±5%  
40±8%  
63±10%  
500±25%  
25±5%  
40±8%  
66  
105  
165  
1290  
66  
105  
165  
730  
3670  
5240  
540  
300  
170  
0
520  
280  
150  
0
EFD10-3F3-A25-S  
EFD10-3F3-A40-S  
EFD10-3F3-A63-S  
EFD10-3F3-S  
EFD10-3F4-A25-S  
EFD10-3F4-A40-S  
EFD10-3F4-A63-S  
EFD10-3F4-S  
3F4  
63±10%  
280±25%  
1400 +40/-30%  
2000 +40/-30%  
3E4  
3E5  
0
0
EFD10-3E4-S  
EFD10-3E5-S  
Properties of core sets under power conditions  
B(mT) at  
H = 250 A/m  
f = 25kHz  
Core loss at  
f = 100 kHz  
B = 100mT  
Core loss at  
f = 400 kHz  
B = 50mT  
Core loss at  
Core loss at  
f = 3MHz  
B = 10mT  
Grade  
f = 1MHz  
B = 30mT  
o
o
o
o
o
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
3F3  
3F4  
≥ 315  
≥ 250  
≤ 0.02  
≤ 0.035  
−
−
−
−
≤ 0.034  
≤ 0.055  
13  
Philips Magnetic Products  
EFD12  
1.8  
8.65-0.15  
6.55-0.1  
5.65+0.1  
8.7-0.15  
7.65min.  
0.8  
1.8  
13.4  
3
9
16.2max.  
2
13.7max.  
3
MBW123  
Fig. 1 SMD coil former for EFD12  
Winding data  
Number of  
sections  
Number of  
solder pads  
Winding area  
Winding width Average length  
Type number  
2
(mm )  
(mm)  
of turn (mm)  
1
8
6.5  
7.65  
18.6  
CPHS-EFD12-1S-8P  
Coil former data  
Coil former material  
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance  
with UL94V-0.  
Solder pad material  
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
o
Maximum operating temperature  
Resistance to soldering heat  
Solderability  
155 C, IEC 85 class F  
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.  
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s  
Clamp data  
14 - 0.3  
11.5  
Clamp material  
Clamping force  
Type number  
stainless(CrNi) steel  
20N  
CLM-EFD12  
± 0.2  
9.4  
12.5  
10.5  
12 - 0.3  
4
MBW129  
Fig. 2 clamp for EFD12  
14  
Philips Magnetic Products  
EFD12  
Effective core parameters  
symbol  
parameter  
value  
unit  
-1  
Σ (l/A)  
core factor (C1)  
effective volume  
effective length  
effective area  
2.50  
325  
28.5  
11.4  
10.7  
0.9  
mm  
mm  
mm  
3
V
e
l
e
2
A
mm  
e
2
A
minimum area  
mass of core half  
mm  
g
min  
m
12.5 ± 0.3  
9 ± 0.25  
5.4 ± 0.15  
MBW132  
Fig. 3 EFD12 core half  
Core sets for general purpose transformers and power applications  
Grade  
A (nH)  
µ
Airgap (µm)  
Type number  
L
e
3F3  
40±5%  
63±8%  
100±10%  
700±25%  
40±5%  
80  
125  
200  
1370  
80  
125  
200  
760  
3780  
5570  
490  
280  
160  
0
470  
260  
140  
0
EFD12-3F3-A40-S  
EFD12-3F3-A63-S  
EFD12-3F3-A100-S  
EFD12-3F3-S  
EFD12-3F4-A40-S  
EFD12-3F4-A63-S  
EFD12-3F4-A100-S  
EFD12-3F4-S  
3F4  
63±8%  
100±10%  
380±25%  
1900 +40/-30%  
2800 +40/-30%  
3E4  
3E5  
0
0
EFD12-3E4-S  
EFD12-3E5-S  
Properties of core sets under power conditions  
B(mT) at  
H = 250 A/m  
f = 25kHz  
Core loss at  
f = 100 kHz  
B = 100mT  
Core loss at  
f = 400 kHz  
B = 50mT  
Core loss at  
Core loss at  
f = 3MHz  
B = 10mT  
Grade  
f = 1MHz  
B = 30mT  
o
o
o
o
o
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
3F3  
3F4  
≥ 315  
≥ 250  
≤ 0.04  
≤ 0.065  
−
−
−
−
≤ 0.065  
≤ 0.11  
15  
Philips Magnetic Products  
EFD15  
2
10.55 - 0.15  
6.65 - 0.1  
5.55+0.1  
10.4 - 0.15  
9.15 min  
1.8  
3.75  
11.25  
1
16  
18.7 max  
2
16.7 max  
3.75  
MBW143  
Fig. 1 SMD coil former for EFD15  
Winding data  
Number of  
sections  
Number of  
solder pads  
Winding area  
(mm2)  
Winding width Average length  
Type number  
(mm)  
of turn (mm)  
1
8
16.7  
9.15  
25.6  
CPHS-EFD15-1S-8P  
Coil former data  
Coil former material  
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance  
with UL94V-0.  
Solder pad material  
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
o
Maximum operating temperature  
Resistance to soldering heat  
Solderability  
155 C, IEC 85 class F  
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.  
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s  
Clip data  
4.5  
5
Clip material  
Clamping force  
Type number  
stainless(CrNi) steel  
12.5N each  
CLI-EFD15  
2.6  
MBW144  
Fig. 2 Clip for EFD15  
0
Clamp data  
16.5  
-0.3  
± 0.2  
15  
13.5  
12  
Clamp material  
Clamping force  
Type number  
stainless(CrNi) steel  
25N  
CLM-EFD15  
12.5  
± 0.2  
14.3  
4
Fig. 2 Clamp for EFD15  
16  
Philips Magnetic Products  
EFD15  
Effective core parameters  
symbol  
parameter  
value  
unit  
-1  
Σ (l/A)  
core factor (C1)  
effective volume  
effective length  
effective area  
2.27  
510  
34.0  
15.0  
12.2  
1.4  
mm  
mm  
mm  
3
V
e
l
e
2
A
mm  
e
2
A
minimum area  
mass of core half  
mm  
g
min  
15 ± 0.4  
11 ± 0.35  
5.3 ± 0.15  
m
MBW145  
Fig. 3 EFD15 core half  
Core sets for general purpose transformers and power applications  
Grade  
A (nH)  
µ
Airgap (µm)  
Type number  
L
e
3F3  
63±5%  
100±8%  
160±10%  
780±25%  
63±5%  
115  
180  
290  
1400  
115  
180  
290  
720  
3610  
≥ 4510  
350  
170  
100  
0
350  
160  
90  
0
EFD15-3F3-A63-S  
EFD15-3F3-A100-S  
EFD15-3F3-A160-S  
EFD15-3F3-S  
EFD15-3F4-A63-S  
EFD15-3F4-A100-S  
EFD15-3F4-A160-S  
EFD15-3F4-S  
3F4  
100±8%  
160±10%  
400±25%  
2000 +40/-30%  
≥ 2500  
3E4  
3E5  
0
0
EFD15-3E4-S  
EFD15-3E5-S  
Properties of core sets under power conditions  
B(mT) at  
H = 250 A/m  
f = 25kHz  
Core loss at  
f = 100 kHz  
B = 100mT  
Core loss at  
f = 400 kHz  
B = 50mT  
Core loss at  
Core loss at  
f = 3MHz  
B = 10mT  
Grade  
f = 1MHz  
B = 30mT  
o
o
o
o
o
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
3F3  
3F4  
≥ 315  
≥ 250  
≤ 0.06  
≤ 0.10  
−
−
−
−
≤ 0.10  
≤ 0.16  
17  
Philips Magnetic Products  
EFD20  
2
14.8 - 0.2  
10.5 - 0.15  
9.2 + 0.1  
14.8-0.2  
13.5 min  
1.8  
1
7.5 ±0.05  
15 ± 0.05  
21.7 max  
21  
23.7 max  
2
3.75  
MBW148  
Fig. 1 SMD coil former for EFD20  
Winding data  
Number of  
sections  
Number of  
solder pads  
Winding area  
Winding width Average length  
Type number  
2
(mm )  
(mm)  
of turn (mm)  
1
10  
27.7  
13.5  
34.1  
CPHS-EFD20-1S-10P  
Coil former data  
Coil former material  
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance  
with UL94V-0.  
Solder pad material  
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
o
Maximum operating temperature  
Resistance to soldering heat  
Solderability  
155 C, IEC 85 class F  
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.  
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s  
Clip data  
5
6
Clip material  
Clamping force  
Type number  
stainless(CrNi) steel  
20N each  
CLI-EFD20  
4
MBW146  
Fig. 2 Clip for EFD20  
Clamp data  
0
- 0.3  
21.5  
±
0.2  
20  
18.5  
17  
Clamp material  
Clamping force  
Type number  
stainless(CrNi) steel  
30N  
CLM-EFD20  
17.5  
4
±
0.2  
19.3  
Fig. 2 Clamp for EFD20  
18  
Philips Magnetic Products  
EFD20  
Effective core parameters  
symbol  
parameter  
value  
unit  
-1  
Σ (l/A)  
core factor (C1)  
effective volume  
effective length  
effective area  
1,52  
1460  
47.0  
31.0  
29.0  
3.5  
mm  
mm  
mm  
3
V
e
l
e
2
A
mm  
e
2
A
minimum area  
mass of core half  
mm  
g
min  
20 ± 0.55  
15.4 ± 0.5  
8.9 ± 0.2  
m
MBW147  
Fig. 3 EFD20 core half  
Core halves/sets for general purpose transformers and power applications  
Grade  
A (nH)  
µ
Airgap (µm)  
Type number  
L
e
3F3  
63±3%  
100±3%  
160±5%  
250±8%  
315±10%  
1200±25%  
63±3%  
100±3%  
160±5%  
250±8%  
315±10%  
650±25%  
75  
120  
195  
300  
425  
1450  
75  
120  
195  
300  
425  
785  
500  
240  
140  
90  
65  
0
500  
240  
140  
90  
65  
0
EFD20-3F3-E63-S  
EFD20-3F3-A100-S  
EFD20-3F3-A160-S  
EFD20-3F3-A250-S  
EFD20-3F3-A315-S  
EFD20-3F3  
EFD20-3F4-E63-S  
EFD20-3F4-A100-S  
EFD20-3F4-A160-S  
EFD20-3F4-A250-S  
EFD20-3F4-A315-S  
EFD20-3F4  
3F4  
Properties of core sets under power conditions  
B(mT) at  
H = 250 A/m  
f = 25kHz  
Core loss at  
f = 100 kHz  
B = 100mT  
Core loss at  
f = 400 kHz  
B = 50mT  
Core loss at  
Core loss at  
f = 3MHz  
B = 10mT  
Grade  
f = 1MHz  
B = 30mT  
o
o
o
o
o
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
3F3  
3F4  
≥ 315  
≥ 300  
≤ 0.17  
≤ 0.28  
−
−
−
−
≤ 0.44  
≤ 0.50  
19  
Philips Magnetic Products  
EP7  
7-0.1  
4.5-0.1  
4.9-0.1  
3.9min.  
1.8  
3.5+0.1  
0.8  
1.8  
7.15  
9.85max.  
3
6
2
3
MBW124  
9.2max.  
Fig. 1 SMD coil former for EP7  
Winding data  
Number of  
sections  
Number of  
solder pads  
Winding area  
(mm2)  
Winding width Average length  
Type number  
CPHS-EP7-1S-6P  
(mm)  
of turn (mm)  
1
6
4.7  
3.9  
17.9  
Coil former data  
Coil former material  
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance  
with UL94V-0.  
Solder pad material  
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
o
Maximum operating temperature  
Resistance to soldering heat  
Solderability  
155 C, IEC 85 class F  
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.  
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s  
Clip data  
9.4+0,2  
Clip material  
Clamping force  
Type number  
stainless(CrNi) steel  
22N  
CLI-EP7  
4.3  
0.25  
MBW130  
Fig. 2 clip for EP7  
20  
Philips Magnetic Products  
EP7  
Effective core parameters  
symbol  
parameter  
value  
unit  
7.2 + 0.4  
3.4 - 0.2  
-1  
Σ (l/A)  
core factor (C1)  
effective volume  
effective length  
effective area  
1.45  
165  
15.5  
10.7  
8.55  
0.8  
mm  
mm  
mm  
mm  
mm  
g
3
V
e
l
e
2
2
A
e
A
minimum area  
mass of core set  
min  
m
9.4 - 0.4  
MBW133  
Fig. 3 EP7 core set  
Core sets for general purpose transformers and power applications  
Grade  
A (nH)  
µ
Airgap (µm)  
Type number  
L
e
3F3  
25±3%  
40±3%  
63±3%  
100±3%  
160±5%  
1000±25%  
100±3%  
160±5%  
30  
48  
76  
790  
440  
260  
150  
85  
0
150  
85  
0
EP7-3F3-E25  
EP7-3F3-A40  
EP7-3F3-A63  
EP7-3F3-A100  
EP7-3F3-A160  
EP7-3F3  
EP7-3F4-A100  
EP7-3F4-A160  
EP7-3F4  
121  
193  
1210  
121  
193  
730  
6300  
7000  
3F4  
600±25%  
5200 +40/-30%  
5800 +40/-30%  
3E5  
3E6  
0
0
EP7-3E5  
EP7-3E6  
Properties of core sets under power conditions  
B(mT) at  
H = 250 A/m  
f = 25kHz  
Core loss at  
f = 100 kHz  
B = 100mT  
Core loss at  
f = 400 kHz  
B = 50mT  
Core loss at  
Core loss at  
f = 3MHz  
B = 10mT  
Grade  
f = 1MHz  
B = 30mT  
o
o
o
o
o
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
3F3  
3F4  
≥ 315  
≥ 250  
≤ 0.02  
≤ 0.035  
−
−
−
−
≤ 0.033  
≤ 0.053  
21  
Philips Magnetic Products  
ER9.5  
ø 7.3 ± 0,1  
ø 4.45± 0.08  
ø 3.6 ±0.08  
1.6  
8.6 max.  
0.7  
8.1  
2
6
11.7max.  
2
Fig. 1 SMD coil former for ER9.5  
Winding data  
Number of  
sections  
Number of  
solder pads  
Winding area  
Winding width Average length  
Type number  
2
(mm )  
(mm)  
of turn (mm)  
1
8
2.8  
2.05  
18.4  
CPVS-ER9.5-1S-8P  
Coil former data  
Coil former material  
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance  
with UL94V-0.  
Solder pad material  
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
o
Maximum operating temperature  
Resistance to soldering heat  
Solderability  
155 C, IEC 85 class F  
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.  
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s  
Clamp data  
4
5.5  
Clamp material  
Clamping force  
Type number  
stainless(CrNi)steel  
20N  
CLM-ER9.5  
Fig. 2 clamp for ER9.5  
22  
Philips Magnetic Products  
ER9.5  
Effective core parameters  
symbol  
parameter  
value  
unit  
0
3.5  
-1  
- 0.2  
Σ (l/A)  
core factor (C1)  
effective volume  
effective length  
effective area  
1.67  
120  
14.2  
8.47  
7.60  
0.35  
mm  
mm  
3
V
e
l
mm  
e
2
A
mm  
e
2
A
minimum area  
mass of core half  
mm  
0
min  
9.5  
7.1  
- 0.3  
m
g
+ 0.2  
0
+ 0.25  
0
7.5  
Fig. 3 ER9.5 core half  
Core sets for general purpose transformers and power applications  
Grade  
A (nH)  
µ
Airgap (µm)  
Type number  
L
e
3F3  
3F4  
3E5  
3E6  
850±25%  
525±25%  
3600 +40/-30%  
4800 +40/-30%  
1145  
700  
4780  
6380  
0
0
0
0
ER9.5-3F3-S  
ER9.5-3F4-S  
ER9.5-3E5-S  
ER9.5-3E6-S  
Properties of core sets under power conditions  
B(mT) at  
H = 250 A/m  
f = 25kHz  
Core loss at  
f = 100 kHz  
B = 100mT  
Core loss at  
f = 400 kHz  
B = 50mT  
Core loss at  
Core loss at  
f = 3MHz  
B = 10mT  
Grade  
f = 1MHz  
B = 30mT  
o
o
o
o
o
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
3F3  
3F4  
≥ 300  
≥ 250  
≤ 0.015  
≤ 0.025  
−
−
−
−
≤ 0.024  
≤ 0.038  
23  
Philips Magnetic Products  
ER11  
+0.1  
ø 8.5-0.2  
1.6  
ø 5.3± 0.1  
ø 4.5± 0.1  
10.6 max.  
0.7  
4
8
9.2  
12.35max.  
2
Fig. 1 SMD coil former for ER11  
Winding data  
Number of  
sections  
Number of  
solder pads  
Winding area  
Winding width Average length  
Type number  
CPVS-ER11-1S-10P  
2
(mm )  
(mm)  
of turn (mm)  
1
10  
2.8  
1.85  
21.6  
Coil former data  
Coil former material  
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance  
with UL94V-0.  
Solder pad material  
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
o
Maximum operating temperature  
Resistance to soldering heat  
Solderability  
155 C, IEC 85 class F  
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.  
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s  
Clip data  
4.4  
5.6  
Clip material  
Clamping force  
Type number  
stainless(CrNi) steel  
25N  
CLM-ER11  
Fig. 2 clamp for ER11  
24  
Philips Magnetic Products  
ER11  
Effective core parameters  
symbol  
parameter  
value  
unit  
0
4.25  
-1  
- 0.25  
Σ (l/A)  
core factor (C1)  
effective volume  
effective length  
effective area  
1.23  
174  
14.7  
11.9  
10.3  
0.5  
mm  
mm  
3
V
e
l
mm  
e
2
A
mm  
e
2
A
minimum area  
mass of core half  
mm  
min  
0
11  
- 0.35  
m
g
+0.2  
0
8
+0.3  
0
8.7  
Fig. 3 ER11 core half  
Core sets for general purpose transformers and power applications  
Grade  
A (nH)  
µ
Airgap (µm)  
Type number  
L
e
3F3  
3F4  
3E5  
3E6  
1200±25%  
725±25%  
5000 +40/-30%  
6700 +40/-30%  
1170  
710  
4890  
6560  
0
0
0
0
ER11-3F3-S  
ER11-3F4-S  
ER11-3E5-S  
ER11-3E6-S  
Properties of core sets under power conditions  
B(mT) at  
H = 250 A/m  
f = 25kHz  
Core loss at  
f = 100 kHz  
B = 100mT  
Core loss at  
f = 400 kHz  
B = 50mT  
Core loss at  
Core loss at  
f = 3MHz  
B = 10mT  
Grade  
f = 1MHz  
B = 30mT  
o
o
o
o
o
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
3F3  
3F4  
≥ 300  
≥ 250  
≤ 0.025  
≤ 0.040  
−
−
−
−
≤ 0.035  
≤ 0.056  
25  
Philips Magnetic Products  
RM4/I  
ø 7.85-0.15  
ø 4.9-0.1  
ø 4+0.1  
2
2
1.8  
1
7.5  
7
10.65 max  
11.15 max  
3.75  
MBW125  
Fig. 1 SMD coil former for RM4/I  
Winding data  
Number of  
sections  
Number of  
solder pads  
Winding area  
Winding width Average length  
Type number  
2
(mm )  
(mm)  
of turn (mm)  
1
6
8.4  
5.75  
19.8  
CPVS-RM4-1S-6P  
Coil former data  
Coil former material  
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance  
with UL94V-0.  
Solder pad material  
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
o
Maximum operating temperature  
Resistance to soldering heat  
Solderability  
155 C, IEC 85 class F  
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.  
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s  
Clip data  
2.1  
Clip material  
Clamping force  
Type number  
stainless steel  
5 N each  
CLI-RM4/5  
Fig. 2 Clip for RM4/I  
26  
Philips Magnetic Products  
RM4/I  
Effective core parameters  
symbol  
parameter  
value  
unit  
-1  
Σ (l/A)  
core factor (C1)  
effective volume  
effective length  
effective area  
1.69  
322  
23.3  
13.8  
11.5  
1.7  
mm  
mm  
mm  
3
V
e
l
e
2
A
mm  
e
2
A
minimum area  
mass of core set  
mm  
g
> 5.8  
min  
11 - 0.5  
m
ø 3.9 - 0.2  
ø 7.95 + 0.4  
MBW134  
Fig. 3 RM4/I core set  
Core sets for general purpose transformers and power applications  
Grade  
A (nH)  
µ
Airgap (µm)  
Type number  
L
e
3F3  
100±3%  
160±3%  
250±10%  
950±25%  
100±3%  
134  
215  
336  
1280  
134  
215  
336  
750  
4700  
170  
100  
50  
0
150  
80  
40  
0
RM4/I-3F3-A100  
RM4/I-3F3-A160  
RM4/I-3F3-A250  
RM4/I-3F3  
RM4/I-3F4-A100  
RM4/I-3F4-A160  
RM4/I-3F4-A250  
RM4/I-3F4  
3F4  
3E5  
160±3%  
250±10%  
560±25%  
3500 +40/-30%  
0
RM4/I-3E5  
Properties of core sets under power conditions  
B(mT) at  
H = 250 A/m  
f = 25kHz  
Core loss at  
f = 100 kHz  
B = 100mT  
Core loss at  
f = 400 kHz  
B = 50mT  
Core loss at  
Core loss at  
f = 3MHz  
B = 10mT  
Grade  
f = 1MHz  
B = 30mT  
o
o
o
o
o
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
3F3  
3F4  
≥ 300  
≥ 250  
≤ 0.05  
≤ 0.07  
−
−
−
−
≤ 0.065  
≤ 0.11  
27  
Philips Magnetic Products  
RM5/I  
0
ø10.1  
− 0.15  
0
ø5.9  
− 0.1  
+0.1  
ø5  
0
2
1
1.8  
3.75  
2
14.9 max.  
3.75  
11.25  
14.25 max.  
Fig. 1 SMD coil former for RM5/I  
Winding data  
Number of  
sections  
Number of  
solder pads  
Winding area  
Winding width Average length  
Type number  
2
(mm )  
(mm)  
of turn (mm)  
1
8
9.8  
4.9  
24.9  
CPVS-RM5-1S-8P  
Coil former data  
Coil former material  
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance  
with UL94V-0.  
Solder pad material  
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
o
Maximum operating temperature  
Resistance to soldering heat  
Solderability  
155 C, IEC 85 class F  
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.  
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s  
Clip data  
2.1  
Clip material  
Clamping force  
Type number  
stainless (CrNi)steel  
5 N each  
CLI-RM4/5  
Fig. 2 Clip for RM5/I  
28  
Philips Magnetic Products  
RM5/I  
Effective core parameters  
symbol  
parameter  
value  
unit  
-1  
Σ (l/A)  
core factor (C1)  
effective volume  
effective length  
effective area  
0.935  
574  
23.2  
24.8  
18.1  
3.3  
mm  
mm  
mm  
3
V
e
l
e
2
A
mm  
e
2
A
minimum area  
mass of core set  
mm  
g
> 6  
min  
14.6 - 0,6  
m
ø 4.9 - 0.2  
ø 10.2 + 0.4  
MBW135  
Fig. 3 RM5/I core set  
Core sets for general purpose transformers and power applications  
Grade  
A (nH)  
µ
Airgap (µm)  
Type number  
L
e
3F3  
100±3%  
160±3%  
250±3%  
1700±25%  
100±3%  
160±3%  
74  
119  
186  
1270  
74  
119  
186  
750  
4980  
7050  
300  
160  
90  
0
300  
160  
90  
0
RM5/I-3F3-A100  
RM5/I-3F3-A160  
RM5/I-3F3-A250  
RM5/I-3F3  
RM5/I-3F4-A100  
RM5/I-3F4-A160  
RM5/I-3F4-A250  
RM5/I-3F4  
3F4  
250±3%  
1000±25%  
6700 +40/-30%  
9500 +40/-30%  
3E5  
3E6  
0
0
RM5/I-3E5  
RM5/I-3E6  
Properties of core sets under power conditions  
B(mT) at  
H = 250 A/m  
f = 25kHz  
Core loss at  
f = 100 kHz  
B = 100mT  
Core loss at  
f = 400 kHz  
B = 50mT  
Core loss at  
Core loss at  
f = 3MHz  
B = 10mT  
Grade  
f = 1MHz  
B = 30mT  
o
o
o
o
o
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
3F3  
3F4  
≥ 315  
≥ 250  
≤ 0.08  
≤ 0.11  
−
−
−
−
≤ 0.11  
≤ 0.20  
29  
Philips Magnetic Products  
RM6S/I  
ø 12.3-0.25  
ø 7.55-0.15  
ø 6.5+0.15  
2
2
1
14.7  
1.8  
5
12.5  
17.45 max  
3.75  
3.75  
5
15.7 max  
MBW127  
Fig. 1 SMD coil former for RM6S/I  
Winding data  
Number of  
sections  
Number of  
solder pads  
Winding area  
Winding width Average length  
Type number  
2
(mm )  
(mm)  
of turn (mm)  
1
8
14  
6.25  
31  
CPVS-RM6S-1S-8P  
Coil former data  
Coil former material  
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance  
with UL94V-0.  
Solder pad material  
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
o
Maximum operating temperature  
Resistance to soldering heat  
Solderability  
155 C, IEC 85 class F  
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.  
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s  
Clip data  
2.3  
Clip material  
Clamping force  
Type number  
stainless (CrNi) steel  
10 N each  
CLI-RM6  
MBW138  
Fig. 2 Clip for RM6S/I  
30  
Philips Magnetic Products  
RM6S/I  
Effective core parameters  
symbol  
parameter  
value  
unit  
14.7 - 0.6  
-1  
Σ (l/A)  
core factor (C1)  
effective volume  
effective length  
effective area  
0.784  
1090  
29.2  
37.0  
31.2  
4.9  
mm  
mm  
3
V
e
l
mm  
e
2
A
mm  
e
2
A
minimum area  
mass of core set  
mm  
min  
> 8.8  
m
g
17.9 - 0.7  
ø 6.4 - 0.2  
ø 12.4 + 0.5  
MBW136  
Fig. 3 RM6S/I core set  
Core sets for general purpose transformers and power applications  
Grade  
A (nH)  
µ
Airgap (µm)  
Type number  
L
e
3F3  
63±3%  
100±3%  
160±3%  
250±3%  
2150±25%  
63±3%  
100±3%  
160±3%  
250±3%  
39  
62  
100  
156  
1350  
39  
950  
500  
300  
150  
0
950  
500  
300  
150  
0
RM6S/I-3F3-A63  
RM6S/I-3F3-A100  
RM6S/I-3F3-A160  
RM6S/I-3F3-A250  
RM6S/I-3F3  
RM6S/I-3F4-A63  
RM6S/I-3F4-A100  
RM6S/I-3F4-A160  
RM6S/I-3F4-A250  
RM6S/I-3F4  
3F4  
62  
100  
156  
780  
5370  
6200  
1250±25%  
8600 +40/-30%  
12500 +40/-30%  
3E5  
3E6  
0
0
RM6S/I-3E5  
RM6S/I-3E6  
Properties of core sets under power conditions  
B(mT) at  
H = 250 A/m  
f = 25kHz  
Core loss at  
f = 100 kHz  
B = 100mT  
Core loss at  
f = 400 kHz  
B = 50mT  
Core loss at  
Core loss at  
f = 3MHz  
B = 10mT  
Grade  
f = 1MHz  
B = 30mT  
o
o
o
o
o
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
3F3  
3F4  
≥ 315  
≥ 250  
≤ 0.14  
≤ 0.20  
−
−
−
−
≤ 0.22  
≤ 0.35  
31  
Philips Magnetic Products  
RM6S/ILP  
2
ø 12.3 - 0.25  
ø 7.55 - 0.15  
ø 6.5 +0.15  
2
1
14.7  
1.8  
5
12.5  
17.45 max  
3.75  
3.75  
5
15.7 max  
MBW142  
Fig. 1 SMD coil former for RM6S/ILP  
Winding data  
Number of  
sections  
Number of  
solder pads  
Winding area  
Winding width Average length  
Type number  
2
(mm )  
(mm)  
of turn (mm)  
1
8
6.4  
2.8 min  
31.0  
CPVS-RM6S/LP-1S-8P  
Coil former data  
Coil former material  
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance  
with UL94V-0.  
Solder pad material  
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
o
Maximum operating temperature  
Resistance to soldering heat  
Solderability  
155 C, IEC 85 class F  
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.  
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s  
Clip data  
2.3  
Clip material  
Clamping force  
Type number  
stainless (CrNi) steel  
10 N each  
CLI-RM6/LP  
Fig. 2 Clip for RM6S/ILP  
32  
Philips Magnetic Products  
RM6S/ILP  
Effective core parameters  
symbol  
parameter  
value  
unit  
-1  
14.7 - 0.6  
Σ (l/A)  
core factor (C1)  
effective volume  
effective length  
effective area  
0.580  
820  
21.8  
37.5  
31.2  
4.2  
mm  
mm  
mm  
mm  
mm  
g
3
V
e
l
e
2
2
A
e
A
minimum area  
mass of core set  
min  
> 8.8  
m
17.9 - 0.7  
ø 6.4 - 0.2  
ø 12.4 +0.5  
MBW140  
Fig. 3 RM6S/ILP core set  
Core sets for general purpose transformers and power applications  
Grade  
A (nH)  
µ
Airgap (µm)  
Type number  
L
e
3F3  
3F4  
3E5  
3E6  
2700±25%  
1600±25%  
10500 +40/-30%  
15000 +40/-30%  
1250  
740  
4850  
6930  
0
0
0
0
RM6S/ILP-3F3  
RM6S/ILP-3F4  
RM6S/ILP-3E5  
RM6S/ILP-3E6  
Properties of core sets under power conditions  
B(mT) at  
H = 250 A/m  
f = 25kHz  
Core loss at  
f = 100 kHz  
B = 100mT  
Core loss at  
f = 400 kHz  
B = 50mT  
Core loss at  
Core loss at  
f = 3MHz  
B = 10mT  
Grade  
f = 1MHz  
B = 30mT  
o
o
o
o
o
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
T = 100 C  
3F3  
3F4  
≥ 300  
≥ 250  
≤ 0.10  
≤ 0.15  
−
−
−
−
≤ 0.16  
≤ 0.26  
33  
Philips Magnetic Products  
TGPS-9  
13 max.  
1.75max.  
1.8  
0.8  
0.3  
3
9
3
Fig. 1 Tag plate for 9mm ring cores.  
Winding data  
Number of  
sections  
Number of  
solder pads  
Winding area  
Winding width Average length  
Type number  
2
(mm )  
(mm)  
of turn (mm)  
-
8
-
-
-
TGPS-9  
Coil former data  
Coil former material  
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance  
with UL94V-0.  
Solder pad material  
Copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
o
Maximum operating temperature  
Resistance to soldering heat  
Solderability  
155 C, IEC 85 class F  
“IEC 68-2-20” part2, test Tb, method 1B: 350 C, 3.5s.  
o
o
“IEC 68-2-20” part2, test Ta, method 1: 235 C, 2s  
Cover data  
0.6(4x)  
Cover material  
Polyamide (PA4.6)  
glass reinforced, flame retardant  
in accordance with UL94V-0.  
o
Maximum operating 130 C, IEC 85 class B  
temperature  
Type number  
11.7 max  
0.6  
6 max.  
COV-9  
Fig. 2 Cover for TGPS-9  
34  
Philips Magnetic Products  
TN9/6/3  
Effective core parameters  
symbol  
parameter  
value  
unit  
-1  
Σ (l/A)  
core factor (C1)  
effective volume  
effective length  
effective area  
5.17  
102  
22.9  
4.44  
0.5  
mm  
mm  
mm  
9.4 ± 0.3  
3.4 ± 0.3  
3
V
e
l
e
2
A
mm  
g
e
m
mass of core  
5.5 ± 0.3  
Fig. 3 TN9/6/3 ring core  
Ring core data  
Grade  
A (nH)  
µ
Colour code  
Type number  
L
e
3F3  
440 ±25%  
2070 ±30%  
2435 ±30%  
1800  
8500  
10000  
blue  
yellow/white  
purple/white  
TN9/6/3-3F3  
TL9/6/3-3E5  
TC9/6/3-3E6  
1)  
3E5  
2)  
3E6  
Note  
1. Ring cores in 3E5 are lacquered and therefore have different dimensions: OD = 9.3±0.4 mm, ID = 5.75±0.3mm, H = 3.25±0.3mm.  
2. Ring cores in 3E6 are coated with parylene and therefore have different dimensions: OD = 9.0±0.2 mm, ID = 6.0±0.2mm, H = 3.0±0.15mm.  
35  
Philips Magnetic Products  
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Tel. +7 95 755 6918, Fax. +7 95 755 6919  
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Tel. +55 11 821 2333, Fax. +55 11 829 1849  
Singapore: Philips Singapore Pte Ltd., SINGAPORE,  
Tel. +65 350 2000, Fax. +65 355 1758  
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Tel. +1 416 292 5161, Fax. +1 416 754 6248  
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Tel. +27 11 470 5911, Fax. +27 11 470 5494  
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Tel. +86 21 6354 1088, Fax. +86 21 6354 1060  
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Tel. +34 93 301 63 12, Fax. +34 93 301 42 43  
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Tel. +45 3329 3333, Fax. +45 3329 3905  
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Tel. +46 8 5985 2000, Fax. +46 8 5985 2745  
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Tel. +358 9 615 800, Fax. +358 9 615 80510  
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Tel. +41 1 488 22 11, Fax. +41 1 481 7730  
France: Philips Composants, SURESNES,  
Tel. +33 1 4099 6161, Fax. +33 1 4099 6493  
Taiwan: Philips Taiwan Ltd., TAIPEI,  
Tel. +886 2 2134 2900, Fax. +886 2 2134 2929  
Germany: Philips Components GmbH, HAMBURG,  
Tel. +49 40 2489-0, Fax. +49 40 2489 1400  
Thailand: Philips Electronics (Thailand) Ltd., BANGKOK,  
Tel. +66 2 745 4090, Fax. +66 2 398 0793  
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Tel. +30 1 4894 339/+30 1 4894 239, Fax. +30 1 4814 240  
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Tel. +90 212 279 2770, Fax. +90 212 282 6707  
Hong Kong: Philips Hong Kong, KOWLOON,  
Tel. +852 2784 3000, Fax. +852 2784 3003  
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Tel. +44 1306 512 000, Fax. +44 1306 512 345  
India: Philips India Ltd., MUMBAI,  
Tel. +91 22 4930 311, Fax. +91 22 4930 966/4950 304  
United States:  
• Display Components, ANN ARBOR, MI,  
Tel. +1 734 996 9400, Fax. +1 734 761 2776  
Indonesia: P.T. Philips Development Corp., JAKARTA,  
Tel. +62 21 794 0040, Fax. +62 21 794 0080  
• Magnetic Products, SAUGERTIES, NY,  
Tel. +1 914 246 2811, Fax. +1 914 246 0487  
Ireland: Philips Electronics (Ireland) Ltd., DUBLIN,  
Tel. +353 1 7640 203, Fax. +353 1 7640 210  
• Passive Components, SAN JOSE, CA,  
Tel. +1 408 570 5600, Fax. +1 408 570 5700  
Israel: Rapac Electronics Ltd., TEL AVIV,  
Tel. +972 3 6450 444, Fax. +972 3 6491 007  
Yugoslavia (Federal Republic of): Philips Components, BELGRADE,  
Tel. +381 11 625344/373,Fax. +381 11 635 777  
Italy: Philips Components S.r.l., MILANO,  
Tel. +39 2 6752 2531, Fax. +39 2 6752 2557  
Internet:  
Japan: Philips Japan Ltd., TOKYO,  
• Display Components: www.dc.comp.philips.com  
• Passive Components: www.passives.comp.philips.com  
Tel. +81 3 3740 5135, Fax. +81 3 3740 5035  
Korea (Republic of): Philips Electronics (Korea) Ltd., SEOUL,  
For all other countries apply to:  
Tel. +82 2 709 1472, Fax. +82 2 709 1480  
Philips Components, Building BF-1, P.O. Box 218, 5600 MD EINDHOVEN,  
The Netherlands, Fax. +31-40-27 23 903.  
Malaysia: Philips Malaysia SDN Berhad,  
Components Division, PULAU PINANG,  
Tel. +60 3 750 5213, Fax. +60 3 757 4880  
COB20  
Philips Electronics N.V. 1998  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the  
copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to  
be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher  
for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or  
other industrial or intellectual property rights.  
Mexico: Philips Components, EL PASO, U.S.A.,  
Tel. +52 915 772 4020, Fax. +52 915 772 4332  
New Zealand: Philips New Zealand Ltd., AUCKLAND,  
Tel. +64 9 815 4000, Fax. +64 9 849 7811  
Norway: Norsk A/S Philips, OSLO,  
Tel. +47 22 74 8000, Fax. +47 22 74 8341  
Pakistan: Philips Electrical Industries of Pakistan Ltd., KARACHI,  
Tel. +92 21 587 4641-49, Fax. +92 21 577 035/+92 21 587 4546  
Printed in The Netherlands  
9398 237 50011  
Date of release: 6/97  
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