BLS2731-110,114 [ETC]

TRANSISTOR RF POWER SOT423A;
BLS2731-110,114
型号: BLS2731-110,114
厂家: ETC    ETC
描述:

TRANSISTOR RF POWER SOT423A

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中文:  中文翻译
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BLS2731-110  
Microwave power transistor  
Rev. 6 — 1 September 2015  
Product data sheet  
IMPORTANT NOTICE  
Dear customer,  
As of December 7th, 2015 BL RF Power of NXP Semiconductors will operate as  
an independent company under the new trade name Ampleon, which will be used  
in future data sheets together with new contact details.  
In data sheets, where the previous Philips references is mentioned, please use  
the new links as shown below.  
http://www.philips.semiconductors.com use http://www.ampleon.com  
http://www.semiconductors.philips.com use http://www.ampleon.com (Internet)  
sales.addresses@www.semiconductors.philips.com use  
http://www.ampleon.com/sales  
The copyright notice at the bottom of each page (or elsewhere in the document,  
depending on the version)  
- © Koninklijke Philips Electronics N.V. (year). All rights reserved -  
is replaced with:  
- © Ampleon B.V. (year). All rights reserved. -  
If you have any questions related to the data sheet, please contact our nearest  
sales office (details via http://www.ampleon.com/sales).  
Thank you for your cooperation and understanding,  
Ampleon  
Philips Semiconductors  
Product specification  
Microwave power transistor  
BLS2731-110  
FEATURES  
PINNING - SOT423A  
PIN  
Suitable for short and medium pulse applications  
DESCRIPTION  
Internal input and output matching networks for an easy  
circuit design  
1
2
3
collector  
emitter  
Emitter ballasting resistors improve ruggedness  
Gold metallization ensures excellent reliability  
base; connected to flange  
Interdigitated emitter-base structure provides high  
emitter efficiency  
Multicell geometry improves power sharing and reduces  
thermal resistance.  
1
dbook, halfpage  
APPLICATIONS  
Common base class-C pulsed power amplifiers for radar  
3
applications in the 2.7 to 3.1 GHz band.  
3
2
MBK052  
DESCRIPTION  
NPN silicon planar epitaxial microwave power transistor in  
a 2-lead rectangular flange package with a ceramic cap  
(SOT423A) with the common base connected to the  
flange.  
Fig.1 Simplified outline.  
QUICK REFERENCE DATA  
RF performance at Th = 25 °C in a common base class-C test circuit.  
f
VCB  
(V)  
PL  
(W)  
Gp  
(dB)  
ηC  
(%)  
MODE OF OPERATION  
(GHz)  
Pulsed class-C  
2.7 to 3.1  
40  
>110  
>7  
>35  
WARNING  
Product and environmental safety - toxic materials  
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged.  
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety  
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of  
the user. It must never be thrown out with the general or domestic waste.  
2001 Dec 05  
2
Philips Semiconductors  
Product specification  
Microwave power transistor  
BLS2731-110  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
SYMBOL  
PARAMETER  
collector-base voltage  
CONDITIONS  
open emitter  
MIN.  
MAX.  
75  
UNIT  
VCBO  
VCES  
VEBO  
ICM  
V
collector-emitter voltage  
emitter-base voltage  
RBE = 0  
75  
V
open collector  
2
V
peak collector current  
total power dissipation  
storage temperature  
tp 100 µs; δ ≤ 10%  
tp = 100 µs; δ = 10%; Tmb = 25 °C  
12  
A
Ptot  
500  
+200  
200  
235  
W
°C  
°C  
°C  
Tstg  
Tj  
65  
operating junction temperature  
soldering temperature  
Tsld  
up to 0.2 mm from ceramic cap;  
t 10 s  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
VALUE UNIT  
Zth j-h  
thermal impedance from junction to  
heatsink  
tp = 100 µs; δ = 10%; note 1  
0.24  
K/W  
Note  
1. Equivalent thermal impedance under pulsed microwave operating conditions.  
CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
collector-base breakdown voltage  
collector-emitter breakdown voltage  
collector leakage current  
collector leakage current  
emitter leakage current  
CONDITIONS  
IC = 30 mA; open emitter  
IC = 30 mA; VBE = 0  
VCB = 40 V; IE = 0  
MIN.  
MAX.  
UNIT  
V(BR)CBO  
V(BR)CES  
ICBO  
75  
75  
V
V
3
mA  
mA  
mA  
ICES  
VCE = 40 V; VBE = 0  
VEB = 1.5 V; IC = 0  
6
IEBO  
0.6  
100  
hFE  
DC current gain  
VCE = 5 V; IC = 3 A  
40  
APPLICATION INFORMATION  
RF performance at Th = 25 °C in a common base test circuit.  
f
MODE OF OPERATION  
(GHz)  
VCE  
(V)  
PL  
(W)  
GP  
(dB)  
ηC  
(%)  
2.7 to 3.1  
40  
40  
40  
110  
7  
35  
Class-C; tp = 100 µs; δ = 10%  
2.7 to 2.9  
2.9 to 3.1  
typ. 130  
typ. 120  
typ. 8  
typ. 7.5  
typ. 42  
typ. 40  
2001 Dec 05  
3
Philips Semiconductors  
Product specification  
Microwave power transistor  
BLS2731-110  
MBK284  
MBK285  
10  
50  
140  
P
handbook, halfpage  
handbook, halfpage  
2.7  
3.1  
L
η
G
C
p
(W)  
120  
2.9 GHz  
η
(%)  
40  
C
(dB)  
8
G
p
100  
80  
60  
40  
20  
6
4
30  
20  
2
0
10  
0
0
10  
2.7  
2.8  
2.9  
3
3.1  
12  
14  
16  
18  
20  
P
(W)  
f (GHz)  
D
VCE = 40 V; class-C; tp = 100 µs; δ = 10%.  
VCE = 40 V; class-C; tp = 100 µs; δ = 10%.  
Fig.2 Power gain and efficiency as functions of  
frequency; typical values.  
Fig.3 Load power as a function of drive power;  
typical values.  
MGM538  
MGM539  
8
12  
handbook, halfpage  
handbook, halfpage  
Z
L
()  
x
Z
i
i
R
L
()  
4
0
8
r
i
4
0
4  
X
L
8  
2.6  
2.8  
3
3.2  
2.6  
2.8  
3
3.2  
f (GHz)  
f (GHz)  
VCB = 40 V; class-C; PL = 110 W.  
VCB = 40 V; class-C; PL = 110 W.  
Fig.4 Input impedance as function of frequency  
(series components); typical values.  
Fig.5 Load impedance as function of frequency  
(series components); typical values.  
2001 Dec 05  
4
Philips Semiconductors  
Product specification  
Microwave power transistor  
BLS2731-110  
30  
30  
40  
L8  
L11  
L2  
RC  
C2  
L7  
L1  
L4  
L5  
L10  
L9  
C1  
L6  
L3  
input  
output  
L13  
L14  
L12  
MGM540  
Dimensions in mm.  
The components are located on one side of the copper-clad printed-circuit board, the other side is unetched and serves as a ground plane.  
Earth connections from the component side to the ground plane are made by through metallization.  
Fig.6 Component layout for 2.7 to 3.1 GHz class-C test circuit.  
2001 Dec 05  
5
Philips Semiconductors  
Product specification  
Microwave power transistor  
BLS2731-110  
List of components (see Fig.6)  
COMPONENT  
DESCRIPTION  
VALUE  
DIMENSIONS  
C1  
C2  
RC  
multilayer ceramic chip capacitor; note 1  
multilayer ceramic chip capacitor; note 1  
12 pF  
18 pF  
multilayer ceramic chip capacitor in series 100 nF + 5 Ω  
with SMD resistor  
L1  
stripline; note 2  
stripline; note 2  
stripline; note 2  
stripline; note 2  
stripline; note 2  
stripline; note 2  
stripline; note 2  
stripline; note 2  
stripline; note 2  
stripline; note 2  
stripline; note 2  
stripline; note 2  
stripline; note 2  
stripline; note 2  
length 4.5 mm  
width 10 mm  
L2  
length 2.5 mm  
width 16.4 mm  
L3  
length 8.3 mm  
width 1 mm  
L4  
length 8 mm  
width 1.5 mm  
L5  
length 2 mm  
width 8.9 mm  
L6  
length 12.7 mm  
width 1.2 mm  
L7  
length 4.5 mm  
width 10 mm  
L8  
length 2.5 mm  
width 24.4 mm  
L9  
length 4.4 mm  
width 1 mm  
L10  
L11  
L12  
L13  
L14  
length 5.2 mm  
width 1 mm  
length 9.3 mm  
width 1 mm  
length 2.5 mm  
width 6 mm  
length 7.8 mm  
width 1.2 mm  
length 7.5 mm  
width 1.2 mm  
Notes  
1. American Technical Ceramics type 100A or capacitor of same quality.  
2. The striplines are on double-clad printed-circuit board with Duroid dielectric (εr = 2.2); thickness = 0.38 mm.  
2001 Dec 05  
6
Philips Semiconductors  
Product specification  
Microwave power transistor  
BLS2731-110  
PACKAGE OUTLINE  
Flanged hermetic ceramic package; 2 mounting holes; 2 leads  
SOT423A  
D
A
F
3
D
1
U
B
1
q
C
c
1
p
H
U
E
E
2
1
w
M
M
M
B
A
1
A
2
Q
w
b
M
M
C
2
0
5
10 mm  
scale  
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)  
UNIT  
A
b
c
D
D
E
E
F
H
p
Q
q
U
U
w
w
2
1
1
1
2
1
9.53  
9.27  
0.10  
0.05  
5.72  
4.90  
12.09 12.83 8.84 10.29  
11.71 12.57 8.56 10.03  
1.58  
1.47  
19.81  
18.29  
3.43  
3.18  
3.35  
2.95  
22.99 9.91  
22.73 9.65  
mm  
16.51  
0.65  
0.25  
0.01  
0.76  
0.03  
0.375 0.004  
0.365 0.002  
0.225  
0.193  
0.476 0.505 0.348 0.405 0.062  
0.461 0.495 0.337 0.395 0.058  
0.78  
0.72  
0.135 0.132  
0.125 0.116  
0.905 0.390  
0.895 0.380  
inches  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
EIAJ  
99-03-29  
SOT423A  
2001 Dec 05  
7
Philips Semiconductors  
Product specification  
Microwave power transistor  
BLS2731-110  
DATA SHEET STATUS  
PRODUCT  
DATA SHEET STATUS(1)  
STATUS(2)  
DEFINITIONS  
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Changes will be  
communicated according to the Customer Product/Process Change  
Notification (CPCN) procedure SNW-SQ-650A.  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes, without notice, in the  
products, including circuits, standard cells, and/or  
software, described or contained herein in order to  
improve design and/or performance. Philips  
Semiconductors assumes no responsibility or liability for  
the use of any of these products, conveys no licence or title  
under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that  
these products are free from patent, copyright, or mask  
work right infringement, unless otherwise specified.  
Application information  
Applications that are  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
CAUTION  
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport  
and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.  
2001 Dec 05  
8
Philips Semiconductors  
Product specification  
Microwave power transistor  
BLS2731-110  
NOTES  
2001 Dec 05  
9
Philips Semiconductors  
Product specification  
Microwave power transistor  
BLS2731-110  
NOTES  
2001 Dec 05  
10  
Philips Semiconductors  
Product specification  
Microwave power transistor  
BLS2731-110  
NOTES  
2001 Dec 05  
11  
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2001  
SCA73  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
613524/05/pp12  
Date of release: 2001 Dec 05  
Document order number: 9397 750 09083  

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