CXL5506M/P [ETC]

CMOS-CCD 1H Delay Line for PAL ; 对于PAL CMOS , CCD 1H延时线\n
CXL5506M/P
型号: CXL5506M/P
厂家: ETC    ETC
描述:

CMOS-CCD 1H Delay Line for PAL
对于PAL CMOS , CCD 1H延时线\n

CD
文件: 总9页 (文件大小:108K)
中文:  中文翻译
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CXL5506M/P  
CMOS-CCD 1H Delay Line for PAL  
For the availability of this product, please contact the sales office.  
Description  
CXL5506M  
8 pin SOP (Plastic)  
CXL5506P  
8 pin DIP (Plastic)  
The CXL5506M/P are CMOS-CCD delay line ICs  
that provide 1H delay time for PAL signals including  
the external low-pass filter.  
Features  
Single 5V power supply  
Low power consumption 95mW (Typ.)  
Built-in peripheral circuits  
Functions  
1130-bit CCD register  
Clock driver  
Auto-bias circuit  
Input clamp circuit  
Sample-and-hold circuit  
Absolute Maximum Ratings (Ta = 25°C)  
Supply voltage  
VDD  
6
V
°C  
Operating temperature Topr  
Storage temperature Tstg  
Allowable power dissipation  
PD  
–10 to +60  
–55 to +150 °C  
Structure  
CMOS-CCD  
CXL5506M  
CXL5506P  
350  
480  
mW  
mW  
Recommended Operating Condition (Ta = 25°C)  
Supply voltage 5 ± 5%  
VDD  
V
Recommended Clock Conditions (Ta = 25°C)  
Input clock amplitude VCLK 0.3 to 1.0  
Vp-p  
(0.5Vp-p typ.)  
17.734475 MHz  
Input clock waveform Sine wave  
Clock frequency  
fCLK  
Input Signal Amplitude  
VSIG 575mVp-p (Max.) (at internal clamp condition)  
Blook Diagram and Pin Configuration (Top View)  
8
7
6
5
Auto-bias circuit  
Bias circuit  
Timing circuit  
Clock driver  
Bias circuit (A)  
Bias circuit (B)  
CCD  
(1130bit)  
Output circuit  
(S/H 1bit)  
Clamp circuit  
2
3
4
1
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by  
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the  
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.  
– 1 –  
E90632B7X-PS  
CXL5506M/P  
Pin Description  
Pin No. Symbol  
Description  
Signal input  
Impedance  
I/O  
I
> 10kat no clamp  
1
2
3
4
5
6
7
8
IN  
VG2  
OUT  
VSS  
CLK  
VG1  
VDD  
AB  
I
Gate bias 2 DC input  
Signal output  
40 to 500Ω  
> 10kΩ  
O
I
GND  
Clock input  
O
O
Gate bias 1 DC output  
Power supply (5V)  
Auto-bias DC output  
600 to 200kΩ  
Description of Pin 2 (VG2)  
Control of input signal clamp condition  
0V ........ Sync tip clamp condition  
5V ........ Center bias condition  
Center biased to approx. 2.1V by means of the IC internal resistance (approx. 10k).  
In this mode, the input signal is limited to APL 50% and the maximum input signal amplitude is  
200mVp-p.  
Input waveform  
Output waveform  
Clamp  
level  
– 2 –  
CXL5506M/P  
Electrical Characteristics  
(Ta = 25°C, VDD = 5V, fCLK = 17.734475MHz, VCLK = 500mVp-p, sine wave)  
See "Electrical Characteristics Test Circuit"  
SW condition  
Item  
Symbol  
Test condition  
Min. Typ. Max.  
Unit Note  
2
a
1
a
3
19  
0
28  
2
mA  
dB  
1
2
Supply current  
10  
–2  
IDD  
200kHz,  
500mVp-p,  
sine wave  
Low frequency gain  
a
b
a
GL  
200kHz 4.43MHz,  
150mVp-p,  
sine wave  
b
c
d
–1  
3
0
dB  
3
4
Frequency response  
Differential gain  
–2  
0
b
a
b
c
fR  
5-staircase wave  
(See Note 4)  
5
5
%
DG  
5-staircase wave  
(See Note 4)  
3
degree  
4
5
Differential phase  
S/H pulse coupling  
0
a
b
c
d
f
DP  
CP  
350 mVp-p  
dB  
No signal input  
a
50% white  
video signal  
(See Note 6)  
56  
6
S/N ratio  
52  
a
d
e
SN  
Notes  
(1) This is the IC supply current value during clock and signal input.  
(2) GL is the output gain of OUT pin when a 500mVp-p, 200kHz sine wave is fed to IN pin.  
OUT pin output voltage [mVp-p]  
GL = 20 log  
[dB]  
500 [mVp-p]  
(3) Indicates the dissipation at 4.43MHz in relation to 200kHz.  
From the output voltage at OUT pin when a 150mVp-p, 200kHz sine wave is fed to IN pin, and from the  
output voltage at OUT pin when a 150mVp-p, 4.43MHz sine wave is fed to same, calculation is made  
according to the following formula.  
OUT pin otuput voltage (4.43MHz) [mVp-p]  
fR = 20 log  
[dB]  
OUT pin output voltage (200kHz) [mVp-p]  
– 3 –  
CXL5506M/P  
(4) In figure below, differential gain (DG) and differential phase (DP) are tested with a vector scope when  
the 5-staircase wave is fed.  
150mV  
350mV  
500mV  
150mV  
1H 64µs  
Input waveform  
(5) The internal clock component to the output signal during no-signal input and the leakage of that high  
harmonic component are tested.  
Test value  
(mVp-p)  
(6) S/N ratio during a 50% white video signal input shown in figure below is tested at a video noise meter, in  
BPF 100kHz to 5MHz, Sub Carrier Trap mode.  
175mV  
325mV  
150mV  
1H 64µs  
Input waveform  
Clock  
4fsc (17.734475MHz) sine wave  
0.3 to 1.0Vp-p  
(0.5Vp-p typ.)  
– 4 –  
CXL5506M/P  
– 5 –  
CXL5506M/P  
– 6 –  
CXL5506M/P  
Example of Representative Characteristics  
Supply current vs. Ambient temperature  
Low frequency gain vs. Ambient temperature  
30  
2
1
20  
0
–1  
–2  
10  
–20  
0
20  
40  
60  
80  
–20  
0
20  
40  
60  
80  
Ambient temperature [°C]  
Ambient temperature [°C]  
Frequency response vs. Ambient temperature  
Differential gain vs. Ambient temperature  
0
10  
8
–1  
–2  
–3  
6
4
2
0
–20  
0
20  
40  
60  
80  
–20  
0
20  
40  
60  
80  
Ambient temperature [°C]  
Ambient temperature [°C]  
Supply current vs. Supply voltage  
Low frequency gain vs. Supply voltage  
30  
2
1
20  
0
–1  
10  
4.75  
–2  
5
5.25  
4.75  
5
5.25  
Supply voltage [V]  
Supply voltage [V]  
– 7 –  
CXL5506M/P  
Frequency response vs.Supply voltage  
Differential gain vs. Supply voltage  
0
10  
8
–1  
6
4
–2  
–3  
2
0
4.75  
5
5.25  
4.75  
5
5.25  
Supply voltage [V]  
Supply voltage [V]  
Frequency response  
2
0
–2  
–4  
–6  
10k  
100k  
1M  
10M  
Frequency [Hz]  
– 8 –  
CXL5506M/P  
Package Outline  
CXL5506M  
Unit: mm  
8PIN SOP (PLASTIC)  
+ 0.4  
1.85 – 0.15  
+ 0.4  
6.10.1  
8
5
0.15  
+ 0.2  
0.1– 0.05  
1
4
+ 0.1  
0.2 – 0.05  
0.45 ± 0.1  
1.27  
0.24  
M
PACKAGE STRUCTURE  
EPOXY RESIN  
PACKAGE MATERIAL  
LEAD TREATMENT  
LEAD MATERIAL  
SOLDER PLATING  
SONY CODE  
EIAJ CODE  
SOP-8P-L01  
SOP008-P-0300  
42/COPPER ALLOY  
0.1g  
PACKAGE MASS  
JEDEC CODE  
CXL5506P  
8PIN DIP (PLASTIC)  
+ 0.4  
9.4 – 0.1  
5
8
1
0° to 15°  
4
2.54  
0.5 ± 0.1  
1.2 ± 0.15  
PACKAGE STRUCTURE  
PACKAGE MATERIAL  
LEAD TREATMENT  
LEAD MATERIAL  
EPOXY RESIN  
SOLDER PLATING  
SONY CODE  
DIP-8P-01  
EIAJ CODE  
DIP008-P-0300  
COPPER ALLOY  
0.5g  
PACKAGE MASS  
JEDEC CODE  
– 9 –  

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